Operational Description

FCC ID: Z64-CC256XEM

Operational Description

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FCCID_1963166

CC256x QFN Board – Operational and Technical Description The CC256x QFN EM board is the evaluation and development board for the Texas Instruments (TI) CC256x device. It plugs directly into many TI Microcontroller’s MSP430 and Stellaris Evaluation Boards with header connectors that simplify prototype wiring and field trials. When coupled with this Microcontroller Units (MCU), the CC256x QFN EM board provides flexibility and best-in-class RF performance for different applications. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software Bluetooth stack available from TI is pre-integrated with TI's MSP430 and Stellaris MCUs. Some of the profiles supported today include: Serial port profile (SPP), Advanced audio distribution profile (A2DP) and several BLE profiles (these profiles vary based on the supported MCU). The TI CC256x device is a Bluetooth BR/EDR/LE Host Controller Interface (HCI) solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the device brings a product-proven solution that supports Bluetooth 4.0 dual mode (BR/EDR/LE) protocols. TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. Key Features • Bluetooth Specification v4.0, Bluetooth & Bluetooth Low Energy • Easy PCB Layout Using Cadence Tools • 4 Layer PCB design • High sensitivity (-93 dBm typ.) • H4 UART and PCM/I2S Interface • Fast Time to Market


Document Created: 2013-03-21 18:19:17
Document Modified: 2013-03-21 18:19:17
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