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CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module Doc. # 002-15315 Rev. *C Cypress Semiconductor 198 Champion Court San Jose, CA 95134-1709 Phone (USA): 800.858.1810 Phone (Intnl): +1.408.943.2600 www.cypress.com

Copyrights Copyrights © Cypress Semiconductor Corporation, 2014-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document, including any software or firmware included or refer- enced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as spe- cifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organi- zation, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited. TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PUR- POSE. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without fur- ther notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weap- ons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F- RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respec- tive owners. CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 2

Preface This document provides descriptions of the interfaces, pin assignments, and specifications of CYW20736S Bluetooth Low Energy (BLE) System-in-Package (SiP) module. It is intended for designers who are responsible for adding the CYW20736S module to wireless input devices including heart-rate monitors, blood pressure monitors, proximity sensors, temperature sensors, and battery monitors.. Cypress Part Numbering Scheme Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this con- version, there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides Cypress ordering part number that matches an existing IoT part number. Table 2-1. Mapping Table for Part Number between Broadcom and Cypress Broadcom Part Number Cypress Part Number BCM20736 CYW20736 BCM20736S CYW20736S Acronyms and Abbreviations In most cases, acronyms and abbreviations are defined on first use. For a comprehensive list of acronyms and other terms used in Cypress documents, go to http://www.cypress.com/glossary. Document Conventions The following conventions may be used in this document: Convention Description Bold User input and actions: for example, type exit, click OK, press Alt+C Code: #include <iostream> Monospace HTML: <td rowspan = 3> Command line commands and parameters: wl [-l] <command> <> Placeholders for required elements: enter your <username> or wl <command> Indicates optional command-line parameters: wl [-l] [] Indicates bit and byte ranges (inclusive): [0:3] or [7:0] Technical Support Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout informa- tion, and software updates. Customers can acquire technical documentation and software from the Cypress Support Commu- nity website (http://community.cypress.com/). 3 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

SZ Crpress

Contents 1. Introduction 7 1.1 Overview...................................................................................................................................7 1.1.1 Features ........................................................................................................................7 1.1.2 Application Profiles........................................................................................................7 1.1.3 Block Diagram...............................................................................................................8 1.1.4 External Reset...............................................................................................................8 1.1.5 32.768 kHz Oscillator ....................................................................................................9 1.2 Pin Map and Signal Descriptions............................................................................................10 1.3 Electrical Specifications ..........................................................................................................14 1.4 RF Specifications....................................................................................................................15 1.5 ADC Specifications .................................................................................................................16 1.6 Timing and AC Characteristics ...............................................................................................17 1.6.1 SPI Timing...................................................................................................................17 1.6.2 BSC Interface Timing ..................................................................................................18 1.6.3 UART Timing ...............................................................................................................19 1.7 PCB Design and Manufacturing Recommendations ..............................................................20 1.7.1 Pad and Solder Mask Opening Dimensions ...............................................................20 1.7.2 PCB Layout Recommendations ..................................................................................20 1.7.3 PCB Stencil .................................................................................................................21 1.7.4 Solder Reflow..............................................................................................................22 1.8 Packaging and Storage Information .......................................................................................23 1.9 Mechanical Information...........................................................................................................25 1.10 Ordering Information...............................................................................................................26 Revision History 27 5 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Contents CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 6

1. Introduction 1.1 Overview The CYW20736S is a compact, highly integrated Bluetooth low energy (BLE) system-in-package (SiP) module. The CYW20736S SiP includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so only a minimal set of exter- nal components is needed to create a standalone BLE device. The CYW20736S is designed to accelerate time to market. The Bluetooth stack and several application profiles are built into the module, allowing customers to focus on their core applications. To further reduce application development time, the CYW20736S includes integrated software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle. All this, coupled with an ultrasmall form factor and support for a wide voltage range, makes the CYW20736S well suited for virtually any Bluetooth Smart application. 1.1.1 Features ■ ARM Cortex-M3 microcontroller unit (MCU) ■ Embedded 512 Kb EEPROM ■ Broadcom Serial Control (BSC), SPI, and UART interfaces ■ FCC and CE compliant ■ RoHS compliant, certified lead- and halogen-free ■ Moisture Sensitivity Level (MSL) 3 compliant ■ 6.5 mm × 6.5 mm × 1.2 mm Land Grid Array (LGA) 48-pin package 1.1.2 Application Profiles The following profiles are supported in CYW20736S ROM: ■ Battery status ■ Blood pressure monitor ■ Find me ■ Heart rate monitor ■ Proximity ■ Thermometer ■ Weight scale ■ Time ■ Blood glucose monitor Additional profiles that can be supported in CYW20736S RAM include: ■ Blood glucose monitor ■ Temperature alarm ■ Location ■ Other custom profiles 7 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction 1.1.3 Block Diagram A block diagram of the CYW20736S BLE SiP is shown in Figure 1-1. Figure 1-1. CYW20736S BLE SiP Block Diagram VBAT/VDDIO Antenna CYW20736S Bandpass Filter UART SPI/I2C CYW20736 Bluetooth Low Energy Infrared System-on-Chip with ARM ® Cortex™ M3-based ADC 24 MHz Microprocessor Core GPIOs XTAL PWM 32.768 kHz EEPROM Oscillator 512 Kb I2C (optional) 1.1.4 External Reset External reset timing for the CYW20736S is illustrated in Figure 1-2. Figure 1-2. External Reset Timing Pulse width >20 µs RESET_N Crystal warm‐up delay: ~ 5 ms Baseband Reset Start reading EEPROM and firmware boot Crystal Enable CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 8

Introduction 1.1.5 32.768 kHz Oscillator The CYW20736S includes a standard Pierce oscillator. The oscillator circuit includes a comparator with hysteresis on the out- put to create a single-ended digital output. The hysteresis eliminates chatter when the input is near the comparator threshold (~100 mV). The oscillator circuit can is designed for a 32 kHz or 32.768 kHz crystal oscillator, and can also be driven by an external clock input with a similar frequency. Characteristics for a 32 kHz oscillator are defined in Table 1-1. Table 1-1. 32 kHz Crystal Oscillator Characteristics Parameter Symbol Conditions Min. Typ. Max. Unit Output frequency Foscout – – 32.768 – kHz Frequency tolerance Ftol Crystal-dependent – 100 – ppm Start-up time Tstartup – – – 500 µs Crystal drive level Pdrv For crystal selection 0.5 – – µW Crystal series resistance Rseries For crystal selection – – 70 kΩ Crystal shunt capacitance Cshunt For crystal selection – – 1.3 pF 9 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction 1.2 Pin Map and Signal Descriptions The CYW20736S pin map is shown in Figure 1-3. Figure 1-3. CYW20736S (TOP View) The signal name, type, and description of each pin in the CYW20736S is listed in Table 1-2 . The symbols shown under I/O Type indicate pin directions (I/O = bidirectional, I = input, O = output) and the internal pull-up/pull-down characteristics (PU = weak internal pull-up resistor and PD = weak internal pull-down resistor), if any. CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 10

Introduction Table 1-2. Pin Descriptions Pin Name I/O Type Description 1 GPIO: P27 I Default direction: Input. After POR state: Input floating. PWM1 Drain current: 16 mA Alternate function: MOSI (master and slave) for SPI_2 2 GND GND GND 3 VBAT I Battery supply input. 4 GND GND GND 5 GND GND GND 6 GND GND GND 7 GND GND GND 8 GND GND GND 9 GND GND GND 10 Reserved – Leave floating 11 GND GND GND 12 GND GND GND 13 GND GND GND 14 GND GND GND 15 GND GND GND 16 GND GND GND 17 GND GND GND 18 UART_RX I UART_RX. This pin is pulled low through an internal 10 kΩ resistor. 19 UART_TX O, PU UART_TX 20 GND GND GND 21 SCL I/O, PU SCL I/O, PU clock signal for an external I2C device 22 SDA I/O, PU SDA I/O, PU data signal for an external I2C device 23 GND GND GND 24 GND GND GND 25 GPIO: P1 I Default direction: Input. After POR state: Input floating. This pin is tied to the WP pin of the embedded EEPROM. Requires an external 10K pull-up 26 TMC I Test mode control. Pull this pin high to invoke test mode; leave it floating if not used. This pin is connected to GND through an internal 10 kΩ resistor. 27 RESET_N I/O PU Active-low system reset with open-drain output 11 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction Table 1-2. Pin Descriptions (Cont.) Pin Name I/O Type Description 28 GPIO: P0 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ Peripheral UART TX (PUART_TX) ■ MOSI (master and slave) for SPI_2 ■ IR_RX ■ 60Hz_main 29 GND GND GND 30 GPIO: P3 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ Peripheral UART CTS (PUART_CTS) ■ SPI_CLK (master and slave) for SPI_2 31 GPIO: P2 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ Peripheral UART RX (PUART_RX) ■ SPI_CS (slave only) for SPI_2 ■ SPI_MOSI (master only) for SPI_2 32 GPIO: P4 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ Peripheral UART RX (PUART_RX) ■ MOSI (master and slave) for SPI_2. ■ IR_TX 33 GPIO: P8 I Default direction: Input. After POR state: Input floating. Alternate functions: A/D converter input. 34 GPIO: P33 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ MOSI (slave only) for SPI_2 ■ Auxiliary clock output (ACLK1) ■ Peripheral UART RX (PUART_RX) 35 GPIO: P32 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ SPI_CS (slave only) for SPI_2. ■ Auxiliary clock output (ACLK0) ■ Peripheral UART TX (PUART_TX) 36 GPIO: P25 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ MISO (master and slave) for SPI_2 ■ Peripheral UART RX (PUART_RX) 37 GPIO: P24 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ SPI_CLK (master and slave) for SPI_2 ■ Peripheral UART TX (PUART_TX) CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 12

Introduction Table 1-2. Pin Descriptions (Cont.) Pin Name I/O Type Description 38 NC NC No Connection (N/C). 39 GPIO: P13 I Default Direction: Input PWM3 After POR State: Input Floating Drain current: 16 mA Alternate function: A/D converter input GPIO: P28 I Default direction: Input. PWM2 After POR state: Input floating. Drain current: 16 mA Alternate functions: ■ A/D converter input ■ LED1 ■ IR_TX 40 GPIO: P14 I Default direction: Input. After POR state: Input floating. PWM2 Alternate function: A/D converter input GPIO: P38 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ MOSI (master and slave) for SPI_2 ■ IR_TX 41 GPIO: P15 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ IR_RX ■ 60 Hz_main 42 GPIO: P26 I Default direction: Input. PWM0 After POR state: Input floating. Drain current: 16 mA Alternate function: SPI_CS (slave only) for SPI_2 43 GPIO: P12 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ XTALO32K XTALO32K O Low-power oscillator (LPO) output. Alternate functions: P12 P26 44 GPIO: P11 I Default direction: Input. After POR state: Input floating. Alternate functions: ■ A/D converter input ■ XTALI32K XTALI32K I Low-power oscillator (LPO) input. Alternate functions: ■ P11 ■ P27 45 GND GND GND 46 GND GND GND 47 GND GND GND 48 GND GND GND 13 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction 1.3 Electrical Specifications Absolute maximum ratings are defined in Table 1-3. Table 1-3. Absolute Maximum Ratings Parameter Min. Max. Unit Supply power NA 3.63 V Storage temperature –40 125 °C Voltage ripple 0 ±2 % Power supply (VBAT absolute maximum rating) 1.62 3.63 V Power for the CYW20736S module is provided by the host through the power pins. Table 1-4. Voltage Symbol Parameter Min. Typ. Max. Unit VBAT Battery voltage 1.62 – 3.63 V Note: With an optional DC-DC (90% efficient) converter at 3V, the current between the battery terminals (shown in Table 1-5) are about 50% lower than their nominal values at the default operating voltage (1.62V). Table 1-5. Current Consumption Operating Mode Condition Nominal Maximum Unit Receive Receiver and baseband are both operating, 100% 9.8 10.0 mA Transmit Transmitter and baseband are both operating, 100% 9.1 9.3 mA Sleep Wake in < 5 ms 12.0 19.2 µA Deep Sleep Wake on interrupt 0.65 – µA Note: All measurements taken at 25°C Based on the current measurements in Table 1-5 , CYW20736S peak power values are: ■ RX: 39.6 mW ■ TX: 37.8 mW ■ Sleep mode: 36 µW ■ Deep Sleep mode: 2.4 µW CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 14

Introduction 1.4 RF Specifications CYW20736S receiver specifications are defined in Table 1-6. Table 1-6. Receiver Specifications Parameter Mode and Conditions Min. Typ. Max. Unit Frequency range – 2402 – 2480 MHz RX sensitivity (standard) Packets: 200 – –94 – dBm Payload: PRBS 9 Length: 37 Bytes Dirty Transmitter: off. PER: 30.8% Maximum input – –10 – – dBm Note: All measurements taken at 3.0V (default voltage) RF transmitter specifications are defined in Table 1-7. Table 1-7. Transmitter Specifications Parameter Min. Typ. Max. Unit Transmitter Frequency rangea 2402 – 2480 MHz Output power adjustment range –20 – 4 dBm Output power – 2 – dBm Output power variation – 2.5 – dB LO Performance Initial carrier frequency tolerance – – ±150 kHz Frequency Drift Frequency drift – – ±50 kHz Drift rate – – 20 kHz/50 µs Frequency Deviation Average deviation in payload 225 – 275 kHz (sequence: 00001111) Average deviation in payload 185 – – kHz (sequence: 10101010) Channel spacing – 2 – MHz a. This parameter is taken from the Bluetooth 4.0 specification. 15 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction 1.5 ADC Specifications CYW20736S ADC specifications are defined in Table 1-8. Table 1-8. ADC Specifications Parameter Symbol Conditions Min. Typ. Max. Unit Number of input channels – – – 9 – - Channel switching rate fch – – – 133.33 Kch/s Input signal range Vinp – 0 – 3.63 V Reference settling time – Charging refsel 7.5 – – µs Input resistance Rinp Effective, single-ended – 500 – kΩ Input capacitance Cinp – – – 5 pF Conversion rate Fc – 5.859 – 187 kHz Conversion time Tc – 5.35 – 170.7 µs Resolution R – 16 Bits Absolute voltage measurement error – Using on–chip ADC – ±2 – % firmware driver Current I Iavdd1p2 + Iavdd3p3 – – 1 mA Power P – – 1.5 – mW Leakage Current Ileakage T = 25°C – – 100 nA Power-up time Tpowerup – – – 200 µs Integral nonlinearity INL In the guaranteed –1 – 1 LSBa performance range Differential nonlinearity DNL In the guaranteed –1 – 1 LSBa performance range a. LSBs are expressed at the 10-bit level. CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 16

Introduction 1.6 Timing and AC Characteristics 1.6.1 SPI Timing SPI interface timing is illustrated in Figure 1-4 and Figure 1-5 and defined in Table 1-9 . Figure 1-4. SPI Timing—Modes 0 and 2 6 SPI_CSN SPI_CLK 1 (Mode 0) SPI_CLK (Mode 2) 2 3 ‐ First Bit Second Bit Last bit ‐ SPI_MOSI 4 5 SPI_MISO Not Driven First Bit Second Bit Last bit Not Driven Figure 1-5. SPI Timing—Modes 1 and 3 6 SPI_CSN SPI_CLK 1 (Mode 1) SPI_CLK (Mode 3) 2 3 ‐ Invalid bit First bit Last bit ‐ SPI_MOSI 4 5 SPI_MISO Not Driven Invalid bit First bit Last bit Not Driven 17 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction Table 1-9. SPI Interface Timing Specifications Reference Characteristics Min. Typ. Max. 1 Time from CSN asserted to first clock edge 1 SCK 100 ∞ 2 Master setup time – 1/2SCK – 3 Master hold time 1/2SCK - – 4 Slave setup time – 1/2 SCK – 5 Slave hold time 1/2 SCK – – 6 Time from last clock edge to CSN deasserted SCK 10 SCK 100 1.6.2 BSC Interface Timing BSC interface timing is illustrated in Figure 1-6 and is defined in Table 1-10. Figure 1-6. BSC Interface Timing Table 1-10. BSC Interface Timing Specifications Reference Characteristics Min. Max. Unit 1 Clock frequency – 100, 400, 800, 1000 kHz 2 START condition setup time 650 – ns 3 START condition hold time 280 – ns 4 Clock low time 650 – ns 5 Clock high time 280 – ns 6 Data input hold time 0 – ns 7 Data input setup time 100 – ns 8 STOP condition setup time 280 – ns 9 Output valid from clock – 400 ns 10 Bus free time 650 – ns CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 18

Introduction 1.6.3 UART Timing UART timing is illustrated in Figure 1-7 and defined in Table 1-11. Figure 1-7. UART Timing Table 1-11. UART Timing Specifications Reference Characteristics Min. Max. Unit 1 Delay time, UART_CTS_N low to UART_TXD valid – 24 Baudout cycles 2 Setup time, UART_CTS_N high before midpoint of stop bit – 10 ns 3 Delay time, midpoint of stop bit to UART_RTS_N high – 2 Baudout cycles 19 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction 1.7 PCB Design and Manufacturing Recommendations 1.7.1 Pad and Solder Mask Opening Dimensions CYW20736S pad and solder mask opening dimensions are defined in Table 1-12. Table 1-12. Pad and Solder Mask Dimensions Pad Type Pad Dimensions Solder Mask Opening Dimensions Unit Type A 0.6 × 0.25 0.7 × 0.35 mm Type B 0.55 × 0.3 0.65 × 0.4 Type C 0.4 × 0.4 0.5 × 0.5 1.7.2 PCB Layout Recommendations The following layout recommendations are referenced to Figure 1-8. ■ Connect to system ground from side D of the module (pins 13–22). ■ The L-shaped ground plane is required for the embedded BLE antenna. Keep the GND continuous. Do not cut off the GND shape to accommodate trace routes. ■ An L-shaped ground plane is required. If the L-shaped GND plane is located on the top layer of the PCB, do not place components on the ground plane. If this cannot be avoided, move the L-shaped ground plane to another layer. ■ Antenna efficiency of 31–41% can be achieved based on the layout in Figure 1-8 and the dimensions listed below. Follow- ing these layout recommendations is expected to yield 50+ meters of usable range; deviating from these recommenda- tions may reduce the range of the antenna. ❐ D: 4.5 mm (typical) ❐ G, H, S: 3 mm (typical) ❐ L: 3 mm (minimum) ❐ W: 0.4 mm (typical) ■ Route signal traces out of the module from side C (between pins 27 and 30) or side D (between pins 16 and 19) of the module. Traces can be overlapped to avoid routing through the keep-out area. ■ Do not route traces from side A or side B. CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 20

Introduction Figure 1-8. PCB Layout Example 1.7.3 PCB Stencil The recommended PCB stencil is shown in Figure 1-9 (all measurements in mm). Use an unsolder mask to set the module footprint. Figure 1-9. CYW20736S Stencil (Bottom View) 21 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction 1.7.4 Solder Reflow The recommended solder reflow profile for the CYW20736S is defined in Figure 1-10. Figure 1-10. Solder Reflow Profile 245°C 217°C 200°C Temperature 150°C Pre‐Heating: 90~120 sec. Soldering: 60~90 sec. Time CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 22

Introduction 1.8 Packaging and Storage Information The CYW20736S is available in a tape and reel package and is shipped in an ESD-protected moisture-resistant (MSL-3) bag as shown in Figure 1-11. The storage temperature range is –40°C to +125°C. Figure 1-11. CYW20736S ESD/Moisture Packaging The moisture sensitivity label on the CYW20736S shipping bag is shown in Figure 1-12. Figure 1-12. CYW20736S Moisture Sensitivity Label 23 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction Figure 1-13 shows the location of pin 1 on the CYW20736S relative to its orientation on the tape packaging. Figure 1-13. CYW20736S Tape and Reel Pin 1 Location CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 24

Introduction 1.9 Mechanical Information Package dimensions for the CYW20736S are shown in Figure 1-14. Figure 1-14. CYW20736S Package Dimensions Additional CYW20736S package dimensions are shown in Figure 1-15. 25 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C

Introduction Figure 1-15. CYW20736S Pin Dimensions (Bottom View) 1.10 Ordering Information Table 1-13. Ordering Information Part Number Package Operating Temperature Humidity CYW20736S 48-pin LGA –40°C to +85°C 95% max., noncondensing CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C 26

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Revision History Document Revision History Document Title: CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module Document Number: 002-15315 Origin of Revision ECN# Issue Date Description of Change Change 20736S-TRM100-R: ** - 04/18/2014 - Initial Release 20736S-TRM101-R *A - 07/15/2014 - Updated: Pin 33 and pin 38 descriptions; see Table 2: “Pin Descriptions”. 20736S-TRM102-R Updated: *B - 09/11/2014 - • Table 2, “Pin Descriptions”: Pin 37. Removed: Appendix A: “Acronyms and Abbreviations”. *C 5560317 01/27/2017 UTSV Updated to Cypress Template. 27 CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module, Doc. # 002-15315 Rev. *C


Document Created: 2018-05-14 10:16:13
Document Modified: 2018-05-14 10:16:13
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