UA9TT2301

FCC ID

Application Frequency Range	Final Action Date Granted
5RmFal72QbQ9iwiAeVyrxQ== 3100.0-4800.0	2008-05-09 APPROVED

File Name	Document Type	Date	Direct
Label location	ID Label/Location Info	2008-05-09 00:00:00	pdf
Compliance Test Report	Test Report	2008-05-09 00:00:00	pdf
Theory of Operation	Operational Description	2008-05-09 00:00:00	pdf
Users Manual	Users Manual	2008-05-09 00:00:00	pdf
Request for Modular Approval	Cover Letter(s)	2008-05-09 00:00:00	pdf
Label	ID Label/Location Info	2008-05-09 00:00:00	native
Internal Bottom	Internal Photos	2008-05-09 00:00:00	native
Internal Top	Internal Photos	2008-05-09 00:00:00	native
Agency Letter	Cover Letter(s)	2008-05-09 00:00:00	pdf
Confidentiality Letter	Cover Letter(s)	2008-05-09 00:00:00	pdf
External Bottom	External Photos	2008-05-09 00:00:00	native
External Top	External Photos	2008-05-09 00:00:00	native
Bill of Material	Parts List/Tune Up Info		N/A
Block Diagram	Block Diagram		N/A
Schematic	Schematics		N/A

Equipment	Focus Enhancement Wireless USB Module TT2301
FRN	0015116239
Grantee Code	UA9
Product Code	TT2301
Applicant Business	Summit Semiconductor LLC
Business Address	22867 NW Bennett St Suite 200, Hillsboro,Oregon United States 97124
TCB Scope
TCB Email
Applicant	Ken N Boehlke – Engineering Manager
Applicant Phone
Applicant Fax	503-615-4232
Applicant Email	[email protected]
Applicant MailStop
Test Firm	TDK RF Solutions, Inc.
Test Firm Contact	Robert Sutton
Test Firm Phone	103
Test Firm Fax	512-258-0740
Test Firm Email	[email protected]
Certified By	Armando Medina – Test Engineer