User Manual

FCC ID: NKRIMS2

Users Manual

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FCCID_3561706

IMS2 module user manual Project Name: IMS2 Author: Wistron NeWeb Corporation Revision: 1.1 Revision Date: 2017/09/13 □ Normal □ Internal Use  Confidential □ Restricted Confidential 1 / 26

Product datasheet Contact Information Technical Support Website https://SupportIoT.wnc.com.tw Company Website www.wnc.com.tw Revision History Rev. # Author Summary of Changes Date 1.0 WNC First release 2017/07/14 Add FCC statement and manual information to 1.1 WNC 2017/09/13 the end user in the user manual □ Normal □ Internal Use  Confidential □ Restricted Confidential 2 / 29

Product datasheet © Wistron NeWeb Corporation THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC. LIMITATION OF LIABILITY THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT. FCC Statement Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:NKRIMS2”. Any similar wording that expresses the same meaning may be used. Manual Information to the End User The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. □ Normal □ Internal Use  Confidential □ Restricted Confidential 3 / 29

Product datasheet Contents Contact Information .......................................................................................................................... 2 Revision History ............................................................................................................................... 2 1 Product Features ...................................................................................................................... 6 1.1 Features Description ........................................................................................................... 6 2 Pin Definitions ......................................................................................................................... 8 2.1 LGA Module Pin Diagram .................................................................................................. 8 2.2 LGA Module Pin Definitions .............................................................................................. 8 3 Electrical Specifications......................................................................................................... 12 3.1 Electrical Operating Conditions ........................................................................................ 12 3.1.1 Detailed Information .............................................................................................. 12 3.1.2 Power Tree ............................................................................................................. 12 3.2 Control Interfaces .............................................................................................................. 13 3.2.1 Power-on Signal (TBD) ......................................................................................... 13 3.2.2 Wake-up Interface (TBD) ...................................................................................... 13 3.2.3 Reset Signal............................................................................................................ 14 3.3 UART Interface................................................................................................................. 14 3.4 UIM Interface .................................................................................................................... 15 3.5 I/O Characteristics............................................................................................................. 15 3.6 JTAG Interface .................................................................................................................. 17 3.7 Power Consumption .......................................................................................................... 17 3.8 RF Performance ................................................................................................................ 18 3.8.1 RF Pad Design ....................................................................................................... 18 3.8.2 RF Matching Guide ................................................................................................ 21 3.8.3 Interference and Sensitivity.................................................................................... 21 3.8.4 Band Support.......................................................................................................... 22 3.8.5 Bandwidth Support................................................................................................. 22 3.8.6 RF Transmission Specifications ............................................................................. 22 3.8.7 RF Receiver Specifications .................................................................................... 23 3.9 Temperature ...................................................................................................................... 23 3.10 LTE Power Saving Mode ................................................................................................ 23 3.11 Serial Number and IMEI ................................................................................................. 23 4 Mechanical Information ......................................................................................................... 25 4.1 Physical Dimensions ......................................................................................................... 25 4.2 Pin Dimensions ................................................................................................................. 25 4.3 Marking Information ......................................................................................................... 27 5 Packing Information............................................................................................................... 28 5.1 Packing Information .......................................................................................................... 28 5.2 Storage Conditions ............................................................................................................ 28 6 PCB Mounting Guidelines ..................................................................................................... 28 6.1 Mounting Considerations .................................................................................................. 28 7 Regulatory and Industry Approval ......................................................................................... 28 7.1 Certification Testing ......................................................................................................... 28 □ Normal □ Internal Use  Confidential □ Restricted Confidential 4 / 29


1 Product Features 1.1 Features Description The WNC IMS2 module includes the Sequans SQN3330 Cat. M1 baseband, a complete three LTE band (2/4/12) RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Release 13 specifications) and AT&T Wireless LTE Cat. M1 UE specifications. The architecture block diagram of the IMS2 is presented in Figure 1-1 below. Figure 1-1. IMS2 block diagram Table 1-1. General features of the IMS2 • JTAG • USIM General interfaces • GPIO • UART • LTE Band 2 Supported frequency bands • LTE Band 4 • LTE Band 12 Operating voltage • VCC (range from 3.3 V to 4.2 V) • LGA module Packaging • 104 pads (21.5 mm × 16.5 mm × 2.3 mm) • RoHS compliant • 3GPP compliant: –20 °C to +60 °C (ambient) Operating temperature • Operational: –40 °C to +85 °C (functional) □ Normal □ Internal Use  Confidential □ Restricted Confidential 6 / 26

Product datasheet Table 1-2. LTE-related features of the IMS2 Standards • 3GPP E-UTRA Release 13 compliance • One UL and one DL transceiver • Supports HD-FDD Duplexing • Category M1 UE • Normal cyclic prefix • Supports MPDCCH • Modulation - DL: QPSK, 16QAM PHY - UL: QPSK, 16QAM • All coding schemes corresponding to modulations • All channel coding (turbo-coding with inter-leaver, tail biting convolutional coding, block and repetition coding) and CRC lengths • All power control schemes and DL power allocation schemes • UEPCOP (from 3GPP Release 12) Power Saving Mode • Random access procedure in normal sub-frames • Scheduling request, buffer status reporting, and power headroom reporting MAC • Discontinuous reception (DRX, eDRX) with long and short cycles • Fast scanning • IPv4, IPv6 RLC • ARQ modes: UM, AM, and TM • Ciphering and deciphering: NULL, AES, SNOW 3G PDCP • Integrity and protection: AES, SNOW 3G • MIB and new SIB1bis RRC • Supports up to eight data radio bearers • NAS NAS and above • SMS over SG • LWM2M client □ Normal □ Internal Use  Confidential □ Restricted Confidential 7 / 29

Product datasheet 2 Pin Definitions 2.1 LGA Module Pin Diagram The IMS2 LGA module pin layout is illustrated below. Figure 2-1. IMS2 LGA module pin layout 2.2 LGA Module Pin Definitions The signals and all the related details are listed in the below table. Table 2-1. IMS2 module pin definition Pin No. Name Description 7 GND Ground 8 GND Ground 9 NC Not connected 10 GND Ground 11 GND Ground 12 GND Ground 13 GND Ground 14 GND Ground □ Normal □ Internal Use  Confidential □ Restricted Confidential 8 / 29

Product datasheet 15 Main antenna Main antenna port 16 GND Ground 17 GND Ground 18 GND Ground 19 GND Ground 20 GND Ground 21 NC Not connected 22 GND Ground 23 GND Ground 24 GND Ground 25 GND Ground 26 GND Ground 27 NC Not connected 28 GND Ground 29 GND Ground 30 GND Ground 37 Power Power 38 Power Power 39 Power Power 40 Power Power 41 Power Power 42 Power Power 43 NC Not connected 44 GND Ground 45 GND Ground 46 GPIO46 General purpose input/output 47 GPIO47 General purpose input/output 48 GPIO48 General purpose input/output 49 GPIO49 General purpose input/output 50 GND Ground 51 GND Ground 52 GPIO01 General purpose input/output 53 GPIO02 General purpose input/output 80 UART1_CTS Clear to send for UART 1 81 UART1_RTS Request to send for UART 1 82 UART1_Rx Receive for UART 1 83 UART1_Tx Transmit for UART 1 84 GND Ground 85 GND Ground □ Normal □ Internal Use  Confidential □ Restricted Confidential 9 / 29

Product datasheet 86 NC Not connected 87 NC Not connected 88 NC Not connected 89 GND Ground 90 GND Ground 91 GND Ground 92 UART0_CTS Clear to send for UART 0 93 UART0_TX Transmit for UART 0 94 UART2_TX Transmit for UART 2 95 UART0_RX Receive for UART 0 96 UART2_RX Receive for UART 2 97 UART0_RTS Request to send for UART 0 98 UART2_RTS Request to send for UART 2 99 UART2_CTS Clear to send for UART 2 FFF/FFH mode FFF/FFH mode switch; FFF is normal mode; FFH is for 100 switch design mode. 101 RFDATA5 RF control interface 102 RFDATA6 RF control interface 103 RFDATA7 RF control interface 130 ADC Analog-to-digital converter 131 ADC Analog-to-digital converter 132 GPIO08 General purpose input/output 133 UIM_VCC SIM card power 134 UIM DATA SIM card data line 135 UIM CLK SIM card clock line 136 UIM RESET SIM card reset line 137 UIM DETECT SIM card detect line 138 NC Not connected 139 GND Ground 140 GND Ground 141 WWAN_STATE Wireless WAN radio state 142 Power on Power on the module 143 WAKEUP_OUT Module wakes up host. 144 WAKEUP_IN Host wakes up module. 145 RESET Main reset line 146 VREF Reference logic voltage (1.8 V voltage) 201 JTAG TCK JTAG TCK 202 JTAG TDI JTAG TDI 203 JTAG TDO JTAG TDO □ Normal □ Internal Use  Confidential □ Restricted Confidential 10 / 29

Product datasheet 204 JTAG_TMS JTAG_TMS 205 JTAG_SRST_N JTAG_SRST_N 206 NC Not connected 208 GND Ground 209 GND Ground 210 GND Ground 211 GND Ground 212 GND Ground 213 GND Ground 214 GND Ground 215 GND Ground 216 GND Ground 217 GND Ground 218 GND Ground 219 GND Ground 220 GND Ground 221 GND Ground 222 GND Ground 223 GND Ground □ Normal □ Internal Use  Confidential □ Restricted Confidential 11 / 29

Product datasheet 3 Electrical Specifications 3.1 Electrical Operating Conditions 3.1.1 Detailed Information Table 3-1. Electrical operating conditions for the IMS2. Direction Minimum Typical Maximum VCC In 3.3 V 3.8 V 4.2 V IMS2 includes an integrated Power Manager enabling single and direct voltage supply from the battery and reducing the overall bill of materials. Layout Suggestion: Each power trace should possess sufficient line width to withstand its respective current listed in Table 3-2 below. Table 3-2. Power supply reference currency Net Name Current Value VCC(1–6) total TBD UIM_VCC TBD VREF TBD Note: Routing under a 1 A design is desired as it will result in more stable power. 3.1.2 Power Tree Figure 3-1 provides a representation of the power tree of the IMS2 LGA module Figure 3-1. IMS2 power tree □ Normal □ Internal Use  Confidential □ Restricted Confidential 12 / 29

Product datasheet 3.2 Control Interfaces This section describes the power-on/off, wake-up, and reset interface for controlling the module. 3.2.1 Power-on Signal (TBD) The POWER_ON signal is an active low input signal used to enable or disable the module. Do not toggle the PERST# pin during power-on. This signal has the highest priority among the wakeup, the alarm signal, and the digital control pins. There are three possible states of the module: • Module Off: VCC is not present. • Module Enabled: VCC is supplied, and the module is enabled. • Module Disabled: VCC is supplied, and the module is disabled. The state transitions are defined as follows: • When voltage is applied to VCC, the module shall enter the Module Disabled state. An input to the POWER_ON pin shall trigger the transition from the Module Disabled to the Module Enabled state. See Figure 6; a low pulse (tlow > 0s) on the POWER_ON pad will enable the module after VCC is applied. 3.2.2 Wake-up Interface (TBD) In applications where power consumption is a major factor in performance metrics (such as battery-operated sensors that are based on an IOT/M2M modem solution and also include a third-party host), definitions are necessary for a simple interface that will enable both the modem and the host to enter low-power states whenever possible and the other side to wake it up once required. For example, if the host has no data to transmit or any other tasks, it may enter a low-power state according to its own capabilities and configurations. If during that period the host is in a low-power state and the modem suddenly receives data, it must wake-up the host. A similar requirement exists in the reverse case. For example, if the modem is in a low-power state and suddenly the host must transmit data, it must be able to wake- up the modem. The interface consists of two signals: One is triggered by the host and received by the modem; the other is triggered by the modem and received by the host. Each side can wake the other by toggling a wakeup signal high and enabling the □ Normal □ Internal Use  Confidential □ Restricted Confidential 13 / 29

Product datasheet other side to activate sleep mode when not needed by toggling it low. • “WAKEUP_IN” (Host: Output, Modem: Input): • LOW: SoC does not require the MODEM (allowing it to sleep). • HIGH: SoC requires the MODEM or acknowledges it is ready following a wakeup request from the MODEM. • “WAKEUP_OUT” (Host: Input, Modem: Output): • LOW: The MODEM does not require the Host (allowing it to sleep). • HIGH: The MODEM requires the Host or acknowledges it is ready following a wakeup request from the SoC. When the IMS2 module functions as a modem, keep WAKEUP_IN high before the system boot process is complete. After the system boot, maintain WAKEUP_IN in a low state. The WAKEUP_IN and WAKEUP_OUT operation in host mode will be discussed according to product specifications. 3.2.3 Reset Signal The Reset Signal is a hardware reset signal to control the system reset directly. The user can connect it to a key or a control signal. A low pulse after power on will reset the module. 3.3 UART Interface There are three UART interfaces; these interfaces are 4 bit for high-speed data transfer, and the UART definitions of IMS2 are shown in Figure 3-2. 1. UART0 for data 2. UART1 for debugging the DM tool and software upgrade 3. UART2 for the console Figure 3-2. UART connection (example) □ Normal □ Internal Use  Confidential □ Restricted Confidential 14 / 29

Product datasheet 3.4 UIM Interface IMS2 modules provide a UIM_DETECT input pin for UIM connectors to detect a UIM card. When a UIM card is present, UIM_DETECT should be high (1.8 V). If the UIM card is absent, UIM_DETECT should be low. This is required to pull UIM_DETECT to VREF with a 470 kΩ resistor. A 0.1 μF and a 33 pF capacitor are recommended to place between UIM_VCC and Ground in parallel. We recommend placing a 33 pF capacitor between UIM_RESET, UIM_CLK, and UIM_DATA and Ground in parallel. (Refer to Figure 5.) An electrostatic discharge (ESD) protection circuit is also recommended to place near the UIM socket as close as possible, and the Ground pin of the ESD protection component must be well connected to the Ground plane. The following figure illustrates an example UIM card circuit. The default configuration is active high. Figure 3-3. Example UIM card circuit 3.5 I/O Characteristics The voltage and current characteristics of the various IO pads of the IMS2 versus IO bank supply voltage are illustrated in Table 3-3 below. Table 3-3. DC characteristics for digital IOs, voltage 1.8 V - BIDIR and IN types Drive Parameter Min. Nom. Max. Unit Strength VIL VSS 0.3 × PVDD_1V8 V Input low voltage VIH 0.7 × PVDD_1V8 PVDD_1V8 V Input high voltage □ Normal □ Internal Use  Confidential □ Restricted Confidential 15 / 29

vOL VSS 0.2 x PVDD_1V8 V Output low voltage ~ vVOH Output high 0.8 x PVDD_1V8 PVDD_1V8 V voltage IRPU Input pull—up 15 uA resistor current RPU Input pull—up 32.4 kQ resistance IRPD Input pull—down 15 uA resistor current RPD Input pull—down 32.4 kQ resistance VH . 0.1 x PVDD_1V8 V Input hysteresis IPAD Input leakage P current, non— C —1 1 yA tolerant IOZ Off—state leakage 1 uA current 2 mA 1.11 mA IOL . 4 mA 2.25 mA Sink current at ce aig a VOL (max) m : m 12 mA 6.72 mA 2 mA 1.1 mA 4 mA 2.2 mA IOH 8 mA 4.4 mA Source current at VOH (max) 12 mA o Normal o Internal Use M Confidential o Restricted Confidential 16 /29

Product datasheet 3.6 JTAG Interface The IMS2 series contains one JTAG interface; leave JTAG pins floating if they are not used. Figure 3-4. JTAG schematic 3.7 Power Consumption This section describes the typical power consumption of the IMS2 (for reference). Table 3-4. LTE power consumption Working Mode Conditions Result Airplane mode Only the module; no other devices TBD Power saving mode TBD TBD TBD TBD TBD TBD LTE Band2 working mode TBD TBD LTE Band4 working mode TBD TBD LTE Band12 working mode TBD TBD Powering on Conditions Result Peak power consumption Power consumption peak when the TBD module is powering on □ Normal □ Internal Use  Confidential □ Restricted Confidential 17 / 29

Product datasheet Power off Conditions Result Power off consumption The module is powered off. TBD 3.8 RF Performance Each IMS2 module has only one RF pad; developers must connect it via 50 Ω traces to the main board. Main antenna pad (Pin15) – Primary RX/TX path 3.8.1 RF Pad Design We recommended that a ground not be present under the surface of the RF pads in the layout. Details are included below. Layer2 has the same exclusion area as Layer1. Figure 3-5. Sample RF pad layout □ Normal □ Internal Use  Confidential □ Restricted Confidential 18 / 29

Product datasheet The RF trace between RF pads and antenna should as shorter as possible with 50ohm characteristic impedance. The characteristic impedance depends on the dielectric of PCB, the track width and the ground plane spacing. Microstrip type is required. The detail simulation as below. □ Normal □ Internal Use  Confidential □ Restricted Confidential 19 / 29

Product datasheet The antenna should be 50ohm characteristic impedance with the return loss of better than -10dB at the operation band. The antenna gain would affect the radiated power and regulator test result. □ Normal □ Internal Use  Confidential □ Restricted Confidential 20 / 29

_ Product datashect 3.8.2 RF Matching Guide 1. Reserve the matching circuit as depicted in the topological structure below. The impedance (§11) should be close to 2. The matching circuit should be as close 50 Q, VGWR < 1.5. to the module as posgible. Primary Antenna RF connector L Antenna O PinS RF.A1 I M Sz matching modu|e Figure 3—6. RF matching guide 3.8.3 Interference and Sensitivity This section includes tips to help developers identify interferences that may affect the IMS2 module when used in systems. E Interference from other wireless devices ——Harmonics, inter—modulated signals generated from wireless devices within the RX ranges of the modules may result in degraded RX performance. — We highly recommend checking the RX performance of entire systems within the shielding environment. E Interference from the host interface — High—speed signal—switching elements in systems can easily couple noise into the module (ex.: DDR memory, LCD modules, DC—DC converters, PCM signals). M Methods to avoid sources of interference — Antenna location is important; we recommend directing the antenna away from high—speed switching signals. Furthermore, the trace from the module to the antenna should be as short as possible and must be shielded by complete grounding. —The IMS2 module is well shielded; high—speed elements (Ex.: DDR memory, LCD modules, DC—to—DC converters, PCM signals) on a system should have shielding reserved during the early stages of development. o Normal o Internal Use M Confidential o Restricted Confidential 21 /29

Product datasheet 3.8.4 Band Support Table 3-5. Band support Band Uplink (MHz) Downlink (MHz) LTE Band 2 1,850–1,910 1,930–1,990 LTE Band 4 1,710–1,755 2,110–2,155 LTE Band 12 699–716 729–746 3.8.5 Bandwidth Support Table 3-6. Bandwidth support Bandwidth Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz LTE Band 2 - -     LTE Band 4 - -     LTE Band 12 - -   - - Note: The IMS2 supports 1.4 MHz and 3 MHz (not default settings). 3.8.6 RF Transmission Specifications Table 3-7. Conductive Tx output power Band Items Parameter Unit Min. Typ. Max. LTE Band 2 Max. TX Power 20 MHz 1 RBs/QPSK dBm 20.3 23 25.7 LTE Band 4 Max. TX Power 20 MHz 1 RBs/QPSK dBm 20.3 23 25.7 LTE Band 12 Max. TX Power 10 MHz 1 RBs/QPSK dBm 20.3 23 25.7 Notes: 1.The RF transmission specification is defined at the LGA pad. 2. IMS2 fulfills 3GPP test standards. □ Normal □ Internal Use  Confidential □ Restricted Confidential 22 / 29

Product datasheet 3.8.7 RF Receiver Specifications Table 3-7. Conductive Rx sensitivity-3GPP Band Items Parameter Unit Min. Typ. Max. L R 5 d –99.5 T X M B E Hz m S wit B e h4 a n RB n s s d i t 2 i v i t y LTE Band 4 RX Sensitivity 5 MHz with 4 RBs dBm –101.5 LTE Band 12 RX Sensitivity 5 MHz with 4 RBs dBm –98.5 Notes: 1. The RF receiver specification is defined at the LGA pad. 2. IMS2 fulfills 3GPP test standards. 3.9 Temperature • 3GPP compliance: –20 °C to +60 °C (ambient) • Functional: –40 °C to +85 °C • Storage: –40 °C to +85 °C 3.10 LTE Power Saving Mode Note: Details will be provided in a future revision of this document. 3.11 Serial Number and IMEI Serial number and IMEI data can be written to the module only once; these two data □ Normal □ Internal Use  Confidential □ Restricted Confidential 23 / 29

Product datasheet points cannot be rewritten on the SQN3330 platform. □ Normal □ Internal Use  Confidential □ Restricted Confidential 24 / 29

Product datasheet 4 Mechanical Information 4.1 Physical Dimensions Device dimensions illustrated in Figure 4-1 and Figure 4-2 below. Figure 4-1. Top view Figure 4-2. Right view 4.2 Pin Dimensions The dimensions are illustrated in Figure 4-3, Figure 4-4, and Figure 4-5 below. Figure 4-3. PIN dimensions (bottom view) □ Normal □ Internal Use  Confidential □ Restricted Confidential 25 / 29

Product datasheet Figure 4-4. PIN dimensions Figure 4-5. PIN dimensions □ Normal □ Internal Use  Confidential □ Restricted Confidential 26 / 29

Product datasheet 4.3 Marking Information Note: Details will be provided in a future version of this document. □ Normal □ Internal Use  Confidential □ Restricted Confidential 27 / 29

Product datasheet 5 Packing Information 5.1 Packing Information The module is delivered in tape-and-reel based on MPQ. Note: Module packing details will be provided in a future revision of this document. 5.2 Storage Conditions Note: Details will be provided in a future revision of this document. 6 PCB Mounting Guidelines 6.1 Mounting Considerations This section details the recommended reflow profile when the module is mounted onto other boards. Note: Details will be provided in a future revision of this document. 7 Regulatory and Industry Approval 7.1 Certification Testing PTCRB, FCC, and AT&T TA 7.2 GP Compliance RoHS (2011/65/EU) □ Normal □ Internal Use  Confidential □ Restricted Confidential 28 / 29

Product datasheet Initialisms Initialisms and Definitions Initialism Definition AC Alternating Current DC Direct Current ETSI European Telecommunications Standards Institute GND Ground GPIO General Purpose Input Output I/O Input/Output IoT Internet of Things I2C Inter-Integrated Circuit LGA Land Grid Array LTE Long Term Evolution N/A Not/Applicable OS Operating System PIN Personal Identification Number SIM Subscriber Identity Module SPI Serial Peripheral Interface UART Universal Asynchronous Receiver-Transmitter UIM User Identity Module USB Universal Serial Bus Vref Voltage reference WNC Wistron NeWeb Corporation □ Normal □ Internal Use  Confidential □ Restricted Confidential 29 / 29


Document Created: 2017-09-13 15:19:15
Document Modified: 2017-09-13 15:19:15
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