User Manual_CYBLE-413136-01

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PRELIMINARY CYBLE-413136-01 EZ-BLE™ Module with HomeKit General Description n RX current consumption p BLE silicon: 5.8 mA (radio only) The CYBLE-413136-01 is a Bluetooth Low Energy (BLE) p RFX2401C: 7.5 mA (PA/LNA only) wireless module solution with integrated Apple HomeKit support, including the authentication co-processor. The n Cypress CYW20719 silicon low power mode support CYBLE-413136-01 includes onboard crystal oscillators, passive p PDS: 70 μA with 512 KB SRAM retention components, and the Cypress CYW20719 silicon device. p Deep Sleep: 1 μA with 16 KB SRAM retention The CYBLE-413136-01 supports a number of peripheral p HIDOFF: 350 nA with XRES wakeup functions (ADC and PWM), as well as UART serial Functional Capabilities communication protocol. The CYBLE-413136-01 includes a royalty-free BLE stack compatible with Bluetooth 4.2 in a 14.7 × n Apple HomeKit compliant with on-board authentication 20.0 × 1.40mm package. co-processor The CYBLE-413136-01 includes an integrated PCB trace n Switched-cap Sigma-Delta ADC with internal reference antenna. The CYBLE-413136-01 is qulaified by Bluetooth SIG, and includes regulatory certification approval for FCC, ISED, and n UART serial communication block (PUART) CE. n Four dedicated PWM blocks Module Description n BLE protocol stack supporting generic access profile (GAP) n Module size: 14.70 mm × 20.00 mm × 2.60 mm Central, Peripheral, Observer, or Broadcaster roles n Extended Range: Benefits p Up to 400 meters bi-directional communication[1,2] p Up to 450 meters in beacon only mode[1] CYBLE-413136-01 is fully integrated and certified solution that provides all necessary components required to operate BLE n Bluetooth LE 4.2 single-mode module communication standards. n Certified to FCC, IED, and CE standards n Proven hardware design ready to use n Castelated solder pad connections for ease-of-use n Large non-volatile memory for complex application devel- opment n 1024-KB flash memory, 512-KB SRAM memory n Over-the-air update capable for development or field updates n Extended Industrial temperature range: –30 °C to +105 °C n Bluetooth SIG qualified with QDID and Declaration ID n Cortex-M4F 32-bit processor operating up to 96MHz n WICED™ Studio provides an easy-to-use integrated design n Watchdog timer with dedicated internal low-speed oscillator environment (IDE) to configure, develop, program, and test a Power Consumption BLE application n Maximum TX output power: +8.0 dbm[3] n RX Receive Sensitivity: –93 dbm n Received signal strength indicator (RSSI) with 1-dB resolution n TX current consumption p BLE silicon: 5.7 mA (radio only, –16 dbm) p RFX2401C: 27 mA (PA/LNA only, module +8 dBm) Notes 1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interferance sources with output power of +8.0 dBm. 2. Specified as module-to-module range. Mobile phone connection range will decrease based on the PA/LNA performance of the mobile phone used. 3. The CYBLE-413136-01 is capable of higher output power than specified, but is intentionally limited to +8.0dBm due to regulatory requirements for European Standards. Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Document Number: 002-19043 Rev. PRELIMINARY Revised May 12, 2017

PRELIMINARY CYBLE-413136-01 Contents ADC Port.......................................................................... 15 Overview 3 PWM................................................................................. 15 Functional Block Diagram ........................................... 3 Triac Control ................................................................... 16 Module Description...................................................... 3 Security Engine .............................................................. 16 Pad Connection Interface ................................................ 5 Electrical Characteristics............................................... 17 Recommended Host PCB Layout ................................... 6 Core Buck Regulator ................................................. 18 Module Connections ........................................................ 7 Digital LDO ................................................................ 19 Connections and Optional External Components ....... 7 RF LDO ..................................................................... 20 Power Connections (VCC) .......................................... 7 Digital I/O Characteristics.......................................... 21 External Reset (XRES)................................................ 7 Current Consumption ................................................ 21 UART Connections...................................................... 7 RF Specifications ........................................................... 22 External Component Recommendation ...................... 7 Timing and AC Characteristics ..................................... 23 Critical Components List ............................................. 9 UART Timing............................................................. 23 Antenna Design........................................................... 9 Environmental Specifications ....................................... 24 Bluetooth Baseband Core ............................................. 10 Environmental Compliance ....................................... 24 Bluetooth Low Energy ............................................... 10 RF Certification.......................................................... 24 Power Management Unit................................................ 11 Safety Certification .................................................... 24 RF Power Management ............................................ 11 Environmental Conditions ......................................... 24 Host Controller Power Management ......................... 11 ESD and EMI Protection ........................................... 24 BBC Power Management.......................................... 11 Regulatory Information .................................................. 25 Microprocessor Unit....................................................... 12 FCC ........................................................................... 25 Floating Point Unit ..................................................... 12 ISED .......................................................................... 26 On-Chip Flash ........................................................... 12 European R&TTE Declaration of Conformity ............ 27 OTP ........................................................................... 12 Packaging........................................................................ 28 External Reset........................................................... 12 Ordering Information...................................................... 30 Integrated Radio Transceiver ........................................ 13 Acronyms ........................................................................ 31 Transmitter Path........................................................ 13 Document Conventions ................................................. 31 Digital Modulator ....................................................... 13 Units of Measure ....................................................... 31 Power Amplifier ......................................................... 13 Document History Page ................................................. 32 Receiver Path............................................................ 13 Sales, Solutions, and Legal Information ...................... 33 Digital Demodulator and Bit Synchronizer................. 13 Worldwide Sales and Design Support....................... 33 Receiver Signal Strength Indicator............................ 13 Products .................................................................... 33 Calibration ................................................................. 14 PSoC® Solutions ...................................................... 33 Internal LDO Regulator ............................................. 14 Cypress Developer Community................................. 33 Peripheral Transport Unit .............................................. 14 Technical Support ..................................................... 33 UART Interface.......................................................... 14 Peripheral UART Interface ........................................ 15 Document Number: 002-19043 Rev. 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PRELIMINARY CYBLE-413136-01 Overview Functional Block Diagram Figure 1 illustrates the CYBLE-413136-01 functional block diagram. Figure 1. Functional Block Diagram Module Description The CYBLE-413136-01 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 2 on page 4. All dimensions are in millimeters (mm). Table 1. Module Design Dimensions Dimension Item Specification Length (X) 14.70 ± 0.15 mm Module dimensions Width (Y) 20.00 ± 0.15 mm Length (X) 14.70 mm Antenna location dimensions Width (Y) 4.80 mm PCB thickness Height (H) 0.80 ± 0.10 mm Shield height Height (H) 1.80 mm Maximum component height Height (H) 0.60 mm typical Total module thickness (bottom of module to highest component) Height (H) 2.60 mm typical See Figure 2 for the mechanical reference drawing for CYBLE-413136-01. Document Number: 002-19043 Rev. PRELIMINARY Page 3 of 33

PRELIMINARY CYBLE-413136-01 Figure 2. Module Mechanical Drawing Side View Top View (See from Top) Bottom View (Seen from Bottom) Notes 4. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout” on page 6. 5. The CYBLE-413136-01 includes castellated pad connections, denoted as the circular openings at the pad location above. Document Number: 002-19043 Rev. PRELIMINARY Page 4 of 33

PRELIMINARY CYBLE-413136-01 Pad Connection Interface As shown in the bottom view of Figure 2 on page 4, the CYBLE-413136-01 has seven main connections that are connected to the host board via castellated solder pads (“CSP”). The CYBLE-413136-01 also includes additional solder pad connections (“SP”) used for debug or testing on the bottom side of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBLE-413136-01 module. Table 2. Connection Description Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch CSP 7 Castellated Solder Pads 2.00 mm 1.30 mm 2.00 mm SP 7 Solder Pads 0.65 mm (Radius) 0.65 mm (Radius) N/A Figure 3. Solder Pad Dimensions (Seen from Bottom) Castellated Solder Pad (CSP) and Solder Pad (SP) Connection (Seen from Bottom) To maximize RF performance, the host layout should follow these recommendations: 1. Antenna Area Keepout: The host board directly below the antenna area of the Cypress module (see Figure 2 on page 4) must contain no ground or signal traces. This keep out area requirement applies to all layers of the host board. 2. Module Placement: The ideal placement of the Cypress Bluetooth module is in a corner of the host board with the PCB trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Please refer to AN96841 for module placement best practices. 3. Optional Keepout: To maximize RF performance, the area immediately around the Cypress Bluetooth module PCB trace antenna may contain an additional keep out area, where no grounding or signal traces are contained. The keep out area applies to all layers of the host board. The recommended dimensions of the host PCB keep out area are shown in Figure 4 (dimensions are in mm). Figure 4. Optional Additional Host PCB Keep Out Area Around the CYBLE-413136-01 PCB Trace Antenna Optional Host PCB Keep Out Area Around Chip Antenna Document Number: 002-19043 Rev. PRELIMINARY Page 5 of 33

PRELIMINARY CYBLE-413136-01 Recommended Host PCB Layout Figure 5 (Dimensioned) and Figure 6 (Relative to Origin) provide the recommended host PCB layout pattern for the CYBLE-413136-01. Pad length of 1.27 mm (0.655 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length. All dimensions are in millimeters. Figure 5. CYBLE-413136-01 Host Layout (Dimensioned) Figure 6. CYBLE-413136-01 Host Layout (Relative to Origin) Top View (Seen on Host PCB) Top View (Seen on Host PCB) Document Number: 002-19043 Rev. PRELIMINARY Page 6 of 33

PRELIMINARY CYBLE-413136-01 Module Connections Table 3 details the solder pad connection definitions and available functions for each connection pad. Table 3 lists the solder pads on the CYBLE-413136-01, the silicon device pin, and denotes what functions are available for each solder pad. Table 3 also lists the primary/intended function for each solder pad for the application this module was specifically designed for. Table 3. Solder Pad Connection Definitions Pad Num- Pad Name UART PWM GPIO Primary Function ber 1 VCC Power Supply Input (3.30V) Power Supply Input 2 GND Ground Connection Ground Connection 3 PWM1 3 3 PWM R, G, B, or W Function 4 PWM2 3 3 PWM R, G, B, or W Function 5 PWM3 3 3 PWM R, G, B, or W Function 6 PWM4 3 3 PWM R, G, B, or W Function 7 ADC ADC Input 8 PUART_TX 3(UART_TXD) Peripheral UART TXD 9 PUART_RX 3(UART_RXD) Peripheral UART RXD 10 XRES External Reset Hardware Connection Input External Reset (Active Low) 11 UART_RXD 3(UART_RXD) UART RXD 12 UART_TXD 3(UART_TXD) UART TXD 13 UART_CTS 3(UART_CTS) UART CTS 14 UART_RTS 3(UART_RTS) UART RTS GND GND Ground Connection Ground Connections GND GND Ground Connection Must be soldered to host board Connections and Optional External Components Power Connections (VCC) External Component Recommendation The CYBLE-413136-01 contains one power supply connection, Power Supply Circuitry VCC. It is not required to place any power supply decoupling or noise VCC accepts a supply input of 3.30 V. Table 9 provides this reduction circuitry on the host PCB. If desired, an external ferrite specification. The maximum power supply ripple for this power bead between the supply and the module connection can be connection is 100 mV, as shown in Table 9. included, but is not necessary. If used, the ferrite bead should be External Reset (XRES) positioned as close as possible to the module pin connection. The CYBLE-413136-01 has an integrated power-on reset circuit If used, the recommended ferrite bead value is 330Ω, 100 MHz. which completely resets all circuits to a known power on state. (Murata BLM21PG331SN1D). This action can also be driven by an external reset signal, which Apple MFi Authentication Coprocessor Interface can be used to externally control the device, forcing it into a power-on reset state. The XRES signal is an active-low signal, The CYBLE-413136-01 comes with an integrated MFi authenti- which is an input to the CYBLE-413136-01 module. cation co-processor. No additoinal connections are required to be made to the module to enable Apple HomeKit functionality. All UART Connections connections required are internally routed on the module PCB. For full UART functionality, all UART signals must be connected to the Host device. If full UART functionality is not being used, and only UART RXD and TXD are desired or capable, then the following connection considerations should be followed for UART RTS and CTS: n UART RTS: Can be left floating, pulled low, or pulled high. RTS is not critical for initial firmware uploading at power on. n UART CTS: Must by pulled low to bypass flow control and to ensure that continuous data transfers are made from the host to the module. Document Number: 002-19043 Rev. PRELIMINARY Page 7 of 33

PRELIMINARY CYBLE-413136-01 Figure 7 illustrates the CYBLE-413136-01 schematic. Figure 7. CYBLE-413136-01 Schematic Diagram Document Number: 002-19043 Rev. PRELIMINARY Page 8 of 33

PRELIMINARY CYBLE-413136-01 Critical Components List Table 4 details the critical components used in the CYBLE-413136-01 module. Table 4. Critical Component List Component Reference Designator Description Authentication Co-Processor U1 Apple Authentication Co-processor Silicon U2 40-pin QFN BLE Silicon Device - CYW20719 PA/LNA U3 17-pin QFN - Skyworks RFX2401C Crystal Y1 24.000 MHz, 12PF Antenna Design Table 5 details the PCB trace antenna used in the CYBLE-413136-01 module. Table 5. Trace Antenna Specifications Item Description Frequency Range 2402 – 2480 MHz Peak Gain –0.5 dBi maximum Document Number: 002-19043 Rev. PRELIMINARY Page 9 of 33

PRELIMINARY CYBLE-413136-01 Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it, handles data flow control, schedules TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it independently handles host controller interface (HCI) event types, and HCI command types. The following transmit and receive functions are also implemented in the BBC hardware to increase reliability and security of the TX/RX data before sending over the air: n Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy check (CRC), data decryption, and data dewhitening in the receiver. n Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and data whitening in the transmitter. Bluetooth Low Energy The CYBLE-413136-01 supports single-mode Bluetooth LE operation. The CYBLE-413136-01 supports all Bluetooth 4.2 and legacy LE features, with the following benefits: n LE data packet length extension n LE secure connections n Link layer privacy n Enables Bluetooth Smart sensors to access the Internet directly via IPv6/6LoWPAN Link Control Layer The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit (LCU). This layer consists of the command controller that takes commands from the software, and other controllers that are activated or configured by the command controller, to perform the link control tasks. Each task performs a different state in the Bluetooth® Link Controller. n Major states: p Standby p Connection Document Number: 002-19043 Rev. PRELIMINARY Page 10 of 33

PRELIMINARY CYBLE-413136-01 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked through power management registers or packet handling in the baseband core. This section contains descriptions of the PMU features. Figure 8. Power Management Unit of CYW20719 RF Power Management Figure 8 shows the CYBLE-413136-01 power management unit (PMU) block diagram that is contained in the CYW20719 silicon device. The CYW20719 includes an integrated buck regulator, a bypass LDO, a capless LDO, and an additional 1.2 V LDO for RF. Host Controller Power Management Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the disabling of the on-chip regulator when in HIDOFF (deep sleep) mode. BBC Power Management There are several low-power operations for the BBC: n Physical layer packet handling turns RF on and off dynamically within packet TX and RX. n Bluetooth-specified low-power connection mode. While in these low-power connection modes, the CYBLE-413136-01 runs on the Low Power Oscillator and wakes up after a predefined time period. The CYBLE-413136-01 automatically adjusts its power dissipation based on user activity. It supports the following power modes: n Active mode n Idle mode n Sleep mode n HIDOFF (deep sleep) mode The CYBLE-413136-01 transitions to the next lower state after a programmable period of user inactivity. When user activity resumes, the CYBLE-413136-01 immediately enters Active mode. In HIDOFF mode, the CYBLE-413136-01 baseband and core are powered off by disabling power to VDDC_OUT and PAVDD. The VDDO domain remains powered up and will turn the remainder of the chip on when it detects user events. This mode minimizes chip power consumption and is used for extended periods of inactivity. Document Number: 002-19043 Rev. PRELIMINARY Page 11 of 33

PRELIMINARY CYBLE-413136-01 Microprocessor Unit The CYBLE-413136-01 microprocessor unit runs software from the link control (LC) layer up to the host controller interface (HCI). The microprocessor is a Cortex<Superscript>®-M4 32-bit RISC processor with embedded ICE-RT debug and serial wire debug (SWD) interface units. The microprocessor also includes 2 MB of ROM memory for program storage and 512 KB of RAM for data scratch-pad. The internal ROM provides flexibility during power-on reset to enable the same device to be used in various configurations. At power-up, the lower layer protocol stack is executed from the internal ROM. External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. The device also supports the integration of user applications and profiles. Patches and applications can be stored in on-chip flash. Floating Point Unit The CYBLE-413136-01 includes the CM4 single precision IEEE-754 compliant floating point unit. For additional details, see the Cor- tex-M4 manual. On-Chip Flash The silicon device used in the CYBLE-413136-01 module includes 1 MB of on-chip flash. This flash can be used for direct program execution or for non-volatile data. Typical usage for the on-chip flash includes: n Chip configuration n Patches n Peer addresses and link keys n Application code n Application non-volatile data n Product information OTP The CYBLE-413136-01 includes 2 KB of one-time programmable (OTP) memory. This memory can be used by the factory to store product specific information. Note: Use of OTP requires a 3 V supply to be present at all times. External Reset An external active-low reset signal, XRES, can be used to put the CYBLE-413136-01 in the reset state. An external voltage detector reset IC with 50 ms delay is needed on the XRES. The XRES should be released only after the VDDO supply voltage level has been stabilized for 50 ms. Document Number: 002-19043 Rev. PRELIMINARY Page 12 of 33

PRELIMINARY CYBLE-413136-01 Figure 9. Reset Timing Integrated Radio Transceiver The CYBLE-413136-01 has an integrated radio transceiver that is optimized for 2.4 GHz Bluetooth wireless systems. It has been designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz unli- censed ISM band. It is fully compliant with Bluetooth Radio Specification 3.0 and meets or exceeds the requirements to provide the highest communication link quality of service. Transmitter Path The CYBLE-413136-01 features a fully integrated transmitter. The baseband transmit data is GFSK modulated in the 2.4 GHz ISM band. Digital Modulator The digital modulator performs the data modulation and filtering required for the GFSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal. Power Amplifier The CYBLE-413136-01 has an integrated power amplifier (PA) on the silicon device as well as a high power external power amplifier (PA) integrated on the module. The total output power that this module is designed to achieve is +8 dBm. Receiver Path The receiver path uses a low IF scheme to down convert the received signal for demodulation in the digital demodulator and bit syn- chronizer. The receiver path provides a high degree of linearity, and an extended dynamic range to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology, which has built-in out-of-band attenuation, enables the CYBLE-413136-01 to be used in most applications without off-chip filtering. Digital Demodulator and Bit Synchronizer The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit syn- chronization algorithm. Receiver Signal Strength Indicator The radio portion of the CYBLE-413136-01 provides a receiver signal strength indicator (RSSI) to the baseband. This enables the controller to take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the transmitter should increase or decrease its output power. Document Number: 002-19043 Rev. PRELIMINARY Page 13 of 33

PRELIMINARY CYBLE-413136-01 Calibration The CYBLE-413136-01 radio transceiver features a self-contained automated calibration scheme. No user interaction is required during normal operation or during manufacturing to provide optimal performance. Calibration compensates for filter, matching net- work, and amplifier gain and phase characteristics to yield radio performance within 2% of what is optimal. Calibration takes process and temperature variations into account, and it takes place transparently during normal operation and hop setting times. Internal LDO Regulator The CYBLE-413136-01 has an integrated 1.2 V LDO regulator that provides power to the digital and RF circuits. The 1.2V LDO reg- ulator operates from a 1.425 V to 3.63 V input supply with a 30 mA maximum load current. Peripheral Transport Unit UART Interface The CYBLE-413136-01 includes a UART interface for factory programming as well as when operating as a BT HCI device in a sys- tem with an external host. The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 6 Mbps. During initial boot, UART speeds may be limited to 750 kbps. The baud rate may be selected via a vendor-specific UART HCI command. The CYBLE-413136-01 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to sup- port enhanced data rates. The interface supports the Bluetooth UART HCI (H4) specification. The default baud rate for H4 is 115.2 kbaud. The UART clock default setting is 24 MHz. The baud rate of the CYBLE-413136-01 UART is controlled by two values. The first is a UART clock divisor (set in the DLBR register) that divides the UART clock by an integer multiple of 16. The second is a baud rate adjustment (set in the DHBR register) that is used to specify a number of UART clock cycles to stuff in the first or second half of each bit time. Up to eight UART cycles can be inserted into the first half of each bit time, and up to eight UART clock cycles can be inserted into the end of each bit time. Table 6 contains example values to generate common baud rates with a 24 MHz UART clock. Table 6. Common Baud Rate Examples, 24 MHz Clock Baud Rate (bps) DHBR DLBR Mode Error (%) 3M 0xFF 0xF8 High rate 0.00 2M 0XFF 0XF4 High rate 0.00 1.5M 0X00 0XFF Normal 0.00 1M 0x44 0xFF Normal 0.00 921600 0x55 0xFF Normal 0.16 460800 0x22 0xFD Normal 0.16 230400 0x44 0xFA Normal 0.16 115200 0x00 0xF3 Normal 0.16 38400 0x01 0xD9 Normal 0.00 Table 7 contains example values to generate common baud rates with a 48 MHz UART clock. Table 7. Common Baud Rate Examples, 48 MHz Clock Baud Rate (bps) High Rate Low Rate Mode Error (%) 6M 0xFF 0xF8 High rate 0.00 4M 0xFF 0xF4 High rate 0.00 3M 0x0 0xFF Normal 0.00 2M 0x44 0xFF Normal 0.00 1.5M 0x00 0xFE Normal 0.00 1M 0x00 0xFD Normal 0.00 921600 0x22 0xFD Normal 0.16 460800 0x44 0xFA Normal 0.16 Document Number: 002-19043 Rev. PRELIMINARY Page 14 of 33

PRELIMINARY CYBLE-413136-01 Table 7. Common Baud Rate Examples, 48 MHz Clock (continued) Baud Rate (bps) High Rate Low Rate Mode Error (%) 230400 0x0 0xF3 Normal 0.16 115200 0x1 0xE6 Normal –0.08 57600 0x1 0xCC Normal 0.04 38400 0x11 0xB2 Normal 0.00 19200 0x22 0x64 Normal 0.00 Support for changing the baud rate during normal HCI UART operation is included through a vendor-specific command that allows the host to adjust the contents of the baud rate registers. The CYBLE-413136-01 UART operates correctly with the host UART as long as the combined baud rate error of the two devices is within ±5%. Peripheral UART Interface The CYBLE-413136-01 has a second UART that may be used to interface to peripherals. This peripheral UART is accessed through the optional I/O ports, which can be configured individually and separately for each functional pin. ADC Port The ADC block is a single switched-cap Σ-Δ ADC core for audio and DC measurement. It operates at the 12 MHz clock rate. The internal bandgap reference has ±5% accuracy without calibration. Different calibration and digital correction schemes can be applied to reduce ADC absolute error and improve measurement accuracy in DC mode. PWM The CYBLE-413136-01 has four PWMs. The PWM module consists of the following: n PWM1–4. Each of the four PWM channels contains the following registers: p 16-bit initial value register (read/write) p 16-bit toggle register (read/write) p 16-bit PWM counter value register (read) n PWM configuration register shared among PWM1–4 (read/write). This 18-bit register is used: p To configure each PWM channel p To select the clock of each PWM channel p To change the phase of each PWM channel Figure 10 shows the structure of one PWM. Document Number: 002-19043 Rev. PRELIMINARY Page 15 of 33

PRELIMINARY CYBLE-413136-01 Figure 10. PWM Block Diagram Triac Control The CYBLE-413136-01 includes hardware support for zero-crossing detection and trigger control for up to four triacs. The CYBLE-413136-01 detects zero-crossing on the AC zero detection line and uses that to provide a pulse that is offset from the zero crossing. This allows the CYBLE-413136-01 to be used in dimmer applications, as well as any other applications that require a con- trol signal that is offset from an input event. The zero-crossing hardware includes an option to suppress glitches. Security Engine The CYBLE-413136-01 includes a hardware security accelerator which greatly decreases the time required to perform typical secu- rity operations. Access to the hardware block is provided via a firmware interface (see firmware documentation for details).Thie security engine includes: n Public key acceleration (PKA) cryptography n AES-CTR/CBC-MAC/CCM acceleration n SHA2 message hash and HMAC acceleration n RSA encryption and decryption of modulus sizes up to 2048 bits n Elliptic curve Diffie-Hellman in prime field GF(p) n Generic modular math functions Document Number: 002-19043 Rev. PRELIMINARY Page 16 of 33

PRELIMINARY CYBLE-413136-01 Electrical Characteristics Note: All voltages listed in Table 8 are referenced to VCC. Table 8. Absolute Maximum Voltages Specification Requirement Parameter Minimum Nominal Maximum Unit Ambient Temperature of Operation –30 25 105 °C Storage temperature –30 – 110 °C ESD Tolerance HBM (Silicon) –2000 – 2000 V ESD Tolerance MM (Silicon) –100 – 100 V ESD Tolerance CDM (Silicon) –500 – 500 V Latch-up (Silicon) – 200 – mA Table 9 shows the power supply characteristics for the range TJ = 0°C to 125°C. Table 9. Power Supply Specifications Parameter Conditions Min. Typical Max. Unit VCC input Module Input 3.0 3.3 3.6 V VCC Ripple Module Input – – 100 mV VBAT Input Internal to Module (not accessible) 1.62 3.3 3.6 V PMU turn-on time VBAT is ready. – – 300 μs Document Number: 002-19043 Rev. PRELIMINARY Page 17 of 33

PRELIMINARY CYBLE-413136-01 Core Buck Regulator Table 10. Core Buck Regulator (Internal to Module) Parameter Conditions Min. Typ. Max. Unit Input supply voltage DC, VBAT DC voltage range inclusive of disturbances 2.1 3.3 3.63 V CBUCK output current LPOM only – – 65 mA Output over-current limit Peak inductor current TBD – – mA Output voltage range Programmable, 30mV/step 1.2 1.2 1.5 V default = 1.2V (bits=0000) Output voltage DC accuracy Includes load and line regulation: • Before trimming –4 – +4 % • After trimming –2 +2 % LPOM ripple voltage, static Measured with 20 MHz bandwidth limit, static load. – – 30 mVpp Max ripple based on VBAT=3V, Vout=1.2V Inductor: 0806 inch-size, Tmax=1 mm, 2.2 μH ±25%, DCR=114 mW ±20%, ACR<1W (for frequency <1 MHz) Capacitor: 1 μF ±10%, 6.3V, 0603 inch, X5R, MLCC capacitor + board total-ESR < 20 mW LPOM efficiency (high load) 10–50 mA load current, Vout=1.2V, Vbat=3V TBD 85 – % @25°C Inductor: 0806 inch-size, Tmax=1 mm, 2.2 μH ±25%, DCR=114 mW ±20%, ACR<1W (for frequency<1 MHz) Capacitor: 1 μF ±10%, 6.3V, 0603 inch, X5R, MLCC capacitor +board total-ESR < 20 mW LPOM efficiency (low load) 1–5 mA load current, Vout=1.2V, Vbat=3V @25°C TBD 80 – % Inductor: 0806 inch-size, Tmax=1 mm, 2.2 ?H ±25%, DCR=114 mW ±20%, ACR<1W (for frequency<1 MHz) Capacitor: 1 μF ±10%, 6.3V, 0603 inch, X5R, MLCC capacitor +board total-ESR < 20 mW Startup time see Table 11 on page 19. – – – – External inductor L 2.2 μH ±25%, DCR=114 mW ±20%, ACR<1W (for – 2.2 – μH frequency<1 MHz) External output capacitor, Cout 1 μF ±10%, 6.3V, 0603 inch, X5R, MLCC capacitor 0.7 1 1.1 μF +board total-ESR < 20 mW External input capacitor, Cin For SR_VDDBAT pin 0.7 4.7 5.64 μF Ceramic, X5R, 0402, ESR<30 mW at 4 MHz, +/-20%, 6.3V, 4.7 μF Input supply voltage ramp-up time 0 to 3.3V 40 – – μs n Minimum capacitor value refers to residual capacitor value after taking into account part-to-part tolerance, DC-bias, temperature, and aging. n Maximum capacitor value refers to the total capacitance seen at a node where the capacitor is connected. This also includes any decoupling capacitors connected at the load side, if any. Document Number: 002-19043 Rev. PRELIMINARY Page 18 of 33

PRELIMINARY CYBLE-413136-01 Digital LDO Table 11. Digital LDO (Internal to Module) Parameter Conditions Min. Typ. Max. Unit Input supply voltage, Vin Minimum Vin=Vo+0.12V requirement must be met 1.2 1.2 1.6 V under maximum load. Nominal output voltage,Vo Internal default bit setting – 1.1 – V Output voltage programmability Range 0.9 – 1.25 V Step size – 10 – mV Accuracy at any step (including line/load regulation) –4 – +4 % before trimming Accuracy at any step (including line/load regulation) –2 – +2 % after trimming Dropout voltage At maximum load – – 120 mV Output current DC load 0.2 1 – 40 mA Output loading capacitor Internal, including the decoupling capacitor to be placed 4 – 10 nF next to the load and the equivalent loading capacitor by the core. Quiescent current At no load, excluding main bandgap Iq – 90 120 μA Line regulation Vin from (Vo+0.12V) to 1.5V; 40 mA load – – 5 mV/V Load regulation Load from 1 mA to 25 mA; Vin (Vo+0.12V) – 0.025 0.045 mV/mA Leakage current In full power-down mode or bypass mode: • Junction temperature: 25°C – 0.05 0.2 μA • Junction temperature: 125°C – 1.1 5.0 μA PSRR @1 kHz, Vin, Vo+0.12V 40 – – dB Output cap of 4 nF~10 nF PMU startup time VBAT is up and steady. Time from HID_OFF falling – 100 – μs edge to DIGLDO reaching 99% of Vo. LDO turn-on time LDO turn-on time when balance of chip is up – – 22 μs External input capacitor Only use an external input capacitor at VDD_DIGLDO – 1 2.2 μF pin if it is not supplied from CBUCK output. 1. By default, an internal loading of ~0.2 mA resides inside the LDO. This is to ensure the LDO is stable with zero loading from the core. After the core is up, digital logic can disable this internal loading by setting i_ldo_cntl<8:7> to 00. Document Number: 002-19043 Rev. PRELIMINARY Page 19 of 33

PRELIMINARY CYBLE-413136-01 RF LDO Table 12. RF LDO (Internal to Module) Parameter Conditions Min. Typ. Max. Unit Input supply voltage, Vin Min Vin=Vo+0.15V = 1.35V (for Vo=1.2V) 1.2 1.35 1.5 V Dropout voltage requirement must be met under maximum load. Nominal output voltage,Vo Internal default bit setting 000 – 1.2 – V Output voltage programmability Range 1.1 – 1.275 V Step size – 25 – mV Accuracy at any step (including line/load regulation) –4 – +4 % Accuracy at any step (including line/load regulation) after trimming –2 – +2 % Dropout voltage At maximum load – – 150 mV Output current TBD 0.1 – 25 mA Quiescent current No load – 44 – μA Line regulation Vin from (Vo+0.15V) to 1.5V; 25 mA load – – 5.5 mV/V Load regulation Load from 1 mA to 25 mA; Vin ≥ (Vo+0.15V) – 0.025 0.045 mV/mA Load step error Load step from 1 mA–25 mA in 1 μs and – – 35 mV 25 mA–1 mA in 1μs; Vin(Vo+0.15V); Co=2.2 μF Leakage current Power-down junction temperature: 85°C – – 10 μA Output noise @30 kHz, 25 mA load, Co= 2.2 μF – – 60 nV/√Hz @100 kHz, 25 mA load, Co= 2.2 μF 35 nV/√Hz PSRR @1kHz, Input > 1.35V, Co= 2.2 μF, Vo=1.2V 20 – – dB LDO turn-on time LDO turn-on time when balance of chip is up – 140 180 μs In-rush current Vin=Vo+0.15V to 1.5V, Co=2.2 μF, no load – – 100 mA External output capacitor, Co Total ESR (trace/cap): 5 m–240 mW 0.5 2.2 4.7 μF External input capacitor Only use an external input capacitor at VDD_DIGLDO – 1 2.2 μF pin if it is not supplied from CBUCK output. Note: Minimum capacitor value refers to residual capacitor value after taking into account part-to-part tolerance, DC-bias, temperature, and aging. Document Number: 002-19043 Rev. PRELIMINARY Page 20 of 33

PRELIMINARY CYBLE-413136-01 Digital I/O Characteristics Table 13. Digital I/O Characteristics Characteristics Symbol Minimum Typical Maximum Unit Input low voltage (VDDO = 3.3V) VIL – – 0.8 V Input high voltage (VDDO = 3.3V) VIH 2.0 – – V Output low voltage VOL – – 0.4 V Output high voltage VOH VDDO – 0.4V – – V Input low current IIL – – 1.0 μA Input high current IIH – – 1.0 μA Output low current (VDDO = 3.3V, VOL = 0.4V) IOL – – 2.0 mA Output high current (VDDO = 3.3V, VOH = 2.9V) IOH – – 4.0 mA Input capacitance CIN – – 0.4 pF Current Consumption In Table 14, current consumption measurements are taken at VBAT with the assumption that VBAT is connected to VDDIO and LDOIN. Table 14. BLE Current Consumption Product Operational Mode Conditions Typical Unit Receiving Receiver and baseband are both operating, 100% ON, silicon only. 5.8 mA Transmitting Transmitter and baseband are both operating, 100% ON, silicon 5.7 mA only. PDS 512 KB SRAM memory retention, silicon only. 70 μA CYW20719 Deep Sleep 16 KB SRAM memory retention, silicon only. 1 μA (Silicon) HIDOFF Wakeup only from XRES. 350 nA No SRAM memory retention, silicon only. Connection, 1-s Avg. Average Power, 1-second connection interval, silicon only. 17 μA Deep Sleep mode enabled during non-TX/RX Connection, 4-s Avg. Average Power, 4-second connection interval, silicon only. 5 μA Deep Sleep mode enabled during non-TX/RX Receiving Receiver and baseband are both operating, 100% ON, module. TBD mA Transmitting Transmitter and baseband are both operating, 100% ON, module.. TBD mA PDS 512 KB SRAM memory retention, module. TBD μA Deep Sleep 16 KB SRAM memory retention, module. TBD μA CYBLE-413136-01 HIDOFF Wakeup only from XRES. TBD nA (Module) No SRAM memory retention, module. Connection, 1-s Avg. Average Power, 1-second connection interval, module. TBD μA Deep Sleep mode enabled during non-TX/RX Connection, 4-s Avg. Average Power, 4-second connection interval, module. TBD μA Deep Sleep mode enabled during non-TX/RX Document Number: 002-19043 Rev. PRELIMINARY Page 21 of 33

PRELIMINARY CYBLE-413136-01 RF Specifications Note: Table 15 and Table 16 apply to single-ended industrial temperatures. Unused inputs are left open. Table 15. Receiver RF Specifications Parameter Mode and Conditions Min Typ Max Unit Receiver Section Frequency range – 2402 – 2480 MHz RX sensitivity GFSK, BDR GFSK 0.1% BER, 1 Mbps – –93.0 – dBm Module Maximum input – –20 – – dBm Table 16. Transmitter RF Specifications Parameter Min Typ Max Unit Transmitter Section Frequency range 2402 – 2480 MHz Class 2: GFSK Tx power (silicon) – 4 – dBm Class 2: GFSK Tx power (module) – 8 – dBm 20 dB bandwidth – 930 1000 kHz Frequency Drift DH1 packet –25 – +25 kHz DH3 packet –40 – +40 kHz DH5 packet –40 – +40 kHz Drift rate –20 20 kHz/50 µs Frequency Deviation Average deviation in payload 140 – 175 kHz (sequence used is 00001111) Maximum deviation in payload 115 – – kHz (sequence used is 10101010) Channel spacing – 1 – MHz Table 17. BLE RF Specifications Parameter Conditions Minimum Typical Maximum Unit Frequency range N/A 2402 – 2480 MHz Rx sensitivity 1 GFSK, BDR GFSK 0.1% BER 0.1% – –93.0 – dBm BER, 1 Mbps Tx power N/A – 4 – dBm Mod Char: Delta F1 average N/A 225 255 275 kHz Mod Char: Delta F2 max 2 N/A 99.9 – – % Mod Char: Ratio N/A 0.8 0.95 – % 1. Dirty Tx is Off. 2. At least 99.9% of all delta F2 max frequency values recorded over 10 packets must be greater than 185 kHz. Document Number: 002-19043 Rev. PRELIMINARY Page 22 of 33

PRELIMINARY CYBLE-413136-01 Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 18. UART Timing Specifications Reference Characteristics Min. Typ. Max. Unit 1 Delay time, UART_CTS_N low to UART_TXD valid. – – 1.50 Bit periods 2 Setup time, UART_CTS_N high before midpoint of stop bit. – – 0.67 Bit periods 3 Delay time, midpoint of stop bit to UART_RTS_N high. – – 1.33 Bit periods Figure 11. UART Timing Document Number: 002-19043 Rev. PRELIMINARY Page 23 of 33

PRELIMINARY CYBLE-413136-01 Environmental Specifications Environmental Compliance This Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-413136-01 module is certified under the following RF certification standards: n FCC: WAP3136 (pending) n IC: 7922A-3136 (pending) n CE (pending) Safety Certification The CYBLE-413136-01 module complies with the following safety regulations: n Underwriters Laboratories, Inc. (UL): Filing E331901 n CSA n TUV Environmental Conditions Table 19 describes the operating and storage conditions for the Cypress BLE module. Table 19. Environmental Conditions for CYBLE-413136-01 Description Minimum Specification Maximum Specification Operating temperature −30 °C 105 °C Operating humidity (relative, non-condensation) 5% 85% Thermal ramp rate – 3 °C/minute Storage temperature –30 °C 110 °C Storage temperature and humidity – 110 °C at 85% 15 kV Air ESD: Module integrated into system Components[6] – 2.0 kV Contact ESD and EMI Protection Exposed components require special attention to ESD and electromagnetic interference (EMI). A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground. Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability. Note 6. This does not apply to the RF pins (ANT). Document Number: 002-19043 Rev. PRELIMINARY Page 24 of 33

PRELIMINARY CYBLE-413136-01 Regulatory Information FCC FCC NOTICE: The device CYBLE-413136-01 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. CAUTION: The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Cypress Semiconductor may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,ê may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: n Reorient or relocate the receiving antenna. n Increase the separation between the equipment and receiver. n Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. n Consult the dealer or an experienced radio/TV technician for help LABELING REQUIREMENTS: The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP3136. In any case the end product must be labeled exterior with “Contains FCC ID: WAP3136”. ANTENNA WARNING: This device is tested with a standard SMA connector and with the antennas listed in Table 5 on page 9. When integrated in the OEMs product, this fixed antenna requires installation preventing end-users from replacing them with non-approved antennas. Any antenna not in Table 5 on page 9 must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas in Table 5 on page 9, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of CYBLE-413136-01 with the chip antenna mounted (FCC ID: WAP3136) is far below the FCC radio frequency exposure limits. Nevertheless, use CYBLE-413136-01 in such a manner that minimizes the potential for human contact during normal operation. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Document Number: 002-19043 Rev. PRELIMINARY Page 25 of 33

PRELIMINARY CYBLE-413136-01 Innovation, Science and Economic Development (ISED) Canada Certification CYBLE-413136-01 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development (ISED) Canada. License: IC: 7922A-3136 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in Table 5 on page 9, having a maximum gain of -0.5 dBi. Antennas not included in Table 5 on page 9 or having a gain greater than -0.5 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. ISED NOTICE: The device CYBLE-413136-01 including the built-in trace antenna complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. L'appareil CYBLE-413136-01, y compris l'antenne intégrée, est conforme aux Règles RSS-GEN de Canada. L'appareil répond aux exigences d'approbation de l'émetteur modulaire tel que décrit dans RSS-GEN. L'opération est soumise aux deux conditions suivantes: (1) Cet appareil ne doit pas causer d'interférences nuisibles, et (2) Cet appareil doit accepter toute interférence reçue, y compris les interférences pouvant entraîner un fonctionnement indésirable. ISED INTERFERENCE STATEMENT FOR CANADA This device complies with Innovation, Science and Economic Development (ISED) Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme à la norme sur l'innovation, la science et le développement économique (ISED) norme RSS exempte de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonction- nement. ISED RADIATION EXPOSURE STATEMENT FOR CANADA This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 15mm between the radiator and the operator. Cet équipement est conforme aux limites d'exposition aux radiations ISED prévues pour un environnement incontrôlé. Cet équipement doit être installé et utilisé avec une distance minimale de 15 mm entre le radiateur et l'opérateur. LABELING REQUIREMENTS: The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor ISED identifier for this product as well as the ISED Notice above. The IC identifier is 7922A-3136. In any case, the end product must be labeled in its exterior with "Contains IC: 7922A-3136". Le fabricant d'équipement d'origine (OEM) doit s'assurer que les exigences d'étiquetage ISED sont respectées. Cela comprend une étiquette clairement visible à l'extérieur de l'enceinte OEM, en précisant l'identifiant Cypress Semiconductor approprié pour ce produit ainsi que l'avis ISED ci-dessus. L'identifiant ID est 7922A-3136. En tout cas, le produit final doit être étiqueté dans son extérieur avec "Contient IC: 7922A-3136". Document Number: 002-19043 Rev. PRELIMINARY Page 26 of 33

PRELIMINARY CYBLE-413136-01 European R&TTE Declaration of Conformity Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-413136-01 complies with the essential requirements and other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the end-customer equipment should be labeled as follows: All versions of the CYBLE-413136-01 in the specified reference design can be used in the following countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxem- bourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway. Document Number: 002-19043 Rev. PRELIMINARY Page 27 of 33

PRELIMINARY CYBLE-413136-01 Packaging Table 20. Solder Reflow Peak Temperature Module Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles CYBLE-413136-01 14-pad SMT 260 °C 30 seconds 2 Table 21. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package MSL CYBLE-413136-01 14-pad SMT MSL 3 The CYBLE-413136-01 is offered in tape and reel packaging. Figure 12 details the tape dimensions used for the CYBLE-413136-01. Figure 12. CYBLE-413136-01 Tape Dimensions Figure 13 details the orientation of the CYBLE-413136-01 in the tape as well as the direction for unreeling. Figure 13. Component Orientation in Tape and Unreeling Direction Document Number: 002-19043 Rev. PRELIMINARY Page 28 of 33

PRELIMINARY CYBLE-413136-01 Figure 14 details reel dimensions used for the CYBLE-413136-01. Figure 14. Reel Dimensions The CYBLE-413136-01 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-413136-01 is detailed in Figure 15. Figure 15. CYBLE-413136-01 Center of Mass Document Number: 002-19043 Rev. PRELIMINARY Page 29 of 33

PRELIMINARY CYBLE-413136-01 Ordering Information Table 22 lists the CYBLE-413136-01 part number and features. Table 22 also lists the target program for the respective module ordering codes. Table 23 lists the reel shipment quantities for the CYBLE-413136-01. Table 22. Ordering Information CPU Flash RAM Ordering Part Base Part Number Speed Apple MFi Package Size Size UART PWM Coprocessor Packaging Program Number (Marking) (MHz) (KB) (KB) CYBLE-413136-01 CYBLE-413136-01 24 1024 512 Yes 4 Yes 14-SMT Tape and Reel A19W CP8745AT CYBLE-413136-01 24 1024 512 Yes 4 Yes 14-SMT Tape and Reel FlexC CP8746AT CYBLE-413136-01 24 1024 512 Yes 4 Yes 14-SMT Tape and Reel Plug CP8747AT CYBLE-413136-01 24 1024 512 Yes 4 Yes 14-SMT Tape and Reel A60Ce CP8748AT CYBLE-413136-01 24 1024 512 Yes 4 Yes 14-SMT Tape and Reel FlexCe Table 23. Tape and Reel Package Quantity and Minimum Order Amount Description Minimum Reel Quantity Maximum Reel Quantity Comments Reel Quantity 800 800 Ships in 800 unit reel quantities. Minimum Order Quantity (MOQ) 800 – – Order Increment (OI) 800 – – The CYBLE-413136-01 is offered in tape and reel packaging. The CYBLE-413136-01 ships in a reel size of 800 units. For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website. U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134 U.S. Cypress Headquarter Contact Info (408) 943-2600 Cypress website address http://www.cypress.com Document Number: 002-19043 Rev. PRELIMINARY Page 30 of 33

PRELIMINARY CYBLE-413136-01 Acronyms Document Conventions Table 24. Acronyms Used in this Document Units of Measure Acronym Description Table 25. Units of Measure BLE Bluetooth Low Energy Symbol Unit of Measure Bluetooth SIG Bluetooth Special Interest Group °C degree Celsius CE European Conformity kV kilovolt CSA Canadian Standards Association mA milliamperes EMI electromagnetic interference mm millimeters ESD electrostatic discharge mV millivolt FCC Federal Communications Commission μA microamperes GPIO general-purpose input/output μm micrometers Innovation, Science and Economic Devel- MHz megahertz ISED opment (Canada) GHz gigahertz IDE integrated design environment V volt KC Korea Certification Ministry of Internal Affairs and Communications MIC (Japan) PCB printed circuit board RX receive QDID qualification design ID surface-mount technology; a method for producing electronic circuitry in which the SMT components are placed directly onto the surface of PCBs TCPWM timer, counter, pulse width modulator (PWM) Germany: Technischer Überwachungs-Verein TUV (Technical Inspection Association) TX transmit Document Number: 002-19043 Rev. PRELIMINARY Page 31 of 33

PRELIMINARY CYBLE-413136-01 Document History Page Document Title: CYBLE-413136-01 EZ-BLE™ Module with HomeKit Document Number: 002-19043 Orig. of Submission Revision ECN Description of Change Change Date ** PRELIM- DSO Preliminary datasheet for CYBLE-413136-01 module. INARY Document Number: 002-19043 Rev. PRELIMINARY Page 32 of 33

PRELIMINARY CYBLE-413136-01 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products PSoC® Solutions ARM® Cortex® Microcontrollers cypress.com/arm PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Automotive cypress.com/automotive Cypress Developer Community Clocks & Buffers cypress.com/clocks Forums | WICED IOT Forums | Projects | Video | Blogs | Interface cypress.com/interface Training | Components Internet of Things cypress.com/iot Technical Support Memory cypress.com/memory cypress.com/support Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs cypress.com/pmic Touch Sensing cypress.com/touch USB Controllers cypress.com/usb Wireless Connectivity cypress.com/wireless © Cypress Semiconductor Corporation, 2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited. TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-19043 Rev. PRELIMINARY Revised May 12, 2017 Page 33 of 33


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Document Modified: 2017-05-12 13:20:03
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