Antenna Data Sheet AT1608

FCC ID: XPYANNAB1

Operational Description

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FCCID_4025342

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X AT1608 Series Multilayer Chip Antenna Features  Monolithic SMD with small, low-profile and light-weight type.  Wide bandwidth  RoHS compliant Applications 2400~2500MHz ISM Band Systems Specifications Frequency Range Peak Gain Average Gain Part Number VSWR Impedance (MHz) (dBi typ.) (dBi typ.) AT1608 0.5 -2.0 -A2R4NAA_ 2400~2480 3 max. 50  (XZ-total) (XZ-total) (*Electrical specification is defined by the measurement of Scenario#1) Q’ty/Reel (pcs) : 4,000 pcs o Operating Temperature Range : -40 ~ +85 C o Storage Temperature Range : -40 ~ +85 C Storage Period : 12 months max. Power Capacity : 2W max. Part Number AT 1608 - A 2R4 NAA           Type AT : Antenna  Dimensions ( L × W ) 1.6× 0.8 mm  Material Code A  Frequency Range 2R4=2400MHz T: Tape & Reel  Specification Code NAA  Packaging B: Bulk  Soldering /LF=lead-free AT1608-A2R4NAAT/LF REV:1 PAGE:1/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Terminal Configuration  Scenario#1: Antenna on the edge side of PCBA No. Terminal Name No. Terminal Name    Feeding Point  NC   GND  GND Scenario#2: Antenna on the corner of PCBA No. Terminal Name No. Terminal Name  Feeding Point  NC  NC  NC Dimensions and Recommended PC Board Pattern d a c Unit : mm W b c L T Mark L W T a b c d 1.6  0.8  0.4  0.5 0.5 0.2  0.55  Dimensions 0.1 0.1 0.1 0.1 0.1 0.05 0.1 AT1608-A2R4NAAT/LF REV:1 PAGE:2/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Typical Electrical Characteristics for Scenario#1 (T=25oC) Test Board-Scenario#1 50Feed Line 80mm 3mm 5mm No Ground 40mm Ground Antenna Footprint With matching- Scenario#1 (Unit in mm) 0.42 0.2 0.6 0.3 0.6 2.9 0.48 0.2 0.6 Matching circuits 0.33 0.3 0.35 0.5 0.6 0.25 3 0.64 0.5 1.5 2.7 nH 0.9 5 0.5 pF (Matching circuit and component values will be different, depending on PCB layout) *Line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. AT1608-A2R4NAAT/LF REV:1 PAGE:3/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Return Loss (with matching)- Scenario#1 0 m90 freq= 2.400GHz -5 dB(S(1,1))=-7.859 m90m92 m80 dB(S(1,1)) -10 freq= 2.440GHz dB(S(1,1))=-24.940 -15 m92 freq= 2.480GHz dB(S(1,1))=-7.042 -20 m80 -25 2.0 2.2 2.4 2.6 2.8 3.0 freq, GHz AT1608-A2R4NAAT/LF REV:1 PAGE:4/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Radiation Patterns- Scenario#1 (Antenna Efficiency: 50 %) Y :Φ(Phi)=90o XY-plane @2440MHz Total X :Φ(Phi)=0o Z : θ(Theta)=0o XZ-plane @2440MHz Total YZ-plane @2440MHz Total AT1608-A2R4NAAT/LF REV:1 PAGE:5/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Typical Electrical Characteristics for Scenario#2 (T=25oC) Test Board- Scenario#2 41mm 5mm 50Feed Line 17mm Antenna 3mm Ground No Ground Antenna Footprint With matching- Scenario#2 0.4mm 0.85mm 1.1mm 0.65mm 0.8mm 0.8 pF 1.43mm Matching circuits 0.8mm 0.5 pF 3.2mm 0.5mm 0.5mm 0.5mm 0.5mm 2.5mm 0.5mm (Matching circuit and component values will be different, depending on PCB layout) *Line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. AT1608-A2R4NAAT/LF REV:1 PAGE:6/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Return Loss (with matching)- Scenario#2 0 m3 freq= 2.400GHz -5 dB(S(1,1))=-12.371 m2 m1 freq= 2.440GHz dB(S(1,1)) -10 m3 dB(S(1,1))=-19.961 -15 m1 freq= 2.480GHz dB(S(1,1))=-10.574 m2 -20 -25 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 freq, GHz AT1608-A2R4NAAT/LF REV:1 PAGE:7/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Radiation Patterns- Scenario#2 (Antenna Efficiency: 50 %) Y :Φ(Phi)=90o XY-plane @2440MHz Total X :Φ(Phi)=0o Z : θ(Theta)=0o XZ-plane @2440MHz Total YZ-plane @2440MHz Total AT1608-A2R4NAAT/LF REV:1 PAGE:8/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Taping Specifications Tape & Reel Dimensions (Unit: mm) vs. Quantity (pcs) A’ 1.75 ± 0.1 D E F C ∣ T B A EMBOSS TAPE Type A A’ B C D E F T Quantity/per reel Tape material AT1608 4.0± 4.0± 0.95± 1.80± 2.0± 3.5± 8.0± 0.60± 4,000pcs Paper 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.03 Reel Dimensions (Unit: mm) W4 Label Label: Customer’s Name, W2 W3 ACX P/N, Q’ty, Date, ACX Corp. 13.5±0.5 2.3 W5 ±0.5 Type W2 W3 W4 W5 AT1608 178±1 60±1 1.4±0.2 9.0±0.3 Leader and Trailer Tape Leader End Trailer End Trailer (160 mm min.) Empty Compartments with Cover Tape (500 mm min.) AT1608-A2R4NAAT/LF REV:1 PAGE:9/12

http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 ACX Advanced Ceramic X Peel-off Force Top Cover Tape Peeling Direction <100 Carrier Tape Peel-off force should be in the range of 0.1 – 0.6 N at a peel-off speed of 300±10 mm/min . Storage Conditions (1) Temperature: 5 ~35℃, relative humidity (RH): 45~75%. (2) Non-corrosive environment Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. AT1608-A2R4NAAT/LF REV:1 PAGE:10/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Mechanical & Environmental Characteristics Item Requirements Procedure 1. No apparent damage 2. More than 95% of the terminal 1. Preheat: 120 5 oC Solderability electrode shall be covered with 2. Solder: 245 5oC for 5 1 sec new solder 1. Solder specimen onto test jig. Soldering strength 2. Apply push force at 0.5mm/s until electrode pads are (Termination 1. 1kg minimum peeled off or ceramic are broken. Pushing force is Adhesion) applied to longitude direction. 1. Solder specimen onto test jig (FR4, 0.8mm) using the recommend soldering profile. 2. Apply a bending force of 2mm deflection. Pressure Rod Deflection 1. No apparent damage (Substrate Bending) R230 90mm 1. Temperature: 85 2oC 1. No apparent damage Heat/Humidity 2. Humidity: 90% ~ 95% RH 2. Fulfill the electrical Resistance 3. Duration: 1000±48hrs specification after test 4. Recovery: 1-2hrs 1. One cycle/step 1：125 ± 5C for 30 min 1. No apparent damage Thermal shock step 2：- 40 ± 5C for 30 min 2. Fulfill the electrical (Temperature Cycle) 2. No of cycles：100 specification after test 3. Recovery:1-2 hrs 1. No apparent damage 1. Temperature: -40o 5 oC Low Temperature 2. Fulfill the electrical 2. Duration: 500 ±24hrs Resistance specification after test 3. Recovery: 1-2hrs AT1608-A2R4NAAT/LF REV:1 PAGE:11/12

ACX http://www.btian.com.cn 135-9038-5985 Andy QQ:2851897926 Advanced Ceramic X Soldering Conditions Typical Soldering Profile for Lead-free Process Reflow Soldering : Temperature (oC) 260oC 20s max. 217oC 150-200oC Pre-heating Time (s.) 60-150s. 60-180s Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. Advanced Ceramic X Corp. 16 Tzu Chiang Road, Hsinchu Industrial District Hsinchu Hsien 303, Taiwan TEL:886-3-5987008 FAX:886-3-5987001 E-mail: acx@acxc.com.tw http://www.acxc.com.tw AT1608-A2R4NAAT/LF REV:1 PAGE:12/12


Document Created: 2018-07-04 14:51:06
Document Modified: 2018-07-04 14:51:06
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