Data Sheet

FCC ID: 2AC23-WF75RL1510C

Cover Letter(s)

Download: PDF
FCCID_2997067

Y NL EO L US IA hk NT MT7601U m. DE .co FI 802.11 b/g/n single chip sac ON Preliminary datasheet o@ K C qia E yl. AT Version: 0.06 Release date: 2012-12-10 R DI FO ME © 2010 - 2012 MediaTek Inc. This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. Specifications are subject to change without notice. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL Document Revision History EO L US IA Revision Date Author Description 0.01 2012/03/30 Alex Lin First formal release 0.02 2012/08/13 Ben Lin 1. Change the thickness of the package to 0.8mm. hk NT 2. Update power consumption information 0.03 2012/08/21 Alex Lin Update bootstrap infomation 0.04 2012/8/26 Ben Lin Update thermal information 0.05 2012/9/27 Alex Lin 1. Fix pin order m. DE 2. Update POD 0.06 2012/12/10 Alex Lin 1. Correct pin description typo 2. Correct strapping option typo .co FI sac ON o@ K C qia E yl. AT R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 2 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL Table of Contents EO L US IA Document Revision History .................................................................................................................. 2 Table of Contents ................................................................................................................................... 3 hk NT 1 System Overview .......................................................................................................................... 4 1.1 General Descriptions ......................................................................................................... 4 m. DE 1.2 Features ............................................................................................................................... 4 1.3 Applications ........................................................................................................................ 5 .co FI 1.4 Block Diagram .................................................................................................................... 5 2 Product Descriptions ................................................................................................................... 6 sac ON 2.1 Pin Layout ........................................................................................................................... 6 2.2 PIN Description ................................................................................................................... 7 2.3 Strapping option ................................................................................................................... 9 o@ K C 2.4 Package Information ........................................................................................................... 10 2.4.1 QFN Packaging ................................................................................................. 10 2.5 Ordering Information ........................................................................................................ 12 qia E 2.6 TOP Marking Information ................................................................................................. 12 yl. AT 3 Electrical characteristics ........................................................................................................... 13 3.1 Absolute maximum rating ................................................................................................... 13 R DI 3.2 Recommended operating range ......................................................................................... 13 3.3 DC characteristics .............................................................................................................. 13 FO ME 3.4 Thermal characteristics ...................................................................................................... 13 3.5 Current consumption .......................................................................................................... 14 MediaTek Confidential © 2012 MediaTek Inc. Page 3 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL 1 System Overview EO L US IA 1.1 General Descriptions The MT7601U is a highly integrated Wi-Fi single chip which supports 150 Mbps PHY rate. It fully hk NT complies with IEEE 802.11n and IEEE 802.11 b/g standards, offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance. Optimized RF architecture and baseband algorithms provide superb performance and low power consumption. Intelligent MAC design deploys a high efficient DMA engine and hardware data m. DE processing accelerators which offloads the host processor. The MT7601U is designed to support standard based features in the areas of security, quality of service and international regulations, giving end users the greatest performance any time and in any circumstance. .co FI 1.2 Features sac ON  IEEE 802.11 b/g/n client  Embedded high-performance 32-bit RISC microprocessor  Highly integrated RF with 55nm CMOS technology o@ K C  1T1R mode with support of 150Mbps PHY rate  Integrate high efficiency switching regulator  Best-in-class power consumption performance  Compact 5mm x 5mm QFN40L package qia E  1/2/3/4-wire PTA Wi-Fi / Bluetooth coexistence support  802.11 d/h/k compliant yl. AT  Security support for WFA WPA/WPA2 personal, WPS2.0, WAPI  Supports 802.11w protected managed frames  QoS support of WFA WMM, WMM PS R DI  Supports Wi-Fi Direct  Fully compliance with USB v2.0 High-speed mode FO ME  Per packet transmit power control  Antenna diversity  Auto-calibration MediaTek Confidential © 2012 MediaTek Inc. Page 4 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL EO L 1.3 Applications US IA  Desk-Top PC  Note-book  TV hk NT  Blue-ray Disk  Tablet PC  Set-top box m. DE 1.4 Block Diagram .co FI RF RF_IN MAC / USB USB receiver Packet Baseband buffer / sac ON security RF_OUTP RF System engine GPIO/LED RF_OUTN transmitter control Figure 1 MT7601U block diagram o@ K C qia E yl. AT R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 5 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL 2 Product Descriptions EO L US IA 2.1 Pin Layout hk NT BG_EXTR XTAL_XO PLL_LDO VDDPST RF_LDO RF_LDO RF_LDO XTAL_XI GPIO0 VDD 40 39 38 37 36 35 34 33 32 31 m. DE RF_ LDO 1 30 GPIO1 RF_IN 2 29 GPIO2 RF_V33A 3 28 GPIO3 RF_OUTP 4 27 GPIO4 .co FI RF_OUTN 5 26 GPIO5 MT7601U RF_V33A 6 25 GPIO6 sac ON VDDPST 7 24 LDO_RST_N EE_MISO 8 23 PHASE EE_MOSI 9 22 DCDC_V33D EE_CLK 10 21 COMP o@ K C 11 12 13 14 15 16 17 18 19 20 FB PADP PADM VRES EEFL_CS LDO_V15A VDD USB_VDDA VOUT_1P2 DCDC_V33A qia E yl. AT Figure 2 Top view of MT7601U QFN pin-out. R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 6 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y 2.2 PIN Description NL EO L Default QFN40 Pin Name Pin description I/O Supply domain PU/PD US IA Reset and clocks 24 LDO_RST_N External system reset active low N/A Input VDDPST hk NT 37 XTAL_XI Crystal input or external clock input N/A Input 36 XTAL_XO Crystal output N/A Input USB interface m. DE 15 USB_VDDA USB 3.3V power supply N/A 16 VRES USB BG reference N/A 13 PADP USB D+ signal N/A In/out USB_VDDA .co FI 14 PADM USB D- signal N/A In/out USB_VDDA EEPROM/flash interface sac ON 8 EE_MISO External memory data input / Antenna select PD Input VDDPST 9 EE_MOSI External memory data output / Antenna select PD Output VDDPST 10 EE_CLK External clock PU Output VDDPST 11 EEFL_CS External chip select PU Output VDDPST o@ K C Programmable I/O 31 GPIO0 Programmable input/output / Bluetooth coexistence PD In/out 30 GPIO1 Programmable input/output / Bluetooth coexistence PD In/out VDDPST 29 GPIO2 Programmable input/output PD In/out VDDPST qia E 28 GPIO3 Programmable input/output / Bluetooth coexistence PD In/out VDDPST yl. AT 27 GPIO4 Programmable input/output / Bluetooth coexistence PD In/out VDDPST 26 GPIO5 Programmable input/output PD In/out VDDPST 25 GPIO6 Programmable input/output PD In/out VDDPST R DI WIFI radio interface 40 BG_EXTR RF BG reference N/A FO ME 2 RF_IN RF auxiliary RX input N/A 4 RF_OUTP RF port N/A 5 RF_OUTN RF port N/A PMU/SMPS 17 VOUT_1P2 LDO 1.2V output N/A Output 18 LDO_V15A SMPS 1.5V input N/A Iutput 19,22 DCDC_V33 SMPS 3.3V power supply N/A Input 20 FB SMPS control N/A MediaTek Confidential © 2012 MediaTek Inc. Page 7 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y 21 COMP SMPS control N/A NL 23 PHASE SMPS control N/A EO L Power supplies US IA 7,33 VDDPST Digital I/O power supply N/A Input 12,32 VDD Digital core power supply N/A Input N/A hk NT 3,6 RF_V33A RF 3.3V power supply Input 1,35, N/A RF _LDO RF power supply Input 38,39 34 PLL_LDO RF power supply N/A Input m. DE E-PAD DVSS Digital ground N/A Table 1 Pin descriptions .co FI sac ON o@ K C qia E yl. AT R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 8 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y 2.3 Strapping option NL EO L QFN40 Pin Name Pin description Default PU/PD XTAL_20_SEL US IA 8 EE_MISO XTAL is 20MHz: Pull up PD XTAL is 40MHz: Pull down 27 GPIO4 EXT_EE_SEL: Pull down PD hk NT 25 GPIO6 CHIP_MODE[2]: Pull down PD 10 EE_CLK CHIP_MODE[1]: Pull down PD 9 EE_MOSI CHIP_MODE[0]: Pull up PU Table 2 Strapping option m. DE .co FI sac ON o@ K C qia E yl. AT R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 9 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y 2.4 Package Information NL EO L 2.4.1 QFN Packaging US IA hk NT m. DE .co FI sac ON o@ K C qia E yl. AT R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 10 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL EO L US IA hk NT m. DE .co FI sac ON o@ K C qia E yl. AT R DI FO ME Figure 3 Package outline drawing MediaTek Confidential © 2012 MediaTek Inc. Page 11 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL EO L 2.5 Ordering Information US IA Part number Package Operational temperature range MT7601UN/A-L 5x5x0.8 mm 40-QFN -10~70°C hk NT Table 3 Ordering information 2.6 TOP Marking Information MTK m. DE .co FI MT7601UN : Part number MT7601UN DDDD : Date code DDDD-#### #### : Internal control code sac ON BBBBBBB : Lot number BBBBBBB o@ K C Figure 4 Top marking qia E yl. AT R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 12 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y NL 3 Electrical characteristics EO L US IA 3.1 Absolute maximum rating Symbol Parameters Maximum rating Unit hk NT VDD33 3.3V Supply Voltage -0.3 to 3.6 V VDD12 1.2V Supply Voltage -0.3 to 1.5 V VDD15 1.5V Supply Voltage -0.3 to 1.8 V TSTG Storage Temperature -40 to +125 °C VESD ESD protection (HBM) 2000 V m. DE Table 4 Absolute maximum ratings .co FI 3.2 Recommended operating range sac ON Symbol Rating MIN TYP MAX Unit VDD33 3.3V Supply Voltage 2.97 3.3 3.63 V VDD12 1.2V Supply Voltage 1.14 1.2 1.26 V VDD15 1.5V Supply Voltage 1.425 1.5 1.575 V o@ K C TAMBIENT Ambient Temperature -10 - 70 °C Table 5 Recommended operating range 3.3 DC characteristics qia E Symbol Parameter Conditions MIN MAX Unit VIL Input Low Voltage LVTTL -0.28 0.6 V yl. AT VIH Input High Voltage 2.0 3.63 V Schmitt Trigger Negative Going VT- 0.68 1.36 V Threshold Voltage LVTTL Schmitt Trigger VT+ 1.36 1.7 V Positive Going Threshold Voltage R DI VOL Output Low Voltage |IOL| = 1.6~14 mA -0.28 0.4 V VOH Output High Voltage |IOH| = 1.6~14 mA 2.4 VDD33+0.33 V RPU Input Pull-Up Resistance PU=high, PD=low 40 190 KΩ FO ME RPD Input Pull-Down Resistance PU=low, PD=high 40 190 KΩ Table 6 DC description 3.4 Thermal characteristics Performance Symbol Description TYP Unit TJ Maximum Junction Temperature (Plastic Package) 125 °C [1][2] ΘJA Junction to ambient temperature thermal resistance 48.11 °C/W ΘJC Junction to case temperature thermal resistance TBD °C/W MediaTek Confidential © 2012 MediaTek Inc. Page 13 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application

MT7601U Preliminary datasheet Confidential A Y [3] ΨJt Junction to the package thermal resistance 3.23 °C/W NL EO L Note: [1] Air flow condition: Natural convection. 0.5m/s. US IA [2] PCB dimension 21mm x 11mm. 4-layer. [3] 5mm x 5mm QFN40L package Table 7 Thermal information hk NT 3.5 Current consumption Performance Description TYP Unit m. DE Sleep mode 1.1 mA RX Active, HT40, MCS7 151 mA RX Power saving, DTIM=1 15 mA RX Listen .co FI 6 mA TX HT40, MCS7 @15dBm 210 mA TX CCK, 11Mbps @19dBm 242 mA sac ON Note: All result is measured at the antenna port and VDD33 is 3.3V Table 8 WLAN 2.4GHz Current Consumption o@ K C qia E ESD CAUTION yl. AT MT7601 is ESD (electrostatic discharge) sensitive device and may be damaged with ESD or spike voltage. Although MT5931 is with built-in ESD protection circuitry, please handle with care to avoid the permanent malfunction or the performance degradation. R DI FO ME MediaTek Confidential © 2012 MediaTek Inc. Page 14 of 14 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. loginid=yl.qiao@sac.com.hk,time=2012-12-21 09:16:35,ip=183.37.247.78,doctitle=MT7601_Data_Sheet_v0_06.pdf,company=silicon application


Document Created: 2012-12-21 09:16:35
Document Modified: 2012-12-21 09:16:35
© 2024 FCC.report
This site is not affiliated with or endorsed by the FCC