User Manual-Rev.02(171030)

FCC ID: U4G-RHINOIIWEC7

Users Manual

Download: PDF
FCCID_3625076

A Datasheet M2SD50NBT

M2SD50NBT Datasheet CONTENTS 1 Scope ................................................................................................................................................................. 3 2 Specifications..................................................................................................................................................... 3 3 WLAN Functional Description ........................................................................................................................... 5 3.1 Overview ................................................................................................................................................ 5 4 Bluetooth Functional Description ..................................................................................................................... 7 5 Electrical Characteristics ................................................................................................................................... 8 5.1 Absolute Maximum Ratings ................................................................................................................... 8 5.2 Recommended Operating Conditions ................................................................................................... 8 5.3 DC Electrical Characteristics................................................................................................................... 8 5.4 WLAN Radio Receiver Characteristics .................................................................................................. 10 6 Bluetooth Radio Characteristics ...................................................................................................................... 11 7 SDIO Timing Requirements ............................................................................................................................. 13 8 Pin Definitions ................................................................................................................................................. 14 9 Mechanical Specifications ............................................................................................................................... 17 10 Mounting ......................................................................................................................................................... 17 11 RF Layout Design Guidelines/Precautions....................................................................................................... 19 12 Regulatory ....................................................................................................................................................... 20 12.1 Certified Antennas ............................................................................................................................... 20 13 FCC and IC Regulatory ..................................................................................................................................... 21 13.1 FCC ....................................................................................................................................................... 21 13.1.1 Federal Communication Commission Interference Statement........................................ 21 13.1.2 End Product Labeling........................................................................................................ 22 13.1.3 Manual Information to the End User ............................................................................... 22 13.2 Industry Canada ................................................................................................................................... 22 13.2.1 Industry Canada Statement .............................................................................................. 22 13.2.2 Antenna Information ........................................................................................................ 23 13.2.3 Radiation Exposure Statement ......................................................................................... 24 13.2.4 Déclaration d'exposition aux radiations ........................................................................... 24 13.2.5 End Product Labeling........................................................................................................ 25 13.2.6 Plaque signalétique du produit final ................................................................................ 25 13.2.7 Manual Information to the End User ............................................................................... 25 13.2.8 Manuel d'information à l'utilisateur final ........................................................................ 25 2

M2SD50NBT Datasheet 1 SCOPE This document describes key hardware aspects of the Laird M2SD50NBT module. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from a number of sources and includes information found in the Laird SSD50NBT which including Qualcomm Atheros (QCA) QCA6004 and Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08 data sheet issued in July 2011, along with other documents provided from QCA and CSR Note that the information in this document is subject to change. Please contact Laird to obtain the most recent version of this document. 2 SPECIFICATIONS Table 1: Specifications Feature Description Wi‐Fi Interface 1‐bit or 4‐bit Secure Digital I/O Bluetooth Interface Host Controller Interface (HCI) using High Speed UART Wi‐Fi – Qualcomm Atheros QCA6004 Main Chip BT – Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08 Input Voltage Requirements 3.3 VDC (3.20V min to 3.46V max) I/O Signalling Voltage 3.3 VDC ± 5% or 1.8 VDC ± 5% Operating Temperature ‐30° to 85°C (‐22° to 185°F) Operating Humidity 10 to 90% (non‐condensing) Storage Temperature ‐40° to 85°C (‐40° to 185°F) Storage Humidity 10 to 90% (non‐condensing) Size 22 mm X 30 mm X 3.3 mm (.87” x 1.18” x .13”) Weight < 3.0 grams (< 0.105822 ounces) Wi‐Fi Standards IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n, 802.11r Bluetooth Standards Bluetooth version 2.1 with Enhanced Data Rate Bluetooth 4.0 (Bluetooth Low Energy or BLE) Wi‐Fi Data Rates Supported 11a (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps 802.11g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n (OFDM, MCS 0‐15) Full Guard Interval: 6.5,13.0, 19.5, 26.0,39.0,52.0,58.5,65.0, 13.0,26.0,39.0, 52.0, 78.0,104.0,117.0 Mbps Short Guard Interval: 1.2,14.4,21.7,29.9,43.3,57.8,65.0,72.2, 14.4,28.9,43.3,57.8, 86.7,115.6,130.0,144.4 Mbps 3

M2SD50NBT Datasheet Feature Description Modulation BPSK @ 1, 6,9, 6.5, 7.2,13 and 14.4 Mbps QPSK @ 2, 12, 18, 13, 14.4,19.5, 21.7, 26, 28.9, 39,43.3 Mbps CCK @ 5.5 and 11 Mbps 16‐QAM @ 24, 36,26, 29.9,39,43.3,52,57.8,78,86.7 Mbps 64‐QAM @ 48,54,52, 57.8, 58.5, 65,72.2,104.0,115.6,117.0,130.0,144.4 Mbps 802.11n Spatial Streams 2 (2x2 MIMO) Bluetooth Data Rates 1, 2, 3 Mbps Supported Bluetooth Modulation GFSK@ 1 Mbps Pi/4‐DQPSK@ 2 Mbps 8‐DPSK@ 3 Mbps Regulatory Domain Support FCC (Americas, Parts of Asia, and Middle East) ETSI (Europe, Middle East, Africa, and Parts of Asia) IC (Industry Canada ) MIC (Japan) (formerly TELEC) – Option KC (Korea) (formerly KCC) – Option 2.4 GHz Frequency Bands ETSI: 2.4 GHz to 2.483 GHz FCC: 2.4 GHz to 2.473 GHz MIC: 2.4 GHz to 2.495 GHz KC: 2.4 GHz to 2.483 GHz 2.4 GHz Operating Channels ETSI: 13 (3 non‐overlapping) (Wi‐Fi) FCC: 11 (3 non‐overlapping) MIC: 14 (4 non‐overlapping) KC: 13 (3 non‐overlapping) 5 GHz Frequency Bands ETSI 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140) FCC 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140 5.725 GHz to 5.825 GHz(Ch 149/153/157/161/165) MIC (Japan) 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140) KC 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124) 5.725 GHz to 5.825 GHz (Ch 149/153/157/161) 4

M2SD50NBT Datasheet Feature Description 5 GHz Operating Channels ETSI: 19 non‐overlapping (Wi‐Fi) FCC: 24 non‐overlapping MIC: (Japan): 19 non‐overlapping KC: 19 non‐overlapping Certifications Wi‐Fi Alliance 802.11a, 802.11b, 802.11g , 802.11n WPA Enterprise WPA2 Enterprise Cisco Compatible Extensions (Version 4) Bluetooth SIG Qualification Warranty Three Year Warranty All specifications are subject to change without notice 3 WLAN FUNCTIONAL DESCRIPTION 3.1 Overview The M2SD50NBT WLAN block is based on the Laird SSD50NBT SIP (System in Package). It is optimized for low‐ power embedded applications and is configured to operate in dual‐band, two‐stream (2x2 MIMO) mode. Its functionality includes:  Improved throughput on the link due to frame aggregation, RIFS (reduced inter‐frame spacing), and half‐ guard intervals.  Support for STBC (space‐time block coding) and LDPC (Low Density Parity Check) codes.  Improved 11n performance due to features such as 11n frame aggregation (A‐MPDU and A‐MSDU) and low‐overhead host‐assisted buffering (RX A‐MSDU and RX A‐MPDU). These techniques can improve performance and efficiency of applications involving large bulk data transfers such as file transfers or high‐ resolution video streaming. 5

M2SD50NBT Datasheet Other functionality includes the following: Feature Description An RTC block controls the clocks and power going to other internal modules. Its inputs contain sleep requests from these modules and its outputs contain clock enable and power signals which are used to gate the clocks going to these modules. The RTC block also manages resets going to other modules with the device. The M2SD50NBT’s clocking is grouped into two types: high‐speed and low‐speed. 3.1.1.1 High Speed Clocking The reference 26 MHz clock source drives the PLL and RF synthesizer of Wi‐Fi and Bluetooth. To minimize power consumption, the reference clock source is powered off in System Clocking SLEEP, HOST_OFF, and OFF states. (RTC Block) 3.1.1.2 Low Speed Clocking This module requires an external sleep clock (32.768 KHz) source from host platform through pin‐50 on the NFGG golden finger. It is used to place BT into deep sleep mode. For Wi‐Fi only application, it is not needed. 3.1.1.3 Interface Clock The host interface clock represents another clock domain for the M2SD50NBT. This clock comes from the SDIO and is independent from the other internal clocks. It drives the host interface logic as well as certain registers which can be accessed by the host in HOST_OFF and SLEEP states. The M2SD50NBT Wireless MAC consists of five major blocks:  Host interface unit (HIU) for bridging to the AHB for bulk data accesses and APB for register accesses MAC/BB/RF Block  Ten queue control units (QCU) for transferring TX data  Ten DCF control units (DCU) for managing channel access  Protocol control unit (PCU) for interfacing to baseband  DMA receive unit (DRU) for transferring RX data The M2SD50NBT baseband block (BB) is the physical layer controller for the 802.11b/g/n air interface.  It modulates data packets in the transmit direction Baseband Block  Detects and demodulates data packets in the receive direction.  It has a direct control interface to the radio to enable hardware to adjust analog gains and modes dynamically.  Clock sharing is implemented on the M2SD50NBT. The Bluetooth chip (CSR8811) receives a reference clock from the Wi‐Fi chip (QCA6004). When Wi‐Fi is in power Clock Sharing off/reset state, Bluetooth is also off.  External 32.768 KHz signal present on pin 50 allows the BT chip to go into deep sleep mode and consume lowest amount of power 6

M2SD50NBT Datasheet 4 BLUETOOTH FUNCTIONAL DESCRIPTION The M2SD50NBT Bluetooth (BT) block is based on the CSR8811A08 and described in the Table 2. Table 2: Bluetooth functions Feature Description The UART Interface is a standard high‐speed UART interface. It operates up to 4 Mbps, HCI‐UART Interface supporting Bluetooth HCI UART interface.  Continuous PCM encoded audio data transmission and reception over Bluetooth  Processor overhead reduction through hardware support for continual transmission and reception of PCM data  A bi‐directional digital audio interface that routes directly into the baseband layer of the firmware. It does not pass through the HCI protocol layer  Hardware on CSR8811 for sending data to and from a SCO connection  Up to three SCO connections on the PCM interface at any one time  PCM interface master, generating PCM_SYNC and PCM_CLK PCM or I2S Interface  PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.  Various clock formats including: – *Long Frame Sync – *Short Frame Sync  GCI timing environments  13‐bit or 16‐bit linear, 8‐bit μ‐law or A‐law companded sample formats  Receives and transmits on any selection of three of the first four slots following PCM_SYNC  The PCM configuration options are enabled by setting SKEY_PCM_CONFIG32  Uses a 16‐bit RISC MCU for low power consumption and efficient use of memory. The MCU, interrupt controller, and event timer run the Bluetooth software stack and control the Bluetooth radio and host interfaces.  56 KB of on‐chip RAM is provided to support the RISC MCU and is shared between CPU and Memory the ring buffers used to hold voice/data for each active connection and the general‐purpose memory required by the Bluetooth stack.  5 Mb of Internal ROM memory is available on the CSR8811. This memory is provided for system firmware, storing CSR8811 settings and program code. Build‐in Standard The M2SD50NBT internally supports the standard WLAN coexistence interface WLAN Coexistence through the WLAN_ACTIVE, BT_PRIORITY, and BT_ACTIVE pins. The BT block is configured for 26 MHz reference clock frequency. The clock source is Reference Clock provided to BT internally from the WLAN block on demand from BT_CLK_REQ. Note: The WLAN block must be initialized prior before BT clock sharing is enabled. Supports Low Energy specification which allows for connections to devices with single BT Low Energy mode LE function (such as a watch, sensor, and HID). The implementation is optimized for coexistence with WLAN. The NGFF pin‐54 is connected to (BT_PWD_L) resets and powers down the BT block. BT_RFKILL Holding the pin‐54 at Low state turns off the entire BT block; all state information is lost. To ensure a full reset, the reset signal should be asserted for a period greater than five milliseconds. 7

M2SD50NBT Datasheet Feature Description The BT radio shares the single antenna port with the WLAN through an internal three‐ way RF switch. The M2SD50NBT implements WLAN/BT coexistence internally. Radio VDDIO is to set the I/O voltage internally with either 1.8 V or 3.3 V to ensure same voltage level for the internal Wi‐Fi and BT coexistence signal. Refer to the reference design specifications for details. 5 ELECTRICAL CHARACTERISTICS 5.1 Absolute Maximum Ratings Table 3 summarizes the absolute maximum ratings and Table 4 lists the recommended operating conditions for the M2SD50NBT. Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended. Note: Maximum rating for signals follows the supply domain of the signals. Table 3: Absolute Maximum Ratings Symbol (Domain) Parameter Max Rating Unit VDDIO WLAN host SDIO interface and BT I/O supply ‐0.3 to 3.6 V VCC3_3 External 3.3V power supply ‐0.3 to 3.6 V Storage Storage Temperature ‐40 to +85 °C ANT1; ANT2 Maximum RF input (reference to 50‐Ω input) +10 dBm ESD Electrostatic discharge tolerance 2000 V 5.2 Recommended Operating Conditions Table 4: Recommended Operating Conditions Symbol (Domain) Parameter Min Typ Max Unit VDDIO WLAN host interface and BT I/O supply 1.71/3.2 1.8/3.3 1.89/3.46 V VCC3_3 External 3.3V power supply 3.2 3.30 3.46 V T‐ambient Ambient temperature ‐30 25 85 °C 5.3 DC Electrical Characteristics Table 5 and Table 6 list the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 5: General DC Electrical Characteristics (For 3.3V I/O Operation) Symbol Parameter Conditions Min Typ Max Unit VIH High Level Input Voltage 0.7 x VDD V 0.3 x VIL Low Level Input Voltage V VDD Without Pull‐up 0V < VIN < VDD Input 0 ‐3 nA or Pull‐down 0V < VOUT< VDD IIL Leakage Current 0 V < VIN < VDD With Pull‐up 16 48 µA 0V < VOUT < VDD 8

M2SD50NBT Datasheet Symbol Parameter Conditions Min Typ Max Unit 0V < VIN < VDD With Pull‐down ‐14 ‐47 µA 0V < VOUT < VDD IOH = ‐4mA 0.9 x VDD V VOH High Level Output Voltage IOH = ‐12mA 0.9 x VDD V 0.1 x IOH = 4mA V VDD VOL Low Level Output Voltage 0.1 x IOH = 12mA V VDD Table 6: General DC Electrical Characteristics (For 1.8V I/O Operation) Symbol Parameter Conditions Min Typ Max Unit VIH High Level Input Voltage 0.7 x VDD V VIL Low Level Input Voltage 0.3 x VDD V IIL Input Without Pull‐up 0V < VIN < VDD 0 ‐3 nA Leakage or Pull‐down 0V < VOUT < VDD Current With Pull‐up 0V < VIN < VDD 3.5 13 µA 0V < VOUT < VDD With Pull‐down 0V < VIN < VDD ‐6.2 ‐23 µA 0V < VOUT < VDD VOH High Level Output Voltage IOH = ‐4mA 0.9 x VDD V IOH = ‐12mA 0.9 x VDD V VOL Low Level Output Voltage IOH = 4mA 0.1 x VDD V IOH = 12mA 0.1 x VDD V Figure 1: Power On/Off Timing Figure 2: Reset Timing 9

M2SD50NBT Datasheet Table 7: Timing Diagram Definitions Timing Description Min Unit Tb Time between VDD33 (3.3V )supplies valid, to SDIO reset (pin‐ 56;WLAN_PWD_L ) negation. 5 µsec Note: have suitable 10K ohm Pull‐up on SDIO bus, already. No extra pull‐up resistor is required. Tc Time between VDD33 (3.3V) supplies valid and BT_RFKILL (pin‐54; BT_PWD_L ) negation 5 msec Td Time between SDIO reset (pin‐56;WLAN_PWD_L ) negation and VDD33 (3.3V) invalid, or time between BT_RFKILL (pin‐54; 0 µsec BT_PWD_L ) negation and VDD33(3.3V) invalid. Tf Time of SDIO reset (pin‐56;WLAN_PWD_L ) assertion during reset 5 µsec or power down period. 3.3V should keep ON. Tg Time of BT_RFKILL (pin‐54; BT_PWD_L )assertion during reset or 5 msec power down period. 3.3V should keep ON. Important: There is 10K ohm pull high resistor already implemented on SD_D0, SD_D1, and SD_D3. No external pull‐up is required for those three lines. 5.4 WLAN Radio Receiver Characteristics Table 8 and Table 9 summarize the WLAN M2SD50NBT receiver characteristics. Table 8: WLAN Receiver Characteristics for 2.4 GHz Signal Chain Operation Symbol Parameter Conditions Min Typ Max Unit Receive input frequency Frx 2.412 2.484 GHz range Srf Sensitivity CCK, 1 Mbps ‐94 CCK, 11 Mbps ‐87 OFDM, 6 Mbps ‐91 See Note3 dBm OFDM, 54 Mbps ‐74 HT20, MCS0 ‐91 HT20, MCS7 ‐71 Radj Adjacent channel rejection OFDM, 6 Mbps 32 OFDM, 54 Mbps 16 See Note4 dB HT20, MCS0 31 HT20, MCS7 14 3 Performance data are measured under signal chain operation. 4 Performance data are measured under signal chain operation. Table 9: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation Symbol Parameter Conditions Min Typ Max Unit Frx Receive input frequency 5.15 5.825 GHz 10

M2SD50NBT Datasheet Symbol Parameter Conditions Min Typ Max Unit range Srf Sensitivity OFDM, 6 Mbps ‐92 OFDM, 54 Mbps ‐74 HT20, MCS0 ‐92 See Note5 dBm HT20, MCS7 ‐71 HT40, MCS0 ‐86 HT40, MCS7 ‐66 Radj Adjacent channel rejection OFDM, 6 Mbps 22 OFDM, 54 Mbps 9 See Note6 dB HT20, MCS0 20 HT20, MCS7 19 5 Performance data are measured under signal chain operation. 6 Performance data are measured under signal chain operation. 6 BLUETOOTH RADIO CHARACTERISTICS Table 10 through Table 11 describe the basic rate transmitter performance, enhanced data transmitter performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption conditions at 25°C. Table 10: Basic Rate Transmitter Performance Temperature at 25°C (3.3V) Test Parameter Min Typ Max BT Spec. Unit Maximum RF Output Power 0.5 6 — –6 to +10 dBm Frequency Range 2.4 — 2.4835 2.4 ≤ f ≤ 2.4835 GHz 20 dB Bandwidth — 925 — ≤ 1000 KHz Adjacent Channel TX Power F = F0 + 2 — –36 — ≤ –20 dBm MHz Adjacent Channel TX Power F = F0 +3 — –42 — ≤ –40 dBm MHz Δf1avg Maximum Modulation 140 165 175 140 < Δf1avg < 175 KHz Δf2max Minimum Modulation — 135 — ≥ 115 KHz Δf2avg/Δf1avg — 0.9 — ≥ 0.80 — Initial Carrier Frequency — 5 — ≤±75 KHz Drift Rate — 5 — ≤ 20 KHz/50 µs Drift (DH1 packet) — 6 — ≤25 KHz Drift (DH5 packet) — 7 — ≤ 40 KHz Table 11: Enhanced Data Rate Transmitter Performance 25°C (3.3V) Test Parameter Min Typ Max BT Spec. Unit Relative Transmit Power –1 3 6 –4 to +1 dBm Max Carrier Frequency π/4 DQPSK — 1 — ≤ ±10 KHz 11

M2SD50NBT Datasheet Test Parameter Min Typ Max BT Spec. Unit Stability |wo| 8 DPSK — 1 — Max Carrier Frequency π/4 DQPSK — 1 — ≤ ±75 KHz Stability |wi| 8 DPSK — 1 — Max Carrier Frequency π/4 DQPSK — 2 — ≤ ±75 KHz Stability |w0+wi| 8 DPSK — 1.5 — π/4 DQPSK — 6 — ≤ 20 % RMS DEVM 8 DPSK — 6 — ≤13 % π/4 DQPSK — 16 — ≤ 35 % Peak DEVM 8 DPSK — 15 — ≤ 25 % π/4 DQPSK — 12 — ≤ 30 % 99% DEVM 12 8 DPSK — — ≤ 20 % EDR Differential Phase Encoding — 99 — ≥ 99 % F≥ ± 3MHz — –60 — < –40 dBm Adjacent Channel Power F = ± 2MHz — –28 — ≤ –20 dBm F = ±1MHz — –32 — ≤ –26 dB Table 12: Basic Rate Receiver Performance at 3.3V Test Parameter Min Typ Max BT Spec. Unit Sensitivity BER ≤ 0.1% — –84 ‐78 ≤ –70 dBm Maximum Input BER ≤ 0.1% –20 ‐10 — ≥ –20 dBm Co‐Channel — — 11 11 Adjacent Channel (± — ‐4/‐2 0 0 dB Carrier‐to‐Interferer 1 MHz) Ratio (C/I) Second Adjacent — ‐35/‐28 –30 –30 dB Channel (± 2 MHz) Third Adjacent — ‐42 –40 –40 dB Channel (± 3 MHz) Maximum Level of Intermodulation Interferers –39 ‐30 ‐ ≥ –39 dBm Table 13: Enhanced Data Rate Receiver Performance 3.3V Bluetooth Test Parameter Min Typ Max Unit Specification Sensitivity (BER ≤0.01%) 8 DPSK — –76 ‐71 ≤ –70 dBm 12

M2SD50NBT Datasheet Bluetooth Test Parameter Min Typ Max Unit Specification Maximum Input (BER π/4 DQPSK –20 — — ≥ –20 dBm ≤0.1%) 8 DPSK –20 — — ≥ –20 dBm π/4 DQPSK — 10 13 ≤ ±13 dB Co‐Channel C/I (BER ≤0.1%) 8 DPSK — 18 20 ≤ ±20 dB Adjacent Channel C/I (BER≤ π/4 DQPSK — ‐9/‐6 0 ≤0 dB 0.1%) 8 DPSK — ‐3/0 5 ≤5 dB Second Adjacent Channel π/4 DQPSK — ‐42/‐28 –30 ≤ –30 dB C/I (BER ≤ 0.1%) 8 DPSK — ‐28/‐22 –25 ≤ –25 dB Third Adjacent Channel C/I π/4 DQPSK — ‐45 –40 ≤ –40 dB (BER ≤ 0.1%) 8 DPSK — ‐39 –33 ≤ –33 dB 7 SDIO TIMING REQUIREMENTS The following figure (Figure 3) and table display SDIO default mode timing. Figure 3: SDIO Default Mode Timing Note: Timing is based on CL ≤ 40 pF load on CMD and Data. Table 14: SDIO Timing Requirements Symbol Parameter Min. Typ. Max. Unit fPP Frequency – Data Transfer mode 0 ‐ 50 MHz tWL Clock low time 7 ‐ ‐ ns tWH Clock high time 7 ‐ ‐ ns tTLH Clock rise time ‐ ‐ 10 ns tTHL Clock low time ‐ ‐ 10 ns Inputs: CMD, DAT (referenced to CLK) tISU Input setup time 6 ‐ ‐ ns 13

M2SD50NBT Datasheet Symbol Parameter Min. Typ. Max. Unit tIH Input hold time 2 ‐ ‐ ns Outputs: CMD, DAT (referenced to CLK) tODLY Output delay time – Data Transfer mode 0 ‐ 14 ns 8 PIN DEFINITIONS Voltage If Not Pin # Name Type Description Reference Used 1 GND ‐ ‐ Ground GND 2 3.3Vaux ‐ ‐ 3.3V power supply 3.3V 3 Reserved I/O ‐ Reserved pin. Please leave open. N/C 4 3.3Vaux ‐ ‐ 3.3V power supply 3.3V 5 Reserved I/O ‐ Reserved pin. Please leave open. N/C 6 LED#1 ‐ ‐ Reserved for Wi‐Fi LED indicator, N/C Active High. Note: Not supported by current software. 7 GND ‐ ‐ Ground GND 8 BT_PCM_CLK I/O 1.8V BT PCM clock N/C 9 SDIO_CLK I 1.8V WLAN SDIO clock N/C Only used for M2SD50NBT. 10 BT_PCM_SYNC I/O 1.8V BT PCM Synchronous data N/C 11 SDIO_CMD I 1.8V WLAN SDIO command data N/C Only used on M2SD50NBT. 12 BT_PCM_OUT O 1.8V BT PCM synchronous data output N/C 13 SDIO_DATA0 I/O 1.8V WLAN SDIO Data0 N/C Only used on M2SD50NBT. 14 BT_PCM_IN I 1.8V BT PCM synchronous data input N/C 15 SDIO_DATA1 I/O 1.8V WLAN SDIO Data1 N/C Only used on M2SD50NBT. 16 LED#2 ‐ ‐ N/C N/C 17 SDIO_DATA2 I/O 1.8V WLAN SDIO Data2 (used on M2SD50NBT) N/C 18 GND ‐ ‐ Ground Ground 19 SDIO_DATA3 I/O 1.8V WLAN SDIO Data3 (used on M2SD50NBT) N/C 20 BT_UART_WAKE O 3.3V Reserved for BT to wakeup Host. N/C When BT wakes up from its deep sleep state, it sends an H pulse signal out to Host. Normally, it is Low state. 21 Wake on WLAN O 1.8V Reserved for Wake‐ON‐Wireless N/C (WOW) LAN, WLAN output signal to wake up host, active Low and already has internal 10K pull up. Note: Not supported by current software. 14

M2SD50NBT Datasheet Voltage If Not Pin # Name Type Description Reference Used 22 BT_UART_TXD O 1.8V BT UART transmission data. N/C 23 WLAN reset I 1.8V WLAN reset or power down; Active L N/C Already has internal 10K pull‐up. Hold this to L to power down the Wi‐Fi chip. 24 Mechanical Key‐E ‐ ‐ ‐ ‐ 25 Mechanical Key‐E ‐ ‐ ‐ ‐ 26 Mechanical Key‐E ‐ ‐ ‐ ‐ 27 Mechanical Key‐E ‐ ‐ ‐ ‐ 28 Mechanical Key‐E ‐ ‐ ‐ ‐ 29 Mechanical Key‐E ‐ ‐ ‐ ‐ 30 Mechanical Key‐E ‐ ‐ ‐ ‐ 31 Mechanical Key‐E ‐ ‐ ‐ ‐ 32 BT_UART_RXD I 1.8V BT UART receives data. N/C 33 GND ‐ ‐ Ground GND 34 BT_UART_RTS O 1.8V BT UART Ready to Send. N/C 35 N/C ‐ ‐ N/C N/C 36 BT_UART_CTS O 1.8V BT UART Clear to Send. N/C 37 N/C ‐ ‐ N/C NC/ 38 N/C ‐ ‐ N/C N/C 39 GND ‐ ‐ Ground GND 40 N/C ‐ ‐ N/C N/C 41 N/C ‐ ‐ N/C N/C 42 N/C ‐ ‐ N/C N/C 43 N/C ‐ ‐ N/C N/C 44 LTE_COEX3 I 1.8V Reserved for LTE coexistence N/C Note: Not currently supported. 45 GND ‐ ‐ Ground GND 46 LTE_ACTIVE I 1.8V Reserved for LTE coexistence N/C Note: Not currently supported. 47 N/C ‐ ‐ N/C N/C 48 LTE_FRAME_SYNC I 1.8V Reserved for LTE coexistence N/C Note: Not currently supported. 49 N/C ‐ ‐ N/C N/C 50 CLK_32K I 3.3V 32.768KHz slow clock input. N/C Necessary to put BT into deep sleep mode. 51 GND ‐ ‐ Ground GND 52 N/C ‐ ‐ N/C N/C 53 N/C ‐ ‐ N/C N/C 54 BT_RFKILL I 3.3V Reset BT or to disable BT; Active L N/C 15

M2SD50NBT Datasheet Voltage If Not Pin # Name Type Description Reference Used 55 N/C ‐ ‐ N/C N/C 56 WIFI_RFKILL I 3.3V Reserved for RF disable (RF Kill) feature. N/C Active Low. Note: Not supported by current software. 57 GND ‐ ‐ Ground GND 58 N/C ‐ ‐ N/C N/C 59 N/C ‐ ‐ N/C N/C 60 N/C ‐ ‐ N/C N/C 61 N/C ‐ ‐ N/C N/C 62 N/C ‐ ‐ N/C N/C 63 GND ‐ ‐ Ground GND 64 N/C ‐ ‐ N/C N/C 65 N/C ‐ ‐ N/C N/C 66 N/C ‐ ‐ N/C N/C 67 N/C ‐ ‐ N/C N/C 78 N/C ‐ ‐ N/C N/C 69 GND ‐ ‐ Ground GND 70 N/C ‐ ‐ N/C N/C 71 N/C ‐ ‐ N/C N/C 72 3.3Vaux ‐ ‐ 3.3V power supply 3.3V 73 N/C ‐ ‐ N/C N/C 74 3.3Vaux ‐ ‐ 3.3V power supply 3.3V 75 GND ‐ ‐ Ground GND 16

M2SD50NBT Datasheet 9 MECHANICAL SPECIFICATIONS Figure 4: M.2 mechanical drawings Note: The Wi‐Fi MAC address is located on the product label. The BT MAC address is always be numerically subsequent to the Wi‐Fi MAC address. Therefore, the BT MAC address is Wi‐Fi MAC address plus one. 10 MOUNTING The M2SD50NBT connects to the host via a standard PCI EXPRESS M2 connector. Kyocera’s (www.Kyocera‐connector.com) 6411 series provide 1.8 mm, 2.3 mm and 3.2 mm connector heights. M2SD50NBT is a signal‐side component module; Laird recommends part number 24‐6411‐067‐101‐897E which has 2.3 mm connector height. The stand‐off mating to the recommend 2.3 mm connector from EMI STOP (www.EMISTOP.com) is part number F50M16‐041525P1D4M. Detail layout and stencil opening are show in Figure 5. 17

M2SD50NBT Datasheet Figure 5: Mounting information for M2SD50NBT and recommended land pad for stand‐off 18

M2SD50NBT Datasheet 11 RF LAYOUT DESIGN GUIDELINES/PRECAUTIONS The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your device.  Do not run antenna cables directly above or directly below the radio.  Do not place any parts or run any high speed digital lines below the radio.  If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices as far apart from each other as possible. Also, make sure there are at least 25dB isolation between Bluetooth antenna and Wi‐Fi antenna.  Laird recommends the use of a double shielded cable for the connection between the radio and the antenna elements.  Be sure to put the capacitor on the power pin as close as possible to reduce the radiation issue.  Use proper electro‐static‐discharge (ESD) procedures when installing the Laird radio module.  In order to get maximum throughput when operate at MIMO 2x2, two antennas with at least 25dB isolation is recommended.  To avoid negatively impacting TX power and receiver sensitivity, do no cover the antennas with metallic objects or components.  Opening/handing/removing must be done on an anti‐ESD treated workbench. All workers must also have undergone anti‐ESD treatment.  The devices should be mounted within one year of the date of delivery. 19

M2SD50NBT Datasheet 12 REGULATORY 12.1 Certified Antennas NOTE: The module is professionally installed device and installed in industry computer that is generally for industrial use. The device cannot be sold retail, to the general public or by mail order. It must be sold to dealers or have strict marketing control (such as Datalogic S.r.l. and SOREDI touch system GmbH). The module must be installed by a specified installers that require approval installation by Datalogic S.r.l. and SOREDI touch system GmbH. Due to this module is a professional installation device, only the antennas listed below are allowed to use. Model Type Connector 2400~2500MHz 5150~5875MHz Antenna includes cable HUBER+SUHNER pigtail, PCB 1 dBi (2.4‐2.5GHz), 1dBi (5.15‐5.875GHz) 1399.99.0124 terminated by connector U.FL 2400~2500MHz 2500~2700MHz Model Type Connector 3400~3700MHz 4900~5470MHz 5470~5935MHz Sencity® 6 dBi (2.4‐2.5GHz), 6dBi (2.5‐2.7GHz) HUBER+SUHNER N, 50 jack Omni‐S 7 dBi (3.4‐3.7GHz), 8dBi (4.9‐5.47GHz) 1399.17.0106 (female) Antenna 8dBi (5.47‐5.935) 20

M2SD50NBT Datasheet 13 FCC AND IC REGULATORY Model US/FCC CANADA/IC M2SD50NBT U4G‐RHINOIIWEC7 3862E‐RHINOIIWEC7 The M2SD50NBT is designed to pass certification with the antenna listed below. The required antenna impedance is 50 ohms. Peak gain ( dBi ) Model Type Connector 2400~2500 5150~5875MHz MHz Antenna includes cable pigtail HUBER+SUHNER PCB terminated 1 dBi 1dBi 1399.99.0124 by connector U.FL Peak gain ( dBi ) Model Type Connector 2400~2500 2500~2700 3400~3700 4900~5470 5470~5935 MHz MHz MHz MHz MHz Sencity® HUBER+SUHNER N, 50 jack Omni‐S 6 dBi 6 dBi 7 dBi 8 dBi 8 dBi 1399.17.0106 (female) Antenna 13.1 FCC 13.1.1 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. 21

M2SD50NBT Datasheet 13.1.1.1 FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 13.1.1.2 Important Note: Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/Canada. This device is intended only for OEM integrators under the following conditions: 1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2. The transmitter module may not be co‐located with any other transmitter or antenna, 3. For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end‐user regarding to Regulatory Domain change. As long as the three conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end‐product for any additional compliance requirements required with this module installed. 13.1.1.3 Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co‐location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re‐evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. 13.1.2 End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: U4G‐RHINOIIWEC7. 13.1.3 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 13.2 Industry Canada 13.2.1 Industry Canada Statement This device complies with Industry Canada’s license‐exempt RSSs. Operation is subject to the following two conditions: 22

M2SD50NBT Datasheet  This device may not cause interference; and  This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:  l’appareil ne doit pas produire de brouillage;  l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. This radio transmitter (M2SD50NBT – IC: 3862E‐RHINOIIWEC7) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le présent émetteur radio (M2SD50NBT –IC: 3862E‐RHINOIIWEC7)) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci‐dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. 13.2.2 Antenna Information NOTE: The module is professionally installed device and installed in industry computer that is generally for industrial use. The device cannot be sold retail, to the general public or by mail order. It must be sold to dealers or have strict marketing control (such as Datalogic S.r.l. and SOREDI touch system GmbH). The module must be installed by a specified installers that require approval installation by Datalogic S.r.l. and SOREDI touch system GmbH. Due to this module is a professional installation device, only the antennas listed below are allowed to use. Peak gain ( dBi ) Model Type Connector 2400~2500 5150~5875MHz MHz Antenna includes cable pigtail HUBER+SUHNER PCB terminated 1 dBi 1dBi 1399.99.0124 by connector U.FL Peak gain ( dBi ) Model Type Connector 2400~2500 2500~2700 3400~3700 4900~5470 5470~5935 MHz MHz MHz MHz MHz Sencity® HUBER+SUHNER N, 50 jack Omni‐S 6 dBi 6 dBi 7 dBi 8 dBi 8 dBi 1399.17.0106 (female) Antenna 23

M2SD50NBT Datasheet 13.2.2.1 Caution: (i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co‐channel mobile satellite systems; (ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250‐ 5350 MHz and 5470‐5725 MHz shall be such that the equipment still complies with the EIRP limit; (iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725‐ 5850 MHz shall be such that the equipment still complies with the EIRP limits specified for point‐to‐point and non‐point‐to‐point operation as appropriate; and Operations in the 5.25‐5.35GHz band are restricted to indoor usage only. 13.2.2.2 Avertissement: (i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux; (ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e; (iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation point à point et l'exploitation non point à point, selon le cas; Les opérations dans la bande de 5.25‐5.35GHz sont limités à un usage intérieur seulement. 13.2.3 Radiation Exposure Statement This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. 13.2.4 Déclaration d'exposition aux radiations Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé. Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps. This device is intended only for OEM integrators under the following condition:  The transmitter module may not be co‐located with any other transmitter or antenna. As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end‐product for any additional compliance requirements required with this module installed. Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:  Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 1 condition ci‐dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé. 13.2.4.1 Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co‐location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used 24

M2SD50NBT Datasheet on the final product. In these circumstances, the OEM integrator will be responsible for re‐evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. 13.2.4.2 Note Importante: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co‐localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. 13.2.5 End Product Labeling The final end product must be labeled in a visible area with the following: Contains IC: IC: 3862E‐RHINOIIWEC7. 13.2.6 Plaque signalétique du produit final Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: IC: 3862E‐RHINOIIWEC7. 13.2.7 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 13.2.8 Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. 25


Document Created: 2017-10-30 10:17:48
Document Modified: 2017-10-30 10:17:48
© 2024 FCC.report
This site is not affiliated with or endorsed by the FCC