Label and Label Location

FCC ID: P53-EMW3162

ID Label/Location Info

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FCCID_2144108

13/08/21 Taim 1 13/11/05 Delete Japan Logo and Update CE Logo Taim Notes: A:CE 2200 CE 2200 ---- Fixed B:FCC ID:P53-EMW3162 D:MXCHIP E:MO-VVSS MO:工單號 500.01467.035 15*15mm VV:為工程版本（參考製造文件封面Foxconn Label Rev.欄位） SS:為文件版本（參考製造文件封面Doc Rev之主版本） F:XXXXXXXXXXXX-EMW3162-XXX XXXXXXXXXXXX:12digital,MAC ID :Customer provide MAC ID range,confirm with PM. (one MAC per product) EMW3162:7digital,Customer PN XXX:Date Code(refer to the attachment) 15 A 11 FCC ID:P53-EMW3162 MXCHIP All font:TRIUMVIRATE COND， height 0.8mm 15 Scannable: B FCC ID:P53-EMW3162 MXCHIP D C:XXXXXXXXXXXX-EMW3162-XXX 11 2D barcode XXXXXXXXXXXX F C Vendor provide DATAMATRIX, 5 dots Columns&Rows 20*20 -EMW3162 -XXX E MO-VVSS Label stick position: 標籤製作黏貼方式/T77H497.00/04/1 of 4 XF581 v MAC ID label T77H497.00 500.01467.035 Taim Sunny

Tray ID label Foxconn PN: 503.00090.005, size: 45*8mm 45 8 TFYWWSSSS H uman readable: TFYWWSSSS Font: TRIUMVIRATE COND.(打印機自帶字體），height：6pt Scannable: 1. Barcode type: code128 2. Barcode height: 2.96mm 3. Barcode content: TFYWWSSSS T---Tray F--- ａ地代 （參照最後一頁附件） Y---西元年最後一碼 WW---生產周別 SSSS---流水號四碼，36進制，隔周reset為0001 具體黏貼位置請參考組立圖及包裝出貨方式， 貼於tray有缺口一側 Panel label 503.00039.015 (19.05*5mm) 19.05 5 PFYMDSSSSS P:PCB label F:Foxconn 產地 YMD:Year,month,day（refer to attachm ent of the last page） SSSSS:序列號（00000-zzzzz） Barcode:128 code, 2.54mm height, Font:Verdana,Bold,2pt label 黏貼位置: panel label 標籤製作黏貼方式/T77H497.00/04/2 of 4

Carton label & Antistatic label:P/N:503.00098.005 A Antistatic label 粘貼位置： M/O: XXXXXXXX Qty : XXX B 50mm Hon Hai P/N: T77H497.00 REV: VVSS C Carton ID: CIPPYWWXXXX D Remark: 100mm M/O: XXXXXXXX Qty : XXX Hon Hai P/N: T77H374.00 REV: VVSS Carton ID: CIPPYWWXXXX Remark: heat seal carton label粘貼位置請參照組立圖及包裝出貨方式 A.XXXXXXXX: the Foxconn MO(工單號) B.Qty : XXX XXX:the quantity of product in carton(carton內裝的產品數量) Barcode content:the quantity of product in carton(carton內裝的產品數量) C.REV:VVSS VV:the engineering version(refer to Foxconn label Rev column in the cover of the MFG document) VV為工程版本（參見製造文件封面Foxconn Label Rev.欄位） SS:the version of A300/A400 product(refer to Doc Rev.in the cover of MFG document) SS為A300/A400產品之版本（參見製造文件封面Doc Rev.之主版本） D.CIPPYWWXXXX C+ production location + production line + production year + production week + Serial Number(Base on 36) C: carton I: production location(refer to attachment of the last page) PP:Production line YWW: Production year & production week. XXXX:Serial number(Base on 36,every two week reset to 0001) Pallet label:P/N:503.00089.005 P/N:T77H497.00 36mm PIPPYWWXXXX REV:VVSS 110mm Follow Foxconn standard PIPPYWWXXXX: P+ production location + production line + production year + production week + Serial Number(Base on 36) P: Pallet I: Production location(refer to attachment of the last page) PP: production line Y: the last digital of production year WW: production week XXXX: Serial number(Base on 36,every two week reset to 0001) VVSS: VV: the engineering version (refer to Foxconn label Rev column in the cover of the MFG document) SS: the version of A300/A400 product (refer to Doc Rev.in the cover of MFG document) 標籤製作黏貼方式/T77H497.00/04/3 of 4

1.Date code define 1 s t C harac ter Y ear C odes Y ear 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 S o on C ode 6 7 8 9 0 1 2 3 4 5 2 nd C haracter Month codes Month J anuary F ebruary March April May J une J uly August S eptember O ctober November December C ode 1 2 3 4 5 6 7 8 9 A B C 3 rd C haracter Day C odes st nd rd th th th th th th th th th th th th th th th th Day 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 C ode 1 2 3 4 5 6 7 8 9 A B C D E F G H I J th st nd rd th th th th th th th st Day 20 21 22 23 24 25 26 27 28 29 30 31 C ode K L M N O P Q R S T U V 產地編碼明細 LOCATION LOCATIONNAME 0 新竹 1 中山 2 褔田 3 土城 4 泰詠 5 精陽 6 廣川 7 台表 8 宏鉅 9 新進 A 香港 B 國璉 C 重慶CBT D FOR DUMMY E 上海 F 龍華E5資料庫 G 龍華E5A資料庫 H 龍華E6資料庫 I 保留 J 保留 K 南寧 L 環電 M EASTAR N 龍華CBT O 保留 P 龍華CPEI RMA Q 重慶CPEI R 上海RMA S CPEII T 煙台（Sony機種） U 越南桂武CMB V 煙台（任天堂機種） Y 越南黃田 Z 越南桂武CPEII 標籤製作黏貼方式/T77H497.00/04/4 of 4


Document Created: 2013-11-13 19:41:38
Document Modified: 2013-11-13 19:41:38
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