Users Manual

FCC ID: X8WBM833A

Users Manual

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FCCID_4501304

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 BluNor BM833A/AF are powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using Nordic nRF52811 SoC. With an ARMCortexTM M4(F) MCU, 192KB flash, 24KB RAM, embedded 2.4GHz multi- protocol transceiver, and an integrated PCB trace antenna. It allows faster time to market with reduced development cost. BM833A/AF are designed to minimize PCB cost and to maximize efficiency in production line dedicated for Bluetooth module. The cost of using BM833A/AF modules can be lower than designing-in SoC at any quantity. At low cost, BM833A/AF offer full features. Inductors for DCDC converter are integrated. All 32 GPIOs are accessible. Bluetooth ranges are estimated in environments with Low Multiple Path Interference. Bluetooth range is much shorter in environments with radio frequency interference and severe multiple path interference. Array antenna required for Angle of Arrival (AoA) and Angle of Departure (AoD) direction finding is supported in BT Series modules. BM833A Specifications: Nordic nRF52 with ARM Cortex M4. Quadrature Demodulator (QDEC) Complete RF solution with integrated antenna 128-bit AES HW encryption Integrated DC-DC converter 5 x 32 bits, 3 x 24 bits Real Time Counters (RTC) Serial Wire Debug (SWD) Receiver Sensitivity: -97 dBm at 1Mbps Nordic SoftDevice Ready TX power: +/- 0 dBm; programmable 4 dBm to - Over-the-Air (OTA) firmware update 20dBm in 4 dB steps. Flash/RAM: 192KB/24KB Hybrid pins: 16 castellated and 24 LGA. 32 General purpose I/O pins Integrated PCB trace antenna; 12 bit/200KSPS ADC, 8 configurable channels with Operation voltage: 1.7V to 3.6V programmable gain. Embedded inductors for DCDC converter 3X SPI Master/Slave (8Mbps) Operation temperature: - 4 0 ° C t o + 8 5 ° C 3X 4-channel pulse width modulator (PWM) FCC ID: Low power comparator IC ID: 2X 2-wire Master/Slave (I2C compatible) CE: I2S audio interface TELEC: UART (with CTS/RTS and DMA) Australia/New Zealand: 20 channel CPU independent Programmable QDID: Peripheral Interconnect (PPI). Applications Wearable Sensors Beacons/Proximity Home and building automation Fitness/Sports Key fobs Smart toys Wireless charger Connected appliances Interactive entertainment devices Lighting products 1

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Model Summaries This radio transmitter [IC: 4100A-BM833A] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. module BM833A BM833AF Flash/RAM 192KB/24KB 192KB/24KB Size 10.2x15x1.9mm 10.2 (15 antenna area) x 20.6 x1.9mm. GPIO 32 32 Antenna & impedance PCB Trace & 50 ohm PCB trace & 50 ohm Antenna Gain 0.01dBi -0.88dBi BT range, low interference 680 meters at 125Kbps, est. 1400 meters at 125 Kbps, est. Sample Availability Sample 2

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Table Of Contents 1. Introduction .......................................................................................................................................................... 4 Block Diagram ...................................................................................................................................................... 4 BM833A................................................................................................................................................................ 5 BM833AF ............................................................................................................................................................. 5 2. Codes Development Using Nordic Tools ............................................................................................................ 6 Easy, fast and safe code development ............................................................................................................... 6 Over-The-Air DFU ................................................................................................................................................ 6 SoftDevices .......................................................................................................................................................... 6 Development Tools .............................................................................................................................................. 6 3. Product Overview................................................................................................................................................. 7 Nordic SoCs ......................................................................................................................................................... 7 Mechanical Drawings ........................................................................................................................................... 9 BM833A/BM833AF Pin Functions ..................................................................................................................... 10 Mounting BM833A on the Host PCB ................................................................................................................. 13 4. Bluetooth Range Measurements .......................................................................................................................14 Measurement Results ........................................................................................................................................ 14 5. Evaluation Board................................................................................................................................................15 Nordic Development Environment ..................................................................................................................... 15 Loading Firmware into Evaluation Board Through a Nordic DK ....................................................................... 15 Evaluation Board Schematic.............................................................................................................................. 19 Suggestion for Battery Power Application ......................................................................................................... 20 6. Preloaded Firmware ..........................................................................................................................................21 Reprogram with New AT Command Codes ...................................................................................................... 21 Reprogram with User’s Codes ........................................................................................................................... 21 7. Miscellaneous ....................................................................................................................................................22 Soldering Temperature-Time Profile for Re-Flow Soldering ............................................................................. 22 Cautions, Design Notes, and Installation Notes ................................................................................................ 22 Packaging........................................................................................................................................................... 25 FCC Label .......................................................................................................................................................... 25 8. Revision History .................................................................................................................................................26 9. Contact Us .........................................................................................................................................................27 3

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 1. Introduction BluNor BM833A is powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using Nordic nRF52 SoCs. With an ARMCortexTM M4 MCU, 192 KB flash, 24KB RAM, embedded 2.4GHz multi-protocol transceiver, and an integrated antenna, it allows faster time to market with reduced development cost. The following is a block diagram of BM833A. Antenna circuit and main clock are integrated. All 32 GPIOs of nRF52811 can be accessed from main board. For lower power consumption at idle state, a 32.768 kHz crystal is added on the host board. BlurNor BM833AF is sister module of BM833A. They are pin to pin compatible. In this data sheets, BM833A and BM833AF can be referred as B833A. Block Diagram 4

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 BM833A Series modules have the same features except the followings. BM833A • Integrated PCB trace antenna BM833AF • Integrated high performance PCB trace antenna 5

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 2. Codes Development Using Nordic Tools Development tools by Nordic and other third party development tools recommended by Nordic should be used . Easy, fast and safe code development Nordic development environment for nRF52 offers a clean separation between application code development and embedded protocol stacks. This means compile, link and run time dependencies with the embedded stack and associated debugging challenges are removed. The Bluetooth low energy and ANT stack is a pre- compiled binary, leaving application code to be compiled stand-alone. The embedded stack interface uses an asynchronous and event driven model removing the need for RTOS frameworks. Over-The-Air DFU The nRF52 SoC is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for in the field updates of application software and SoftDevice. SoftDevices The Nordic protocol stacks are known as SoftDevices and complement the nRF52 Series SoCs. All nRF52 Series are programmable with software stacks from Nordic. This bring maximum flexibility to application development and allows the latest stack version to be programmed into the SoC. SoftDevices available from Nordic: • S112 SoftDevice The S112 SoftDevice is a Bluetooth low energy peripheral protocol stack solution. It supports up to four peripheral connections with an additional broadcaster role running concurrently. The S112 SoftDevice integrates a Bluetoothlow energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions. S112 can be used for for BM833A. Development Tools Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52 DK board is recommended for firmware development. 6

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 3. Product Overview Nordic SoCs For full description of the SoC, please download data sheets from Nordic Semiconductor website. https://www.nordicsemi.com/eng/Products/Bluetooth-low-energy 7

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 The following is a block diagram of Nordic nRF52811 Bluetooth Low Energy (BLE) SoC. The 32 bit ARM Cortex M4 MCU with hardware supports for DSP instructions and floating point operations, code density and execution speed are higher than other Cortex M MCU. The Programmable Peripheral Interconnect (PPI) system provides a 20-channel bus for direct and autonomous system peripheral communication without CPU intervention. This brings predictable latency times for peripheral to peripheral interaction and power saving benefits associated with leaving CPU idle. The device has 2 global power modes ON/OFF, but all system blocks and peripherals have individual power management control which allows for an automatic switching RUN/IDLE for system blocks based only on those required/not required to achieve particular tasks. The radio supports Bluetooth low energy. Output power is scalable from a maximum of +4dBm down to -20 dBm in 4dB steps. Sensitivity is increased to -104 dBm at 125 Kbps and -97 dBm at 1Mbps. 8

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Mechanical Drawings The followings are mechanical drawings of BM833A, top view. Size of module is 10.2x15.0x1.9mm. X-axis and Y-axis coordinate of each pin is shown in table. Library components for PADS and EAGLE can be downloaded from http://www.fanstel.com/download-document/ For other PCB layout tools, please download evaluation Gerber files and extract library component. 9

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 BM833A/BM833AF Pin Functions The followings are BM833A pin assignment. Pin functions are in a table below. Please refer to Nordic nRF52811 Product Specifications for detailed descriptions and features supported. https://infocenter.nordicsemi.com/pdf/nRF52811_PS_v1.0.pdf BM833A nRF52811 pin# pin name pin# pin name Descriptions 1 GND 45 VSS Ground 2 GND Ground 3 GND Ground 4 GND Ground 5 GND Ground 6 P025 37 P0.25 GPIO 10

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 7 P026 38 P0.26 GPIO 8 P027 39 P0.27 GPIO 9 P028 40 P0.28/AIN4 GPIO, Analog input 10 P029 41 P0.29/AIN5 GPIO, Analog input 11 P030 42 P0.30/AIN6 GPIO, Analog input 12 P031 43 P0.31/AIN7 GPIO, Analog input 13 GND Ground 14 VDD 36 VDD DC supply 1.7V to 3.6V 15 GND Ground 16 P000 2 P0.00/XL1 GPIO, connection for 32.768kHz crystal 17 P001 3 P0.01/XL2 GPIO, connection for 32.768kHz crystal 18 GND Ground 19 GND Ground 20 P003 5 P0.03/AIN1 GPIO, Analog input 21 P004 6 P0.04/AIN2 GPIO, Analog input 22 P002 4 P0.02/AIN0 GPIO, Analog input 23 P005 7 P0.05/AIN3 GPIO, Analog input 24 P007 9 P0.07 GPIO 25 P006 8 P0.06 GPIO 26 P009 11 P0.09 GPIO 27 P008 10 P0.08 GPIO 28 VDD VDD DC supply 1.7V to 3.6V 29 P010 12 P0.10 GPIO 30 GND Ground 31 P011 14 P0.11 GPIO, used as UART RX on evaluation board 32 P012 15 P0.12 GPIO, used as UART TX on evaluation board 33 P014 17 P0.14 GPIO 34 P013 16 P0.13 GPIO 35 P015 18 P0.15 GPIO 36 P016 19 P0.16 GPIO 37 P017 20 P0.17 GPIO 38 P018 21 P0.18 GPIO 39 P019 22 P0.19 GPIO 40 P021/RST 24 P0.21/RST GPIO, configurable as RESET pin 41 P020 23 P0.20 GPIO 42 SWDCLK 25 SWDCLK Serial Wire Debug clock input 43 SWDIO 26 SWDIO Serial Wire Debug I/O 44 P022 27 P0.22 GPIO 45 GND Ground 46 P023 28 P0.23 GPIO 11

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 47 P024 29 P0.24 GPIO BM833A Pin Functions 12

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Mounting BM833A on the Host PCB The following figure shows recommended mounting of BM833A module on the host PCB. • For the best Bluetooth range performance, the antenna area of module shall extend 4.4 mm outside the edge of host PCB board, or 4.4 mm outside the edge of a ground plane. • The next choice is to place a module on a corner of host PCB, the antenna area shall extend 4.4 mm from the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of module. • We don’t recommend mounting BM833A module in the middle of a host PCB. For the best Bluetooth range performance, keep all external metal at least 30mm from the antenna area. 13

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 4. Bluetooth Range Measurements Bluetooth range measurement hex codes can be downloaded from Bluetooth Range Measurements section of this webpage. http://www.fanstel.com/download-document/ Description of measurement site, measurement methods, and range raw data are available at: https://www.fanstel.com/testreport/ Measurement Results Bluetooth ranges are measured for antennas at two heights. • 1.52 meters or 5 feet, the typical height of thermostat in the USA. • 3.0 meters. It has 85% Fresnel zone clearance when transmitter and receiver are 400 meters away. Multiple path interference caused by ground is low. Results to be provided. In actual application environments, Bluetooth range is much shorter because of radio frequency interference and severe multiple path interference. 14

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 5. Evaluation Board An evaluation board can be used to evaluate performance of module and to develop and test your firmware before an application-specific host board is developed. Nordic Development Environment Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52 DK board is recommended for firmware development. Document and Software development tools can be downloaded by the following links. Get started with Nordic chip and all online documents. http://infocenter.nordicsemi.com/index.jsp?topic=/com.nordic.infocenter.nrf52/dita/nrf52/development/nrf52 _dev_kit.html&cp=1_1 Nordic SDK with many example projects. https://developer.nordicsemi.com/nRF5_SDK/ Nordic development zone. https://devzone.nordicsemi.com/tutorials/b/getting‐started/posts/development‐with‐gcc‐and‐eclipse Programming the Nordic chip Download and install Nrf5x‐Command‐Line Tools https://www.nordicsemi.com/eng/nordic/Products/nRF52840/nRF5x‐Command‐Line‐Tools‐Win32/58850 Download and install nRFgo Studio https://www.nordicsemi.com/eng/Products/2.4GHz‐RF/nRFgo‐Studio/ nRF52DK The nRF52 DK is a versatile single board development kit for Bluetooth® low energy, This kit supports development for the nRF52832 and nRF52810 SoC. It supports the standard Nordic Software Development Tool-chain using SES, Keil, IAR and GCC. Program/Debug options on the kit is Segger J-Link OB. Loading Firmware into Evaluation Board Through a Nordic DK Procedures to connect a Nordic DK to a Fanstel nRF52 module evaluation board. • Connect Nordic nRF52DK debug out to Fanstel evaluation board debug in using the 10‐pin flat cable as shown below. • Connect Nordic nRF52DK to PC. • Connect a DC power source to micro or mini USB port ofevaluation board. 15

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 16

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Check COM Port Connection After connecting nRF52DK and an nRF52 sensor/evaluation board, you can see You canJ-Link device and COM port on the PC control panel Device Manager. Starting Nordic nRFgo Open nRFgo Studio. 1. Click Segger 682990549 as in the example below. 2. Erase all if needed 3. Browse for Bootloader and program. After programming bootloader, you can use OTA for firmware update. 4. Browse for theSoftDevice and program. 5. Browse for the application hex file and program 17

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 18

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Evaluation Board Schematic 19

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Suggestion for Battery Power Application Standby current consumption is important for battery-powered product. We suggest adding a 32.768 kHz crystal and 2 capacitors as shown in the upper left corner of the evaluation board schematics. The 32MHz main clock won’t be active at idle state to save power. Two inductors required for DCDC converter are inside BM833A module. You can enable DCDC to lower power consumption. 20

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 6. Preloaded Firmware Modules are loaded with production test codes to • enable Bluetooth transmitter for power measurement. • set each GPIO pin to high/low for continuity measurement. Production test codes are not erased when modules are shipped from factory. To reprogram with your codes, follow the procedures in Reprogram with User’s Codes Section. Starting with November 2018 production (date code 1847 or later), AT command codes for UART interface with boot loader are used in production testing. You can use AT command codes as loaded or erase and reprogram with your codes. Fanstel may upgrade AT command codes and use new firmware in production testing. If you prefer to use a specific version of AT command codes, please download and save. AT command codes are free to use as loaded. Programming services for a specific version of codes or user’s codes are available in factory for fee and with Minimum Order Quantity. Reprogram with New AT Command Codes Up to date AT command codes for UART and SPI interfaces can be downloaded from Fanstel website. http://www.fanstel.com/download-document/ You can reprogram new AT command codes using OTA DFU (Over The Air Device Firmware Upgrade). Reprogram with User’s Codes To load your application codes, SoftDevice, and bootloader, you need to chiperase and reprogram modules. An example for BT832 module: //program BT832 Bootloader+Softdevice+Application hex nrfjprog -f NRF52 --program BT832_AT_3in1PC181113.hex --chiperase --reset //The file BT832_AT_3in1PC181113.hex = softdevice S1320v6.1.1+BT832_AT_UARTwithout32K+bootloader 21

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 7. Miscellaneous Soldering Temperature-Time Profile for Re-Flow Soldering Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight. Cautions, Design Notes, and Installation Notes Failure to follow the guidelines set forth in this document may result in degrading of the product’sfunctions and damage to the product. Design Notes (1) Follow the conditions written in this specification, especially the control signals ofthis module. (2) The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the module). (3) This product should not be mechanically stressed when installed. (4) Keep this product away from heat. Heat is the major cause of decreasing the life of these products. (5) Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance. (6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. (7) this product away from other high frequency circuits. 22

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Notes on Antenna and PCB Layout (1) Don’t use a module with internal antenna inside a metal case. (2) For PCB layout: • Avoid running any signal line below module whenever possible, • No ground plane below antenna, • If possible, cut-off the portion of main board PCB below antenna. Installation Notes (1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets.Set up the temperature at the soldering portion of this product according to this reflow profile. (2) Carefully position the products so that their heat will not burn into printed circuitboards or affect the other components that are susceptible to heat. (3) Carefully locate these products so that their temperatures will not increase due tothe effects of heat generated by neighboring components. (4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. (5) This product should not be mechanically stressed or vibrated when reflowed. (6) If you want to repair your board by hand soldering, please keep the conditions of this chapter. (7) Do not wash this product. (8) Refer to the recommended pattern when designing a board. (9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. Usage Condition Notes (1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products. (2)Do not use dropped products. (3)Do not touch, damage or soil the pins. (4) Follow the recommended condition ratings about the power supply applied to thisproduct. (5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB (6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. (7) These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, informationand communication equipment. Storage Notes (1)The module should not be stressed mechanically during storage. (2)Do not store these products in the following conditions or the performancecharacteristics of the product, such as RF performance will be adverselyaffected: 23

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 • Storage in salty air or in an environment with a high concentration of corrosive gas. • Storage in direct sunlight • Storage in an environment where the temperature may be outside the range specified. • Storage of the products for more than one year after the date of delivery storage period. (3) Keep this product away from water, poisonous gas and corrosive gas. (4) This product should not be stressed or shocked when transported. (5) Follow the specification when stacking packed crates (max. 10). Safety Conditions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum. (1)Ensure the safety of the whole system by installing a protection circuit and a protection device. (2)Ensure the safety of the whole system by installing a redundant circuit or anothersystem to prevent a dual fault causing an unsafe status. Other Cautions (1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. (2)Do not use the products for other purposes than those listed. (3)Be sure to provide an appropriate failsafe function on your product to prevent anadditional damage that may be caused by the abnormal function or the failure of the product. (4)This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. (5)These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner. • In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. • In direct sunlight, outdoors, or in a dusty environment • In an environment where condensation occurs. • In an environment with a high concentration of harmful gas. (6) If an abnormal voltage is applied due to a problem occurring in other componentsor circuits, replace these products with new products because they may not beable to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 24

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 (7) When you have any question or uncertainty, contact Fanstel. Packaging Production modules are delivered in reel, 1000 modules in each reel. FCC LABEL The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only. 25

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 8. Revision History • July 2019, Ver. 0.90: The first copy 26

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 9. Contact Us United States: Fanstel Corp. 7466 E. Monte Ctisto Ave. Scottsdale AZ 85260 Tel. 1 480-948-4928 Fax. 1-480-948-5459 Email: module@fanstel.com Website: www.fanstel.com Taiwan: Fanstel Corp. 10F-10, 79 Xintai Wu Road Xizhu, New Taipei City, Taiwan 22101 泛世公司 臺灣省新北市汐止區新臺五路 79 號 10 樓之 10, 22101 Tel. 886-2-2698-9328 Fax. 886-2-2698-4813 Email: tp@fanstel.com Website: www.fanstel.com China: Fanstel Technologies Corp. 11 Jiale Street Ping-Dih, Long-Gang, Shen Zhen, GD 518117 泛世康科技(深圳)有限公司 廣東省深圳市龍崗區坪地鎮佳樂街 11 號 Tel. 86-755-8409-0928 Fax. 86-755-8409-0973 QQ. 3076221086 Email: sz@fanstel.com Website: www.fanstel.com 27

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Federal Communications Commission (FCC) Statement You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: 1) this device may not cause harmful interference, and 2) this device must accept any interferencereceived, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. RF exposure warning This equipment must be installed and operated in accordance with provided instructions and the antenna(s) usedfor this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and mustnot be co-located or operating in conjunction with any other antenna or transmitter. End-users and installers mustbe provide with antenna installation instructions and transmitter operating conditions for satisfying RF exposurecompliance. Industry Canada (IC) Statement This device complies with Industry Canada license-exempt RSS standard(s). Operation is subjectto the following two conditions: (1) this device may not cause interference, and (2) this devicemust accept any interference, including interference that may cause undesired operation of thedevice. 28

BLE5.1Module BM833A/AF Data SheetsVer 0.90 July 2019 Canada, avis d’Industry Canada (IC) Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Informations concernant l'exposition aux fréquences radio (RF) Cet équipement est conforme avec l'exposition aux radiations IC définies pour un environnement noncontrôlé. Cet équipement doit être installé et utilisé à une distance minimum de 20 cm entre le radiateuret votre corps. Cet émetteur ne doit pas être co-localisées ou opérant en conjonction avec une autreantenne ou transmetteur. Les utilisateurs finaux et les installateurs doivent être informés des instructions d'installation de l'antenne et des conditions de fonctionnement de l'émetteur afin de satisfaire à la conformité d'exposition RF. Note: The end product shall has the words “Contains Transmitter Module FCC ID:X8WBM833A,IC: 4100A-BM833A” Information for the OEM and Integrators The following statement must be included with all versions of this document supplied to an OEM or integrator, but should not be distributed to the end user. (1) This device is intended for OEM integrators only. (2) Please see the full Grant of Equipment document for other restrictions. 29


Document Created: 2019-10-31 11:07:04
Document Modified: 2019-10-31 11:07:04
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