Operational description

FCC ID: S9NZB32C1

Operational Description

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FCCID_1573686

SPZB32Wxy1.z 802.15.4 ZigBee® modules based on the STM32W chipset Features ■ 2.4 GHz IEEE 802.15.4-compliant SMD modules based on the ST STM32W chipset solution featuring: – Integrated 2.4 GHz transceiver – PHY and MAC IEEE 802.15.4 features – Integrated ARM® Cortex-M3 core – Integrated embedded Flash and RAM – Integrated encryption (AES-128) accelerator ■ Power amplified RF performances: – Up to 20 dBm nominal TX output power – Up to 105 dBm RX sensitivity T AF ■ Robust Wi-Fi and Bluetooth® coexistence ■ 16 channels (IEEE 802.15.4 channel 11 to 26) ■ Multiple configurable interfaces available (UART, SPI, I2C, ADC, GPIOs) ■ Industry standard JTAG programming ■ Onboard 24 MHz and 32.768 kHz stable Xtal R ■ Less than 2 uA typ power consumption in deep sleep mode (32.768 Xtal) ■ Multiple antenna options: integrated antenna or integrated UFL connector D ■ Multiple Protocol Stack Options ■ Single voltage supply (2.1 to 3.6 V) ■ FCC and CE compliant qualified ■ Small Form Factor : 16.4 x 26.5 mm ■ Operating temperature range: -40 °C to +85 °C 28 July 2011 Doc ID xxxxx Rev 1 1/19 www.st.com 19

Contents SPZB32Wxy1.z Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 T Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 AF 6.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.3 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.4 Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.5 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 R 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 D 9 Product approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.1 FCC approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.1.1 FCC labeling requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.2 European certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/19 Doc ID xxxxx Rev 1

SPZB32Wxy1.z Description 1 Description SPZB32Wxy1.z is a series of ready-to-use IEEE 802.15.4/ZigBee compliant and power amplified RF modules optimized for embedded applications that require low data rate communications and high transmission range capabilities based on the STM32W single chip that integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARM® Cortex embedded processor . The modules are very compact and enable OEMs to easily add wireless capabilities to electronics devices by optimizing time-to-market, cost, size, and consumption of their target applications. No RF experience or expertise is required to add this powerful networking capability to the final product. 24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per IEEE 802.15.4/ZigBee® specifications; additionally a 32.768kHz Xtal is also provided onboard for low power operation. A single supply voltage is requested to power the modules. The supply is in the range of 2.1 to 3.6 V. The voltage supply also determines the I/O ports level allowing an easy interface with additional peripherals. T An advanced solution integrating PA and LNA in a single package is aboard to ensure excellent power transmission and receiver sensitivity performances. To support user defined applications, a number of peripherals such as GPIO, UART, I2C, AF ADC and general purpose timers are available and user selectable. The size and footprint of this series of modules is equivalent to that of the series SPZB32Wxy2.z to facilitate the evaluation of the different range options on the target application. The series groups multiple versions that differ in terms of memory size , antenna (ceramic antenna or integrated u.fl connector for the connection of an external antenna) and stacks options (ZigBee, RF4CE, SimpleMAC). R The SPZB32W1y1.z versions are based on the STM32W108CB chipset integrating 128 kB of embedded flash memory and 8 kB of RAM available for data and program storage. For technical details on the STM32W108CB chipset refer to the related datasheet. For technical details on the supported stacks refer to the related user guide and application D notes. Doc ID xxxxx Rev 1 3/19

RoHS compliance SPZB32Wxy1.z 2 RoHS compliance ST modules are RoHS compliant and comply with ECOPACK® norms. 3 Application ● Smart energy applications ● Machine2Machine industrial control ● Wireless sensor networks ● Home/building automation ● Smart appliances ● Wireless alarms and security systems ● Lighting control ● Remote monitoring T AF R D 4/19 Doc ID xxxxx Rev 1

SPZB32Wxy1.z Block diagram 4 Block diagram Figure 1. SPZB32WxA1.z block diagram 6DD  K(Z  - (Z 2& 8TAL 8TAL ANTENNA '0)/S *TAG ,.! "0& 34- 7 3OC 0! 3YSTEM 3IGNALS ".W Figure 2. SPZB32WxC1.z block diagram 6DD  K(Z 8TAL T  - (Z 8TAL AF '0)/S *TAG ,.! 5&) 34- 7 3O# "0& 0! #ONNECTOR 3YSTEM 3IGNALS R ".W D Doc ID xxxxx Rev 1 5/19

Pin settings SPZB32Wxy1.z 5 Pin settings 5.1 Pin connections Figure 3. Pin connection diagram Antenna T AF R TOP VIEW AM09235V1 D 6/19 Doc ID xxxxx Rev 1

5.2 Pin description SPZB32Wxy1.z Table 1. Pin description Module pin n° Pin name Direction STM32W pin Description PB5 I/O 43 Digital I/O ADC0 Analog 43 ADC Input 0 1 TIM2CLK I 43 Timer 2 external clock input TIM1MSK I 43 Timer 1 external clock mask input PA5 ADC5 D I/O Analog 27 27 Digital I/O ADC Input 1 2 PTI_DATA nBOOTMODE O I R 27 27 Frame signal of PTI (Packet Trace Interface) Embedded serial bootloader activation out of reset Doc ID xxxxx Rev 1 AF TRACEDATA3 0 27 Synchrounus CPU trace data bit 3 PA4 I/O 26 Digital I/O ADC4 Analog 26 ADC Input 0 3 PTI_EN O 26 Frame signal of PTI (Packet Trace Interface) T TRACEDATA2 O 26 Synchrounus CPU trace data bit 2 PA3 I/O 25 Digital I/O SC2nSSEL I 25 SPI SLAVE SELECT of Serial Controller 2 4 TIM2_CH2 I/O 25 Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5]) TRACECLK O 25 Synchrounus CPU trace clock 5 nRESET I 12 Active low reset ( an internal pull-up of 30 kohm typ. is provided) PB3 I/O 19 Digital I/O UART_CTS I 19 UART CTS handshake of Serial Controller 1 6 Pin settings SC1SCLK I/O 19 SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1 TIM2_CH3 I/O 19 Timer 2 channel 3 input / Timer 2 channel 3 output 7/19

Table 1. Pin description (continued) 8/19 Pin settings Module pin n° Pin name Direction STM32W pin Description PB4 I/O 20 Digital I/O UART_RTS O 20 UART RTS handshake of Serial Controller 1 7 TIM2_CH4 I/O 20 Timer 2 channel 4 input / Timer 2 channel 4 output SC1nSSEL I 20 SPI slave select of Serial Controller 1 PA0 I/O 21 Digital I/O D SC2MOSI O 21 SPI Master data out of Serial Controller 2 8 SC2MOSI I 21 SPI Slave data in of Serial Controller 2 TIM2_CH1 I/O 21 Timer 2 channel 1 input / Timer 2 channel 1 output PA1 SC2MISO I/O I R 22 22 Digital I/O SPI Master data in of Serial Controller 2 Doc ID xxxxx Rev 1 9 SC2MISO SC2SDA TIM2_CH3 PA2 O I/O I/O I/O 22 22 22 24 AF SPI Slave data out of Serial Controller 2 TWI (I2C) data of Serial Controller 2 Timer 2 channel 3 input / Timer 2 channel 3 output Digital I/O 10 SC2SCLK SC2SCLK SC2SCL TIM2_CH4 O I/O I/O I 24 24 24 24 T SPI Master clock of Serial Controller 2 SPI Slave clock of Serial Controller 2 TWI (I2C) clock of Serial Controller 2 Timer 2 channel 4 input / Timer 2 channel 4 output 11 GND -- 49 Ground 12 VDD Power 16,23,28,37 Input power supply PC1 I/O 38 Digital I/O SPZB32Wxy1.z ADC3 Analog 38 ADC Input 3 13 SWO O 38 Serial Wire Output ayncronous trace output to debugger TRACEDATA0 O 38 Syncronous CPU trace data bit 0

Table 1. Pin description (continued) SPZB32Wxy1.z Module pin n° Pin name Direction STM32W pin Description PB0 I/O 36 Digital I/O VREF (O/I) Analog 36 ADC reference output / ADC reference input TIM1CLK I 36 Timer 1 external clock input 14 TIM2MSK I 36 Timer 2 external clock mask input IRQA I 36 External interrupt source A D TRACECLK O 36 Syncronous CPU trace clock PB1 I/O 30 Digital I/O SC1TXD O 30 UART transmit data of Serial Controller 1 15 SC1MOSI / SC1MISO SC1SDA O I/O R 30 30 SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1 TWI (I2C) data of Serial Controller 1 Doc ID xxxxx Rev 1 16 TIM2_CH1 PB2 SC1RXD SC1MISO / SC1MOSI I/O I/O I I 30 31 31 31 AF Timer 2 channel 1 input / Timer 2 channel 1 output Digital I/O UART receive data of Serial Controller 1 SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1 17 SC1SCL TIM2_CH2 JTCK SWCLK I/O I/O I/O I 31 31 32 32 T TWI (I2C) clock of Serial Controller 1 Timer 2 channel 2 input / Timer 2 channel 2 output JTAG clock input from debugger Serial Wire clock input/output with debugger PC2 I/O 33 Digital I/O 18 JTDO O 33 JTAG data out to debugger SWO O 33 Serial Wire Output asyncronous trace output to debugger PC3 I/O 34 Digital I/O 19 Pin settings JTDI I 34 JTAG data in from debugger PC4 I/O 35 Digital I/O 9/19 20 JTMS I 35 JTAG mode select from debugger SWDIO I/O 35 Serial Wire bidirectional data to/from debugger

Table 1. Pin description (continued) 10/19 Pin settings Module pin n° Pin name Direction STM32W pin Description PC0 I/O 40 Digital I/O (high current) JRST I 40 JTAG reset input from debugger 21 TRACEDATA1 O 40 Syncronous CPU trace data bit 1 IRQD I 40 External interrupt source D PB7 I/O 41 Digital I/O D TIM1_CH2 O 41 Timer 1 channel 2 output 22 TIM1 _CH2 I 41 Timer 1 channel 2 input IRQC I 41 External interrupt source C ADC2 PB6 I/O I R 41 42 ADC input 2 Digital I/O Doc ID xxxxx Rev 1 23 TIM1_CH1 TIM1_CH1 IRQB ADC1 O Analog I I 42 42 42 42 AF Timer 1 channel 1 output Timer 1 channel 1 input External interrupt source B ADC input 1 24 LNA/ENABLE PA6/LNA_ENABLE O I 29 29 T Digital input, module firmware dependent, externally forced by the user dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA. (HIGH= internal LNA enabled, LOW= internal LNA disabled). Digital output, module firmware dependent, internally forced by application dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA. (HIGH= internal LNA enabled, LOW= internal LNA disabled). Digital input, module firmware dependent, externally forced by the user dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY RF_STANDBY I 18 state. SPZB32Wxy1.z (HIGH= Front-end enabled, LOW= Front-end forced in the STANDBY state). 25 Digital output, module firmware dependent, internally forced by application dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY PA7/RF_STANDBY O 18 state. (HIGH= Front-end enabled, LOW= Front-end forced into STANDBY state).

SPZB32Wxy1.z Electrical characteristics 6 Electrical characteristics 6.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Min. Max. Unit VDD Module supply voltage - 0.3 3.6 V Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V Tstg Storage temperature -40 +85 °C Tsold Soldering temperature < 10s 250 °C 6.2 Recommended operating conditions Table 3. Recommended operating conditions Symbol VDD Parameter Module supply voltage T Conditions -40 °C < T < +85 °C Min. Typ. Max. 2.1 3.3 3.6 Unit V AF Tstg Operating ambient temperature -40 +85 °C 6.3 DC electrical characteristics Table 4. DC electrical characteristics Symbol Parameter Conditions Min. Typ. Max. Unit R IRX RX current Vdd = 3.3 V, T= 25 °C - 20 - mA Po = 18 dBm, Vdd = 3.3 V, ITX TX current - 120 - mA T = 25 °C, F = 2450MHz D Deep sleep current IDS Vdd = 3.3 V, T = 25 °C - 1.3 - mA (32.768 kHz oscillator) Doc ID xxxxx Rev 1 11/19

Electrical characteristics SPZB32Wxy1.z 6.4 Digital I/O specifications Table 5. Digital I/O specifications Symbol Parameter Conditions Min. Typ. Max. Unit VIL Low level input voltage 2.1 < Vdd < 3.6 V 0 0.5 x Vdd V VIH High level input voltage 2.1 < Vdd < 3.6 V 0.62 x Vdd Vdd V Iil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA Iih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA Ripu Input pull-up resistor 30 kΩ Ripd Input pull-down resistor 30 kΩ VOL Low level output voltage 0 0.18 x Vdd V VOH High level output voltage 0.82 x Vdd Vdd V IOHS Output source current (standard) 4 mA IOLS Output sink current (standard) 4 mA T IOHH Output source current (high current) 8 mA IOLH Output sink current (high current) 8 mA IOTot Total output current for I/O 40 mA AF 6.5 RF electrical characteristics Table 6. Electrical characteristics Symbol Parameter Conditions Min. Typ. Max. Unit R Frequency range Vdd = 3.3 V, T= 25 °C 2405 2480 MHz TX Output power Vdd = 3.3 V, T= 25 °C 20 dBm RX Sensitivity Vdd = 3.3 V, 1 % PER -105 dBm D ±5 MHz 35 Adjacent channel rejection dBm ±10 MHZ 40 12/19 Doc ID xxxxx Rev 1

SPZB32Wxy1.z Mechanical dimensions 7 Mechanical dimensions Figure 4. Mechanical dimensions      7239,(: SLWFK PP 7ROHUDQ FHV “PP     [          $QWHQQD 6FDOH T      [  AF   %277209,(: R Figure 5. Pin land pattern (dimensions in mm) 5(&200(1'('/$1'3$77(517239,(: SLWFK    D        !-6 Doc ID xxxxx Rev 1 13/19

Soldering SPZB32Wxy1.z 8 Soldering The soldering phase must be carefully executed; in order to avoid undesired melting phenomenon, particular attention must be paid to the set-up of the peak temperature. Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations Table 7. Soldering Profile feature PB free assembly Average ramp up rate (TSMAX to TP) 3 °C / sec max. Preheat Temperature min. (TS MIN) 150 °C Temperature max. (TS MAX) 200 °C Time (TS MIN to TS MAX) (tS) 60 – 100 sec Time maintained above: Temperature TL 217 °C Time tL Peak temperature (Tp) Time within 5 °C of actual peak temperature (tP) T 40 – 70 sec 240 + 0 °C 10 – 20 sec AF Ramp down rate 6 °C / sec Time from 25 °C to peak temperature 8 minutes max. R D 14/19 Doc ID xxxxx Rev 1

SPZB32Wxy1.z Product approvals 9 Product approvals This series of modules has been designed to meet national regulations for world wide use. Different versions of modules belonging to the same series are orderable as it is specified in the Section 10. They differ in terms of integrated memory size and protocol stack enabled to run while sharing the same manufacturing , design and radios capabilities. As representative of the series from the RF design and radios capabilities, the versions using 128 kB Flash/8kB RAM and Zigbee PRO Protocol stack (i.e. SPZB32W1A1.1 and SPZB32W1C1.1) have been used during the certification tests. The following certifications have been obtained. 9.1 FCC approvals The SPZB32W1A1.1 device, with integrated antenna, as well as the SPZB32W1C1.1, with the antenna specified in Table 8, have been tested and found to comply with the limits for a Class B digital device , pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. T This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If AF this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ● Reorient or relocate the receiving antenna ● Increase the separation between the equipment and receiver ● Connect the equipment into an outlet on a circuit different from that to which the receiver is connected R Consult the dealer or an experienced radio/TV technician for help Module type: ZigBee® module SPZB32W1A1.1 / SPZB32W1C1.1 FCC-ID: S9NZB32C1 D Modular type: single modular Table 8. Antenna used for FCC approvals ITEM Part N° Manufacturer 1 2010B4844-01 (Titanis Antenna) Antenova Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment. While the applicant for a device into which the SPZB32W1A1.1 or the SPZB32W1C2.1 with the antenna specified in Table 8 installed is not required to obtain new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product. Doc ID xxxxx Rev 1 15/19

Product approvals SPZB32Wxy1.z 9.1.1 FCC labeling requirements When integrating the SPZB32W1A1.1 / SPZB32W1C1.1 into the final product, il must be ensured that the FCC labelling requirements, as specified below, are satisfied. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C1 or “Contains FCC ID: S9NZB32C1” , any similar wording that expressed the same meaning may be used. An example is: Contains FCC ID: S9NZB32C1 9.2 European certification SPZB32W1A1.1 and SPZB32W1C2.1 devices are CE certified: 0051 T Expert opinion N. xxx-xxxxxx released by IMQ refers to the following normative: AF Radio: EN300 328: V1.7.1:2006-10 EMC: EN301 489 17 V2.1.1:2009 Safety: EN60950-1:2006 + A11:2009 R D 16/19 Doc ID xxxxx Rev 1

SPZB32Wxy1.z Ordering information scheme 10 Ordering information scheme Table 9. Ordering information scheme SPZB 32Wx y 1 .z 802.15.4 / ZigBee modules Memory options: x --> 1: 128 kB Flash; 8 kB RAM x --> 2: 256 kB Flash; 16 kB RAM Antenna options: y --> A: Integrated ceramic antenna T y --> C: Integrated UFL connector 1: Long TX range AF Firmware options: z --> 1: ZigBee PRO (EmberZnet) z --> 2: STM ZigBee z --> 3: RF4CE R z --> 4: SimpleMAC z --> 5: Zigbee IP D Note: Check availability of the different versions with your ST sales representative. Doc ID xxxxx Rev 1 17/19

Revision history SPZB32Wxy1.z 11 Revision history Table 10. Document revision history Date Revision Changes 28-Jul-2011 1 Initial release T AF R D 18/19 Doc ID xxxxx Rev 1

SPZB32Wxy1.z Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no T liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such AF third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, R DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void D any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID xxxxx Rev 1 19/19


Document Created: 2011-07-28 08:31:46
Document Modified: 2011-07-28 08:31:46
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