Users Manual

FCC ID: Q2331307

Users Manual

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Preliminary Product Overview T3130-7V10PO1-7600 Apr-2004 PBA 313 07 Singlestone Secure Mobile Solutions Preliminary Data Sheet, 11/2001 CONFIDENTIAL N e v e r s t o p t h i n k i n g .

Singlestone PBA 313 07 For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1, FALC®-LH, IDEC®, IOM®, IOM®-1, IOM®-2,IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A, OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI®, are registered trademarks of Infineon Technologies AG. ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG. BLUETOOTHT M is a trademark owned by its proprietor and used by Infineon Technologies AG under license. Edition 4/2004 Published by Infineon Technologies WS Sweden AB, Isafjordsgatan 16 SE-164 81 Kista © Infineon Technologies AG All Rights Reserved. Attention please! The information presented in this document does not constitute a part of any quotation or contract. Infineon Technologies especially emphazises the following: As far as patents or other rights of third parties are concerned, liability is expressly excluded for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics or representation. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 of the Infineon Technologies AG, may only be used in life-support devices or systems 2 with the express written approval of Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life, such as, for example, in medical, air traffic, defense, or life-sustaining automotive applications. If they fail, it is reasonable to assume that the health of the user or another person may be endangered. Exclusion of Warranty and Liability The Software is provided "as is" and Infineon gives no warranty - expressly or implied - of any kind, including, but not limited to, warranties of merchantability or fitness for a particular purpose, nor does Infineon assume any liability whatsoever as to the performance of the Software. In addition, Infineon assumes no responsibility for the ability of the customer to use this Software for the purpose it was provided for, nor does Infineon assume responsibility for any claims, including, but not limited to, claims of infringement of intellectual property rights of third parties, arising from the customer's use of the Software. Preliminary Product Overview 2 4/2004

Singlestone PBA 313 07 Table of Contents 1 Introduction ...................................................................................................................... 5 2 General Device Overview.............................................................................................. 6 2.1 General Features............................................................................................................. 7 2.2 Block diagram................................................................................................................. 8 2.3 Typical application ......................................................................................................... 8 2.4 Mechanical dimension and pad arrangement ................................................................. 9 2.5 Module pin-out.............................................................................................................. 10 2.6 Functional Block Diagram ............................................................................................ 11 2.7 System Integration and Applications............................................................................ 12 2.7.1 General description.................................................................................................. 12 3 Electrical Specifications .............................................................................................13 3.1 Absolute Maximum Ratings.......................................................................................... 13 3.2 Operating conditions.................................................................................................... 13 3.3 Latch-up immunity ........................................................................................................ 13 3.4 Quality .......................................................................................................................... 13 3.5 Capacitance .................................................................................................................. 14 3.6 Current consumption.................................................................................................... 14 3.7 DC Characteristics of Digital Part ................................................................................. 15 3.7.1 Pull Up characteristics on ResetQ ............................................................................. 16 3.8 Operational Range for RF part ...................................................................................... 16 3.9 AC/DC Characteristics of RF part.................................................................................. 16 3.9.1 Transmitter Characteristics....................................................................................... 17 3.9.2 RSSI ....................................................................................................................... 17 3.9.3 Receiver Characteristics........................................................................................... 18 3.10 Characteristics of externally supplied 32.768kHz clock signal............................... 18 4 Assembly and design guidelines .............................................................................19 4.1 General description of the module ............................................................................... 19 4.2 Printed Circuit Board design......................................................................................... 19 4.3 Solder paste printing .................................................................................................... 19 4.4 Assembly...................................................................................................................... 20 4.4.1 Component placement ............................................................................................. 20 4.4.2 Pin mark .................................................................................................................. 20 4.5 Soldering profile........................................................................................................... 21 4.6 Antenna ........................................................................................................................ 21 4.7 Shielding / EMC requirements....................................................................................... 21 4.8 Safety............................................................................................................................ 21 5 Type approvals and Qualification.............................................................................22 5.1 Bluetooth Qualification ................................................................................................. 22 Preliminary Product Overview 3 4/2004

Singlestone PBA 313 07 5.2 FCC Modular Approval.................................................................................................. 22 5.3 R&TTE Approval ........................................................................................................... 22 6 Module marking.............................................................................................................23 7 Package...........................................................................................................................24 8 References......................................................................................................................25 Preliminary Product Overview 4 4/2004

Singlestone PBA 313 07 1 Introduction The module is built around the BlueMoon Single Cellular chip (PMB 8761) which contains the radio, baseband, link manager and HCI functionality. For additional information regarding the PMB8761 such as firmware features, complete description of Infineon specific HCI commands and events, please refer to the latest version of the Data sheet for PMB8761, T8761-XV01Dx-7600. Preliminary Product Overview 5 4/2004

Singlestone PBA 313 07 2 General Device Overview Infineon’s Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted for data and audio applications in the 10 meters personal area range. BLUETOOTH wireless technology is an open industry standard for short range wireless communication with both data and voice transmission capability (up to 723 kbit/s data asymmetrically or up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, so any further development and qualification efforts for the user are minimized. It is already hardware prepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections, support the co-existence with WLAN solutions using the same frequency band and accelerate the connection setup. Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between the Bluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controller- interface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). In parallel, the PCM interface is suitable for audio connections. Around Infineon’s BlueMoon Single Cellular – PMB 8761 Bluetooth chip, all essential components for a complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperature compensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an E²PROM holds the application specific configuration data which is loaded after power-up reset, and an integrated balun-filter component ensures optimized RF matching between the chip and the external antenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must be provided to the Singlestone module. Bluetooth stack software supporting the extended feature set of Infineon’s BlueMoon family and a comprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety of host architectures. The device is designed for a broad range of wireless applications in the consumer, automotive and industrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, and PDAs. The device is available in a shielded LGA package (11.85 x 10.6 mm²) with 8x9 pads. Preliminary Product Overview 6 4/2004

Singlestone PBA 313 07 2.1 General Features General • Low power consumption, programmable Power down mode • Chip in advanced low power CMOS technology • External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 % • Extended temperature range – 40°C .. +85°C Interfaces • UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud) • PCM interface (slave- and master-mode; programmable PCM slot allocation) • JTAG • GPIO for control of external devices Digital-Section • Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance • Digital offset compensation and symbol synchronization / frame synchronization • GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and high- performance A/D-converter for RX-data • Digital part (Noise-shaper, Gaussian impulse filter) of Σ∆-Fractional-N-PLL • CVSD transcoder for voice conformant to BLUETOOTH wireless technology • A-law, u-Law and linear PCM also possible • Baseband and Linkmanager Firmware up to HCI in internal ROM 2 • 4 kbit E PROM for storing Bluetooth device data RF and Analog Section • Analog part of Σ∆-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phase detector and charge pump) on chip • Fully integrated and balanced VCO with integrated varactors and inductors. • On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - + 5 dBm in 1.5 dB steps) • Integrated LNA • Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additional external RF components • Chip-integrated supply voltage regulator for VCO • On module 26 MHz reference clock • On module voltage regulator for single supply voltage. • Typical sensitivity -83 dBm • Typical output power +2.5 dBm Software • Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chip- integrated ROM. • Infineon specific HCI+ commands to support enhanced features 2 • Configuration data (e.g. Bluetooth device address) are loaded from internal E PROM after reset. Optionally, configuration data may be provided by the host via HCI+ command. Package • LGA 9 x 8 pads Preliminary Product Overview 7 4/2004

Singlestone PBA 313 07 2.2 Block diagram Singlestone – PBA 313 07 EEPROM 2 IC Antenna UART HCI PMB8761 Bluemoon Balun Antenna Single Cellular Filter PCM Vsupply Voltage Regulator Low Power Clock 32.768 kHz Clock 26 MHz Figure 2-1: Block diagram of the PBA 313 07 Singlestone module 2.3 Typical application Bluetooth Module PBA 313 07 Singlestone CLK32 VSupply PCM UART Host application Figure 2-2: Typical application diagram Preliminary Product Overview 8 4/2004

Singlestone PBA 313 07 2.4 Mechanical dimension and pad arrangement Below shows the module’s pad layout. All dimensions are in mm. A B C D E F G H J 7 6 5 4 3 2 1 0 Figure 2-3 Mechanical dimensions, pad arrangement. Dimension min. typ. max. Unit Length 11.65 11.85 12.05 mm Width 10.40 10.6 10.80 mm Height 1.6 1.8 2.0 mm Table 2-1 Mechanical dimensions with tolerances Preliminary Product Overview 9 4/2004

Singlestone PBA 313 07 2.5 Module pin-out Table 2-2 represents the functional description of Singlestone’s connecting pads. Functionally non- used pads (NC) are used as sacrifice pads or test pads, and must not be connected in an application. Pin Location Symbol Input/ During After Function Comments Output Reset Reset D6 UARTIN I Tristate Tristate UART-Input E6 UARTOUT O Pull-Up Pull-Up UART-Output (Pull-Up controlled by FW) E5 UARTRTS O Pull-Down Pull-Down UART-Request to Send (Pull- Down/-Up controlled by FW) B5 UARTCTS I Tristate Tristate UART-Clear to Send D5 WAKEUP_HOST O Pull-Down Pull-Down Wake-up signal for host ) (Pull- Down controlled by FW) C2 PCMIN I Tristate Tristate PCM input D3 PCMOUT O Pull-Down Pull-Down PCM output (Pull-Down/-Up controlled by FW) B0 PCMFR I/O Pull-Down Pull-Down PCM frame (8kHz)(Pull-Down/-Up controlled by FW) C1 PCMCLK I/O Pull-Down Pull-Down PCM clock (>64kHz) (Pull-Down/- Up controlled by FW) C3 GPIO I/O Pull-Down Pull-Down General purpose Input/Output (Pull- (=GPIO0) Down/Up controlled by FW) G2 TRST I Pull-Down Pull-Down Test Reset (JTAG) B4 TCK I Input Input Test Clock (JTAG) C4 TMS I Pull-Up Pull-Up Test Mode Set (JTAG) D4 TDI I Pull-Up Pull-Up Test Data Input (JTAG) B3 TDO O Tristate Tristate Test Data Output (JTAG) F2 RESETQ I Pull-Up Pull-Up Reset line (0:reset, 1:active) F3 WAKEUP_BT I Input Input Wake-up signal from low power mode E2 CLK32 I Input Input 32.768 kHz clock input J5 ANT A RF input /output 50 ohms. F0 VSUPPLY S Power Supply G7 NC (VDD) Regulated supply voltage for test purposes. Important that is leaved NC. A0, A1, A4, A5 GND C5, C6 GND D1 GND E0, E1 GND E3, E4 GND F4, F5 GND G1, G6 GND H0, H4, H5, H6 GND J0, J4, J6 GND A2, A3 , A6, A7 NC B1, B2, B6, B7 NC C0, C7 NC D0, D2, D7 NC E7 NC F1, F6, F7 NC G0, G3, G4, G5, NC G7 H1, H2, H3, H7 NC J1, J2, J3, J7 NC Table 2-2 Module pin-out Preliminary Product Overview 10 4/2004

Singlestone PBA 313 07 2.6 Functional Block Diagram PCM Interface Loop Filter PMB8761 BlueMoon Single Cellular Impulse Par a Ser PCM- Shaping RF Frequency Interface Data- CRC/FEC Control Information Timers/ Synthesizer RAM/ RF-Interface (Analog part ofΣ∆- Baseband- Control- A/µ-Law Frame- Fractional-N-PLL) Control RAM Ser a Par Σ∆ Sync Fract.-N- (Buffers) CRC/FEC Symbol- PLL & CVSD Recov. Encryption Offset- Transmitter Demodulator Canc. Balun + Digital Baseband Antenna Section Switch filter Watch- Bluetooth Clocks Timer dog Link-Control/ Σ∆-Clocks-PLL Link-Manager/ Inter- LNA Ports I²C HCI-UART rupts UART Power management unit Receiver Digital Link Control Section Analog RF-Section Analog Baseband Section 2 I C- Interface E2 PROM 26 MHz XO UART GPIO JTAG WAKEUP 32.768 kHz VSUPPLY (3.0V – 4.75V) Figure 2-4: Singlestone PBA 313 07 Block diagram Preliminary Product Overview 11 4/2004

Singlestone PBA 313 07 2.7 System Integration and Applications 2.7.1 General description On the RF-side, Singlestone provides a 50 Ohm single-ended input/output to be directly connected to an external antenna. The design of the antenna is open to a broad spectrum (e.g. PCB antenna, ceramic antenna, external antenna) and can be optimized to the target application requirements. The HCI-interface is implemented as a full-duplex UART port which can be configured to be used in 2- line or 4-line mode (with or without hardware handshake). If hardware handshake is not used then the UARTCTS pin must be grounded. The PCM interface is able to serve one Bluetooth SCO channel for voice data. Optionally, SCO channels may be linked to the host via the HCI-UART interface. Both the UART- and PCM-interfaces are assigned to the regulated voltage (2.7V) powered by VSUPPLY. VSUPPLY must be in the range of 3.0 to 4.75 V. General purpose input/output lines (GPIOs) can be controlled via HCI+ commands. 2 Configuration data (e.g. Bluetooth device address) are loaded from internal E PROM after reset. Optionally, configuration data may be provided by the host via HCI+ commands. Preliminary Product Overview 12 4/2004

Singlestone PBA 313 07 3 Electrical Specifications 3.1 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. Parameter Limit values Unit min. max. VSUPPLY Supply voltage range -0.3 6.0 V VI Input Voltage Range -0.3 3.75 V VO Output Voltage Range 0.3 3.0 V IIN Input Current - 10 10 mA ESD integrity according to MIL-STD883D 1 kV Method 3015.7 TStorage Maximum storage temperature range -40 125 °C Table 3-1: Absolute maximum ratings Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to conditions beyond those indicated in the recommended operational conditions of this specification may affect device reliability. This is a stress rating only and functional operation of the device under these conditions or at any other condition beyond those indicated in the operational conditions of this specification is not implied. 3.2 Operating conditions Unless otherwise stated, the following characteristics apply operating conditions. Parameter min. typ. max. Remarks Temperature -40°C +25°C +85°C VSUPPLY 3.0V 3.3V 4.75V Table 3-2 Operating Conditions 3.3 Latch-up immunity Latch-up immunity is guaranteed in accordance with JEDEC-standard No. 17, EIA Jedec JC-40.2. 3.4 Quality For quality and reliability conditions se 105 63-PBA31301+ Uen. Preliminary Product Overview 13 4/2004

Singlestone PBA 313 07 3.5 Capacitance T = 25°C Symbol Parameter Limit Values min. max. Unit CIN input capacitance - 10 pF COUT output capacitance - 15 pF CIO I/O - 20 pF Table 3-3: Capacitance 3.6 Current consumption Regulator input voltage: VSUPPLY = 3.0..4.75V # Bluetooth mode Average Consumption Unit Test Conditions min. typ. max. 1 HV3 32 40 mA ACL link in sniff mode with max. interval 2 WSE 0x02 2.2 3.5 mA 1.28 s scan interval, 11.25 ms scan, no interlaced scan 3 WSE 0x03 3.0 4 mA 1.28 s scan interval, 2*11.25 ms scan, no interlaced scan 4 Sniff mode 2 3 mA 2.00 s sniff interval, sniff attempt = 1, sniff timeout = 0 Table 3-4: Average current for some Bluetooth modes. WSE means after HCI_Write_Scan_Enable. Preliminary Product Overview 14 4/2004

Singlestone PBA 313 07 3.7 DC Characteristics of Digital Part VSUPPLY = 3.0V..4.75V. Maximum allowed input levels are from -0.3V to 3.0V. Higher voltages up to 3.6V can be applied at UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST, TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT. Symbol Parameter Test Condition Limit Values Unit Min typ max Pins: PCMCLK, PCMFR, PCMIN, UARTIN, UARTCTS, GPIO0 V IN LOW Input low voltage - - 0.81 V V IN HIGH Input high voltage - 1.89 - V Pins: PCMCLK, PCMFR, PCMOUT, UARTOUT, UARTRTS, GPIO0 V OUT LOW Output low voltage IOL =2.4mA - - 0.68 V V OUT LOW Output low voltage IOL =100µA - - 0.27 V V OUT HIGH Output high voltage IOH=-2.4mA 2.02 - - V V OUT HIGH Output high voltage IOH=-100µA 2.43 - - V Pins: WAKEUP_HOST V OUT LOW Output low voltage IOL =100µA - - 0.27 V V OUT HIGH Output high voltage IOH=-100µA 2.43 - - V Pins: TRST, TCK, TMS, TDI V IN LOW Input low voltage - - 0.81 V V IN HIGH Input high voltage - 1.89 - V Pin: TDO V OUT LOW Output low voltage IOL =2.4mA - 0.35 V V OUT LOW Output low voltage IOL =100µA - 0.15 V V OUT HIGH Output high voltage IOH=-2.4mA 2.2 - V V OUT HIGH Output high voltage IOH=-100µA 2.6 - V Pin: WAKEUP_BT, CLK32 V ILOSC Input low voltage - - 0.4 V V IHOSC Input high voltage - 2.0 - V Pin: RESETQ V IN LOW Input low voltage - - 0.35 V V IN HIGH Input high voltage - 2.5 - V Table 3-5: DC characteristics of digital part max. Load Capacitance Rise/Fall Time (for measurement of (during test) DC characteristics) PCMOUT 30 pF 30 ns PCMCLK 30 pF 30 ns PCMFRM 30 pF 30 ns Table 3-6: Pin characteristics Symbol Parameter Limit Unit Test Condition Values min typ max ILI Input leakage current - - 1 µA 0V<V IN<2.7V ILO Output leakage current - - 1 µA 0V<V OUT <2.7V ILI, H Input leakage current for 3.6V - - 1 µA 0V<V IN<3.6V tolerant pins* ILO, H Output leakage current for UART - - 1 µA 0V<V OUT <2.7V and PCM domain pins Table 3-7: Leakage currents * The following pins are 3.6 V tolerant: UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST, TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT Preliminary Product Overview 15 4/2004

Singlestone PBA 313 07 Pull-Up and Pull-Down Values Symbol Pull-Up Pull-Down Unit Test Condition min typ max min typ max UARTRTS 100 160 230 100 150 200 µA UARTOUT 100 160 230 100 150 200 µA WAKEUP_HOST 100 160 230 100 140 200 µA PCMOUT 100 160 230 100 140 200 µA PCMFR 100 160 230 100 140 200 µA PCMCLK 100 160 230 100 140 200 µA GPIO0 40 100 200 30 90 170 µA Table 3-8: Pull-Up / Pull-Down characteristics 3.7.1 Pull Up characteristics on ResetQ The ResetQ signal is pulled up to Vdd. In order for the chip to start up properly at power up the pull up is delayed. Below is a table stating the delay from applying a stable Vsupply to the module until the ResetQ goes high. Parameter Limit Unit Test Condition Values min typ max Delay pull up of ResetQ 26 50 µs Pull-up current ResetQ 270 500 µA 3.8 Operational Range for RF part Within the operational range the module operates as described in the circuit description. The AC/DC characteristic limits are not guaranteed. Note: Power levels refer to 50Ω impedance # Parameter Symbol Limit values Unit Remarks min. max. 1 RF input level PRFIN 10 dBm 2 RF input frequency fRFIN 2500 MHz 3 Ambient temperature TA -40 +85 °C Table 3-9: Operational range for the RF part 3.9 AC/DC Characteristics of RF part AC/DC characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. Typical values are the median of the production. Preliminary Product Overview 16 4/2004

Singlestone PBA 313 07 3.9.1 Transmitter Characteristics # Parameter Symbol Limit values Unit Test min. typ. max. Conditions 1 Output power -3.0 1.0 4.5 dBm 2 Output power -1.0 1.0 4 dBm T=25°C 3 Frequency deviation f dev 140 158 175 kHz (00001111 sequence) 4 Frequency deviation f dev 115 140 175 kHz (0101 sequence) 5 Relative frequency f dev,0101 /f dev,00001111 0.8 0.95 deviation (0101 sequence) 6 In-band spurious -20 dBc @ 500kHz emissions offset* -20 dBm @ 2MHz offset* -40 dBm @ 3MHz offset* 7 Out of band spurious -36 dBm 30MHz -1GHz emission -30 dBm 1 - 12.75 GHz -47 dBm 1.8 - 1.9 GHz -47 dBm 5.15 -5.3 GHz *measurement method corresponding to Bluetooth test specification Table 3-10: Transmitter characteristics 3.9.2 RSSI # Parameter Symbol Limit values Unit Test min. typ. max. Conditions 1 Linear response lower limit -90 -80 dBm 2 Linear response upper limit -40 dBm Table 3-11: RSSI Preliminary Product Overview 17 4/2004

Singlestone PBA 313 07 3.9.3 Receiver Characteristics # Parameter Range/Location Limit values Unit Test Conditions min. typ. max. -3 1 Sensitivity (BER=10 ) -85 -75 dBm According to Bluetooth spec. -3 2 Sensitivity (BER=10 ) -85 -81 dBm T=25°C, nominal transmitter 3 Interference Y=M -71 -68 dBm frequency deviation performance Y=M±1 -60 -58 dBm 160kHz for wanted -3 (BER=10 ) Y=M-2 -30 -23 dBm (M) and interferer (Y), Y=M+2 -51 -43 dBm level wanted (image) –60dBm measured at antenna input Y=M-3 -27 -25 dBm frequency deviation Y=M+3 -47 -36 dBm 160kHz for wanted (adj. Image) (M) and interferer (Y), Y= any other -27 -22 dBm Bluetooth channel level wanted –67dBm measured at antenna input 4 a) Out of band 30MHz≤f≤2GHz 5 8 dBm frequency deviation -3 blocking (BER=10 ) 2GHz≤f≤2.4GHz -27 dBm 160kHz for wanted, 2.5GHz≤f≤3GHz -27 dBm unmodulated 3GHz≤f≤5GHz 5 8 dBm interferer, level 5GHz≤f≤12.75GHz -10 dBm wanted –67dBm, not at VCO frequency and mixing products of :3/2, measured at antenna input c) Exceptions for LO 1/3 fout 0 5 dBm spurious (based on 1/2 fout -10 0 dBm measurements on 1785MHz<f<1850MHz -10 0 dBm golden board) 2 fout -10 0 dBm 5 Intermodulation -39 -34 dBm frequency deviation performance 160kHz for wanted -3 (BER=10 ) (N), level –64dBm; interferer (N+5) unmodulated, frequency deviation 160kHz for interferer (N+10), measured at antenna input 6 Spurious Emission 30 MHz - 1 GHz -57 dBm 1 - 12.75 GHz -47 dBm Table 3-12: Receiver characteristics (including Digital Demodulator and PAM-Receiver) 3.10 Characteristics of externally supplied 32.768kHz clock signal The 32.768kHz clock signal applied to CLK32 has to be a rectangular waveform with a duty cycle of 10% up to 90%. The frequency accuracy has to be better than 250ppm. The rise time and fall time of the 32.768kHz signal must be below 10µs. The amplitude must satisfy the requirements in Table 3-5. Preliminary Product Overview 18 4/2004

Singlestone PBA 313 07 4 Assembly and design guidelines 4.1 General description of the module Singlestone is a Land Grid Array (LGA 8x9) module made for surface mounting. The pad diameter is 0.8 mm and the pitch 1.27 mm. All solder joints on the module will reflow during soldering on the mother board. All components and shield will stay in place due to wetting force. Surface treatment on the module pads is Nickel /Gold. Figure 1 shows the pad layout on the module, Seen from component side. Figure 4-1 Pad layout on the module (top view) 4.2 Printed Circuit Board design The land pattern on the PCB shall be according to the land pattern on the module, which means that the diameter of the LGA pads on the PCB shall be 0.8 mm. It is recommended that each pad on the PCB shall be surrounded by a solder mask clearance of about 75 µm to avoid overlapping solder mask and pad. The solder pads must have wetability to eutectic solder. Electroless Ni/Au plating or OSP (Organic Surface Protection) is a common surface finish and is suitable for assembly. 4.3 Solder paste printing The solder paste deposited on the PCB by stencil printing has to be of eutectic or near eutectic tin lead composition (e.g. 63Sn37Pb or 62Sn36Pb2Ag). A no-clean solder paste is preferred, because cleaning of the solder joints which are under the module is difficult. Preferred thickness of the solder paste stencil is 100 - 127 µm (4 - 5 mils). The apertures on the solder paste stencil shall be of the same size as the pads, 0.8 mm. Preliminary Product Overview 19 4/2004

Singlestone PBA 313 07 4.4 Assembly 4.4.1 Component placement In order to assure a high yield soldering process good placement on the PCB is necessary. As a rule of thumb the tolerable misplacement is 150 µm. This means that the Singlestone module can be assembled with a variety of placement systems. The recommendation is to pick and place the module with a nozzle in the centre of the shield. The nozzle diameter shall not be bigger than 4 mm. 4.4.2 Pin mark Pin 1 (A0) is marked on bottom footprint and on the top of the shield on the module according to fig 2a-b. Diameter of pin 1 mark on the shield is 0.40 mm. Pin 1 mark 0,92 Figure 2a: Top view Figure 2b: Bottom viewPin 1 mark mark 0,92 Figure 4-2 Pin mark Preliminary Product Overview 20 4/2004

Singlestone PBA 313 07 4.5 Soldering profile Generally all standard reflow soldering processes (vapour phase, convection, infra red) and typical temperature profiles used for surface mount devices are suitable for the Singlestone module. Wave soldering is not possible. Figure 4-3 shows an example of a suitable solder reflow profile. Figure 4-3 : Eutectic Sn/Pb-Solder Profile Singlestone shall be handled according to MSL3, which means a floor life of 168 h in 30°C/60% r.h. 4.6 Antenna The antenna output routing should be 50 W (VSWR ≤ 2:1) all the way to the antenna in order to maintain the radio performance listed in this data sheet. For the routing underneath the module, the modules ground plane should be considered. The type approval for FCC and R&TTE have been done with an antenna gain of 1.6dBi. 4.7 Shielding / EMC requirements The module has its own RF shielding and is approved according to the standards by FCC and R&TTE. If the approval number is not visible on the outside when the module is utilised in the final product, an exterior label must state that there is a transmitter module inside the product (see Section 5.2). 4.8 Safety In the R&TTE directives there are safety requirements for high voltage applications. For complying with the R&TTE security requirements regarding usage in high voltage equipment, using 230V supply, the device shall be mounted un-resolvable or it needs to be ensured that it cannot cause a short circuit. Preliminary Product Overview 21 4/2004

Singlestone PBA 313 07 5 Type approvals and Qualification 5.1 Bluetooth Qualification The PBA 31307 is Bluetooth Qualified according to specification v1.1 with the ID: PBA31307. The covered functionality of this listing covers RF, Baseband and Link Manager. Since the PBA 31307 constitute a complete Bluetooth system, the pre-testing, listings and qualifications can be reused by reference by the end-customer. Please refer to the application note “PBA 31307 Bluetooth Qualification & Type Approval” for the details on the procedure to re-using the BT-qualification. 5.2 FCC Modular Approval This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The modular transmitter is labeled with its own FCC ID number, but, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. The exterior label can use wording such as the following: “Contains Transmitter Module FCC ID Q2331307” or “Contains FCC ID Q2331307”. Any similar wording that expresses the same meaning may be used. When reusing the Modular Approval, antenna related measurements might need to be redone. The antenna used for modular approval was a max 1.6dBi half-wave antenna from gigAnt (PCB Swivel 6076019). When using an other antenna a class II permissive change will be needed. For further details on the procedure for re-using the FCC type approval, please refer to the application note “PBA 31307 Bluetooth Qualification & Type Approval”. 5.3 R&TTE Approval This device complies with the requirements in the European Union and EFTA according to the following test specifications: EN 300 328 EN 301 489 -1/17 The R&TTE approval for the PBA31307 - device is valid in the following countries: Austria, Belgium, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. The notification time for these countries to request additional testing and/or documentation are 4 weeks. Preliminary Product Overview 22 4/2004

Singlestone PBA 313 07 6 Module marking Marking Description Infineon logotype 1, 2. <PBA 313 07 Product number with suffix and revision state according to R1A> purchase order. 3. <bbbbbb> Batch number 4. <XX> Type of module: Engineering Samples, XX=ES 5. <yyww2> Manufacturing year (yy), week (ww) and factory code (2) 6. <FCC ID Q23 FCC Identification number 31307> Bluetooth logotype. 7 CE marking 8. Table 6-1 Figure 6-1 Marking example Preliminary Product Overview 23 4/2004

Singlestone PBA 313 07 7 Package Singlestone is packed in tape on reel according to Figure 7-1. The tape is also the module dry pack as referred to in chapter 4.5. Figure 7-1 Tape on reel for Singlestone Preliminary Product Overview 24 4/2004

Singlestone PBA 313 07 8 References 1. T8761-XV01D12 -7600 Preliminary Data Sheet PMB 8761 Preliminary Product Overview 25 4/2004


Document Created: 2019-06-15 15:00:15
Document Modified: 2019-06-15 15:00:15
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