Layout Guide

FCC ID: RX3-BTUC49

Parts List/Tune Up Info

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FCCID_4106218

                             BTUC49-TX&SP Trace Layout
                                                                  13/12/18


For proper integration of the BTUC49-TX&SP module in end products the following requirements must
be met. The BTUC49-TX&SP modules have same hardware and According to end product, BTUC49-
TX&SP will be mounted at two different board, which has same type antenna and similar RF trace.
 A host product incorporating the BTUC49-TX&SP modules cannot take advantage of the pre-existing
certification of the component transmitter without conformity to the specific requirements in these
instructions.




1. Contents
2.   Approved RF Connection (BTUC49-TX)........................................................................................... 2
3.   Alternate RF Connection (BTUC49-SP) ........................................................................................... 4
4.   Approved Antennas ...................................................................................................................... 6
5.   Design Verification Test Procedures .............................................................................................. 6
6.   Production Test Procedures for Ensuring Compliance ..................................................................... 6




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2. Approved RF Connection (BTUC49-TX)
This is the preferred RF connection design and is approved with all operating modes of the module.
This design uses a PCB microstrip to connect the BTUC49-TX module’s Antenna
A 2 layer PCB is used in this design. The Top layer 16mil RF trace and bottom ground plane form an RF microstrip.
    -   Figure 1 shows the required layer stackup for this design and must be matched precisely
        including material type, dielectric thickness, and copper thickness.
    -   Figure 2 shows the trace dimensions that must be followed precisely, including trace width,
        routing, and RF matching components. A 0ohm resistor (TA-I 1R-0000000-J200) is located
        at Pi-matching by series connect, between the module and RF switch. A RF switch is located
        at Between antenna and Pi-matching which is only for connecting RF connector to RF
        testing.
    -   The Ground plane on bottom must not have any cutouts in the area under the RF trace, in the
        area between the module and the antenna, or under the RF matching components.




                  Layer       Layer Name            Material          Nominal Thickness (mil)
                                         Top soldermask                        0.40
                    1                   1/2oz + Plating                         1.4
                                        core(36mil H/H)                        34.6
                    2                   1/2oz + Plating                         1.4
                                       Bottom soldermask                        0.4



                                           Figure 1 - PCB Stackup




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Figure 2 - Trace Dimensions and RF Matching Component Placement for BTU49-TX




             Figure3 – Pin size for BTUC49-TX


3. Alternate RF Connection (BTUC49-SP)
This is the preferred RF connection design and is approved with all operating modes of the module.
This design uses a PCB microstrip to connect the BTUC49-SP module’s Antenna.
The RF trace’s difference for TX and SP is the path between antenna feed point and RF switch only.
A 2 layer PCB is used in this design. The Top layer 16mil RF trace and bottom ground plane form an RF microstrip.
    -   Figure 4 shows the required layer stackup for this design and must be matched precisely
        including material type, dielectric thickness, and copper thickness.
    -   Figure 5 shows the trace dimensions that must be followed precisely, including trace width,
        routing, and RF matching components. A 0ohm resistor (TA-I 1R-0000000-J200) is located
        at Pi-matching by series connect, between the module and RF switch. A RF switch is located
        at Between antenna and Pi-matching which is only for connecting RF connector to RF
        testing.
    -   The Ground plane on bottom must not have any cutouts in the area under the RF trace, in the
        area between the module and the antenna, or under the RF matching components.




                    Layer       Layer Name             Material          Nominal Thickness (mil)
                                           Top soldermask                         0.40
                      1                    1/2oz + Plating                         1.4
                                           core(36mil H/H)                        34.6
                      2                    1/2oz + Plating                         1.4
                                          Bottom soldermask                        0.4


                                     Figure 4 - PCB Stackup




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Figure 4 - Trace Dimensions and RF Matching Component Placement for BTU49-SP




      Figure5 – Pin size for BTUC49-SP



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    4. Approved Antennas
    The antenna in Table 1 is tested and approved with BTUC49-TX. According to the FCC Permissive Change
    Policy (178919 D01)Additional“ antennas that are equivalent may be substituted, and then marketed
    without a Class II permissive change…Equivalent antennas must be of the same type (e.g., yagi, dish,
    etc.), must be of equal or less gain than an antenna previously authorized under the same grant of
    certification (FCC ID), and must have similar in-band and out-of-band characteristics. The antenna in
    Table 2 is alternate antenna which is follow the FCC Permissive Change Policy (178919 D01) and is used
    for connecting to BTUC49-SP module.
    Manufacturer          Part number                  Type               Peak Gain        Module Type
N
       N/A                    N/A                      PIFA                2.49dBi             TX

                                        Table 1 - Approved Antennas

    Manufacturer          Part number                  Type               Peak Gain        Module Type
N
       N/A                    N/A                      PIFA                2.4dBi              SP

                                        Table 2 - Alternate Antennas


    5. Design Verification Test Procedures
    After the design is fabricated the following measurements should be executed to verify the design:
        1. Mechanical measurement of dimensions specified in the Microstrip Dimensions diagrams above
       2. Obtain and review the detailed layer stackup solution used for the build from the PCB
          manufacturer that specifies dielectric thicknesses and target dielectric constants for
          substrate materials.




    6. Production Test Procedures for Ensuring Compliance
    During production test for the host device, The BTUC49-TX&SP module are to be activated in maximum
    power transmit and the conducted RF output power at RF switch is to be measured using a Spectrum
    Analyzer, RF Power Meter or other appropriate RF measurement equipment. The conducted output
    power should not exceed the maximum output power specified in the BTUC49-TX&SP Data Guide.




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Document Created: 2018-12-14 10:41:54
Document Modified: 2018-12-14 10:41:54

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