User Manual-module

FCC ID: QYLRS500

Users Manual

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FCCID_3141013

Indy® RS500 Datasheet IPJ-RS500-GX, IPJ-RS500-EU Electrical, Mechanical, & Thermal Specification Indy® RS500 Overview Indy RS500 is a completely integrated UHF reader SiP (system-in-package). It can be easily added to an embedded system, requiring only connections to a power source, digital communication with a host, and an antenna. The package design allows it to be attached to a PCB using standard surface mount technology (SMT), with no need for additional connectors or mounting hardware. The Indy RS500 is the easiest way to embed UHF RFID reader capability. Air Interface EPCglobal UHF Class 1 Gen 2 / ISO 18000-63 (formerly 18000-6C) Protocol Supports dense reader mode (DRM) Tx Output Power +10 to +23 dBm (Peak Power) Operating IPJ-RS500-GX (902-928MHz) supports all 900MHz bands worldwide Frequencies IPJ-RS500-EU (865-868MHz) supports current EU operating band Package 29 mm by 32 mm by 3.8 mm Package Type 32 pin surface mount package (SMT compatible) -65 dBm (1% packet error rate). Assumes a 15 dB antenna return loss at 23 dBm Rx Sensitivity output power. DC Power Supply 3.6 to 5.25 Volts Supported Worldwide regional support. All major regions supported. See section 5.6 for a Regions complete list. Compliance Certified: FCC and Canada modular operation, RoHS compliant For technical support, visit the Impinj support portal at support.impinj.com www.impinj.com Copyright © 2014, Impinj, Inc. Impinj and Indy are either registered trademarks or trademarks of Impinj, Inc. Revision 1.1 For more information, contact readerchips@impinj.com

1 Table of Contents INDY® RS500 OVERVIEW .......................................................................................................................... 1 1 TABLE OF CONTENTS ......................................................................................................................... 2 1.1 FIGURES ............................................................................................................................................ 2 1.2 TABLES .............................................................................................................................................. 2 2 INTRODUCTION .................................................................................................................................... 3 2.1 KEY FEATURES OF THE INDY RS500 .................................................................................................... 4 3 SYSTEM BLOCK DIAGRAM................................................................................................................. 4 4 PIN LISTING AND SIGNAL DEFINITIONS ........................................................................................... 7 5 ELECTRICAL SPECIFICATIONS ......................................................................................................... 8 5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 8 5.2 OPERATING CONDITIONS..................................................................................................................... 9 5.3 DEVICE FUNCTIONAL SPECIFICATIONS ................................................................................................. 9 5.4 UHF GEN 2 RFID RADIO SPECIFICATIONS .........................................................................................10 5.5 DEVICE INPUT AND OUTPUT SPECIFICATIONS .....................................................................................11 5.6 SUPPORTED REGIONS.......................................................................................................................13 5.7 EPC CLASS-1 GENERATION-2 OPERATION ........................................................................................15 6 IMPINJ RADIO INTERFACE (IRI) ....................................................................................................... 16 7 REGULATORY INFORMATION .......................................................................................................... 17 8 PACKAGE AND ASSEMBLY INFORMATION ................................................................................... 17 8.1 PACKAGE MASS................................................................................................................................17 8.2 PACKAGE DIMENSIONS......................................................................................................................17 8.3 PCB FOOTPRINT ..............................................................................................................................20 8.4 SMT REFLOW INFORMATION .............................................................................................................24 9 DOCUMENT CHANGE LOG ............................................................................................................... 25 10 NOTICES .......................................................................................................................................... 25 1.1 Figures FIGURE 2-1: RS500 SYSTEM INTEGRATION ...................................................................................................... 4 FIGURE 3-1: EXAMPLE RS500 BLOCK DIAGRAM ............................................................................................... 5 FIGURE 4-1: INDY RS500 PIN LISTING.............................................................................................................. 7 FIGURE 6-1: HOST AND READER FIRMWARE STACK ........................................................................................ 16 FIGURE 8-1: RS500 PACKAGE DIMENSIONS, TOP, FRONT, AND SIDE VIEWS .................................................... 18 FIGURE 8-2: RS500 PIN DIMENSIONS (VIEWED FROM UNDERNEATH PACKAGE)................................................. 19 FIGURE 8-3: RS500 RECOMMENDED ETCHED COPPER FOOTPRINT – ALL PADS .............................................. 20 FIGURE 8-4: RS500 RECOMMENDED ETCHED COPPER FOOTPRINT – SINGLE PAD ........................................... 21 FIGURE 8-5: RS500 RECOMMENDED PASTEMASK FOOTPRINT – ALL PADS ...................................................... 22 FIGURE 8-6: RS500 RECOMMENDED PASTEMASK FOOTPRINT – SINGLE PAD .................................................. 23 FIGURE 8-7: RECOMMENDED SOLDER STENCIL OPENING WITH ETCHED PAD FOR RS500................................. 23 FIGURE 8-8: RECOMMENDED SOLDER REFLOW PROFILE FOR THE INDY RS500 ............................................... 24 1.2 Tables TABLE 4-1: INDY RS500 – PIN LISTING AND SIGNAL DEFINITIONS ...................................................................... 7 TABLE 5-1: INDY RS500 – ABSOLUTE MAXIMUM RATINGS ................................................................................. 8 TABLE 5-2: INDY RS500 – OPERATING CONDITIONS ......................................................................................... 9 TABLE 5-3: INDY RS500 – SUPPLY CURRENT SPECIFICATIONS ......................................................................... 9 TABLE 5-4: INDY RS500 – STARTUP AND WAKEUP TIME ................................................................................. 10 TABLE 5-5: INDY RS500 – RF RECEIVER SPECIFICATIONS .............................................................................. 10 2 Revision 1.1, Copyright © 2014, Impinj, Inc.

TABLE 5-6: INDY RS500 – RF TRANSMITTER SPECIFICATIONS ........................................................................ 10 TABLE 5-7: INDY RS500 – DIGITAL INTERFACE SPECIFICATION ........................................................................ 11 TABLE 5-8: INDY RS500 – ANALOG INTERFACE SPECIFICATION ....................................................................... 12 TABLE 5-9: INDY RS500 – REGIONAL SUPPORT.............................................................................................. 13 TABLE 5-10: INDY RS500 – LINK PROFILE ...................................................................................................... 15 TABLE 5-11: INDY RS500 – GEN 2 FUNCTIONALITY ........................................................................................ 15 TABLE 5-12: INDY RS500 – INVENTORY PERFORMANCE ................................................................................. 16 TABLE 8-1: RS500 SERIAL # MAKEUP ............................................................................................................ 19 TABLE 9-1: DOCUMENT CHANGE LOG............................................................................................................. 25 2 Introduction The Indy® RS500 reader SiP (system-in-package) is a completely integrated reader solution for EPC Gen 2 / ISO18000-63 (formerly 18000-6C) applications. The Indy RS500 was developed to make embedding UHF RFID reader capability easy. The Indy RS500 builds on market-leading Indy reader chip technology and integrates all of the necessary components into a small package. The Indy RS500 requires no external components, is fully tested and meets regulatory requirements. The Indy RS500 comes in a surface mount package designed to work as a SMT (surface mount technology) compatible component in a standard PCB manufacturing process, which eliminates costly mechanical hardware, RF cables and human assembly that are typically required with embedded readers on the market today. The Indy RS500 is a turnkey solution that will enable quick and easy embedding of RFID with low development risk and fast time- to-market. Ideal for moderate read range of small tag populations, the Indy RS500’s small form factor enables a diverse range of applications that need a low-cost embedded UHF Gen 2 RFID reader capability, such as consumables authentication, access control, process control, appliances, POS devices for retail, medical equipment, printers, and low-duty handheld readers. The RS500 is capable of reading dozens of tags per second at distances greater than 3 meters when using a 6 dBi reader antenna and far field passive tags. This document includes interface, functional, performance, mechanical and environmental specifications. Host communication specifications (e.g. firmware upgrade and host interface protocol) and Impinj Radio Interface (IRI) documentation is provided in the latest RS500 Software release package. The Indy RS500 uses the IRI™ (Impinj Radio Interface) to communicate with host systems. The IRI Tool Kit enables developers to build on a variety of embedded host platforms by providing the following: documentation, image loader, IRI library, sample C code and project files. The IRI Tool Kit can be found in the latest Indy RS500 Software release package and can be downloaded from the restricted documents and downloads section at support.impinj.com. Please create an account and subscribe to receive automatic updates to the latest documentation and releases. Contact your local Impinj representative if you have trouble creating an account or accessing this site. Revision 1.1, Copyright © 2014, Impinj, Inc. 3

Figure 2-1: RS500 System Integration DC Power Host Antenna UART IRI Library Three simple connections: Partners build  DC Power API with IRI  UART Communication Tool Kit  RF Antenna 2.1 Key features of the Indy RS500  Fully tested turnkey solution  Maximum output power is 23 dBm  -65 dBm Rx sensitivity, assuming 15 dB antenna return loss  Inventory (FastID, Tag Population Estimate, Select, Session, Target)  Access (Read, Write, Lock, Kill, BlockPermalock, and QT)  Shielded to prevent unwanted radiation and provide noise immunity in embedded environments  29 mm by 32 mm by 3.8 mm surface mount package with SMT compatibility  Single mono-static RF port  Field upgradability via firmware updates. Gen 2 v2 will be firmware upgradable.  Part of Impinj’s GrandPrix® platform, ensuring better performance when using Impinj’s Monza® UHF RFID tag chips (enabling FastID, Tag Focus and QT)  UART serial interface using IRI (Impinj Radio Interface)  Test features (CW, PRBS, custom regions, channel lists, and fixed frequency) 3 System Block Diagram An example Indy RS500 system-level block diagram for an embedded application is shown in Figure 3-1. This figure shows the electrical connections that may and must be made to control the RS500. In the figure, the required connections are illustrated with 4 Revision 1.1, Copyright © 2014, Impinj, Inc.

solid lines. Recommended and optional connections are illustrated with different dotted and dashed line patterns. They are also listed below. For more detail on pin characteristics and behaviors, see the RS500 Hardware User’s Guide. Figure 3-1: Example RS500 Block Diagram 3.6 - 5.25 V UART1 RX & TX VDC_IN RF Indy NRST RS500 WKUP Host GND SiP GPIOs UC_ADC & UC_DAC STATUS & HEALTH UART2 RX & TX Key GPIOs Required Recommended Test User Optional Points Def. Required connections:  VDC_IN and GND are required to power the RS500.  RF is required to connect to the UHF RFID antenna.  UART1 Tx and Rx are required to communicate with the system host. Recommended connections:  nRST is used to reset the RS500 if UART communication is not available. This connection is highly recommended. This pin internally driven strong low during software resets, so it should only be driven externally by an open drain signal. It must not be driven strong high.  UART2 Tx and Rx may be used to examine debug information.  HEALTH indicates successful operation of the RS500. Connection to an LED provides a visual indication of whether or not an error condition exists.  STATUS provides an indication when the RS500 is in active mode (for example, inventorying tags). Connection to an LED provides a visual indicator of the device’s activity. Optional connections: Revision 1.1, Copyright © 2014, Impinj, Inc. 5

 GPIOs allow interaction with the RS500 as both digital inputs and outputs. They may be used to trigger inventory, generate events based on inventory activity, or provide general-purpose user-controlled digital I/O.  WKUP provides a mechanism to wake up the RS500 from the low power Sleep mode. WKUP is also used to force entry into the Impinj firmware bootstrap. If unused, this pin should be tied to logic low.  UC_ADC allows use of an ADC to convert an analog input voltage into a digital value.  UC_DAC allows use of a DAC to generate an analog output voltage from a digital value.  BOOT0 provides access to the built-in bootloader in case the Impinj firmware is corrupted. For more details on the built-in bootloader, please contact Impinj support. No connect:  SWCLK and SWD connections are reserved for Impinj use only. 6 Revision 1.1, Copyright © 2014, Impinj, Inc.

4 Electrical Specifications 4.1 Absolute Maximum Ratings The absolute maximum ratings (see Table 5-1) define limitations for electrical and thermal stresses. These limits prevent permanent damage to the Indy RS500. Operation outside maximum ratings may result in permanent damage to the device. Table 5-1: Indy RS500 – Absolute Maximum Ratings Parameter Min. Max. Unit Conditions Supply voltage -0.3 5.5 V VDC_IN pin relative to GND IO voltage -0.3 4.0 V Non-VDC_IN pin voltages relative to GND RF input power - +23 dBm Incident to pin 1 (RF) Storage temperature -30 +100 ºC Humidity - 95 % RH Non-condensing Revision 1.1, Copyright © 2014, Impinj, Inc. 7

Parameter Min. Max. Unit Conditions ESD immunity - 2 kV Human-body model, all I/O pads Indy RS500 from open trays must be baked Package moisture before going through a standard solder - - - sensitivity level 3 reflow process (48 hours at 125 ºC or 24hrs at 150 ºC) 4.2 Operating Conditions This section describes operating voltage, frequency, and temperature specifications for the Indy RS500 during operation. Table 5-2: Indy RS500 – Operating Conditions Parameter Min. Max. Unit Conditions Supply 3.6 5.25 V VDC_IN relative to GND Temperature -20 +70 ºC Ambient Temperature Frequency 902 928 MHz IPJ-RS500-GX, See section 5.6 for regional support Frequency 865 868 MHz IPJ-RS500-EU, See section 5.6 for regional support 4.3 Device Functional Specifications Table 5-3: Indy RS500 – Supply Current Specifications Parameter Typ. Unit Description Supply Current Current consumed by RS500 via VDC_IN pin Active mode - 5V 510 mA +23 dBm transmit power supply – GX Inventorying tags Active mode - 5V 580 mA +23 dBm transmit power supply - EU Inventorying tags Active mode - 570 mA +23 dBm transmit power 3.6V supply Inventorying tags Idle mode – 50 mA Ready to receive IRI packets. Lower latency to return low latency to Active mode. Idle mode – 15 mA Ready to receive IRI packets. standard latency Standby mode 1 mA GPIO activity or WKUP rising edge required to wakeup part. Sleep mode <100 µA WKUP rising edge required to wakeup part. 8 Revision 1.1, Copyright © 2014, Impinj, Inc.

Table 5-4: Indy RS500 – Startup and Wakeup Time Parameter Min. Typ. Max. Unit Description Startup Time 200 ms Time to receive IRI packets after power supply or nRST pin initiated startup Wakeup Time Time to receive IRI packets after wakeup event Standby 50 ms GPIO activity or WKUP rising edge required to wakeup part. Sleep 200 ms WKUP rising edge required to wakeup part. 4.4 UHF Gen 2 RFID Radio Specifications Table 5-5: Indy RS500 – RF Receiver Specifications Parameter Min. Typ. Max. Unit Conditions Frequency 902 928 MHz IPJ-RS500-GX, See section 5.6 for regional support Frequency 865 868 MHz IPJ-RS500-EU, See section 5.6 for regional support Input impedance 50 Ω Input match -10 dB S11 1% PER, assuming 15dB antenna RL at 23dBm Rx sensitivity -65 dBm output Table 5-6: Indy RS500 – RF Transmitter Specifications Parameter Min. Max. Unit Notes Tx Power 10 23 dBm Meets worldwide regulatory constraints (except Japan) Tx Power 10 20 dBm Meets Japan regulatory constraints Tx Power Error 18-23 dBm -0.5 0.5 dB Difference between desired Tx power and actual Tx 13-18 dBm -1.0 1.0 dB power. 10-13 dBm -2.0 2.0 dB Tx ACPR 1st Adjacent -25 dBch Refer to Gen 2 dense-interrogator transmit mask 1st Alternate -55 dBch spec for definition of channel bandwidths and measurement regions. 2nd Alternate -65 dBch Return Loss 0 dB No damage into open RF port at 23 dBm at any phase angle Frequency 902 928 MHz IPJ-RS500-GX, See section 5.6 for regional support Frequency 865 868 MHz IPJ-RS500-EU, See section 5.6 for regional support Revision 1.1, Copyright © 2014, Impinj, Inc. 11

4.5 Device Input and Output Specifications Table 5-7: Indy RS500 – Digital Interface Specification Parameter Min. Typ. Max. Unit Conditions nRST VIL -0.3 0.8 V VIH 2 3.6 V Hysteresis voltage 200 mV Internal pull-up resistor 25 40 55 kΩ Reset pulse width 25 µs BOOT0 VIL 0.0 0.6 V VIH 0.62 3.6 V Hysteresis voltage 300 mV WKUP VIL -0.3 1.0 V VIH 1.8 3.6 V Hysteresis voltage 200 mV Internal pull-down resistor 25 40 55 kΩ Digital inputs VIL -0.3 1.0 V VIH 1.8 3.6 V Hysteresis voltage 200 mV Pull-up and pull-down resistor 25 40 55 kΩ Digital outputs VOL 0.0 0.4 V VOH 2.7 3.6 V Drive current (sink or source) 8 mA UART Baud rate 115.2 kbaud Parity None 10 Revision 1.1, Copyright © 2014, Impinj, Inc.


Table 5-8: Indy RS500 – Analog Interface Specification Parameter Min. Typ. Max. Unit Conditions ADC (Pin 13) Resolution 12 Bits Conversion voltage range 1 3.3 V Sampling rate 0.05 1 MSPs Total conversion time 1 18 µsec Power-up time 1 µsec External input impedance 50 kΩ Sampling switch resistance 1 kΩ Internal sample and hold 8 pF capacitance Total unadjusted error ±3.3 ±4 LSB Offset error ±1.9 ±2.8 LSB Gain error ±2.8 ±3 LSB DNL error ±0.7 ±1.3 LSB INL error ±1.2 ±1.7 LSB DAC (Pin 16) Resolution 12 Bits Resistive load with buffer ON 5 kΩ Impedance output with buffer OFF 15 kΩ When the buffer is OFF, the minimum resistive load between DAC_OUT and VSS to achieve 1% accuracy is 1.5 MΩ. Capacitive load 50 pF Maximum capacitive load at the DAC_OUT pin when the buffer is ON Output voltage range 0.2 3.1 V DNL ±2 LSB INL ±4 LSB Offset ±10 mV Gain error ±0.5 % Settling time 3 4 µsec CLOAD < 50 pF & RLOAD > 5 kΩ 12 Revision 1.1, Copyright © 2014, Impinj, Inc.

4.6 Supported Regions Table 5-9: Indy RS500 – Regional Support Region SKU Argentina IPJ-RS500-GX Armenia IPJ-RS500-EU Australia (920-926 MHz) IPJ-RS500-GX Austria IPJ-RS500-EU Azerbaijan IPJ-RS500-EU Belgium IPJ-RS500-EU Bosnia and Herzegovina IPJ-RS500-EU Brazil (902-907 MHz) IPJ-RS500-GX Brazil (915-928 MHz) IPJ-RS500-GX Bulgaria IPJ-RS500-EU Canada IPJ-RS500-GX Chile IPJ-RS500-GX China (920-925 MHz) IPJ-RS500-GX Colombia IPJ-RS500-GX Costa Rica IPJ-RS500-GX Croatia IPJ-RS500-EU Cyprus IPJ-RS500-EU Czech Republic IPJ-RS500-EU Denmark IPJ-RS500-EU Dominican Republic IPJ-RS500-GX Estonia IPJ-RS500-EU Finland IPJ-RS500-EU France IPJ-RS500-EU Germany IPJ-RS500-EU Greece IPJ-RS500-EU Hong Kong (920-925 MHz) IPJ-RS500-GX Hungary IPJ-RS500-EU Iceland IPJ-RS500-EU Revision 1.1, Copyright © 2014, Impinj, Inc. 13

Region SKU India IPJ-RS500-EU Indonesia IPJ-RS500-GX Ireland IPJ-RS500-EU Israel IPJ-RS500-GX Italy IPJ-RS500-EU Japan (916-921 MHz) IPJ-RS500-GX Korea (917-921 MHz) IPJ-RS500-GX Latvia IPJ-RS500-EU Lithuania IPJ-RS500-EU Luxembourg IPJ-RS500-EU Macedonia IPJ-RS500-EU Malaysia (919-923 MHz) IPJ-RS500-GX Malta IPJ-RS500-EU Mexico IPJ-RS500-GX Moldova IPJ-RS500-EU Netherlands IPJ-RS500-EU New Zealand (921-928 MHz) IPJ-RS500-GX Norway IPJ-RS500-EU Oman IPJ-RS500-EU Panama IPJ-RS500-GX Peru IPJ-RS500-GX Philippines IPJ-RS500-GX Poland IPJ-RS500-EU Portugal IPJ-RS500-EU Romania IPJ-RS500-EU Russian Federation (916-921 MHz) IPJ-RS500-GX Saudi Arabia IPJ-RS500-EU Serbia IPJ-RS500-EU Singapore (920-925 MHz) IPJ-RS500-GX Slovak Republic IPJ-RS500-EU 14 Revision 1.1, Copyright © 2014, Impinj, Inc.

Region SKU Slovenia IPJ-RS500-EU South Africa (915-919 MHz) IPJ-RS500-GX Spain IPJ-RS500-EU Sweden IPJ-RS500-EU Switzerland IPJ-RS500-EU Taiwan (922-928 MHz) IPJ-RS500-GX Thailand IPJ-RS500-GX Turkey IPJ-RS500-EU United Arab Emirates IPJ-RS500-EU United Kingdom IPJ-RS500-EU United Sates IPJ-RS500-GX Uruguay IPJ-RS500-GX Venezuela IPJ-RS500-GX Vietnam (920-925 MHz) IPJ-RS500-GX 4.7 EPC Class-1 Generation-2 Operation Table 5-10: Indy RS500 – Link Profile Parameter Description Forward Link PR-ASK 25 µs Tari Reverse Link 250 kHz link frequency Miller, M=4 62.5 kbps data rate Table 5-11: Indy RS500 – Gen 2 Functionality Parameter Description Select Support for 2 Select commands Inventory FastID, TagFocus, Tag Population Estimate, Select, Session, and Target Access Read, Write, Lock, Kill, BlockPermalock, and QT Revision 1.1, Copyright © 2014, Impinj, Inc. 15

Table 5-12: Indy RS500 – Inventory Performance Parameter Min. Typ. Max. Unit Conditions Inventory Rate 130 Tags/sec 1 Tag with tag population estimate = 1 35 Tags/sec 1 Tag with tag population estimate = 16 50 Tags/sec 16 Tags with tag population estimate = 16 5 Impinj Radio Interface (IRI) The Indy RS500 uses IRI to enable communications; this is enabled with the IRI Tool Kit. The IRI Tool Kit includes documentation, IRI API, and sample C code. The IRI Tool Kit is intended to enable a broad set of host platforms due to its ease of use and portability. Communication with the RS500 via IRI occurs in two states: 1. Configuration (synchronous) a. All communications are commands and responses b. Start and Stop commands cause transition to the Listen state 2. Listen (asynchronous) a. Host is in a listening mode and polls to obtain tag reports Customer applications can be enabled on a variety of embedded systems with hosts ranging in size from small microcontrollers to large microprocessors. The IRI Tool Kit is structured to ease portability by separating platform specific code from functional reader operation; this is illustrated in Figure 6-1 below. Figure 6-1: Host and Reader Firmware Stack Host Key Customer Application (main.c) iri.h Provided by Impinj IRI C Toolkit (ITK_C/Library/*.h, *.c) platform.h Provided by Platform Interface customer (platform_*.c) IRI over UART RS500 16 Revision 1.1, Copyright © 2014, Impinj, Inc.

Please refer to the documentation included in the RS500 release package for complete details on communicating with the Indy RS500 using IRI. The latest Indy RS500 release package, which includes the IRI Tool Kit, can be downloaded at support.impinj.com. 6 Regulatory Information The Indy RS500 (IPJ-RS500) has been certified for modular operation by FCC and Industry Canada in certain specific configurations. Use of these IDs requires specific text be added to product labeling and product Hardware User’s Guides. See the Indy RS500 Hardware User’s Guide for more details on labeling specifics. 7 Package and Assembly Information This section provides mechanical drawings and critical dimensions needed for PCB layout and housing design, as well as SMT assembly information. 7.1 Package Mass The mass of the RS500 SiP is 4.6 grams. 7.2 Package Dimensions Package dimensions are shown in Figure 8-1 and Figure 8-2. All dimensions are in millimeters. Dimension tolerances (unless otherwise specified): X = 1.0 X.X = 0.5 X.XX = 0.25 X.XXX = 0.125 Hole = 0.075 Angular: MACH 0.5 Bend: 1.0 Degree Revision 1.1, Copyright © 2014, Impinj, Inc. 17

Table 8-1: RS500 Serial # Makeup Digits Meaning XX SKU code: 01 = GX 02 = EU ZZ Lot number WW Workweek produced YY Year produced AAAA Serial number within the lot Figure 8-2: RS500 Pin Dimensions (viewed from underneath package) Note. Callouts A and B show package markings that will vary depending on the manufacturing lot of the RS500 unit. 18 Revision 1.1, Copyright © 2014, Impinj, Inc.

7.3 PCB Footprint Recommended footprint copper and pastemask dimensions are shown in Figure 8-3 and Figure 8-5. Dimensions for the individual pads are shown in Figure 8-4 and Figure 8-6. Figure 8-3: RS500 Recommended Etched Copper Footprint – All Pads Revision 1.1, Copyright © 2014, Impinj, Inc. 21

Figure 8-4: RS500 Recommended Etched Copper Footprint – Single Pad 20 Revision 1.1, Copyright © 2014, Impinj, Inc.

Figure 8-5: RS500 Recommended Pastemask Footprint – All Pads 22 Revision 1.1, Copyright © 2014, Impinj, Inc.

Figure 8-6: RS500 Recommended Pastemask Footprint – Single Pad It is important to note that the optimal pad and stencil design results in a stencil aperture that is of a different shape than and that overhangs the etched pad. This design delivers the optimum amount of solder to the castellation of the SiP pad. Figure 8-7 depicts the pad/solder relationship. Figure 8-7: Recommended Solder Stencil Opening with Etched Pad for RS500 Revision 1.1, Copyright © 2014, Impinj, Inc. 23

7.4 SMT Reflow Information No-clean Type 3 Sn3Ag0.5Cu Solder Paste (Koki S3X58- M650) was used during Impinj’s testing of the Indy RS500. The solder manufacturer’s recommended reflow profile is shown in Figure 8-8. Figure 8-8: Recommended Solder Reflow Profile for the Indy RS500 24 Revision 1.1, Copyright © 2014, Impinj, Inc.

8 Document Change Log Table 9-1: Document Change Log Version Date Description 1.0 Initial version 1.1 4/30/2014 Package drawings updated Spec clarifications Regulatory information moved to Hardware User’s Guide Formatting updates Change log added 9 Notices Copyright © 2014, Impinj, Inc. All rights reserved. Impinj gives no representation or warranty, express or implied, for accuracy or reliability of information in this document. Impinj reserves the right to change its products and services and this information at any time without notice. EXCEPT AS PROVIDED IN IMPINJ’S TERMS AND CONDITIONS OF SALE (OR AS OTHERWISE AGREED IN A VALID WRITTEN INDIVIDUAL AGREEMENT WITH IMPINJ), IMPINJ ASSUMES NO LIABILITY WHATSOEVER AND IMPINJ DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATED TO SALE AND/OR USE OF IMPINJ PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY PATENT, COPYRIGHT, MASK WORK RIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT IS GRANTED BY THIS DOCUMENT. Impinj assumes no liability for applications assistance or customer product design. Customers should provide adequate design and operating safeguards to minimize risks. Impinj products are not designed, warranted or authorized for use in any product or application where a malfunction may reasonably be expected to cause personal injury or death or property or environmental damage (“hazardous uses”) or for use in automotive environments. Customers must indemnify Impinj against any damages arising out of the use of Impinj products in any hazardous or automotive uses. Indy is a trademark of Impinj, Inc. All other product or service names are trademarks of their respective companies. www.impinj.com Revision 1.1, Copyright © 2014, Impinj, Inc. 25

Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. FCC Caution:  Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.  This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This module can be used with T800 or similar platform with similar dimension, antenna location and RF characteristic. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed at the same location as tested in the certification filing, and the maximum antenna gain allowed for use with this device is 4.41 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. 3) For portable usage condition, this module has been SAR evaluated in T800 host with compliance result and can be used with this specific host as described in the certification filing. Other host or platform needs separate approval. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following: “Contains FCC ID: QYLRS500”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.


Document Created: 2016-09-20 10:27:26
Document Modified: 2016-09-20 10:27:26
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