User Manual

FCC ID: Z64-WL18DBMOD

Users Manual

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User's Guide SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for TI Sitara™ Platform The WL1837MODCOM8I is a Wi-Fi® dual-band, Bluetooth, and BLE module evaluation board (EVB) with the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power- optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.TI. Contents 1 Overview ...................................................................................................................... 3 1.1 General Features ................................................................................................... 3 1.2 Key Benefits ......................................................................................................... 3 1.3 Applications .......................................................................................................... 4 2 Board Pin Assignment ...................................................................................................... 4 2.1 Pin Description ...................................................................................................... 5 2.2 Jumper Connections ............................................................................................... 7 3 Electrical Characteristics .................................................................................................... 7 4 Antenna Characteristics..................................................................................................... 8 4.1 VSWR ................................................................................................................ 8 4.2 Efficiency ............................................................................................................. 8 4.3 Radio Pattern ........................................................................................................ 9 5 Circuit Design ................................................................................................................ 9 5.1 EVB Reference Schematics ....................................................................................... 9 5.2 Bill of Materials (BOM) ............................................................................................ 10 6 Layout Guidelines .......................................................................................................... 11 6.1 Board Layout ....................................................................................................... 11 7 Ordering Information ....................................................................................................... 16 List of Figures 1 WL1837MODCOM8I EVB (Top View) .................................................................................... 3 2 EVB Top View ................................................................................................................ 4 3 EVB (Bottom View) .......................................................................................................... 5 4 Antenna VSWR Characteristics ............................................................................................ 8 5 Antenna Efficiency ........................................................................................................... 8 6 EVB Reference Schematics ................................................................................................ 9 7 WL1837MODCOM8I Layer 1 Layout .................................................................................... 11 8 WL1837MODCOM8I Layer 2 Layout .................................................................................... 11 9 WL1837MODCOM8I Layer 3 Layout .................................................................................... 12 10 WL1837MODCOM8I Layer 4 Layout .................................................................................... 12 11 Module Layout Guidelines (Top Layer) .................................................................................. 13 Sitara, WiLink are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Android is a trademark of Google, Inc. Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance. SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board 1 Submit Documentation Feedback for TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

www.ti.com 12 Module Layout Guidelines (Bottom Layer) .............................................................................. 13 13 Trace Design for the PCB Layout ........................................................................................ 14 14 Layer 1 Combined With Layer 2.......................................................................................... 14 15 Top Layer – Antenna and RF Trace Routing Layout Guidelines .................................................... 15 16 Bottom Layer – Antenna and RF Trace Routing Layout Guidelines................................................. 15 17 MIMO Antenna Spacing ................................................................................................... 16 List of Tables 1 Pin Description ............................................................................................................... 5 2 BOM .......................................................................................................................... 10 3 Module Layout Guidelines ................................................................................................ 13 4 Antenna and RF Trace Routing Layout Guidelines .................................................................... 15 2 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Overview 1 Overview Figure 1 shows the WL1837MODCOM8I EVB. Figure 1. WL1837MODCOM8I EVB (Top View) 1.1 General Features The WL1837MODCOM8I EVB includes the following features: • WLAN, Bluetooth, and BLE on a single module board • 100-pin board card • Dimensions: 76.0 mm (L) x 31.0 mm (W) • WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels) • Support for BLE dual mode • Seamless integration with TI Sitara and other application processors • Design for the TI AM335X general-purpose evaluation module (EVM) • WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior WL127x, WL128x, and BL6450 offerings for smooth migration to device • Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for WLAN • Wi-Fi and Bluetooth single-antenna coexistence • Built-in chip antenna • Optional U.FL RF connector for external antenna • Direct connection to the battery using an external switched-mode power supply (SMPS) supporting 2.9- to 4.8-V operation • VIO in the 1.8-V domain 1.2 Key Benefits The WL1837MOD offers the following benefits: • Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth • WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP) • Bluetooth 4.1 + BLE (Smart Ready) • Wi-Fi and Bluetooth single-antenna coexistence • Low power at 30% to 50% less than the previous generation SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board 3 Submit Documentation Feedback for TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Overview www.ti.com • Available as an easy-to-use FCC-, ETSI-, and Telec-certified module • Lower manufacturing costs saves board space and minimizes RF expertise. • AM335x Linux and Android reference platform accelerates customer development and time to market. 1.3 Applications The WL1837MODCOM8I device is designed for the following applications: • Portable consumer devices • Home electronics • Home appliances and white goods • Industrial and home automation • Smart gateway and metering • Video conferencing • Video camera and security 2 Board Pin Assignment Figure 2 shows the top view of the EVB. Figure 2. EVB Top View 4 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Board Pin Assignment Figure 3 shows the bottom view of the EVB. Figure 3. EVB (Bottom View) 2.1 Pin Description Table 1 describes the board pins. Table 1. Pin Description No. Name Type Description 1 SLOW_CLK I Slow clock input option (default: NU) 2 GND G Ground 3 GND G Ground 4 WL_EN I WLAN enable 5 VBAT P 3.6-V typical voltage input 6 GND G Ground 7 VBAT P 3.6-V typical voltage input 8 VIO P VIO 1.8-V (I/O voltage) input 9 GND G Ground 10 N.C. No connection 11 WL_RS232_TX O WLAN tool RS232 output 12 N.C. No connection 13 WL_RS232_RX I WLAN tool RS232 input 14 N.C. No connection 15 WL_UART_DBG O WLAN Logger output 16 N.C. No connection 17 N.C. No connection 18 GND G Ground 19 GND G Ground 20 SDIO_CLK I WLAN SDIO clock SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for 5 Submit Documentation Feedback TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Board Pin Assignment www.ti.com Table 1. Pin Description (continued) No. Name Type Description 21 N.C. No connection 22 GND G Ground 23 N.C. No connection 24 SDIO_CMD I/O WLAN SDIO command 25 N.C. No connection 26 SDIO_D0 I/O WLAN SDIO data bit 0 27 N.C. No connection 28 SDIO_D1 I/O WLAN SDIO data bit 1 29 N.C. No connection 30 SDIO_D2 I/O WLAN SDIO data bit 2 31 N.C. No connection 32 SDIO_D3 I/O WLAN SDIO data bit 3 33 N.C. No connection 34 WLAN_IRQ O WLAN SDIO interrupt out 35 N.C. No connection 36 N.C. No connection 37 GND G Ground 38 N.C. No connection 39 N.C. No connection 40 N.C. No connection 41 N.C. No connection 42 GND G Ground 43 N.C. No connection 44 N.C. No connection 45 N.C. No connection 46 N.C. No connection 47 GND G Ground 48 N.C. No connection 49 N.C. No connection 50 N.C. No connection 51 N.C. No connection 52 PCM_IF_CLK I/O Bluetooth PCM clock input or output 53 N.C. No connection 54 PCM_IF_FSYNC I/O Bluetooth PCM frame sync input or output 55 N.C. No connection 56 PCM_IF_DIN I Bluetooth PCM data input 57 N.C. No connection 58 PCM_IF_DOUT O Bluetooth PCM data output 59 N.C. No connection 60 GND G Ground 61 N.C. No connection 62 N.C. No connection 63 GND G Ground 64 GND G Ground 65 N.C. No connection 66 BT_UART_IF_TX O Bluetooth HCI UART transmit output 67 N.C. No connection 6 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for SWRU382 – November 2014 TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Board Pin Assignment Table 1. Pin Description (continued) No. Name Type Description 68 BT_UART_IF_RX I Bluetooth HCI UART receive input 69 N.C. No connection 70 BT_UART_IF_CTS I Bluetooth HCI UART Clear-to-Send input 71 N.C. No connection 72 BT_UART_IF_RTS O Bluetooth HCI UART Request-to-Send output 73 N.C. No connection 74 RESERVED1 O Reserved 75 N.C. No connection 76 BT_UART_DEBUG O Bluetooth Logger UART output 77 GND G Ground 78 GPIO9 I/O General-purpose I/O 79 N.C. No connection 80 N.C. No connection 81 N.C. No connection 82 N.C. No connection 83 GND G Ground 84 N.C. No connection 85 N.C. No connection 86 N.C. No connection 87 GND G Ground 88 N.C. No connection 89 BT_EN I Bluetooth enable 90 N.C. No connection 91 N.C. No connection 92 GND G Ground 93 RESERVED2 I Reserved 94 N.C. No connection 95 GND G Ground 96 GPIO11 I/O General-purpose I/O 97 GND G Ground 98 GPIO12 I/O General-purpose I/O 99 TCXO_CLK_COM Option to supply 26 MHz externally 100 GPIO10 I/O General-purpose I/O 2.2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections: • J1: Jumper connector for VIO power input • J3: Jumper connector for VBAT power input • J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth • J6: Second RF connector for 2.4-GHz WLAN 3 Electrical Characteristics For electrical characteristics, see the WL18xxMOD WiLink™ Single-Band Combo Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (BLE) Data Sheet (SWRS170). SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board 7 Submit Documentation Feedback for TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Antenna Characteristics www.ti.com 4 Antenna Characteristics 4.1 VSWR Figure 4 shows the antenna VSWR characteristics. Figure 4. Antenna VSWR Characteristics 4.2 Efficiency Figure 5 shows the antenna efficiency. Figure 5. Antenna Efficiency 8 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Antenna Characteristics 4.3 Radio Pattern For information on the antenna radio pattern and other related information, see productfinder.pulseeng.com/product/W3006. 5 Circuit Design 5.1 EVB Reference Schematics Figure 6 shows the reference schematics for the EVB. WLAN_EN_SOC R1 0R 0402 J1 NU_HEADER 1x2 BT_EN_SOC R2 0R 0402 H-1X2_2MM WL_UART_DBG R4 0R 0402 2 1 VIO_IN TP2 1 TP1 1 BT_UART_DBG R3 0R 0402 C1 R32 1uF SLOW_CLK R5 NU TP7 1 VBAT_IN 0R 0402 0402 1 2 0603 R31 OSC1 WLAN_EN_SOC 0R 1V8 / 32.768kHz 3 4 0603 OSC-3.2X2.5 VIO_IN SLOW_CLK VBAT_IN 5 6 3 1 OUT EN 2 1 C2 C3 R6 VIO_IN 10uF 0.1uF 0R 7 8 0603 0402 0402 2 4 C4 GND VCC 0.1uF 9 10 J3 0402 WL_RS232_TX NU_HEADER 1x2 11 12 H-1X2_2MM WL_RS232_RX 13 14 WL_UART_DBG 15 16 36 48 47 46 45 44 43 42 41 40 39 38 37 35 34 33 17 18 SDIO_CLK_WL EXT_32K GND GND GND BT_EN_SOC WLAN_EN_SOC GND BT_UART_DBG VIO GND GND GND GND WL_UART_DBG VBAT VBAT 19 20 21 22 SDIO_CMD_WL 49 32 RF_ANT1 23 24 GND RF_ANT1 SDIO_D0_WL BT_HCI_RTS R7 0R 0402 50 31 25 26 BT_HCI_RTS GND 1 TP8 SDIO_D1_WL BT_HCI_CTS R8 0R 0402 51 30 27 28 BT_HCI_CTS GND SDIO_D2_WL BT_HCI_TX R9 0R 0402 52 29 1 TP3 29 30 BT_HCI_TX GND These two TPs for test mode SDIO_D3_WL BT_HCI_RX when WL_IRQ pull high. 31 32 R11 0R 0402 53 28 1 TP4 BT_HCI_RX GND R10 0R WLAN_IRQ 54 27 R12 0R 0402 WL_RS232_TX 33 34 0402 GND GPIO_1 55 26 R13 0R 0402 WL_RS232_RX 35 36 GND GPIO_2 BT_AUD_IN R14 0R 0402 56 25 1 TP5 37 38 BT_AUD_IN U1 GPIO_4 BT_AUD_OUT R15 0R 0402 57 24 39 40 BT_AUD_OUT WL1837MODGJ GND BT_AUD_FSYNC R16 0R 0402 58 23 41 42 BT_AUD_FSYNC E-13.4X13.3-N100_0.75-TOP GND 59 22 R17 0R 0402 BT_FUNC2 43 44 GND RESERVED2 BT_AUD_CLK R18 0R 0402 60 21 R19 0R 0402 BT_FUNC1 45 46 BT_AUD_CLK RESERVED1 TP6 1 61 20 47 48 VIO_CLK GND GND EXT_CLK_REQ_OUT R34 62 19 49 50 TCXO1 NU RESERVED3 GND BT_AUD_CLK NU_TCXO 26MHz TCXO_CLK_COM R36 NU 0402 63 18 RF_ANT2 51 52 2.0x1.6x0.73mm 0402 GND RF_ANT2 BT_AUD_FSYNC 4 3 64 17 53 54 VCC OUT RESERVED GND BT_AUD_IN C15 R35 R33 55 56 NU_1uF 1 2 NU 0R G19 G1 BT_AUD_OUT 0402 NC GND 0402 0402 G20 GND GND G2 57 58 G21 GND GND G3 G22 GND GND G4 59 60 G23 GND GND G5 G24 GND GND G6 61 62 G25 GND GND G7 G26 GND GND G8 63 64 G27 GND GND G9 BT_HCI_TX VBAT_IN U4 VIO_CLK G28 GND GND G10 65 66 C32 NU_TLV70518 G29 GND GND G11 BT_HCI_RX NU_0.1uF XBGA-N4_0.8X0.8_0.4 G30 GND GND G12 67 68 0402 G31 GND GND G13 BT_HCI_CTS B2 B1 G32 GND GND G14 69 70 VIN VOUT GND WL_SDIO_CMD GND BT_HCI_RTS WL_SDIO_CLK G33 G15 WL_SDIO_D0 WL_SDIO_D1 WL_SDIO_D2 WL_SDIO_D3 G34 GND GND G16 71 72 WLAN_IRQ EXT_CLK_REQ_OUT A2 A1 G35 GND GND G17 BT_FUNC1 EN GND G36 GND GND G18 73 74 GPIO11 GPIO10 GPIO12 GPIO9 GND GND BT_UART_DBG GND GND GND GND GND 75 76 GPIO9 77 78 1 2 3 4 5 6 7 8 9 10 12 13 14 15 16 11 79 80 VIO_IN 81 82 R20 for test mode. R20 10k 83 84 0402 GPIO11 R21 0R 0402 WLAN_IRQ 85 86 GPIO9 R22 0R 0402 R23 0R 0402 SDIO_D3_WL 87 88 BT_EN_SOC GPIO10 R24 0R 0402 R25 0R 0402 SDIO_D2_WL 89 90 GPIO12 R26 0R 0402 R27 0R 0402 SDIO_D1_WL 91 92 BT_FUNC2 R29 0R 0402 SDIO_D0_WL 93 94 GPIO11 R30 0R 0402 SDIO_CLK_WL 95 96 GPIO12 R28 0R 0402 SDIO_CMD_WL 97 98 TCXO_CLK_COM GPIO10 99 100 J2 NU_100pin Micro Edge MEC6 SD-100P EDGE CONNECTOR - MALE ANT1 - WL_2.4_IO2/BT/WL_5GHz ANT2 - WL_2.4_IO1/WL_5GHz ANT1 ANT2 C5 C13 W3006 W3006 0R 0.9pF ANT-10.0X3.2MM_B C6 C14 ANT-10.0X3.2MM_A 0402 0402 0R 1.5pF RF_ANT1 1 2 RF_ANT2 0402 0402 1 2 FEED NC FEED NC C7 L2 L1 C8 L4 L3 NU_0R NU 1.3nH NU_0R 3.9nH 2.2nH 0402 0402 0402 0402 0402 0402 2 2 1 1 3 J5 3 J6 U.FL-R-SMT(10) U.FL-R-SMT(10) U.FL U.FL Figure 6. EVB Reference Schematics SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board 9 Submit Documentation Feedback for TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Circuit Design www.ti.com 5.2 Bill of Materials (BOM) Table 2 lists the BOM for the EVB. Table 2. BOM Item Description Part Number Package Reference Qty Mfr 1 TI WL1837 Wi-Fi / Bluetooth WL1837MODGI 13.4 mm x 13.3 mm U1 1 Jorjin module x 2.0 mm 2 XOSC 3225 / 32.768KHZ / 1.8 V / 7XZ3200005 3.2 mm × 2.5 mm × OSC1 1 TXC ±50 ppm 1.0 mm 3 Antenna / Chip / 2.4 and 5 GHz W3006 10.0 mm × 3.2 mm ANT1, ANT2 2 Pulse × 1.5 mm 4 Mini RF header receptacle U.FL-R-SMT-1(10) 3.0 mm × 2.6 mm × J5, J6 2 Hirose 1.25 mm 5 Inductor 0402 / 1.3 nH / ±0.1 nH / LQP15MN1N3B02 0402 L1 1 Murata SMD 6 Inductor 0402 / 1.8 nH / ±0.1 nH / LQP15MN1N8B02 0402 L3 1 Murata SMD 7 Inductor 0402 / 2.2 nH / ±0.1 nH / LQP15MN2N2B02 0402 L4 1 Murata SMD 8 Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01 0402 C13 1 Murata / ±0.1 pF 9 Capacitor 0402 / 2.4 pF / 50 V / GJM1555C1H2R4BB01 0402 C14 1 Murata C0G / ±0.1 pF 10 Capacitor 0402 / 0.1 µF / 10 V / 0402B104K100CT 0402 C3, C4 2 Walsin X7R / ±10% 11 Capacitor 0402 / 1 µF / 6.3 V / GRM155R60J105KE19D 0402 C1 1 Murata X5R / ±10% / HF 12 Capacitor 0603 / 10 µF / 6.3 V / C1608X5R0J106M 0603 C2 1 TDK X5R / ±20% 13 Resistor 0402 / 0R / ±5% WR04X000 PTL 0402 R1 to R4, R6 to 31 Walsin R19, R21 to R30, R33, C5, C6 (1) 14 Resistor 0402 / 10K / ±5% WR04X103 JTL 0402 R20 1 Walsin 15 Resistor 0603 / 0R / ±5% WR06X000 PTL 0603 R31, R32 2 Walsin 16 PCB WG7837TEC8B D02 / Layer 76.0 mm × 31.0 mm 1 茂榮 4 / FR4 (4 pcs / PNL) × 1.6 mm (1) C5 and C6 are mounted with a 0-Ω resistor by default. 10 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Layout Guidelines 6 Layout Guidelines 6.1 Board Layout Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB. Figure 7. WL1837MODCOM8I Layer 1 Layout Figure 8. WL1837MODCOM8I Layer 2 Layout SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board 11 Submit Documentation Feedback for TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Layout Guidelines www.ti.com Figure 9. WL1837MODCOM8I Layer 3 Layout Figure 10. WL1837MODCOM8I Layer 4 Layout Figure 11 and Figure 12 show instances of good layout practices. 12 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Layout Guidelines Figure 11. Module Layout Guidelines (Top Layer) Figure 12. Module Layout Guidelines (Bottom Layer) Table 3 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12. Table 3. Module Layout Guidelines Reference Guideline Description 1 Keep the proximity of ground vias close to the pad. 2 Do not run signal traces underneath the module on the layer where the module is mounted. 3 Have a complete ground pour in layer 2 for thermal dissipation. 4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. 5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible. 6 Signal traces can be run on a third layer under the solid ground layer and the module mounting layer. SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for 13 Submit Documentation Feedback TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Layout Guidelines www.ti.com Figure 13 shows the trace design for the PCB. TI recommends using a 50-Ω impedance match on the trace to the antenna and 50-Ω traces for the PCB layout. Figure 13. Trace Design for the PCB Layout Figure 14 shows layer 1 with the trace to the antenna over ground layer 2. Figure 14. Layer 1 Combined With Layer 2 Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing. NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. 14 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

www.ti.com Layout Guidelines Figure 15. Top Layer – Antenna and RF Trace Routing Layout Guidelines Figure 16. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines Table 4 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16. Table 4. Antenna and RF Trace Routing Layout Guidelines Reference Guideline Description The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace 1 starts to radiate. RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF 2 traces must not have sharp corners. 3 RF traces must have via stitching on the ground plane beside the RF trace on both sides. 4 RF traces must have constant impedance (microstrip transmission line). For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The 5 ground layer must be solid. 6 There must be no traces or ground under the antenna section. SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board 15 Submit Documentation Feedback for TI Sitara™ Platform Copyright © 2014, Texas Instruments Incorporated

Ordering Information www.ti.com Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater than half the wavelength (62.5 mm at 2.4 GHz). Figure 17. MIMO Antenna Spacing Follow these supply routing guidelines: • For power supply routing, the power trace for VBAT must be at least 40-mil wide. • The 1.8-V trace must be at least 18-mil wide. • Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. • If possible, shield VBAT traces with ground above, below, and beside the traces. Follow these digital-signal routing guidelines: • Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. • Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around these signals. 7 Ordering Information Part number: WL1837MODCOM8I Revision History DATE REVISION NOTES November 2014 * Initial draft 16 Revision History SWRU382 – November 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

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Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.  Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.  This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Industry Canada Statement This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."  CAN ICES-3(B)/ NMB-3(B)  The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. - the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; - the maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and - the maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. In addition, high-power radars are allocated as primary users (i.e. priority users) of the bands 5250–5350 MHz and 5650–5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. Radiation Exposure Statement This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: Z64-WL18DBMOD” “Contains IC: 451I-WL18DBMOD “ The grantee's FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. This device is intended only for OEM integrators under the following conditions: (1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. (3) This radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved by Texas Instrument. Antenna types not included in the list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this transmitter. Antenna Gain (dBi) @ 2.4GHz Antenna Gain (dBi) @ 5GHz 3.2 4.5 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.


Document Created: 2019-06-06 15:58:54
Document Modified: 2019-06-06 15:58:54
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