Antenna specification

FCC ID: VH9-KDC300

Parts List/Tune Up Info

Download: PDF
FCCID_1090224

Messrs : Approval Sheet for Product Specification Issued Date : November 20, 2007 Chip Antenna Product Description For Bluetooth Application Customer 코암텍 Customer Part No(Model) IMTech Part No IMAB IMABE ABE01 Date: Company: Dept. : Approved by (Signature) Checked by Min Soo Kim Approved by Terry Shin Integrated Microsystems Technology Inc. www.im- www.im-tech.com 1

1. FEATURES ▶ Surface Mounted Devices ▶ Multi- Multi-Layer Ceramic Chip Antenna (Low Temperature Co-Co-fired Ceramic Process Technology) ▶ High Stability in Temperature ▶ Small Size Dimension 2. SPECIFICATION 2.1 Electrical Electrical Characteristics ITEM Specification Central Frequency(nominal) 2.450 GHz BandWidth(Typical) 100 MHz Gain(dBi) 2.0 Max VSWR 2 : 1 Max Polarization Linear Azimuth Beam Pattern Omni-directional Impedance (Ω) 50 Ω 2.2 Mechanical Characteristics ITEM Specification Dimension ( mm ) 8.0 x 2.0 x 1.5 Weight ( g ) 0.5 Termination Plate Au Operating Temperature ( ℃ ) -35 ~ +85 www.im- www.im-tech.com 2

2.3 Marking and Dimension ( Unit : mm ) 8.0±0.2 BE01 2.0±0.2 1.0±0.2 1.2±0.2 3. MEASUREMENTS 3.1 Test board for measurements www.im- www.im-tech.com 3

3.2 3.2 Electrical characteristic ( Without Without matching circuit ) 3.2 3.2.1 S11 ( Return Loss and Smith chart) chart) 3.2 3.2.2 Radiation Elevation (E- (E-plane) Azimuth (H- (H-plane) www.im- www.im-tech.com 4

4. Part Numbering ( Part Number ) IM A B E 01 ① ② ③ ④ ⑤ ① Product Company ④ Dimension ( L * W * T ) - IM : IMTECH - E : 8 * 2 * 1.5 1.5 ② Function ⑤ Revision - A : Antenna - 01 01 ( two decimal ) ③ Application - B : Bluetooth www.im- www.im-tech.com 5

5. Notice 5.1 Storage Conditions To avoid damaging the solderability of the external electrodes, be sure to observe the following points. -Store products where the ambient temperature is 15℃ to 35℃ and humidity 45 to 75% RH. (Packing materials, In particular, may be deformed at the temperature over 40℃) -Store products in non corrosive gas (Cl2 ,NH3 ,SO2 ,Nox ,etc.) -Stored products should be used within 6 months of receipt. Solderability should be verified if this period is exceeded. 5.2 5.2 Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products due to the nature of ceramics structure. Handle with care if products may wave cracks on damages on their terminals, the characteristics products may change. Do not touch products with bear hands that may result in poor solderability. 5.3 Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. The recommended land pattern and dimensions is as IMTech's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact IMTech beforehand. 5.4 Notice for Chip Placer When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products www.im- www.im-tech.com 6

5.5 Soldering Conditions: Carefully perform preheating so that the temperature difference (△T) between the solder and products surface should be in the following range. When products are immersed on solvent after mounting, pay special attention to maintain the temperature difference within 100℃. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact IMTech before use if concerning other soldering conditions. Soldering method Temperature Soldering iron method △T ≤ 130 Reflow method -Soldering iron method conditions are indicated below. Kind of iron Item Nichrome heater Ceramics heater Soldering iron wattage ≤ 30 W ≤ 18 W Temperature ≤ 280℃ ≤ 250 ℃ -Diameter of iron-tip : φ3.0 mm max. -Do not allow the iron-tip to directly touch the ceramic element. www.im- www.im-tech.com 7

6. OTHER SPECIFICATION AND METHODS No. Items Specifications Test Methods Appearance No sever damages Solder specimens on the testing jig (glass-fluorine boards) by an eutectic solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat Vibration Satisfy specifications listed in 1 Electrical shock. Resistance paragraph 5 over operational Specifications Frequency : 10~2000~10 Hz temperature range. 2 Acceleration : 196m/ s Direction : X,Y,Z 3 axis Period : 2h on each direction Total 6 h. Appearance No severe damage Solder specimens on the testing jig (glass-fluorine boards) by an eutectic solder. The soldering shall be done either by iron or reflow and be conducted with care so that the Satisfy specifications listed in soldering is uniform and free of defect such as by heat 2 Shock Electrical paragraph 5 over operational shock. Specifications 2 temperature range Acceleration : 980 m/ s Height : 1.5m. Cycle : 10 times Solder specimens on the testing jig (glass epoxy boards) by an eutectic solder. The soldering shall be done either 3 Deflection No damage with 1mm deflection by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Solder specimens onto test jig show below. Apply pushing force at 0.5mm/s until electrode pads are pealed off or ceramics are broken. Pushing force is applied to longitudinal direction. Soldering Strength Specimen 4 9.8 N Minimum (Push Strength) Jig Pushing Direction Immerse specimens first an ethanol (JIS-K-8101) solution of rosin (JIS-K-5902) (25% rosin in weight proportion), then in an eutectic solder solution 75% of terminations is to be ο for 2 ± 0.5 s at 230 ± 5 C 5 Solderability of Termination soldered evenly and ο Preheat : 100~120 C ,60 s continuously. Solder Paste : Eutectic solder Flux : Solution of ethanol and rosin (25% rosin in weight proportion) www.im- www.im-tech.com 8

Immerse the chip in the eutectic solder solution of ο Resistance 270 ± 5 C for 10 ± 0.5 s (flow soldering bath) after ο 6 to Soldering Appearance No severe damages preheating for 1 min at 120 to 150 C Heat (Dipping) Then set it for 2 to 24 h at room temperature and measure. ο Appearance No severe damages Preheat Temperature : 150 ± 10 C Preheat Period : 60 s. min Resistance ο Satisfy specifications listed in Peak Temperature : 230 ± 5 C 7 to Soldering Electrical paragraph over operational Peak Temp. Period : 10 s Heat (Reflow) specifications temperature range Specimens are soldered twice with the above condition, then kept in room condition for 24 h before measurement. Appearance No severe damages Set the specimens to the supporting jig in the same manner and under the some conditions as Fig,1 and conduct the 100 cycles according to the temperatures and tie shown in the following table. Set it for 2 to 24 h at Temperature Satisfy specifications listed in 8 Electrical room temperature, then measure. Cycle paragraph 5 over operational specification Step 1 2 temperature range ο Temp.( C) Min. Operating Max. Operating Temp. +0/-3 Temp. +3/-0 Time(min) 30 ± 3 30 ± 3 ο Appearance No severe damages Temperature : 85 ± 2 C Humidity Satisfy specifications listed in Humidity : 80~85 % RH 9 Electrical (Steady State) paragraph 5 over operational Period : 1000 +48/-0 h specifications temperature range Room Condition: 2~24 h ο Appearance No severe damages Temperature : 85 ± 2 C High Temp. Satisfy specifications listed in Period : 1000 +48/-0 h 10 Electrical Load Life paragraph 5 over operational Room Condition : 2~24 h specifications temperature range Excessive mechanical force or thermal stress may damage the products. Appropriate handling is required. Production Site IMTech, Inc. www.im- www.im-tech.com 9

7. 7. PACKING 7.1 Tape Dimension ( Unit : mm ) 1,75±0.1 ±0.05 4±0.1 2,2±0.1 0,3±0.05 7,5±0.1 BE01 BE01 BE01 BE01 BE01 BE01 16±0.3 8,2±0.1 4±0.1 1,65±0.1 7.2 Reel Dimension www.im- www.im-tech.com 10

7.3 Tape Diagram [3] [1]Feeding Hole : As specified in (1) [1] [2]Hole for chip : As specified in (1) [2] [3]Cover tape : 62㎛ in thickness [4]Base tape : As specified in (1) [3] [4] 7.4 Packing quantity 2000 pcs / Reel 7.5 Box Dimension www.im- www.im-tech.com 11


Document Created: 2009-03-03 17:29:37
Document Modified: 2009-03-03 17:29:37
© 2024 FCC.report
This site is not affiliated with or endorsed by the FCC