C2PC Cover Letter (HSN-I30C)

FCC ID: TX2-RTL8822BE

Cover Letter(s)

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FCCID_4210176

Realtek Semiconductor Corp. No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan Tel: 886-3-5780211 ; Fax: 886-3-5776598 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 SUBJECT: Class II Permissive Change for FCC ID: TX2-RTL8822BE The intension of this application is to enable the modular FCC ID: TX2-RTL8822BE, granted on 08/29/2016 to be integrated in HP Notebook Computer, Model: HSN-I30C. The module installed into host platform mentioned above is electronically and mechanically identical to the original certified module. The Original FCC testing on module under FCC ID: TX2-RTL8822BE was performed with an antenna of higher gain, and the antenna was connected to the module in an open environment. The current host platform under application uses an antenna of the same type but of lower gain and is installed inside the host platform enclosure. The physical restraints introduced by the host platform should have resulted in equal or lower level of radiated emission. Therefore, additional Radiated emission testing is not necessary. Software security remains unchanged from the original application. Sincerely yours, Dana Liaw danaliaw@realtek.com


Document Created: 2019-03-25 06:44:13
Document Modified: 2019-03-25 06:44:13
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