User Manual

FCC ID: WUI-BLELED

Users Manual

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FCCID_4466057

Bluetooth Module Datasheet Model: BLELED Module for Lighting kit BLELED Document Information Title Module for Lighting kit Document type Datasheet Document number SL-18050051 Revision and date V4.02 15-May-2018 Disclosure restriction Public 1 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED This document applicable to the following products： Product name Type number Product status Module for BLELED Mass Production Lighting kit 2 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED Contents 1 General Description ................................................................................................................................................4 2 Applications ............................................................................................................................................................4 3 Features..................................................................................................................................................................5 4 Application Block Diagram .....................................................................................................................................5 5 Interfaces ................................................................................................................................................................6 5.1 Power Supply ...............................................................................................................................................6 5.2 System Function Interfaces..........................................................................................................................6 5.2.1 GPIOs ..................................................................................................................................................6 5.2.2 Two-wire Interface (I2C Compatible) ...................................................................................................6 5.2.3 Flash Program I/Os..............................................................................................................................7 5.2.4 Serial Peripheral Interface ...................................................................................................................7 5.2.5 UARTs .................................................................................................................................................7 5.2.6 Analog to Digital Converter (ADC).......................................................................................................8 5.2.7 Low Power Comparator (LPCOMP) ....................................................................................................8 5.2.8 Reset....................................................................................................................................................8 6 Module Specifications.............................................................................................................................................9 7 Module Pinout and Pin Description ...................................................................................................................... 10 7.1 Module Pinout ............................................................................................................................................10 7.2 Pin Description ...........................................................................................................................................11 8 PCB Design Guide ............................................................................................................................................... 12 9 PCB Footprint and Dimensions ............................................................................................................................ 12 10 Electrical Characteristics ....................................................................................................................................13 10.1 Absolute Maximum Ratings ..................................................................................................................... 13 10.2 Recommended Operation Ratings...........................................................................................................14 10.3 Current ..................................................................................................................................................... 14 11 Manufacturing Process Recommendations .......................................................................................................14 12 Ordering Information...........................................................................................................................................15 13 Packaging Specification .....................................................................................................................................15 14 FCC/IC Information.............................................................................................................................................16 15 Revision History.................................................................................................................................................. 17 3 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 1 General Description The BLELED is a highly integrated Bluetooth 4.2 BLE module, designed for high data rate, short-range wireless communication in the 2.4GHz ISM band. The module is based on Nordic nRF518xx radio Transceiver IC, has a 32 bit ARM Cortex-M0 CPU, Flash memory and analog and digital peripherals. The BLELED provides a low power and ultra-low cost BLE solution for wireless transmission applications. 2 Applications ◆ Computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad ◆ Interactive entertainment devices Remote control 3D Glasses Gaming controller ◆ Personal Area Networks Health/fitness sensor and monitor devices Medical devices Key-fobs + wrist watches ◆ Remote control toys ◆ Beacons ◆ Bluetooth Gateway ◆ Indoor Location ◆ Colourful LED Control Figure 1: BLELED Top View 4 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 3 Features ◆ Main Chip: nRF518xx ◆ Bluetooth® 4.2 low energy single-mode protocol stack L2CAP, ATT, GAP, GATT and SM protocols Central and Peripheral roles GATT Client and Server Full SMP support including MITM and OOB pairing ◆ Data rates up to 1Mbps ◆ 8/9/10 bit ADC-4 configurable channels ◆ 20 General Purpose I/O pins ◆ SPI Master/Slave ◆ Two-wire Master (I2C compatible) ◆ UART (CTS/RTS) ◆ CPU independent Programmable Peripheral Interconnect (PPI) ◆ Quadrature Decoder (QDEC) ◆ AES HW encryption ◆ RoHS compliance (Lead-free) ◆ CE,FCC compliance 4 Application Block Diagram Figure 2: BLELED Block Diagram 5 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 5 Interfaces 5.1 Power Supply Regulated power for the BLELED is required. The input voltage Vcc range should be 1.8V to 3.6V, current is not less than 20mA. Suitable decoupling must be provided by external decoupling circuitry (10uF and 0.1uF). It can reduce the noise from power supply and increase power stability. 5.2 System Function Interfaces 5.2.1 GPIOs The general purpose I/O is organized as one port with up to 20 I/Os enabling access and control of up to 20 pins through one port. Each GPIO can be accessed individually with the following user configurable features: 1、Input/output direction 2、Output drive strength 3、Internal pull-up and pull-down resistors 4、Wake-up from high or low level triggers on all pins 5、Trigger interrupt on all pins 6、All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels 7、All pins can be individually configured to carry serial interface or quadrature demodulator signals 8、All pins can be configured as PWM signal. 9、There are 4 ADC/LPCOMP input in the 20 I/Os. 5.2.2 Two-wire Interface (I2C Compatible) The two-wire interface can communicate with a bi-directional wired-AND bus with two lines (SCL, SDA). The protocol makes it possible to interconnect up to 127 individually addressable devices. The interface is capable of clock stretching, supporting data rates of 100 kbps and 400 kbps. The module has 2 TWI ports and they properties like following table. Instance Master/Slave TWI0 Master TWI1 Master Table5-1: TWI Pin Share Scheme 6 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED Note：I2C:Inter－Integrated Circuit 5.2.3 Flash Program I/Os The module has two programmer pins, respectively SWDCLK pin and SWDIO pin. The two pin Serial Wire Debug (SWD) interface provided as a part of the Debug Access Port (DAP) offers a flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints and single stepping are part of this support. SWDIO can also be used as system reset pin, the system reset pin is active low. 5.2.4 Serial Peripheral Interface The SPI interfaces enable full duplex synchronous communication between devices. They support a three-wire (SCK, MISO, MOSI) bi-directional bus with fast data transfers. The SPI Master can communicate with multiple slaves using individual chip select signals for each of the slave devices attached to a bus. Control of chip select signals is left to the application through use of GPIO signals. SPI Master has double buffered I/O data. The SPI Slave includes EasyDMA for data transfer directly to and from RAM allowing Slave data transfers to occur while the CPU is IDLE. The GPIOs are used for each SPI interface line can be chosen from any GPIOs on the device and configed independently. This enables great flexibility in device pinout and efficient use of printed circuit board space and signal routing. The SPI peripheral support SPI mode 0,1,2,and 3.The module have 3 SPI ports and theirs they properties are as below: Instance Master/Slave SPI0 Master SPI1 Master SPIS1 Slave Table5-2: SPI Properties 5.2.5 UARTs The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication with built-in flow control (CTS, RTS), support in hardware up to 1 Mbps baud. Parity checking is supported. The default P0.08 is UART_TX, P0.09 is UART_RX. Support the following baudrate in bps unit: 1200/2400/4800/9600/14400/19200/28800/38400/57600/76800/115200. 7 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED BLELED Pin Pin Name UART Pin Share Number 16 P0.08 UART_TX UART(For Debug) 17 P0.09 UART_RX Table5-3: UART Pin Share Scheme Note: The GPIOs are used for each SPI/TWI/UART interface line can be chosen from any GPIOs on the device and configed independently. 5.2.6 Analog to Digital Converter (ADC) The 10 bit incremental Analog to Digital Converter (ADC) enables sampling of up to 8 external signals through a front-end multiplexer. The ADC has configurable input and reference prescaling, and sample resolution (8, 9, and 10 bit). Note: The ADC module uses the same analog inputs as the LPCOMP module. Only one of the modules can be enabled at the same time. BLELED Pin Pin Number Description Number 12 P0.01 Digital I/O; Analog input 2 13 P0.02 Digital I/O; Analog input 3 14 P0.03 Digital I/O; Analog input 4 15 P0.04 Digital I/O; Analog input 5 Table5-4: ADC Pins 5.2.7 Low Power Comparator (LPCOMP) In System ON, the block can generate separate events on rising and falling edges of a signal, or sample the current state of the pin as being above or below the threshold. The block can be configured to use any of the analog inputs on the device. Additionally, the low power comparator can be used as an analog wakeup source from System OFF or System ON. The comparator threshold can be programmed to a range of fractions of the supply voltage. 5.2.8 Reset The reset pin of the BLELED module is in the internal pull-high state , when the reset pin of the 8 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED module is input to a low level , the module will be automatically reset .After the reset pin is used , the parameters of the current setting will not be reserved . 6 Module Specifications Hardware Features Model BLELED Antenna Type PCB Antenna Chipset Solution nRF518xx Voltage 1.8V~3.6V Dimension(L×W×H) 17.4×13.7×1.9 mm Wireless Features Wireless Standards Bluetooth ® 4.2 Frequency Range 2400MHz---2483.5MHz Data Rates 1Mbps Modulation Technique GFSK Modulation Wireless Security AES HW Encryption Transmit Power Tx Power -20 to +4 dBm in 4 dB Steps Work Mode Central/Peripheral Others Certification RoHS, FCC, CE Operating Temperature: -25℃~75℃ Storage Temperature: -40℃~85℃ Environment Operating Humidity: 10%~90% Non-condensing Storage Humidity: 5%~90% Non-condensing 9 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 7 Module Pinout and Pin Description 7.1 Module Pinout Figure 3: BLELED Module Pinout 10 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 7.2 Pin Description Pin No. Pin Name Description Remark 1 GND Ground 2 VCC Main Power Supply 1.8V to 3.6V 3 P0.21 General Purpose I/O Digital I/O 4 P0.22 General Purpose I/O Digital I/O 5 P0.23 General Purpose I/O Digital I/O 6 P0.24 General Purpose I/O Digital I/O 7 P0.25 General Purpose I/O Digital I/O 8 P0.28 General Purpose I/O Digital I/O 9 P0.29 General Purpose I/O Digital I/O 10 GND Ground 11 P0.30 General Purpose I/O Digital I/O 12 P0.01 Digital I/O; Analog input ADC/LPCOMP input 2 13 P0.02 Digital I/O; Analog input ADC/LPCOMP input 3 14 P0.03 Digital I/O; Analog input ADC/LPCOMP input 4 15 P0.04 Digital I/O; Analog input ADC/LPCOMP input 5 16 P0.08 General Purpose I/O Default UART TX 17 P0.09 General Purpose I/O Default UART RX 18 P0.10 General Purpose I/O Digital I/O 19 P0.11 General Purpose I/O Digital I/O 20 P0.12 General Purpose I/O Digital I/O 21 P0.13 General Purpose I/O Digital I/O 22 P0.14 General Purpose I/O Digital I/O 23 P0.17 General Purpose I/O Digital I/O Hardware debug and Flash 24 SWDCLK Digital input program I/O Hardware Debug and Flash SWDIO/n RESET Program I/O; System Reset Digital I/O (Active low) 25 11 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 8 PCB Design Guide Please reserve empty area for PCB antenna when you are going to design a board, the empty range device’s minimum size :16.5*6.6mm , please kindly check the “PCB footprint and Dimensions” for reference. 9 PCB Footprint and Dimensions Figure 4: BLELED Recommended PCB Footprint 12 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 10 Electrical Characteristics 10.1 Absolute Maximum Ratings Parameter Condition Min. Typ. Max. Unit Storage Temperature Range -40 85 °C ESD Protection VESD / 4000 V Supply Voltage VCC -0.3 3.9 V Voltage On Any I/O Pin -0.3 3.63 V Table10-1: Absolute Maximum Ratings Note: Absolute maximum ratings are stress ratings only, and functional operation at the maxims is not guaranteed. Stress beyond the limits specified in this table may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the operating conditions tables as follow. *BLELED series modules are Electrostatic Sensitive Devices and require special precautions while handling. ESD precautions The BLELED series modules contain highly sensitive electronic circuitry and are Electrostatic Sensitive Devices (ESD). Handling the BLELED series modules without proper ESD protection may destroy or damage them permanently. The BLELED series modules are electrostatic sensitive devices (ESD) and require special ESD precautions typically applied to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling, transportation and operation of any application that incorporates the BLELED series module. Don’t touch the module by hand or solder with non-anti-static soldering iron to avoid damage to the mode. 13 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 10.2 Recommended Operation Ratings Parameter Symbol Min. Typ. Max. Unit Extended Temp. Range TA -25 75 ºC Power Supply VCC 1.8 3.3 3.6 V Input Low Voltage VIL 0 1 V Input High Voltage VIH 2.3 3.9 V Table10-2: Operating Conditions 10.3 Current System State TX Peak RX Peak Advertise Interval Sleep Mode Idle Mode @0dBm @100ms (0dBm)(avg) （avg） (avg) Current (peak)@3V 10.5 mA 13 mA 270uA 0.28uA 2.43uA Table10-3: Power Consumption in Different States 11 Manufacturing Process Recommendations Figure 5: BLELED Typical Lead-free Soldering Profile Note：The final re-flow soldering temperature map chosen at the factory depends on additional external factors, for example, choice of soldering paste, size, thickness and properties of the module`s baseboard etc. 14 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED Exceeding the maximum soldering temperature in the recommended soldering profile may permanently damage the module. 12 Ordering Information Module No. Type number Chipset Certification BLELED 09192 nRF51822 RoHS, FCC, CE BLELED 0919204 nRF51802 RoHS, FCC, CE 13 Packaging Specification BLELED modules are put into tray and 528 units per tray. Each tray is ‘dry’ and vacuum packaging. Figure 6: BLELED Packaging 15 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 14. FCC Information This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. THE MANUFACTURER IS NOT RESPONSIBLE FOR ANY RADIO OR TV INTERFERENCE CAUSED BY UNAUTHORIZED MODIFICATIONS OR CHANGE TO THIS EQUIPMENT. SUCH MODIFICATIONS OR CHANGE COULD VOID THE USER’S AUTHORITY TO OPERATE THE EQUIPMENT. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Increase the separation between the equipment and receiver. -- Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. To satisfy FCC exterior labeling requirements, the following text must be placed on the exterior of the end product “Contains Transmitter module FCC ID: WUI-BLELED” The modular must be installed in the host that assign by Company name: Winplus Co., Ltd. Product/PMN: Exterior Trim LED Model no./HVIN: LM57485 if other host types used would need further evaluation and possible C2PC if they are not significantly similar to the one tested. IC Information -English: 1. This device complies with Industry Canada RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This equipment complies with ISED RF radiation exposure limits set forth for an uncontrolled environment. -French: Leprésent appareil est conforme aux CNR d'Industrie Canada applicable aux appareils radio Exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement." Cet appareil est conforme aux limitesd'exposition de rayonnement RF ISEDC établiespour un environnement non contrôlé. Pour satisfaire la ISED extérieur étiquetage, le texte suivant doit être placéàl’extérieur du produit final “Contains émetteur module IC:7297A-BLELED”. The modular must be installed in the host that assign by Le modulaire doit être installé dans l'hôte assigné par Nom de la compagnie: Winplus Co., Ltd. Produit/PMN: Exterior Trim LED Modèle no./HVIN: LM57485 if other host types used would need further evaluation and possible C2PC if they are not significantly similar to the one tested. si d'autres types d'hôtes utilisés nécessiteraient une évaluation plus poussée et un C2PC possible s'ils ne sont pas significativement similaires à celui testé 16 / 17 SKB360-DA-001,A/4

Bluetooth Module Datasheet Model: BLELED 14 Revision History Revision Description Approved Date V1.01 Initial Release Sunny 20140611 V2.01 Upgrade Hardware Sunny 20150117 V2.02 Add AT Instruction Sunny 20150528 V2.03 Upgrade hardware Hogan 20160611 V3.01 Upgrade format Hogan 20161211 V3.02 Upgrade product image Hogan 20170504 V3.03 Update certification information George 20170831 V4.01 Add order information George 20180209 V4.02 Add part number information George 20180515 17 / 17 SKB360-DA-001,A/4


Document Created: 2019-09-19 12:33:28
Document Modified: 2019-09-19 12:33:28
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