Users Manual

FCC ID: YZP-VL3010

Users Manual

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FCCID_4187787

Data sheet for the LTD—VL3010 Product: LTE_CDMA Wireless Modem Model name: LTD—VL3010 Table of Contents 4 . Overview 2 . Major features 3 . Interface 4 . Electrical specifications 5. RF specifications 6 . Mechanical specifications 7 . General specifications 8. RFx information 9 . Approbation FCC @ LG Innotek

1. Overview The LTD—VL3010 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support for CDMA BCO 850MHz / BC1 1900MHz bands and LTE(700/850/1700/1900 MHz). This device acts as the vehicle‘s telematics system and connects to CDMA EVDO and LTE wireless networks and wireless modules to allow voice and data communication. Furthermore, this device can operate on land and water as well as other similar areas. In LTE mode (CAT4), the device provides uplink speeds of up to 50 Mbps and downlink speeds of up to 150 Mbps for seamless transfer of data such as movies and video calls. The device also supports the transfer of large amounts of data. The device communicates with the host system via a standard RS—232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible. @ LG Innotek

2. Major features Dimensions 34 x 40 x 3.5 mm (L x W x T) (Tolerance — width, length : TBD) Weight TBD g (max) Mechanical Interface USB, general purpose |/O pins Temperature* Operation: —20 °C — +70 °C peratu Storage: —40 °C — +85 °C Main chipset MDM9628 Memory 4Gb(NAND) / 2Gb(SDRAM) CDMA (EVDO) — DL Speed : 3.1 Mbps — UL Speed : 1.8 Mbps Standard LTE P P Technol ecnno 0dy — DL Speed : 150 Mbps — UL Speed : 50 Mbps Band CDMA BCO, BC1 an LTE B2, B4, B5, B13 Power CDMA : Typ. 24dBm (Power Class 3) LTE : Typ. 230Bm (Power Class 3) DC power 4V ETC Functions Voice, data, SMS @ LG Innotek

3. Interface 3.1 LGA Pad Layout (Top View) ) | l 7 E E6 7 14 46 6 73 E 46 7 G© — — H B E 6 476 E6 36E 6 476 A 8 B A R 26E R G 6 A 4A G® — EB OE 6 36E 6 460 E 6 7E 6 § K <l l l E § l 4\ +4 K SE < S — § — E C E E6 7 E 6 8 G E 6 7 E6 6 § —@® A A 7 C C A = m ® — 6 A E ® 5 2 G 2 CE A © 4 4 4 4 Eo_ s 4 4 400E 4o3 4 — m M E m A f ® = C R mR CG6G—S5E 1000 @6866 — 5 G E ® 5 | © a 5 a C M § 4 ~ ——_ s 4 4 400E 4o3 4oE a ® 5 ® a m ® 5 a 9 & B 6 8 3 E c a 3 a 8 C O E E 7 E 56 G E6 6 § 6 § § ‘H «l bk 42 = EB 58 < € € § — E€ < —< — E [—1 E A E6 R C A @6 — | 6 E 6 7E 6 7 6 6 § 7 — 7 H 6 |G EC 1B §E l — eE E6 B Ee + 7E s — -IIIIIEIIIIIIIEIIIEI I :::::::::::::::: znuzmu‘ Figure 1. LGA Pin map @LG Innotek

3. Interface 3.2 Pin description PAD. _ | NAME | DIRECTION___| DESCRIPTION Antenna Interface Pads ©21 MAIN_ANT Input/Qutput__| RF Main Antenna AG21 DIV _ANT Input RF Diversity Antenna AE17 GNSS ANT Input GNSS Antenna User Interface Pads H6 ACC PWR ON Input ACC_PWR ON 15 BOOT OK Output BOOT OK H4 MSG Output MSG G3 168H END OQutput Remote standby moade end F20 MAIN_ANT DTC EN Output Main ANT Detect Enable 220 |DIV ANT DTC EN Output Diversity ANT Detect Enable I7 SPI LEVEL_SHIFT EN Output SPI LEVEL SHIFT Enable AD4__| ETHERNET_DCDC_ENABLE Output Ethernet power enable F6 GPIQ1 Input/Output General purpose /O (Do not use E5| GPIO2 \IIDVB? External General purpose /O L6 |GPios su%pm IETE(HH General purpose |/O Input/Qutput (Not NG GPIO4 UPT) General purpose |/O ADGC Interface Pads ADC Convertor input for main E19| ADCI Input antenna detect ADC Convertor input for diversity AA19 ADC2 Input antenna detect PCM Interface Pads W3 PGM_EN Output PCM 3.3 Level Shifter Enable x2 PCM _CLK Input PCM Clock Wi__| PCM_SYNC Input PCM Frame Sync Y3 PCM_DIN Input PCM Data In Y1 PCM_DOUT Output PCM Data Out JTAG Pin Description AG7 MDM_JTAG_TMS Input/Qutput JTAG mode select input AD8 MDM JTAG PS _HOLD input JTAG PS HOLD detect AD6__| MDM_JTAG_TD! Input JTAG data input AEZ MDM JTAG TRST N Input JTAG reset for debug ABG_| MDM JTAG_TDO Qutput JTAG debugging ABS MDM JTAG TCGK Input JTAG clock input AE9 MDM JTAG SRST N Input JTAG reset USB Interface Pads N2 USB_HS_DM Input/Qutput__| USB high speed data (minus} M1 USB_ HS DP Input/Qutput__| USB high speed data (plus} Ki USB_VBUS Input USB power L2 USB_ID Input USB ID SDIQ Interface Pads S1 SDCG CLK Output Secure digital controller clock Q1 SDCG_CMD Output Secure digital controller command T2 SDG_DATAO Input/Qutput__| Secure digital controller data bit 0 R2 SDG_DATA1 Input/Qutput__| Secure digital controller data bit 1 S3 SDC_DATA2 Input/Qutput Secure digital controller data bit 2 Table 1. Pin descriptions @LG Innotek

3. Interface a3 _| SDC DATA3 Input/Quiput _ | Secure digital controller data bit 3 SGMMI Interface Pads AA1 EPHY_RST_N or UIM2_RESET Output Ethernet PHY reset AE11 EPHY_INT_N or UIM2_DETECT Input Ethernet PHY interrupt AB10 SGMII_DATA or UIM2_CLK Input/Qutput SGMI input Output data AD10 GND Ground xX10 SGMII_RX_P Input SGMII receive — plus W11 SGMII_RX_M Input SGMII receive —minus 210 SGMII_TX_M Qutput SGMII transmit — plus Y11 SGMII TX P Output SGMIL transmit —minus AC11_ SGMIL CLK or UIM2_DATA Output SGMII clock SPI Interface Pads S5 SPI_MOSI Qutput SPI Serial Output T6 SPI_CLK Output SPI Serial Clock R6 SPI_ CS N Qutput SPI Chip Select US SPI_MISO Input SPI Serial input 5 SPI_INTERRUPT Input MICOM — LGA SPI interrupt UART Interface Pads MS UART2_ TX Output UART2 Transmit data N4 UART2 _RX Input UARTZ Receive data K5 UARTH _TX Qutput Debug UARTS Transmit Data L4 UARTA_BX Input Debug UARTS Receive Data 05 UART3 _TX Output UART6 Transmit data P4 UART3 _RX Input UART6 Receive data USIM Interface Pads 13 UIM1_PRESENT Input Detection of an external UIM card H2 UIM1_CLK Output Clock Qutput to an external UIM card E1 UIM1_RESET Qutput Reset Output to an external UIM card ai UIM1_DATA InputOutput E;t; connection with an external UIM F2 VREG_L6_UIM1 Output Supply Output for an external UIM card E3 GND Ground D2 GND Ground A1 GND Ground C1 GND Ground B2 GND Ground HSIC Pin Description AB2 HSIC_DATA Input/Qutput HSIC data AC1 HSIC_STB Input/Qutput HSIC Strobe signal AD2 NC No Connect AE1 NC No Connect DSRC Pin Description v7 coEx_UART_RX Input LTE receiver syne for coexistence with UART LTE transmitter sync for coexistence Z6 COEX_UART_TX Output with UART x4 RFCLK2_QCA Qutput Low noise RF clock Output AA3 NC Qutput No Connect Table 1. Pin descriptions @LG Innotek

3. Interface x6 DSRC SLP_CLK DSRC si clock Y5 WLAN 3V_EN_DSRC Used for WLAN enable 24 DSRC_PPS Pulse Per Second x8 MDM2AP_INT_N MDM to AP interrupt, PCM_LDO_EN 28 AP2MDM_INT_N AP to MDM interrupt Control Pads As LGA_PHONE_ON ON/OFF Control B4 MDM_RESOUT_N Reset Qutput C3 LGA_RESIN N External Reset Input Power Supply Pads A17 VPH_PWBR for PAM wer supply (4.0 B1G VPH_PWBR for PAM wer supply (4.0 A15 VPH_PWBR for PAM wer supply (4.0 B14 VPH_PWBR for PAM wer supply (4.0 Ag VPH_PWBR for PMIG wer supply (4.0 B8 VPH_PWBR for PMIG wer supply (4.0 A7 VPH_PWBR for PMIG wer supply (4.0 CZ VPH_PWBR for PMIG wer supply (4.0 Voltage Reference Pad C9 VREG L11 1P8 ut LDOQ out for 1.8V pull u D8 VREG L11 1P8 ut LDOQ out for 1.8V pull u Voltage Reference for SGMII AE3 (VREG_L5_UIM2) — Ethernet Output Ethernet 1/O voltage NC Pads [eF] NC No Connect B12 NC No Connect 19 NC No Connect 7 N nn C§ NC No Connect D4 NC No Connect A21 Ground E21 Ground 21 roun 121 roun K21 Ground M2i Ground ©21 Ground @21 Ground 1 roun 1 roun W2l Ground Y21 Ground AA21 Ground AE21 Ground roun roun roun Ground Table 1. Pin descriptions @LG Innotek

3. Interface Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground roun Ground Ground Ground Ground Ground roun roun Ground Ground Ground Ground roun roun Ground Ground Ground Ground Ground roun roun Ground Ground Ground Ground roun Table 1. Pin descriptions @LG Innotek

3. Interface Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground roun Ground Ground Ground Ground Ground Ground roun Ground Ground Ground Ground Ground roun Ground Ground Ground Ground Ground roun roun Ground Ground Ground Ground Ground roun roun Ground Ground Ground Ground roun roun Ground Ground Table 1. Pin descriptions @LG Innotek

3. Interface Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground roun Ground Ground Ground Ground Ground roun Ground Ground Ground Ground Ground roun roun Ground Ground Ground Ground roun roun roun Table 1. Pin descriptions @LG Innotek

3. Interface Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions @LG Innotek

3. Interface 3.3 USB This device supports universal serial bus (USB) connections for high—speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps . . Pin VO . baas Pin NO. Signal Name (Modem host) Function Description M1 USB_D+ 10 USB Differential data line (+) N2 USB_D— 10 USB Differential data line (—) K1 USB_VBUS I USB Power Supply Table 2. USB Pin descriptions @LG Innotek

3. Interface 3.4 Audio This module includes a PCM interface. The pull—up and pull—down resistors attached to these pin must provide more than 50 Kohm of resistance. Pin NO. Signal Name (MoZer:/(r?ost) Function Description W1 PCM_SYNC I PCM Interface sync X2 PCM_CLK I PCM Interface clock Y1 PCM_TXD O PCM Interface digital audio data out Y3 PCM_RXD I PCM Interface digital audio data in Table 3. PCM Pin descriptions 3.5 User interface Pin No. Signal Name Direction Function 15 BOOT_OK O Indicates that the Modem boot is complete. c3 RESET_IN Control line to unconditionally restart the module. H4 MsG 0 ::giscse:g:.that the Modem receive Urgent G3 168H_END O Indicates that the 168hr sleep mode is end. H6 ACC_ON_SLEEP Control line to power on or 168hr sleep mode. As Phone_ON Control line to power on / off Table 4. User interface Pin descriptions @LG Innotek

4. Electrical specifications 4.1 Power supply specifications The host system provides the power supply (V_BATT)DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption. In particular, the PAM (power amplifier module) consumes a lot of power, so it receives a direct power supply of 4 V from the V_BATT. Therefore the V_BATT signal inputs only the supply power of the PAM, even when the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module. Pin No. Signal Name Direction MIN TYP MAX A7,07,B8,A9, B14,A415,B16, V_BATT 3.9V 4V 4.1 V A17 Table 5. Power supply specifications @LG Innotek

4. Electrical specifications 4.2 Logic level specifications 4.2.1 Digital logic level specifications . Low High . Signal Name Type NMin Vax NVin Vax Unit BOOT_OK o 0 0.45 1.35 1.8 RESET_IN I —0.3 0.63 1.17 1.8 MSG o 0 0.45 1.35 1.8 v 96H_END 0 0 0.45 1.35 1.8 ACC_ON_SLEEP I 0 0.63 1.17 1.8 Table 6. Digital logic level specifications @LG Innotek

5. RF specifications 5.1 CDMA 5.1.1 Receiver .— Bandwidth : 1.25MHz .— Frequency : 869MHz — 894MHz (BCO), 1930MHz — 1990MHz (BC1) .— RF to Baseband Direct conversion (Zero IF) .— Modulation method : QPSK, 8PSK, 16QAM .— Sensitivity : <—104dBm (BER = Under 0.5%) 5.1.2 Transmitter .— Frequency: 824MHz — 849MHz (BCO), 1850MHz — 191 0MHz (BC1) .— Maximum RF Output : 20.3 dBm ~ 25.7 dBm max. (BCO—Power class3, BC1—Power class2) .— Modulation method : QPSK .— Baseband to RF Direct conversion (Zero IF) 5.2 LTE 5.2.1 Receiver .— Bandwidth : B2/B4(5 MHz, 10 MHz, 15 MHz, 20 MHz), B5/B13(5 MHz, 10 MHz) .— Frequency : B2 (1930 MHz — 1990 MHz), B4 (2110 MHz — 2155 MHz), B5 (869 MHz — 894 MHz), B13 (746 MHz — 756 MHz) .— RF to Baseband Direct conversion (Zero IF) .— Modulation method : QPSK, 16QAM and 64QAM .— Sensitivity : B2 (<—94.3dBm @QPSK, BW:10 MHz), B4 (<—96.3dBm @QPSK, BW :10 MHz), B5 (<—94.3dBm @QPSK, BW :10 MHz), B13 (<—93.3dBm @QPSK, BW:10 MHz) @LG Innotek

5. RF specifications 5.2.2 Transmitter .— Frequency: B2 (1850 MHz — 1910 MHz), B4 (1710 MHz — 1755 MHz), B5 (824 MHz — 849 MHz), B13 (777 MHz — 787MHz) .— Maximum RF Output : Power class3 , 20.3dBm ~ 25.70Bm .— Modulation method : QPSK and 16QAM .— Baseband to RF Direct conversion (Zero IF) @LG Innotek

6. Mechanical specifications 6.1 Environment specifications .— Storage temp.: —40 °C — +85 °C .— Operating temp.: —20 °C — +70 °C (—20 °C — +70 °C : 3GPP specifications are satisfied —30 °C — —20 °C, +70 °C — +80 °C : May cause performance degradation) .— Operating humidity: 80% (60°C) relative humidity @ LG Innotek

6. Mechanical specifications 6.1 Mechanical dimensions Dimensions 34 x 40.0 x 3.5 mm (L x W x T) (Tolerance — width, length : TBD) Weight TBD grams(max.) Table 7. Mechanical specification n3.5mmP LTD—VL3010 VZW | omcs customer rav : 130120012023 x tar en : wicamzzorns ree 10 : vervisor0 sw : ornpavew 40 0 imet : 223asere0012345 Figure 2. Mechanical dimension Copyright ©. 2017. All Rights Reserved. @LG Innotek

7. General specifications 7.1 CDMA BCO/BC1 electrical specifications CHANNEL TEST ITEM Spec. 1011/25 384/600 77971175 445 Maximum Output Power 20.3 ~ 25.7 dBm max PASS PASS PASS ; 885 kHz to 1.98 MHz —42 dBcl/30 kHz PASS PASS PASS 451 Conducted Spurious Emissions 1.98 MHz to 4.00 MHz ~54 dacl/30 knz (Bco) —50 dBcl/30 kz (BC1) PASS PASS PASS 4.4.6 Minimurm Controlled Output Power —50dBml PASS PASS PASS up @ Full rate 241 PASS PASS PASS down @ Full Rate —241 PASS PASS PASS up @ Half rate 241 PASS PASS PASS Range of Closed Loop down @ Half Rate —241 PASS PASS PASS 4.4.4 Power Control up @ Quarter rate 241 PASS PASS PASS down @ Quarter Rate —241 PASS PASS PASS up @ Eighth rate 241 PASS PASS PASS down @ Eighth Rate —241 PASS PASS PASS 35.1 Reference Sensitivity Level{—104/—25) 0.5% 1 PASS PASS PASS Table 8. CDMA RF specification @LG Innotek

7. General specifications 7.3 LTE B2 electrical specifications TX Channel TEST ITEM Spec. Test Temperature Frequency imsso i8900 19150 1 Maximum Output Power(class 3) 20.3—25.7dBm Normal, TempL, TempH Low, Mid,High PASS Pass Pass 2 Minimum Output Power —39dBm 1 Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 3 Frequency Error +0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 4 Error Vector Magnitude(EVM) 12 Su/gégs)QAM' Normal Low, Mid, High PASS Pass Pass s Relative Leakage Carrier Power Carrier Leakage (32dBm x 3 206) . 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 6 fesi In—band emission In—band emission (32dBm a 3.206) 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 7 EVM equalizer spectrum flatness EVMflatness equalizer spectrum Range1 54 db 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass Spectrum Emission upper/lower AreaM2SK 1 1g5 gam | pass pass pass Spectrum Emission M@SK g5 ggrn | pass pass pass upper/lower Area 2 8 Spectrum emission maskc Normal Low, Mid, High Spectrum Emission upper/lower AreaM@SK 3 11 5 gam | pass pass pass Spectrum Emission upperflower AreaM2SK 4 3 5 ggr | pass pass pass ACIR E—UTRA + —2020B 1 Pass Pass Pass 9 Adjacent Leakage Channel Power Ratio ACLRUTRAOffset 1 + —3220B 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass ACLR UTRA Offset 2 + —3520B 1 Pass Pass Pass 10 Reference Level@Sensitivity Tomtiz Ref shallbe Sensethroughput 2 05% _ 94.3 dam Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass Table 10. LTE B2 RF specification @LG Innotek

7. General specifications 7.4 LTE B4 electrical specifications TX Channel TEST ITEM Spec. Test Temperature Frequency 20000 20175 20350 1 Maximum Output Power(class 3) 20.3—25.7dBm Normal, TempL, TempH Low, Mid,High PASS Pass Pass 2 Minimum Output Power —39dBm 1 Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 3 Frequency Error +0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 4 Error Vector Magnitude(EVM) 12 Su/gégs)QAM' Normal Low, Mid, High PASS Pass Pass s Relative Leakage Carrier Power Carrier Leakage (32dBm x 3 206) . 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 6 fesi In—band emission In—band emission (32dBm a 3.206) 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 7 EVM equalizer spectrum flatness EVMflatness equalizer spectrum Range1 54 db 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass Spectrum Emission upper/lower AreaM2SK 1 1g5 gam | pass pass pass Spectrum Emission M@SK g5 ggrn | pass pass pass upper/lower Area 2 8 Spectrum emission maskc Normal Low, Mid, High Spectrum Emission upper/lower AreaM@SK 3 11 5 gam | pass pass pass Spectrum Emission upperflower AreaM2SK 4 3 5 ggr | pass pass pass ACIR E—UTRA + —2020B 1 Pass Pass Pass 9 Adjacent Leakage Channel Power Ratio ACLRUTRAOffset 1 + —3220B 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass ACLR UTRA Offset 2 + —3520B 1 Pass Pass Pass 10 Reference Level@Sensitivity Tomtiz Ref shallbe Sensethroughput 2 05% _ 96.3 dam Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass Table 11. LTE B4 RF specification @LG Innotek

7. General specifications 7.5 LTE B5 electrical specifications TX Channel TEST ITEM Spec. Test Temperature Frequency 2o4so z0525 20600 1 Maximum Output Power(class 3) 20.3—25.7dBm Normal, TempL, TempH Low, Mid,High PASS Pass Pass 2 Minimum Output Power —39dBm 1 Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 3 Frequency Error +0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 4 Error Vector Magnitude(EVM) 12 Su/gégs)QAM' Normal Low, Mid, High PASS Pass Pass s Relative Leakage Carrier Power Carrier Leakage (32dBm x 3 206) . 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 6 fesi In—band emission In—band emission (32dBm a 3.206) 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 7 EVM equalizer spectrum flatness EVMflatness equalizer spectrum Range1 54 db 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass Spectrum Emission upper/lower AreaM2SK 1 1g5 gam | pass pass pass Spectrum Emission M@SK g5 ggrn | pass pass pass upper/lower Area 2 8 Spectrum emission maskc Normal Low, Mid, High Spectrum Emission upper/lower AreaM@SK 3 11 5 gam | pass pass pass Spectrum Emission upperflower AreaM2SK 4 3 5 ggr | pass pass pass ACIR E—UTRA + —2020B 1 Pass Pass Pass 9 Adjacent Leakage Channel Power Ratio ACLRUTRAOffset 1 + —3220B 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass ACLR UTRA Offset 2 + —3520B 1 Pass Pass Pass 10 Reference Level@Sensitivity Tomtiz Ref shallbe Sensethroughput 2 05% _ 94.3 dam Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass Table 12. LTE B5 RF specification @LG Innotek

7. General specifications 7.17 LTE B13 electrical specifications TX Channel TEST ITEM Spec. Test Temperature Frequency 2azeo 23750 23800 1 Maximum Output Power(class 3) 20.3—25.7dBm Normal, TempL, TempH Low, Mid,High PASS Pass Pass 2 Minimum Output Power —39dBm 1 Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 3 Frequency Error +0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS Pass Pass 4 Error Vector Magnitude(EVM) 12 Su/gégs)QAM' Normal Low, Mid, High PASS Pass Pass s Relative Leakage Carrier Power Carrier Leakage (32dBm x 3 206) . 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 6 fesi In—band emission In—band emission (32dBm a 3.206) 242 dBc Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass 7 EVM equalizer spectrum flatness EVMflatness equalizer spectrum Range1 54 db 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass Spectrum Emission upper/lower AreaM2SK 1 1g5 gam | pass pass pass Spectrum Emission M@SK g5 ggrn | pass pass pass upper/lower Area 2 8 Spectrum emission maskc Normal Low, Mid, High Spectrum Emission upper/lower AreaM@SK 3 11 5 gam | pass pass pass Spectrum Emission upperflower AreaM2SK 4 3 5 ggr | pass pass pass ACIR E—UTRA + —2020B 1 Pass Pass Pass 9 Adjacent Leakage Channel Power Ratio ACLRUTRAOffset 1 + —3220B 1 Normal, Temp L, Temp H Low, Mid, High Pass Pass Pass ACLR UTRA Offset 2 + —3520B 1 Pass Pass Pass 10 Reference Level@Sensitivity Tomtiz Ref shallbe Sensethroughput 2 05% _ 93.3 dam Normal, Temp L, Temp H un Low, Mid, High PASS Pass Pass Table 13. LTE B13 RF specification @LG Innotek

8. RFx information The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use. Regardless of the power levels, care should be taken to minimize human contact during normal operation. This module should be remain more than 20 cm (8 inches) from the body when wireless devices are on and transmitting. This transmitter must not be collocated or operated in conjunction with any other antenna or transmitter. Operation is subject to the following two conditions: (1) this module does not cause interference , (2) this module accepts any interference that may cause undesired operation. 8.1 Information for the integrator The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter. The label for the end product must include FCC ID: YZP—VL3010 or A RF transmitter inside. @ LG Innotek

9. Approbation FCC This module complies with FCC rules. FCC : Part 22, Part 24, Part 27 Furthermore, this device complies with FCC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with minimum distance of 20 cm between the radiating element and the user. This module must not be co—located with any other transmitters or antennas. To comply with FCC regulations limiting both the maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile—only exposure condition must not exceed the values listed in the following table. Band Frequency Range Maximum Antenna [MHz] Gain[dBi] CDMA(BCO) 826.40~846.6 4.5 CDMA(BC1) 1852.4~1907.6 2.0 LTE(B2) 1850~1910 2.0 LTE(BA4) 1710~1755 2.0 LTE(B5) 824~849 4.5 LTE(B13) 777~787 4.5 To satisfy the FCC‘s exterior labeling requirements, the following text must appear on the exterior of the end product. Contains transmitter module FCC ID: YZP—VL3010 Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or codification is made. Note: If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS—102. @ LG Innotek


Document Created: 2019-02-28 11:18:24
Document Modified: 2019-02-28 11:18:24
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