Technical Description

FCC ID: ZY9-BTS200M

Operational Description

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FCCID_3006563

Technical Description The Equipment-Under-Test (EUT) 4000764 is a Auvio Mono Bluetooth Speaker with AUX in. The EUT contains a Bluetooth 2.1 radio. The EUT can accept both analog audio signal (AUX-in) and wireless audio signal via Bluetooth devices. The EUT has internal power amplifier and loudspeaker. It is powered by USB port (5VDC) which is for charging the internal 3.7V rechargeable battery. Antenna Type: Internal, Integral Antenna Gain: 0dBi Operating mode Nominal Production Modulation Radiated Tolerance Type Field Strength Bluetooth 91.8 dBµV/m at 3m +/- 3dB GFSK 92 The main components are described below: IC2 (F-6188) is Bluetooth RF radio Module U50 (BK8000L) is 2.4GHz Bluetooth RF radio IC X10 is 26MHz crystal providing master clock for U50 U4 (25F04) is 4Mbit serial flash C9, C10 are antenna matching network IC3 (HT6871) is 3.4W power amplifier IC1 (TP4054) is battery charging IC

CH.NO.] FRE. \Hex Value CH.NO.| FRE. Hex Value CH.NO| FRE. _|Hex Value! CH.NOJ FRE. Hex Value CHO 2402MHe 0 CH2s 2028MKe 1A CHS2 245MMHe 3 CH73 2480MHe 45 chl 2403viHe L CH27 2429Me 1s CHS3 24S5MHe 35 CH2 2400MHe ; CH23 2430Me ic CHS4 24S6MHe 3 CH3 2405MiHe : CH29_| AGIMKe ID CHSS 2457MHe 37 CHd 2406MHe i CH30 2632Me 1t CHSG 2456MHe 3 CHS_| 2407MHe 5 CHsl_| 233MKe if CHS7 2450MHe 39 CH6 2408MHe 6 CHS2 A34ue 20 CHS3 2460MHe 34 CH7_| 2409MHe 7 CH33_| 2G5MRe 2l CHS9 2401MHe 36 CHB 2410MHe 8 CH34 AGoMHe 2 CHS0 2462MHe 3¢ ch9 241 IMHe 9 CHSS 237Mz 2 Chel 2463MHe En CHIO 2412MHe A chso 20G3MKe 2 CHG2 246tMHe 36 CHL 2413MHe B CHI7_| Ad39MKe 25 CH3 2405MHe 3r CHI2 |2414MHe c CH3 2650MKe 2 CHot 24G6MHe 40 CHI3 |2415MHe D CH39_| 2001MRe 27 CH6S 2407MHe 41 CHl4 24I6NH & CH4O 462Mz 2 CHss 24G8MHe 42 CHIS |2417iHe f CHdl 2M03MHe 2 CH7 2460MHe 43 Chio 2418MHe 10 CHd2_| 2044Wke 24 CHGS 2470MHe 4 cml7 |acowne| i1 ocms |asovne| 20 chco aaringe|__ 45 CHIB 220M(He 12 CHd 244GMEKe 2¢ CH70 2472MHe 46 ch19 22M(He 13 CHdS 2407MiKe 20 CH7 243viHe 47 CH20_| 2422MHe 14 Chido 2448MKe 25 CHT2 274MHe 48 CH2l_| 2023MHe 15 CHIT 2449MKe 2r CH73 2475VHe 49 CH22 220(He 16 CHdS 2450MKe 3 CH74 2476MHe 4h CH23 225M(He 17 CHd9 5TWe 31 CHTS 2477MHe 45 CH24 2420MHe 18 CHSO t52Me 32 CHG 2473MHe 4C CHS 207iHe 19 CHS1 AS3Me 3 CHT7 249MHe 4D

The Bluetooth module F—6188 manual —, Product overview: Intelligent wireless audio data transmission products F—6188 Bluetooth module for the independent development of our company, is the high price of stereo wireless transmission scheme of low cost, module uses BEKEN chip to provide the high quality and compatibility for the module, the overall better performance. F—6188 Bluetooth module with free driving mode, customers only need to access the application module products, wireless transmission can quickly realize the music, enjoy wireless music. =.,. Field of application: This module is mainly used for music transmission in short distance, can be connected with mobile phone and personal computer, conveniently, the connection between PDA and other digital products, enjoy bluetooth wireless transmission of music. % Bluetooth audio % Bluetooth stereo headset % hands—free phone The Bluetooth wireless audio transmission =. Essential qualities: Bluetooth Profiles % Bluetooth v2. I+EDR specification support K A2DPv1I. 2 K AVRCPvI. 0 K HFPvI. 5 JY], Performance parameters: Model F—6188 Bluetooth Bluetooth V2. 1 Ad: MBILTEANRERAH BBif : 0755—29179480/1, FAX: 0755—84736169 tihih: Bd EEEIIEAIT DLE A3 # /Ar) i: www.e—chip.com.cn

specification supply voltage DC2. 8—4. 2V Support Bluetooth HFPV1. 5, A2DPV1. 2, AVRCPV1I. 0 protocol working current <60mA standby current <500uA temperature range |—40°C to +85°C The wireless <10 meter tranmission range Transmission CLASS2, 4dbm power: sensitivity: —80dBm<O. 1%BER frequency range : 2. 4GHz—2. 480GHz External Port: 12C, SPI and UART interface audio performance SBCdecode The audio Signal to >75dB Noise Ratio: Module size 25X13. 5X1. 8MM 4. The size graph of the module : Ad: NTAAA IRAH tBif : 0755—29179480/1, FAX: 0755—84736169 thit:| Gdilt EEEIIEIIT NLE A3 # /Ar) i: www.e—chip.com.cn

5 . 7mm m 10.2m 66 i i Eo Ej 25.0mm <]————— DD6€: 11101111 un, Ad: MBILTEANRERAH BBif : 0755—29179480/1, FAX: 0755—84736169 tihih: Bd EEEIIEAIT DLE A3 # /Ar) i: www.e—chip.com.cn

7z, Module pin definition diagram i Eou GND N i RF a 6 ADC dhite niiels : : 3v3 TMS(GPIO19) CR R VBAT TCK(GPIO18) a m vseus TDO(GPIO21) o = = AUDIORN TDI(GPIO20 m m AUDIORP RSTN ME = =a N AUDIOLP MBISTEN Mim m z3 = ® RWEAauDioun GPI0OO(TX) j = i @UCBias GPIO1(RX) MICINP CPIO2 I guicinn GPIO3 LINL GPIO4 LINR GPIO5 GPI010 GND AGND +. Pin description Ad: MBILTIEAHRERAH i# : 0755—29179480/1, FAX: 0755—84736169 tihih: Bd EEEIIEAIT DLE A3 # /Ar) i: www.e—chip.com.cn

Fuicfltk Pin Symb 1/0 Description 1 RF_GND RF_GND RF_GND 2 ANT ANT ANT PORT 3 RF_GND RF_GND RF_GND 4 TMS (GPIO19) Digital 1/O JTAG pin 5 TCK (GPIO18) Digital 1/O JTAG pin 6 TDO(GPIO21) Digital 1/O JTAG pin T TDI (GPIO20 Digital 1/O JTAG pin 8 RSTN Digital 1/O JTAG pin / Reset pin—low active 9 MBISTEN Digital 1/O Memory bit check 10 GPIOO (TX) Digital 1/O UART TX 11 GPIOL (RX) Digital 1/O UART RX 12 GPIO2 Digital 1/O GPIO2 13 GPIO3 Digital 1/O GPIO3 14 GPIO4 Digital 1/O GPIO4 15 GPIO5 Digital 1/O GPIO5 16 GND GND Ground connect battery negative 17 AGND AGND Ground connect battery negative 18 GPIO10 Digital 1/O GPIO10 19 LINR AUX_INPUT LINR 20 LINL AUX_INPUT LINL 21 MICINN MIC— MICINN 22 MICINP MIC+ MICINP 23 MICBIAS MICBIAS MICBIAS 24 AUDIOLN Audio output Left channel audio output negative 25 AUDIOLP Audio output Left channel audio output positive 26 AUDIORP Audio output Right channel audio output positive 27 AUDIORN Audio output Right channel audio output negative 28 VBUS Charge port VBUS 29 VBAT Power supply Power supply 30 3VO Power 3. OV output 31 ADC Power ADC input 32 E4AE IRAHn tBif : 0755—29179480/1, FAX: 0755—84736169 thit:| Gdilt EEEIIEIIT NLE A3 # /Ar) i: www.e—chip.com.cn

JA,. Connection circuit notice;: The F—6188 module in the application process, please pay attention to avoid the influence of power amplifier, a boost circuit to avoid interference source module, module power supply circuit with high power circuit unit to form a series circuit, in order to improve the SNR Fu, Notice: A. About the Bluetooth wireless application environment, wireless signal includes a Bluetooth application are influenced by the surrounding environment, such as Wood, metal and other obstacles will be absorbed on the wireless signal, thus in the practical application, influence the distance of data transmission B. Because Bluetooth module to complete the existing system, placed in the shell. Because of the metal shell on the radio frequency signal Is a shielding effect. It is recommended not to install in a metal shell. C. PCB Layout: The antenna part of the Bluetooth module is the PCB antenna, the metal will weaken the function of antenna, while to the module layout, below the antenna module is prohibit paving and walk the line, if hollow out it is better 4. Application ciriuit: SctReemie menescem VeC o a F—alg 8 25 8 p P * + x ango is agl ANTEXT > | ; i\? vabe J T — | 9B 3. ov_out 49 liliinal T uy — 44 me/ortoig vaat L8 E> liglst e mK‘W\( 44 ter/crio18 vese |2 NT To mK‘W\, £4 mo/crrozi apptorx (22 AUDIO_RN fhey *— m 4 to1/ortoso aupro_rp L26._____«_—)] Aup10_RP lrteyame RESET( > — rery Aubto_LP .25____@ AUDIO_LP 44 uatsten Aubto_px (B4.—___—«—3] AUIDO_IN 1X )——————————H rx/eerc0 vie LBB_____¢773 MIC_BlaSs semnemniieinerer < wl Rerror wiop 22 ‘am| o ehRgas, * m LK 12 crrog wrex LBL____@—3) MIC_N fee B3 crros mey, ____«7 ABXLL se F4 crro4 rag _43 L AUX_R wore [>——HH cros crioun LE «7 Avx_DET -|E M54 cap [.-.xn-ll—h. Ad: MILTIEHRERAH i : 0755—29179480/1, FAX: 0755—84736169 tihih: Bd EEEIIEAIT DLE A3 # /Ar) i: www.e—chip.com.cn

I : | | ANT_EXT Notice: The module has built—in antenna, external antenna as the need increases MIC circuit: Ad: MBILTEANRERAH BBif : 0755—29179480/1, FAX: 0755—84736169 tihih: Bd EEEIIEAIT DLE A3 # /Ar) i: www.e—chip.com.cn

sW qiplgy MIC_BIAS ; _J'zKM MICP ; § lfiS %%:: MIC MIC_N | T é 1 1.2K 105 104 MIC Recommended M Specification:sensitivity—38dB/+—2dB DC2V working voltage Ad: MBILTEANRERAH BBif : 0755—29179480/1, FAX: 0755—84736169 tihih: Bd EEEIIEAIT DLE A3 # /Ar) i: www.e—chip.com.cn

BK8000L Datasheet v 0.2 BK8000L Bluetooth Audio SoC Datasheet Preliminary Specification Approvals Name Date Signature Beken Corporation 3A，1278 Keyuan Rd, Shanghai 201204, China PHONE: (86)21 5108 6811 FAX: (86)21 6087 1277 This document contains information that may be proprietary to, and/or secrets of, Beken Corporation. The contents of this document should not be disclosed outside the companies without specific written permission. Disclaimer: Descriptions of specific implementations are for illustrative purpose only, actual hardware implementation may differ. © 2014 Beken Corporation Proprietary and Confidential Page 1 of 14

Low Power Bluetooth Audio SoC v 0.2 Revision History Rev. Date Author(s) Remark 0.1 10/May/2014 Weifeng Initial Draft 0.2 5/June/2014 Weifeng Add 7x7 56-pin package to support SD- card 16/July/2014 Weifeng Release the word file to XZX © 2014 Beken Corporation Proprietary and Confidential Page 2 of 14

BK8000L Datasheet v 0.2 Contents 1. General Description......................................................................................................................4 1.1. Features ................................................................................................................................4 1.2. Applications .........................................................................................................................4 2. Pin Definition................................................................................................................................5 3. Functional Description .................................................................................................................7 3.1. GPIO.....................................................................................................................................7 3.2. PWM Timer and Watch Dog Timer...................................................................................8 3.3. Power Management.............................................................................................................8 3.4. MCU.....................................................................................................................................8 3.5. I2C and UART Interface.....................................................................................................8 3.6. FM Receiver Control Interface ...........................................................................................8 3.7. FLASH Access Interface ....................................................................................................9 3.8. SPI ........................................................................................................................................9 3.9. SAR ADC and LED ............................................................................................................9 3.10. Audio Peripheral..................................................................................................................9 4. Electrical Characteristics............................................................................................................10 4.1. Absolute Maximum Ratings .............................................................................................10 4.2. Recommended Operating Conditions ..............................................................................10 4.3. System LDO ......................................................................................................................10 4.4. Analog LDO/BUCK..........................................................................................................10 4.5. Digital LDO/BUCK ..........................................................................................................11 4.6. USB LDO...........................................................................................................................11 4.7. Typical Power Consumption ............................................................................................11 4.8. RF Characteristics .............................................................................................................11 4.9. Audio Characteristics ........................................................................................................12 5. Application Schematic ...............................................................................................................12 6. About the Qualification..............................................................................................................12 7. Package Information...................................................................................................................13 8. Ordering Information .................................................................................................................14 © 2014 Beken Corporation Proprietary and Confidential Page 3 of 14

Low Power Bluetooth Audio SoC v 0.2 l Bluetooth 2.1+EDR compliant 1. General Description l -92 dBm sensitivity for 2 Mbps mode and 5 dBm transmit power The BK8000L chip is a highly integrated l A2DP v1.2, AVRCP v1.0 and HFP v1.5 single-chip Bluetooth audio device. It profile integrates the high-performance transceiver, l Integrated 96 dB SNR stereo ADC and rich features baseband processor, and stereo DAC Bluetooth audio profile. The BK8000L cache based architecture enables it is fully l Five bands hardware equalizer programmable with any application, that it l Digital equalizer for stereo line in may be used for control and multimedia hybrid application. The internal dual stereo l Hardware accelerator for low power ADC converts the stereo line in input to l Full duplex hands-free speakerphone digital audio that enables the line in use the digital equalizer. Hardware equalizer and l Up to 250 mA charge controller accelerator offload the MCU, and make it suitable for low power headset application. 1.2. Applications 1.1. Features l Bluetooth stereo speaker l Bluetooth stereo headset l Operation voltage from 2.8 V to 4.2 V l Bluetooth control and multimedia hybrid I2C/ BIST Audio Audio UART DAC ADC MCU 16 KB LED Audio(inc. DTMF) with I-Cache JTAG ADC Reset 80 KB Data DMA RAM Bluetooth Transceiver Watch HWA Dog ROSC PMU I2C Power Manage POR DPLL PWM ment Switch FLASH SPI XTAL Regulator Controller © 2014 Beken Corporation Proprietary and Confidential Page 4 of 14

BK8000L Datasheet v 0.2 2. Pin Definition It provides maximum QFN6x6 48-pins package for wireless audio application. 48 47 46 45 44 43 42 41 40 39 38 37 RSTN 1 36 VCC3SYS TSTEN 2 35 VCC4BAT RFP_BT 3 34 VCC5USB TDI(GPIO20) 4 33 AUDIORN GPIO11 5 32 AUDIORP 6 GND PAD VDD12 31 AUDIOLP GPIO0 7 BK8000L BK8006 30 AUDIOLN GPIO1 8 QFN 6*6 48-Pin 29 VCCAUD GPIO2 28 VREF1AUD GPIO3 27 V2MICBIAS GPIO4 26 MICINP GPIO5 25 MICINN 13 14 15 16 17 18 19 20 21 22 23 24 Table 1 Pin Description of 48Pin Package PIN Name Pin Function Description 1 RSTN Digital I/O Active low reset 2 TSTEN Digital I/O Test enable, high enable chip in test mode 3 RFP_BT RF port 2.4 GHz antenna port 4 TDI Digital I/O JTAG TDI, GPIO20 5 GPIO11 Digital I/O General I/O 6 VDD12 Power 1.2 V LDO output 7 GPIO0 Digital I/O GPIO 8 GPIO1 Digital I/O GPIO 9 GPIO2 Digital I/O GPIO © 2014 Beken Corporation Proprietary and Confidential Page 5 of 14

Low Power Bluetooth Audio SoC v 0.2 10 GPIO3 Digital I/O GPIO 11 GPIO4 Digital I/O GPIO 12 GPIO5 Digital I/O GPIO 13 CSN_FLA Digital I/O FLASH CSN 14 WP_FLA Digital I/O FLASH WP 15 SI_FLA Digital I/O FLASH SI 16 SO_FLA Digital I/O FLASH SO 17 SCK_FLA Digital I/O FLASH SCK 18 HOLD_FLA Digital I/O FLASH HOLD 19 VCC3IO Power 3.3 V LDO output 20 SWD Analog Switch regulator port for digital 21 VSYS3V8D Power Input Power 3.6V 22 VBUCKD Power Switch regulator output for digital 23 LINR Analog Line in right channel 24 LINL Analog Line in left channel 25 MICINN Analog Microphone input negative 26 MICINP Analog Microphone input positive 27 V2MICBIAS Analog Audio bias voltage output 28 VERF1AUD Analog Audio reference output,1.2V 29 VCCAUD Power supply Audio power supply input, 1.8V~3.6 30 AUDIOLN Analog Audio left channel output negative 31 AUDIOLP Analog Audio left channel output positive 32 AUDIORP Analog Audio right channel output negative 33 AUDIORN Analog Audio right channel output positive 34 VCC5USB Power USB power input 35 VCC4BAT Power Battery input 36 VCC3SYS Power 3.6V system LDO output 37 SWA Analog Switch regulator port for analog 38 VCC3BUCKA Power Switch regulator input for analog 39 VBUCKA Power Switch regulator output for analog 40 VADC Analog Battery detector ADC input 41 NC NC NC 42 VCCBT Power BT power supply input, 1.8V~3.6 43 VCC3XTAL Power XTAL power input, 3.6V 44 XO Analog XTAL output 45 XI Analog XTAL input 46 TMS Digital I/O JTAG TMS 47 TCK Digital I/O JTAG TCK 48 TDO Digital I/O JTAG TDO © 2014 Beken Corporation Proprietary and Confidential Page 6 of 14

BK8000L Datasheet v 0.2 3. Functional Description 3.1. GPIO The BK8000L has total 19 GPIOs, which can be configured as either input or output. Most of them have second function. Table 2 GPIO Function Mapping 功能分类 Mbist Mode Perial Mode GPIO Mode GPIO0 Mbist Done UART2_TXD/I2C2_SCL General I/O GPIO1 Mbist_Fail UART2_RXD/I2C2_SDA General I/O GPIO2 input pcm2_clk/TXEN General I/O GPIO3 input pcm2_sync/RXEN General I/O GPIO4 input pcm2_din/UART1_TX_Monitor General I/O GPIO5 input pcm2_dout/UART1_RX_Monitor General I/O GPIO6 input pcm2_codec_clk/spi_csn General I/O GPIO7 input spi_sck General I/O GPIO8 input spi_mosi General I/O GPIO9 input spi_miso General I/O GPIO10 input PWM0 General I/O GPIO11 Mbist_Pass PWM1 General I/O GPIO12 input sd_clk/clk13m General I/O GPIO13 input sd_cmd/SCL General I/O GPIO14 input sd_data[0]/SDA General I/O GPIO15 input sd_data[1] General I/O GPIO16 input sd_data[2] General I/O GPIO17 input sd_data[3] General I/O GPIO18 Mbist_Fail_BT jtag_TCK（上电默认） General I/O GPIO19 dram_result[2] jtag_TMS（上电默认） General I/O GPIO20 dram_result[1] jtag_TDI （上电默认） General I/O GPIO21 dram_result[0] jtag_TDO（上电默认） General I/O All GPIO can be source to wake up MCU from shut down state. In shut down state, any level change on the set GPIO will trigger the wake up procedure. When power on, the default state of GPIO0~GPIO9 and GPIO12~GPIO20 is high impedance and pull low internally; the default state of GPIO10~GPIO11 is high impedance and pull high; and the default state of GPIO21 is high impedance only. © 2014 Beken Corporation Proprietary and Confidential Page 7 of 14

Low Power Bluetooth Audio SoC v 0.2 3.2. PWM Timer and Watch Dog Timer There are two sets of PWM timers. One fast set uses 1 MHz clock as main clock, and another slow set uses 32 kHz clock as main clock. Each set has three 16 bits counter with 4 bit pre-divider. First two timers in slow set can be used to LED duty cycle control. The watch dog timer runs with 32 kHz clock, with period from 0.6 ms to 38 second. 3.3. Power Management The BK8000L supports USB power supply that it can work without battery. When there is a USB power supply, it will charge the battery with automatically charge current control while provide power to the BK8000L. The buck will give nearly half current reduction for digital power. The BK8000L can enter into shut down mode when there is no active connection. The shut mode can be waked up by GPIO and USB charge. 3.4. MCU The 16 bit RISC MCU has 16 KB I-Cache and DMA bus, to support efficient execution and frequently data exchange. The JTAG interface can be used to on- line debug, which can be also configured as GPIO. Besides 26 MHz crystal, the MCU can run with internal programmable ROSC clock, or 32 kHz ring oscillator clock, with programmable divided ratio. 3.5. I2C and UART Interface There is one set of I2C interface and one set of UART interface for debug or external MCU control the BK8000L. They share the two same GPIO0 and GPIO1. 3.6. FM Receiver Control Interface © 2014 Beken Corporation Proprietary and Confidential Page 8 of 14

BK8000L Datasheet v 0.2 The FM receiver control interface consists of a two-wire I2C interface and a 13 MHz clock for FM receiver reference. 3.7. FLASH Access Interface The BK8000L MCU is running with the external FLASH program memory and the internal instruction cache. The external FLASH can be also used to store user data such as key configuration and Bluetooth paring information. 3.8. SPI The 4-wires SPI supports high speed data communication, which can be used as interface to either external FLASH or LCD controller. 3.9. SAR ADC and LED The SAR ADC has 10-bit resolution, and the two LED drivers support up to 10 mA current. The SAR has six active channel as follows. Table 3 ADC Channel Table Channel Detected Voltage Description Number 1 VBAT-pin/4 Battery voltage 2 VADC-pin Pin VADC voltage 3 Charge current Used to detect charge current and charge detector circuit control 4 VCC5USB-pin/6 USB voltage 5 GPIO19 GPIO19 voltage 6 GPIO9 GPIO9 voltage 3.10. Audio Peripheral There are one set of speech ADC with sample rate 8 kHz or 16 kHz, 44.1 kHz or 48 kHz. The DAC have two channels for stereo application, with sample rate 8 kHz, 16 kHz, 44.1 kHz or 48 kHz. © 2014 Beken Corporation Proprietary and Confidential Page 9 of 14

Low Power Bluetooth Audio SoC v 0.2 There is also a stereo line in interface, to allow external stereo input passing internal 31 dB programmable gain amplify to stereo output. 4. Electrical Characteristics 4.1. Absolute Maximum Ratings Parameter Description MIN TYP MAX Unit VCCBAT Battery regulator Supply voltage -0.3 3.3 4.2 V PRX RX input power - 10 - dBm T STR Storage temperature range -40 - 150 ℃ VCCIO IO interface voltage -0.3 2.8 3.6 V 4.2. Recommended Operating Conditions Parameter Description MIN TYP MAX Unit VCCBAT Battery regulator Supply voltage 2.8 3.3 4.2 V T OPR Operation temperature range -20 - 80 ℃ VCCIO IO interface voltage 1.8 - 4.2 V 4.3. System LDO State Description MIN TYP MAX Unit VCC4BAT VBAT 2.8 4.2 V VCC3SYS SYSLDO Output Voltage 2.8 3.6 3.8 V Load Current Loading Current 150 mA 4.4. Analog LDO/BUCK System can choose the analog BUCK or LDO as the power supply of RF and Audio part. State Description MIN TYP MAX Unit Analog LDO VCC3BUCKA Analog LDO Input Voltage 2.8 3.3 3.6 V VBUCKA Analog LDO Output Voltage 1.7 1.8 2.4 V Load Current Loading Current 100 mA Analog BUCK VCC3BUCKA Analog BUCK Input Voltage 2.8 3.3 3.6 V VBUCKA Analog BUCK Output Voltage 1.7 1.8 2.4 V Load Current Loading Current 100 mA Switching frequency BUCK modulation frequency 2 5 10 MHz © 2014 Beken Corporation Proprietary and Confidential Page 10 of 14

BK8000L Datasheet v 0.2 4.5. Digital LDO/BUCK System can also choose the digital BUCK or LDO as the power supply for the Digital part. State Description MIN TYP MAX Unit Digital LDO VSYS3V8D Digital LDO Input Voltage 2.8 3.3 3.6 V VBUCKD Digital LDO Output Voltage 1.2 1.35 V Load Current Loading Current 100 mA Digital BUCK VSYS3V8D Digital BUCK Input Voltage 2.8 3.3 3.6 V VBUCKD Digital BUCK Output Voltage 1.2 1.35 V Load Current Loading Current 100 mA Switching frequency BUCK modulation frequency 2 5 10 MHz 4.6. USB LDO When USB is plug in, VCC3SYS will be generated from USB LDO. State Description MIN TYP MAX Unit VCC5USB USB Input Voltage 4.75 5 5.75 V VCC3SYS USBLDO Output Voltage 3.3 V Load Current Loading Current 100 mA 4.7. Typical Power Consumption State Description MIN TYP MAX Unit Software shut down, wake up from Shut down 50 uA GPIO Idle-Sniff Idle state at Sniff mode 900 uA Active (A2DP) 2DH5 20 mA Active (HFP) HV1 20 mA 4.8. RF Characteristics Parameter Condition MIN TYP MAX Unit Operate Frequency 2402~2480 2402 2480 MHz RXSENS-1 Mbps BER=0.001 -90 dBm RXSENS-2 Mbps BER=0.0001 -92 dBm RXSENS-3 Mbps BER=0.0001 -84 dBm Maximum received signal BER=0.001 0 dBm Maximum RF transmit 5 dBm power RF Power Control Range 30 dB © 2014 Beken Corporation Proprietary and Confidential Page 11 of 14

Low Power Bluetooth Audio SoC v 0.2 4.9. Audio Characteristics Parameter Condition MIN TYP MAX Unit DAC Output Amplitude 1 Vrms DAC output SNR 1 kHz sine wave 96 dB DAC Sample Rate 8 48 kHz ADC SNR 1 kHz sine wave 96 dB ADC Sample Rate 8 48 kHz 5. Application Schematic It will be provided with separate document. 6. About the Qualification By carefully PCB layout, the BK8000L RF performance meets FCC, CE and BQB requirement. The Bluetooth protocol and profile provided by Beken are already qualified and listed in SIG website. If there is any end product listing requirement with the BK8000L, please inquire Beken for the related QDID authorization. © 2014 Beken Corporation Proprietary and Confidential Page 12 of 14

BK8000L Datasheet v 0.2 7. Package Information The BK8000L uses the QFN 6x6 48-Pin package. © 2014 Beken Corporation Proprietary and Confidential Page 13 of 14

Low Power Bluetooth Audio SoC v 0.2 8. Ordering Information Part number Package Packing MOQ (ea) BK8000LQB QFN 6mmx6mm 48-Pin Tape Reel 10 k Remark: MOQ: Minimum Order Quantity © 2014 Beken Corporation Proprietary and Confidential Page 14 of 14


Document Created: 2016-05-19 15:46:24
Document Modified: 2016-05-19 15:46:24
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