user manual

FCC ID: 2AOFDLSD4BT-K5X

Users Manual

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FCCID_4216551

LSD4BT-K53x K53BLEmesh Standard Module (PCB Antenna) K53 series of low-power Bluetooth module is a high-performance Bluetooth module which is developed based on the Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts the stamp-type and side plug-in interfaces, is exquisite and compact, is fully lead out via ports and convenient to use, and helps the users omit the complicated RF hardware design, development and production links. Therefore, the users can easily realize the development of Bluetooth application programs on that basis, shorten the R&D cycle, and seize the market opportunities. This model is a pure hardware module that excludes any software. If you need the edition with software, please notify in advance. Product Characteristics ·Communication Interface ·Working Frequency Band - 2 PWM / 4 GPIO / 1 UART （ Pin - Working frequency band: 2402-2480MHz multiplexing） ·Ultra-low Power Consumption - Support 2.7V-3.6V power supply Applicable Scenes - Emission current: ≤20mA (10dBm power - Smart phone and tablet peripherals; configuration) - Bluetooth remote control; - Receiving current: ≤7.5mA (overall current) - Sports and health tracking, health care; - Sleep current: 400nA (SRAM not saving) - Wearables; ·High-link Budget - Smart light control, smart home, smart - Sensitivity-96dBm±1dBm (1Mbps, PER<30.8%) city; - Emission power: Max.12dBm - Logistics transportation tracking; ·Memory Resources - Consumer electronics; - Internal 512kB Flash (the capacity that - Building automation the client can actually use is less than - Industrial control 512kB) - 48kB on-chip SRAM, wherein 32kB can sleep and save ·Compatibility - Designed interface mode with side plug-in and stamp holes compatible ·Mesh Functions - Support BLE - Support the Bluetooth SIG Mesh - Support the exclusive Mesh of Telink 1 / 15

Thanks for choosing Lierda products. Please read through this Manual before using the products. By using the products, you have understood and accept the terms and instructions in this Manual. Lierda Science & Technology Co., LTD reserves all legal rights to revise and explain the terms and information provided, without prior notices. Zhejiang Lierda IoT Technology Co., Ltd provides this document to support the product design of users. Users should design their products according to the specifications and parameters provided in the document.Lierda shall not bear any liability for personal injury or property loss caused by improper operation of users. Lierda has the right to update the document without notice. The copyright of this document belongs to Lierda . Any person who reproduces and copy this document without permission of our company will bear legal responsibility. Copyright © Lierda Science & Technology Group Co.,Ltd reserves all rights. Revision History Version Date Author Major Changes 1.00 2018/12 RenFei Zuo Preliminary release 2 / 15

ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES  The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.  The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC ID: 2AOFDLSD4BT-K5X ”. Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and(2)this device must accept any interference received, including interference that may cause undesired operation.”  The module is limited to installation in mobile or fixed applications. Separate approval is required for all other operating configurations, including portable configuration with respect to Part 2.1093 and different antenna configurations.  A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end‐use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC application filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together. This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product incluld the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user of the final host device. 3 / 15

CONTENTS 1 Specifications & Parameters .................................................................................................................. 5 2 Dimensional Drawing and Pin Definitions........................................................................................... 5 2.1 Dimensional Drawing................................................................................................................. 6 2.2 Pin Definitions............................................................................................................................ 7 3 Basic Operations.................................................................................................................................... 8 3.1 Pins..............................................................................................................................................8 3.2 Notices to Hardware Layout....................................................................................................... 8 3.3 Antenna Clearance...................................................................................................................... 8 4 Common Problems.............................................................................................................................. 10 4.1 Communication Failure of Module in Near Distance.............................................................. 10 4.2 Abnormal Power Consumption of Module.............................................................................. 10 4.3 Insufficient Communication Distance of Module.................................................................... 10 4.4 Module Authentication............................................................................................................. 10 5 Production Guide................................................................................................................................. 12 5.1 Production Guide...................................................................................................................... 12 5.2 Requirements on Module Position on Bottom Plate................................................................ 12 5.3 Opening Design of Steel Mesh................................................................................................. 12 5.4 Standard Operation Procedure (SOP) of Reflow Soldering.....................................................13 6 Packaging............................................................................................................................................ 14 6.1 Packaging material....................................................................................................................14 6.2 Package size.............................................................................................................................. 14 6.3 Packaging direction...................................................................................................................15 4 / 15

1 Specifications & Parameters Table 1-1 Limit Parameters of Module Performance Parameters Remarks Min Max All AVDD and DVDD with Supply voltage （V） -0.3 +3.6 same voltages Max voltage of input pins -0.3 VDD+0.3 Storage temperature（℃） -65 150 Table 1-2 Working Parameters1 of Module Performance Parameters Remarks Min TYP Max Supply voltage（V） 2.7 3.3 3.6 Work temperature（℃） -40 - 85 Initial frequency tolerance -30 - +30 Below 25℃ (KHz) Work frequency (GHZ) 2.402 - 2.480 Support customized frequency setting Transmit 17 18 20 Output power 10dBm，system timer 16MHz (mA) 5.5 6.8 8 Output power 0dBm，system timer 16MHz Power Receive 5.5 6.5 7.5 Overall current consumption (mA) Sleep - 0.15 1 Deep sleep, not save SRAM (uA) Transmit power can be configured Transmit power (dBm) -25 10 - through software RSSI (dBm) -95 -96 - 1Mbps，PER<30.8% Communication protocol BLE5/4.2/Mesh Interface type stamp /side inserted Dimensional accuracy GB/T1804-C level Meet the dimensional tolerance class C 2 Dimensional Drawing and Pin Definitions The physical diagram of LSD4BT-K53ASTD001 is as shown in Fig. 2-1. There will be a label on the shield cover, and it shall be subject to the physical product. 1 The test is conducted at 25℃ in a shielded room environment. 5 / 15

P1 P26 P26 P1 P10 P17 P10 P11 P16 P16 P11 Fig. 2-1 Physical Diagram of LSD4BT-K53ASTD001 * When this product is being designed, the resistance capacitor and PCB have optional material models, so their colors of appearance may be different on the premise that the performance requirements are met, and shall be subject to the physical products; the main materials (main chip, crystal oscillator, etc.) do not have substitute models, and any change of them will be notified in advance. 2.1 Dimensional Drawing Chassis Soldering Fig. 2-2 Dimensional Drawing of LSD4BT-K53ASTD001 6 / 15

2.2 Pin Definitions Table 2-1 Pin Definitions2 PIN Pin Name Description P1 GND Ground P2 ANT RF signal/ANT P3 GND Ground P4 RST Power on reset ,active low P5-P13 NC P14 SWS/UART_RTS/PA<7> Single wire slave / UART_RTS / GPIO PA[7] P15 GND Ground P16 VCC 3.3V power supply for module internal circuit P17 VCC 3.3V power supply for module internal circuit P18 GND Ground P19 SWS/UART_RTS/PA<7> Single wire slave / UART_RTS / GPIO PA[7] PWM3_N/UART_RX/sar_aio<9>/ PWM3 inverting output / UART_RX / SAR ADC P20 PC<5> input / GPIO PC[5] PWM43/UART_TX/sar_aio<1>/ PWM4 output / UART_TX / SAR ADC input / P21 PB<1> GPIO PB[1] P22 The same as P21 The same as P21 PWM34/UART_RX/sar_aio<0>/ PWM3 output / UART_RX / SAR ADC input / P23 PB<0> GPIO PB[0] P24 GND Ground P25 The same as P21 The same as P21 P26 The same as P23 The same as P23 Note: This module is pin-multiplexed.that is, P21, P22, and P25 are the same output port,P23 and P26 are the same output port. This module can output 2 PWM. 2 For the specific functions of the multiplex pin, please refer to the Datasheet for TLSR8250F512 3 pin-multiplexed, P21, P22, and P25 are the same output port,PWM4 output 4 pin-multiplexed, P23, and P26 are the same output port,PWM3 output 7 / 15

3 Basic Operations 3.1 Pins When using the module, please choose the IO pin and carry out single-wire burning to the module according to the actual application. It is suggested leaving VCC, GND and SWS on the bottom plate for burning. Fig. 3-1 Typical Application Circuits 3.2 Notices to Hardware Layout 1． Try to shorten the wire from the RF outlet to the antenna pad, lay the 50Ω impedance wire, surround the wire with copper foil which is grounded, and form as many as possible through holes around the wire. 2． If permitted, add the π circuit from the RF outlet to the antenna pad. 3． Make sure the surrounding environment of the antenna is clear, and at least leave a 5mm clearance area. 4． Pay attention to the grounding quality, and large-area pavement is recommended. 5． Keep off the high-voltage circuits, high-frequency switches and other circuits. 3.3 Antenna Clearance When using the PCB antenna of our company’s module, the following three schemes for the layout of the RF clearance area are recommended. Usually, the RF performance of the module under Scheme 1 (The PCB antenna is outside the board frame) is better than that of the module under Scheme 2 (The PCB antenna is placed along the board side and its lower part is hollowed), and the RF performance of the module under Scheme 2 is better than that under Scheme 3 (The PCB antenna is placed along the board side and is not clad with copper), i.e. Scheme 1 ≥ Scheme 2 ≥ Scheme 3. 8 / 15

Scheme 1: The PCB antenna is outside the board frame Fig. 3-2 The PCB antenna is outside the board frame Scheme 2: The PCB antenna is placed along the board side and its lower part is hollowed Fig. 3-3 The PCB antenna is placed along the board side and its lower part is hollowed Scheme 3: The PCB antenna is placed along the board side and is not clad with copper Fig. 3-4 The PCB antenna is placed along the board side and is not clad with copper 9 / 15

4 Common Problems 4.1 Communication Failure of Module in Near Distance  Make sure the sending and receiving configuration is consistent, because inconsistent configuration will disenable normal communication.  Abnormal voltage: Too low voltage will lead to abnormal sending.  Low battery: when in low battery, the voltage will be reduced at the time of sending which will cause abnormal in sending.  Abnormal antenna soldering, RF signal failed to reach the antenna or wrong soldering of π circuit. 4.2 Abnormal Power Consumption of Module  The module is damaged due to such reasons as static electricity, resulting in abnormal power consumption.  When in receiving at low power, the power consumption of the module does not achieve the expected effect due to the inaccuracy of timing configuration, etc.  The power consumption of the module fluctuates when the working environment is adverse and in such extreme environments as high temperature and humidity, as well as low temperature. 4.3 Insufficient Communication Distance of Module  The antenna impedance is not well matched, so the emission power is very low.  Serious signal attenuation due to metal and other things around the antenna or because the module is in the metal.  Near communication distance of the module due to other interference signals in the testing environment.  Abnormal emission power due to not enough power supply.  The testing environment is adverse, especially the humidity greatly attenuates the 2.4G signals.  The module goes through the wall and other environments and then communicates with the other end, the wall greatly attenuates the signals; most signals go around the wall, so the signals are greatly attenuated.  The module is too close to the ground, absorbed and reflected, and thus the communication effect is worse. 4.4 Module Authentication This module has been certified by SRRC (China) and FCC (United States). CMIIT ID number is xxxxxxxx, and FCC ID number is 2AOFDLSD4BT-K5X. Three display modes of CMIIT ID and FCC ID are provided. The first shield laser scheme is defaulted. 1.Shield shield laser: display module product serial number, CMIIT ID, FCC ID, RoHS logo, lierda registered trademark, CE certification logo, etc., with shield as the specific criterion; 2.Back label: display module product serial number, CMIIT ID, FCC ID, module P/N, lierda registered trademark, etc, specific to the manufactured product; 10 / 15

Fig. 4-1 Back label 3.Display by the terminal device ： The SRRC ID, FCC ID, etc, can be referenced by the terminal device according to relevant standards. FCC Statement： This device complies with part 15 of the FCC rules Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help - This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. RF Exposure Information and Statement : This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 11 / 15

5 Production Guide 5.1 Production Guide It is suggested processing SMT machine patch on the stamp tear sealing module, and finishing it within 24 hours after unpacking. Otherwise, please vacuumize and package again, so as to prevent the problem that the patch processing effect is poor due to damp. If there is a humidity indicator card in the package, it is suggested judging if the module needs to be baked according to the indication of the humidity card. The baking conditions are as follows: Baking temperature: 125℃±5℃; Alarm temperature: 130℃; SMT patch processing can be carried out after the product is cooled to < 36℃ under natural conditions. If the unpacking time exceeds 3 months, whether the product got damp shall be paid special attention to, because the gold immersion process of PCB may lead to the oxidation of the bonding pad when in excess of 3 months, and such problems as pseudo soldering and solder skips. In order to ensure the pass rate of reflow soldering, sampling 10% of products to carry out visual inspection and take the AOI test in the first time of patch processing is suggested, so as to ensure the reasonableness of furnace temperature control, device absorption mode, and placement method. During the whole production process, the operators at all stations must wear antistatic gloves. 5.2 Requirements on Module Position on Bottom Plate It is suggested that the thickness of liquid photosensitive solder resist at the module position on the bottom plate be less than 0.02mm, to avoid excessive thickness causing the module unable to be effectively contacted with the solder paste after being blocked up, thus affecting soldering quality. In addition, please make sure not to put other devices within 2mm around the module position on the interface board, so as to guarantee the maintenance of module. 5.3 Opening Design of Steel Mesh If the thickness of steel mesh on the bottom plate is selected by comprehensively considering the sealing type of the devices in the board in principle, pay close attention to the following requirements: The bonding pad of module can be locally thickened to 0.15~0.20mm, to avoid missing solder. 12 / 15

5.4 Standard Operation Procedure (SOP) of Reflow Soldering Note: This Standard Operation Procedure (SOP) is only applicable to lead-free operation and for reference only. Fig. 5-1 Standard Operation Procedure (SOP) of Reflow Soldering 13 / 15

6 Packaging 6.1 Packaging Material Tape and Reel Foam Electrostatic Bag 6.2 Package Siz Fig. 6-1 Package Size 14 / 15

6.3 Packaging Direction Fig. 6-2 Packaging Direction 15 / 15


Document Created: 2019-03-26 15:37:09
Document Modified: 2019-03-26 15:37:09
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