User manual

FCC ID: S8J-R8723RB1

Users Manual

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FCCID_2734638

Product Specification IEE802.11 b/g/n 2.4G 1T1R WIFI+BT V2.1+EDR/BT3.0/BT 3.0+HS/4.0 USB MODULE Version: 1.0 BL‐R8723RB1 FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. The 150Mbps Wireless N SDIO Module is designed to comply with the FCC statement. FCC ID is S8J-R8723RB1. The host system using 150Mbps Wireless N SDIO Module, should have label indicated it contain modular’s FCC ID：S8J-R8723RB1. This radio module must not installed to colocate and operating simultaneously with other radios in h ost system , additional testing and equipment authorization may be required to operating simultaneously with other radio. RF warning for Mobile device: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. 0

B‐LINK ELECTRONIC CO., LTD in shenzhen Contents 1. General Description ................................................................................................ 2 2. The range of applying ............................................................................................. 2 3. Features .................................................................................................................. 2 4. DC Characteristics ..................................................................................................... 4 5. Functional Specifications .......................................................................................... 5 6. The block diagram of product principle ................................................................... 6 7. The supported platform ........................................................................................... 6 8. The definition of product Pin ................................................................................... 7 9. The Structure and Size of product ............................................................................ 8 10. : The ANT Pin connect to antenna, please refer to design demand .............. 8 11. Tpical Solder Reflow Profile ................................................................................... 9 1

B‐LINK ELECTRONIC CO., LTD in shenzhen 1. General Description BL‐8723RB1 product Accord with FCC CE and is a small size and low profile of WiFi+BT combo module with LGA (Land‐Grid Array) footprint, board size is 19.5mm*12.4 mm with module height 0.6mm. It is 150 wireless USB adapter which has lower power consumption, high linearity output power, accords with IEEE802.11B/G/N, and supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It connects with other wireless device which accorded with these standards together, supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA‐PSK/WPA2‐PSK, WPA/WPA2.Its wireless transmitting rate rises 150M, equivalent to 10 times of common 11b product. The inner AI high gain ceramics antenna adapts different kinds of work environment. It’s easy and convenient to link to wireless network for the users using desktop, laptop and other device that needs connect to wireless network. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0. 2. The range of applying MID, networking camera, STB GPS, E‐book, Hard disk player, Network Radios, PSP, etc, the device which need be supported by wireless networking. 3. Features Feature Implementation Power supply VCC_3.3V +‐0.2V Clock source 40MHz Work temperature: ‐20ºC‐‐‐70ºC Temperature range Storage temperature ‐40°C ~ +80°C The connect type of Connect to the 6th pin of Module Antenna Package SMT 10 pins WLAN and BT features General features ■ CMOS MAC, Baseband PHY, and RF in a single chip for IEEE 802.11b/g/n compatible WLAN ■ Complete 802.11n solution for 2.4GHz band ■ 72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using 20MHz bandwidth ■150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth ■ Compatible with 802.11n specification 2

B‐LINK ELECTRONIC CO., LTD in shenzhen ■ Backward compatible with 802.11b/g devices while operating in 802.11n mode ■Qualified BT 2.1, BT 3.0 and BT 4.0 Dual mode ■Support for Bluetooth Low Energy ■Integrated class 1, class 2, and class 3 PA and modem in Bluetooth Controlle Host Interface ■ Complies with USB Specification Revision 2.0 ■ IEEE 802.11b/g/n compatible WLAN Standards Supported ■ IEEE 802.11e QoS Enhancement (WMM) ■ IEEE 802.11h TPC, Spectrum Measurement ■ 802.11i (WPA, WPA2). Open, shared key, and pair‐wise key authentication services ■ BT v2.1, EDR/BT v3.0 and HS/BT v4.0 ■ Frame aggregation for increased MAC efficiency (A‐MSDU, A‐MPDU) ■ Low latency immediate High‐Throughput Block Acknowledgement WLAN (HT‐BA) MAC ■ Long NAV for media reservation with CF‐End for NAV release Features ■ PHY‐level spoofing to enhance legacy compatibility ■ Power saving mechanism ■ Channel management and co‐existence ■ Transmit Opportunity (TXOP) Short Inter‐Frame Space (SIFS) bursting for higher multimedia bandwidth ■ IEEE 802.11n OFDM ■ One Transmit and one Receive path (1T1R) ■ 20MHz and 40MHz bandwidth transmission WLAN ■ Short Guard Interval (400ns) PHY ■ DSSS with DBPSK and DQPSK, CCK modulation with long and short Features preamble ■ OFDM with BPSK, QPSK, 16QAM, and 64QAM modulation. Convolutional Coding Rate: 1/2, 2/3, 3/4, and 5/6 ■ Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n ■ Switch diversity for DSSS/CCK ■ Hardware antenna diversity ■ Selectable receiver FIR filters ■ Programmable scaling in transmitter and receiver to trade quantization noise against increased probability of clipping Fast 3

B‐LINK ELECTRONIC CO., LTD in shenzhen ■ receiver Automatic Gain Control (AGC) ■ On‐chip ADC and DAC ■ 1Mbps for Basic Rate; 2,3Mbps for Enhanced Data Rate; 6,9,12,18,24,36,48,54Mbpsfor High Speed BT Controller ■ AFH, Time Division for Media Access Control ■ 8DPSK, π/4 DQPSK, GFSK for Modulation Techniques ■PCM interface for audio data transmission via BT controller. ■Integrated MCU to execute Bluetooth protocol stack ■Support all packet types in basic rate and enhanced data rate ■Support SCO / eSCO link (allow one link for PCM interface and three links for HS-UART) ■Support 4 piconets in a scattern ■Support Secure Simple Pairing ■Support Low Power Mode (Sniff / Sniff Sub-rating / Hold / Park) ■Enhanced BT/WIFI Coexistence Control to improve transmission quality in different profiles ■Bluetooth 4.0 Dual Mode support: Simultaneous LE and BR/EDR ■Support multiple states of Low Energy to increase the flexibility of application ■Fast AGC control to improve receiving dynamic range ■Support AFH to dynamically detect channel quality to improve transmission quality Bluetooth Transceiver ■Integrated internal class 1, class 2, and class 3 PA Features ■Bluetooth 3.0+HS compliant ■Power Control / Enhanced Power Control Supported ■Bluetooth Low Energy supported ■Integrated 32K oscillator for power management 4. DC Characteristics Symbol Parameter Minimum Typical Maximum Units VD33A, 3.3V I/O Supply 3.0 3.3 3.6 v VD33D Voltage VD28A, 1.2V Core 1.10 1.2 1.32 v VD28D Supply Voltage VD15A, 1.5V Supply 1.425 1.5 1.575 v 4

B‐LINK ELECTRONIC CO., LTD in shenzhen VD15D Voltage 5. Functional Specifications Host Interface USB2.0 WiFi: EEE 802.11b, IEEE 802.11g, IEEE 802.11n Standard B T: V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0 Frequency Range 2.4GHz~2.4835GHz 802.11b: CCK, DQPSK, DBPSK 802.11g: 64 QAM, 16 QAM, QPSK, BPSK Modulation Type 802.11n: 64 QAM, 16 QAM, QPSK, BPSK B T: 8DPSK, π/4 DQPSK, GFSK Working Mode Infrastructure, Ad‐Hoc Wifi：802.11b: 11, 5.5, 2, 1 Mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: MCS 0 to 7 for HT20MHz ;MCS 0 to 7 for Data Transfer Rate HT40MHz B T: 1 Mbps for Basic Rate 2,3 Mbps for Enhanced Data Rate IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Spread Spectrum Multiplexing) BT：FHSS(Frequency‐Hopping Spread Spectrum) Wi Fi: 1M: ‐92dBm@8%PER 6M: ‐89dBm@10%PER Sensitivity @PER（Tolerance： 11M:‐86dBm@8%PER +/‐2dB） 54M:‐73dBm@10%PER 135M:‐67dBm@10%PER B T: ‐89dBm@1Mbps, ‐85dBm@2Mbps, ‐83dBm@3Mbps 14 dBm@11b, 12dBm@11g , 11dBm@11n（Tolerance： RF Power +/‐1.5dB） BT: MAX +4.5dBm Connect to the external antenna through the half hole. The The connect type of Antenna antenna and other interface get connected to the external devices by the edge half a circle welding plate. 5

B‐LINK ELECTRONIC CO., LTD in shenzhen 6. The block diagram of product principle 7. The supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable 6

B‐LINK ELECTRONIC CO., LTD in shenzhen 8. The definition of product Pin 10 9 8 7 6 5 1 2 3 4 Top and bottom view of BL‐8723RB1 Pin No： TYPE Description 1 P DC:3.3V 2 I/O UDM‐ 3 I/O UDP+ 4 P GND 5 P GND 6 O ANT 7 P BT_PCM_SYNC 8 P BT_PCM_CLK 9 P BT_PCM_IN 10 P BT_PCM_OUT 7

B‐LINK ELECTRONIC CO., LTD in shenzhen 9. The Structure and Size of product 10: The ANT Pin connect to antenna, please refer to design demand Connect to the 6th pin of Module Connect to the 5th pin of Module a) The current of 3.3V power supply must be >300mA, its ripple wave must be <30mV. The GND pins of module and external antenna need to be an incorporated part. The ground plane should be larger, module and antenna should keep far away from interference source. b) The sixth pin is 2.4G high frequency output, coplanar impedance of layout line between this pin to antenna interface should be 50Ω, we suggest use arc line or straight line, and beside the line there will be ground plane that its length as shout as possible, the longest length is no more than 50mm. c) L1, C1, C2 constitute a π‐type network that we preset, please make it close to antenna interface, this π‐type network is used to match the antenna parameters and control the radiation. It should be adjusted according to the real condition when being used. Normally you can only mount L1 that its parameters are: 10pF, NP0 material. No need C1 and C2 8

B‐LINK ELECTRONIC CO., LTD in shenzhen 11. Typical Solder Reflow Profile 9


Document Created: 2015-08-31 14:42:29
Document Modified: 2015-08-31 14:42:29
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