User Manual

FCC ID: P53-EMW3072

Users Manual

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FCCID_4429184

                                                  EMW3072
    Datasheet
                                                                                      Embedded Wi-Fi Module

                        Version:1.2                  Date:2019-07-28                       Number:DS0151EN



                                                     Abstract
                                                           Application

Characteristic                                                 ⚫    Intelligent Lighting

    ⚫ Supports 802.11b/g/n standard, integrates                ⚫    Smart Home/Home Appliances
    ARM-CM4F, WLAN MAC/Baseband/RF.                            ⚫    Industrial Automation
    ⚫    Contains 256KB RAM/2MB FLASH                          ⚫    Intelligent Security
    ⚫    Operation voltage:DC 3.3V

    ⚫ 20MHz Bandwidth with maximum data rate               Module Type
    at 65Mbps
                                                                     Type                   Description

                                                                   EMW3072                 PCB Antenna


    ⚫    Wi-Fi connectivity

         ▪   Support 802.11b/g/n_ HT-20 standard,          Hardware Block
         and HT-40

         ▪  Support Station, Soft AP, Station+Soft
         AP

         ▪   Support EasyLink,Alink,Joinlink



    ⚫    PCB Antenna

    ⚫    Operation temperature:-30℃ to +105℃


                                Datasheet                                         [Page 1]


Version Record
        Data       Version                              Update Note

      2019-05-20     1.0     Initial version

                             Revise supply voltage to 3.3V.

                             PWM9 in pin13 function table is corrected to PWM0,
      2019-05-30     1.1
                             PIN14 is removed as the annotation of PWM1.

                             Definition of Pin2 is changed to PWM1 and revised.

      2019-07-30     1.2     Increase FCC and IC information




                                 EMW3072


                                                                                    Datasheet                                                                                [Page 2]


                                                                                 Catalogue
Abstract ................................................................................................................................................................................. 1
Version Record...................................................................................................................................................................... 1
1.     Product Introduction.................................................................................................................................................... 4
              EMW3072 Label Information ........................................................................................................................... 5
                    Pin Arrangement ................................................................................................................................................ 5
                    Pin Definition .................................................................................................................................................... 7
                   1.3.1        EMW3072 Package Definition ............................................................................................................. 7
                   1.3.2        EMW3072 Pin Definition ..................................................................................................................... 7
2.     Electrical Parameters ................................................................................................................................................... 9
               Operating Ratings .............................................................................................................................................. 9
                    Power Consumption .......................................................................................................................................... 9
                    Operation Conditions ...................................................................................................................................... 10
                    ESD Parameters ............................................................................................................................................... 10
3.     RF Parameters ............................................................................................................................................................ 11
             Basic RF Parameters ....................................................................................................................................... 11
                    TX Performance .............................................................................................................................................. 11
                   3.2.1 IEEE802.11bMode Tx Parameters ..................................................................................................... 11
                   3.2.2 IEEE802.11g mode TX Performance ................................................................................................. 12
                   3.2.3 IEEE802.11n-HT Mode TX Performance .......................................................................................... 13
                    RX Performance .............................................................................................................................................. 13
                   3.3.1        IEEE802.11b Mode RX Performance................................................................................................. 13
                   3.3.2        IEEE802.11g. Mode RX Performance................................................................................................ 14
                   3.3.3        IEEE802.11n HT20 Mode RX Performance ...................................................................................... 14
                   3.3.4        IEEE802.11n HT40 Mode RX Performance ...................................................................................... 14
                   3.3.5        OTA Performance ............................................................................................................................... 14
4.     Antenna Information ................................................................................................................................................. 15
             Antenna Type................................................................................................................................................... 15
                    PCB Antenna Forbidden Area ......................................................................................................................... 15
5.     Production Instruction ............................................................................................................................................... 17
              Production Guidelines ..................................................................................................................................... 17
                    The matters need attention .............................................................................................................................. 18
                    Storage Condition ............................................................................................................................................ 19
                    Recommended Reflow Profile ........................................................................................................................ 20
6.     Reference Circuit ........................................................................................................................................................ 21
7.     FCC and IC Information ........................................................................................................................................... 23
             FCC Warning ................................................................................................................................................... 23
                    IC warning ....................................................................................................................................................... 23
8.     Module MOQ and packaging information .............................................................................................................. 25
9.     Sales Information and Technical Support ................................................................................................................ 26




                                                                                     EMW3072


                                                                     Datasheet                                                                    [Page 3]


Figure Catalogue
   Figure 1 EMW3072 Hardware Block and Interface ........................................................................................ 4
   Figure 2 EMW3072 label picture.................................................................................................................... 5
   Figure 3 Stamp Hole Packaging Dimension Diagram ..................................................................................... 6
   Figure 4 EMW3072 Packaging Definition Diagram ........................................................................................ 7
   Figure 5 EMW3072 Drawings...................................................................................................................... 15
   Figure 6 PCB Minimum clearance area of antenna(Unit: mm) ................................................................. 16
   Figure 7 Humility Card ................................................................................................................................ 17
   Figure 8 Storage Condition ........................................................................................................................... 19
   Figure 9 Temperature Curve Reference ......................................................................................................... 20
   Figure 10 Power Reference Circuit ............................................................................................................... 21
   Figure 11 USB to UART Reference Circuit .................................................................................................. 21
   Figure 12 EMW3072 External Interface Reference Design ........................................................................... 21
   Figure 13 3.3V UART- 5V UART Conversion Reference Circuit .................................................................. 22




Table Catalogue
   Table 1 EMW3072 pin definition ................................................................................................................... 7
   Table 2 Input voltage range ............................................................................................................................ 9
   Table 3 Absolute Maximum Ratings ............................................................................................................... 9
   Table 4 Power Consumption Parameters ......................................................................................................... 9
   Table 5 Temperature and Humidity conditions .............................................................................................. 10
   Table 6 ESD Parameters ............................................................................................................................... 10
   Table 7 RF Standard ......................................................................................................................................11
   Table 8 IEEE 802.11b Mode CCK_11 Tx Parameters ....................................................................................11
   Table 9 IEEE802.11g Mode OFDM_54 TX Performance Parameters............................................................ 12
   Table 10 IEEE802.11n-HT 20MHz Mode MCS7 TX Performance ............................................................... 13
   Table 12 PCB Antenna ................................................................................................................................. 15
   Table 13 Module MOQ and packaging information ...................................................................................... 25




                                                                     EMW3072


                                                Datasheet                                          [Page 4]

1. Product Introduction
EMW3072 is a cost-effective embedded W-Fi module launched by Shanghai Qingke (MXCHIP). It is highly
integrated with ARM CM4F, WLAN MAC/Baseband/RF, with a maximum main frequency of 240MHz, built-in
256KB SRAM, 2M FLASH and 3.3V single power supply.

The following diagram is the hardware block diagram of EMW3072 module, which mainly includes four parts:

    ⚫    CM4F main core

    ⚫    WLAN MAC/BB/RF/ANT

    ⚫    SWD debugging

    ⚫    Power management

    Among them:

    1.   ARM CM4F CPU,working frequency up to 240MHz, internal integration 256K SRAM, 2MB FLASH,
    support high-speed UART, I2C, SPI, PWM, and multiple GPIO ports.

    2.   Extra-chip SPI Flash with maximum support of 128MB for custom firmware development.

    3.   Supporting PCB antenna and IPEX external antenna

    4.   Input typical voltage: DC 3.3V




                                 Figure 1 EMW3072 Hardware Block and Interface




                                                 EMW3072


                                                      Datasheet                                               [Page 5]

     EMW3072 Label Information




                                             Figure 2 EMW3072 label picture

  Label Information:

     CMIIT ID: XXXXXXXXXXXXX, SRRC Authentication ID.

     FCC ID: P53-XXXXXXXX, FCC Authentication ID.

     MXCHIP: Company Logo.

     EMW3072 : Module Main Model.

     D0BAE45000DF: MAC Address(Each module has a unique MAC address).

     X1916:Production batch.

     0000.0000.A213: Module Firmware Serial Number.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.




     Pin Arrangement
EMW3072 adopts the design scheme of stamp hole. The packaging design of stamp hole (as shown in Figure 3 Stamp
Hole Packaging Dimension Diagram) is convenient for customers to debug and disassemble.

The size of welding pad and window is the same. SMT suggests that the thickness of steel mesh be 0.12mm-0.14mm.




                                                      EMW3072


               Datasheet                          [Page 6]




Figure 3 Stamp Hole Packaging Dimension Diagram

                  TOP VIEW




                EMW3072


                                                  Datasheet                                    [Page 7]

         Pin Definition

     1.3.1     EMW3072 Package Definition




                                   Figure 4 EMW3072 Packaging Definition Diagram


     1.3.2     EMW3072 Pin Definition
                                          Table 1 EMW3072 pin definition

                                                                                           FUNCTION6
引 脚                      FUNCTION2          FUNCTION3          FUNCTION4      FUNCTION5
         FUNCTION1                                                                            GPIO
号                        SDIO                  UART               PWM            SPI

 1     RESET

 2                    SDIO_CMD           UART0_TXD            PWM0           ADC1         GPIO_4
       SWD_CLK

 3     ELINK                             UART2_RXD                           SPI2_SCK     GPIO_13


 4     SWD_DIO        SDIO_CLK                                PWM2           ADC2         GPIO_5

 5                    SDIO_INT           UART2_RTS            PWM3           SPI2_MOSI    GPIO_11

 6     ADC3           SDIO_DATA0         UART0_CTS            PWM4           SPI0_CSN     GPIO_6

 7     ADC4           SDIO_DATA1         UART0_RTS            PWM6           SPI0_SCK     GPIO_7

 8     VDD33

 9     GND




                                                  EMW3072


                                                                   Datasheet                                                         [Page 8]

10      I2C0_SDA             SDIO_INT                  UART1_RXD                                        SPI1_MOSI            GPIO_3

11      I2C0_SCL                                       UART1_TXD                                        SPI1_MISO            GPIO_2

12      I2C0_SDA             SDIO_INT                  UART1_RXD                                        SPI1_MOSI            GPIO_3

13      STRAP/SEL1                                     UART1_CTS                PWM0                    SPI2_SCK             GPIO_14

14      MODE_SEL3               ADC7                   UART1_CTS                PWM1                    SPI2_SCK             GPIO_10

15                                                     UART0_RXD                PWM7                    SPI1_SCK             GPIO_1
        SWD

16      SWC                                            UART0_TXD                PWM5                    SPI1_CSN             GPIO_0

17      BOOT                                           UART2_TXD                                        SPI2_CSN             GPIO_12

18      PAD_SEL

     Description:

     (1) PIN 17 pin is used by BOOT by default, PIN 3 pin is used by EASYLINK, PIN 21/22 pin is used by debugging log information
     output. Please try not to use it in hardware design. If you want to use it, please contact our engineer to confirm.

     (2) PIN11/12 pin must be High level while it’s power on, and it can be pull-up by externally connecting with 100k resistance. Please
     pay special attention to the design of the circuit.

     (3) In order to enable pins, CHIP_EN pulls down the resettable module and then pulls up the resettable module. If not used, it can
     remain suspended or pull up 3.3V at 10K.

     (4) PIN11/12 can be internal 100k weak pull-up, please allocate related peripheral devices reasonably.

     (5) PIN18 can be used to choose PAD mode, which is raised when burning, and floating usually.

     (6) Other non-pins can be kept in suspension. It should be noted that IO port is a floating state at startup. This is true from the
     beginning of ROM code. It can be pulled up and down in boot code as soon as possible, and the time it takes will be affected by flash.
     Therefore, if the module needs to be in the level state determined by module at startup, it needs to be added to the outside that less than
     100k resistor pulled up and down to stabilize the level. As shown in the figure below, when the module is started, the level of the IO
     port, which is configured to be very low, is changed when the floating state is pulled up by an external 100K resistor.




                                                                    EMW3072


                                                            Datasheet                                                        [Page 9]

2. Electrical Parameters

    Operating Ratings
  Be noticed that when the input voltage is lower than the minimum rated voltage, EMW3072 may work abnormally.

  Please pay attention while designing power circuit.

                                                       Table 2 Input voltage range

                                                                                              Detail
   Symbol          Description         Condition
                                                                  Min.                 Typ.                Max.              Unit


    VDD           Power supply                                     3.0                 VDD              Power supply           V


Voltage exceeding maximum ratings will cause hardware damage to the module and working at the maximum ratings
for a long time will affect the reliability of the module.

                                               Table 3 Absolute Maximum Ratings

      Symbol                                    Description                                   Min.              Typ.           Unit

        VDD                                     Power supply                                   –0.3               3.6              V

        VIN                               Input voltage of GPIOs                               −0.3               3.6              V


      Power Consumption
    Test temperature:room temperature

    Test distance:20~50cm

                                              Table 4 Power Consumption Parameters

                                    Circuit
        Mode                                                                              Description
                          Average         Maximum

      Run mode               10.2               10.6          Wi-Fi RF is off, MCU is running in Task State

                                                              Wi-Fi RF is off, MCU is in Idle state,system automatically enters
      Idle mode              7.6                 8.2
                                                              low power mode

                                                              Wi-Fi is in connection state, sending broadcast packet state (data
   Station Tx Power        57.8mA             212.5mA
                                                              interval 10ms)

                                                              Wi-Fi is in connection state, receiving broadcast packet state (data
   Station Rx Power        55.9mA              92.7mA
                                                              interval 10ms)

     Station Tx Rx                                            Wi-Fi is in connection state, TCP/IP data is in sending and
                           52.1mA             191.5mA
        Power                                                 receiving status (data interval 10ms)

     SoftAP mode           59.2mA             180.8mA         Wi-Fi start SoftAP mode and connect devices



                                                            EMW3072


                                                  Datasheet                                                     [Page 10]

   Power Save
                      12.4mA            58.3mA       Wi-Fi is in connection state, MCU is in idle state
    mode(Idle)

  Monitor mode        56.5mA            59.3mA       Wi-Fi start monitor mode


Notice: the power consumption data may be different in different firmware. MAX working circuit is 290mA.


  Operation Conditions
                                  Table 5 Temperature and Humidity conditions

    Symbol                                    Name                                          Range                 Unit

      TSTG                              Storage Temperature                                -40 to +85              ℃

       TA                              Operating Temperature                               -20 to +85              ℃

    Humidity                    Non-condensing, relative humidity                             <95                  %


  ESD Parameters
                                               Table 6 ESD Parameters

   Symbol               Name                           Spec                        Rank               Max.         Unit
                  Electronics Static
                     Discharge                     TA= +25 °C
  VESD(HBM)        (Human Body                                                        2                 2000
                                                   JESD22-A114
                      Model)
                                                                                                                       V
                  Electronics Static
                     Discharge                     TA = +25 °C
  VESD(CDM)        (Charge Device                                                     II                  500
                                                   JESD22-C101
                      Model)




                                                    EMW3072


                                                       Datasheet                                                  [Page 11]

3. RF Parameters

    Basic RF Parameters
                                                       Table 7 RF Standard

                    Item                                                      Description
        Frequency Range                    2412~2.462MHz

        Wi-Fi Wireless Standard            IEEE802.11b/g/n

                                           11b: DBPSK, DQPSK,CCK for DSSS
        Modulation Mode                    11g: BPSK, QPSK, 16QAM, 64QAM for OFDM

                                           11n: MCS0~7,OFDM
                                          11b:1,2,5.5 和 11Mbps

        Data Rate           20MHz         11g : 6,9,12,18,24,36,48,54Mbps

                                          11n : MCS0~7,65Mbps


   Antenna Type                           PCB antenna (Default)



    TX Performance                         11g: BPSK, QPSK, 16QAM, 64QAM for OFDM

                                           11n: MCS0~7,OFDM
3.2.1     IEEE802.11bMode Tx Parameters
                                     Table 8 IEEE 802.11b Mode CCK_11 Tx Parameters

                            Item                                               Description

                            Mode                                               IEEE802.11b


                           Channel                                             CH1 to CH13


                            Rage                                              1, 2, 5.5, 11Mbps


                      TX Performance              Minimum          Typical.      Maximum          Unit   Remark


                                                   15.0             16.5            18.0          dBm    1Mbps


          1.Output Power                           15.0             16.5            18.0          dBm    11Mbps


          2. Spectrum Template


            1) fc +/-11MHz to +/-22MHz             -                -               -30           dBr


            2) fc > +/-22MHz                       -                -               -50           dBr




                                                         EMW3072


                                                    Datasheet                                                [Page 12]

        3. Frequency Offset                     -15                -1.5          +15            ppm


        4. EVM( Peak EVM)


                                                                               35%(or
          1) 1~11Mbps                                                          11dB)




3.2.2   IEEE802.11g mode TX Performance
                             Table 9 IEEE802.11g Mode OFDM_54 TX Performance Parameters

                          Item                                               Description

                          Mode                                               IEEE802.11g


                        Channel                                              CH1 to CH13


                          Rate                                      6, 9, 12, 18, 24, 36, 48, 54Mbps


                   TX Performance               Minimum         Typical.         Maximum         Unit   Remark


                                                14.0               15.5          17              dBm    6Mbps


        1. Output Power                         13.0               14.5          16              dBm    54Mbps


        2. Spectrum Template


           1) at fc +/- 11MHz                   -                  -             -20             dBr


           2) at fc +/- 20MHz                   -                  -             -28             dBr


           3) at fc > +/-30MHz                                                   -40             dBr


        3.Frequency Offset                      -15                -1.5          +15             ppm


        4. EVM( Peak EVM)


          6Mbps                                 -                  -30           -5              dBm


          54Mbps                                       -           -31           -25             dBm




                                                      EMW3072


                                                   Datasheet                                                  [Page 13]

3.2.3   IEEE802.11n-HT Mode TX Performance
                              Table 10 IEEE802.11n-HT 20MHz Mode MCS7 TX Performance

                          Item                                               Description

                          Mode                                             IEEE802.11n HT20


                         Channel                                             CH1 to CH13


                          Rate                                 MCS0/1/2/3/4/5/6/7, maximum 65Mbps


                  TX Performance              Minimum           Typical.       Maximum        Unit   Remark


                                               13.5               15             16.5         dBm    MCS0


        1.Output Power                         12                 13.5           15.0         dBm    MCS7


        2.Spectrum Template


           1) at fc +/- 11MHz                  -                  -              -20          dBr


           2) at fc +/- 20MHz                  -                  -              -28          dBr


           3) at fc > +/-30MHz                                                   -45          dBr


        3. Frequency Offset                    -15                -1.5           +15          ppm


        4. EVM( Peak EVM)


            MCS0                               -                  -30            -5           dBm


            MCS7                               -                  -32            -27          dBm




    RX Performance

3.3.1   IEEE802.11b Mode RX Performance

         RX Minimum Receiving Sensitivity     Minimum           Typical.      Maximum         Unit   Remark


          1Mbps (FER≦8%)                           -              -98            -97          dBm


          11Mbps (FER≦8%)                          -              -90            -90          dBm




                                                       EMW3072


                                                           Datasheet                                                         [Page 14]

3.3.2         IEEE802.11g. Mode RX Performance

            RX Minimum Receiving Sensitivity            Minimum          Typical.     Maximum           Unit        Remark


              6Mbps (FER≦10%)                               -              -92.5         -92.5           dBm


              54Mbps (FER≦10%)                              -              -76           -75.5           dBm




3.3.3      IEEE802.11n HT20 Mode RX Performance

            RX Minimum Receiving Sensitivity           Minimum           Typical.      Maximum        Unit          Remark


                MCS0 (FER≦10%)                              -              -92.5         -92             dBm


                MCS7 (FER≦10%)                              -              -73           -73             dBm



3.3.4      IEEE802.11n HT40 Mode RX Performance

            RX Minimum Receiving Sensitivity           Minimum           Typical.      Maximum        Unit          Remark


                MCS0 (FER≦10%)                              -              -90           -90             dBm


                MCS7 (FER≦10%)                              -              -70           -70             dBm


Note:

Tx test data above are typically recorded at room temperature for about 20 seconds.

11b power is measured in factory mode (through-the-wall mode). User's practical application and authentication test will be 2 dB lower
than that in factory mode, i.e. the actual maximum power limit of 11b is 16 dBm. Ensure that the PSD test items of the certification test
pass.


3.3.5      OTA Performance

        TBD




                                                                EMW3072


                                                        Datasheet                                                    [Page 15]

4. Antenna Information

       Antenna Type
EMW3072 only has PCB antenna model.




                                                  Figure 5 EMW3072 Drawings



                                                        Table 11 PCB Antenna

                                                 PCB Antenna Information

                                    Frequency Range                2412MHz~2462MHz

                                    Impedance                                50Ω

                                    VSWR                                      <2

                                    Gain                            2dBi≥Gain>0.8dBi

                                    Efficiency                        >50% or >-3dB



Note: The above conditions are obtained under the condition of module welding to motherboard and darkroom testing.


     PCB Antenna Forbidden Area
While using PCB antenna, make sure that metal and electrical components are at least 16mm away from the antenna.

The shadow area should not contain any metal components, sensor, PCB ground.




                                                          EMW3072


                   Datasheet                               [Page 16]




Figure 6 PCB Minimum clearance area of antenna(Unit: mm)




                     EMW3072


                                                    Datasheet                                        [Page 17]

5. Production Instruction

     Production Guidelines
Qingke stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after
unpacking more than a fixed time patches to bake module.

SMT need machine:
     1.   Reflow soldering SMT machine
     2.   The AOI detector
     3.   6-8 mm diameter suction nozzle
Baking need equipment:
     1.   Cabinet baking box
     2.   The antistatic, high temperature resistant tray
     3.   The antistatic high temperature resistant gloves
Storage conditions as follows:
    1. Moisture bag must be stored in a temperature < 30 ° C, humidity 85% RH of the environment.
    2. Dry packaging products, the guarantee period should be from 6 months from the date of packing seal.




                                                   Figure 7 Humility Card

     ⚫    After the module is split, if the humidity card shows pink, it needs to be baked.

     ⚫    Baking Parameters:

     ▪    Roasting temperature: 12℃±5℃and baking time: 4 hours.

     ▪    The alarm temperature is set to 130 C.

     ▪    SMT patches can be prepared after cooling < 36 C under natural conditions.

     ▪    Drying times: 1 time.

     ▪    If there is no welding after baking for more than 12 hours, please bake again.




                                                      EMW3072


                                                   Datasheet                                             [Page 18]

    ⚫ If opened the time more than 3 months, please ban the use of SMT process welding this batch module,
    zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual
    welding, welding, the resulting problems we do not assume corresponding responsibility.

    ⚫    Please to ESD(static discharge,static electricity discharge) protection module before SMT;

    ⚫ Please according to the SMT reflow soldering curve, peak temperature 245 ℃, reflow soldering
    temperature curve as shown in figure 10, section 5.5;

    ⚫ For the first time in order to ensure the qualified rate of reflow soldering, first SMT please extraction
    10% product to visual analysis, AOI inspection, to ensure that the furnace temperature control, device
    adsorption method, the rationality of the put way; Suggestions:when batch production per hour 5-10 pieces
    of visual analysis, AOI test.

     The matters need attention
⚫   In the entire production, each station of the operator must wear anti-static gloves;
⚫   When baking, no more than baking time;
⚫   When roasting, it is forbidden to join explosive, flammable, corrosive substances;
⚫   When baking, high temperature module application tray in the oven, keep the air circulation between each
    module, at the same time avoid direct contact with the oven wall module;
⚫   Baking, please will bake the door is closed, the guarantee baking box sealing, prevent leakage, temperature
    influence the baking effect;
⚫   Don't open the door, as far as possible when baking box running if must open, shortening the time of can open
    the door as far as possible;
⚫   After baking, must be natural cooling modules to < 36 ℃ before wearing anti-static gloves out, so as not to
    burn.
⚫   Operation, forbidden module bottom touch water or dirt;
⚫   Temperature and humidity control level for Level3, storage and baking conditions based on IPC/JEDEC J -
    STD - 020.




                                                     EMW3072


                       Datasheet                 [Page 19]

Storage Condition




                    Figure 8 Storage Condition




                         EMW3072


                                           Datasheet                                           [Page 20]

 Recommended Reflow Profile
Solder paste recommendations: SAC305, Lead -Free solder paste. Reflow times should be no more than twice.




                                  Figure 9 Temperature Curve Reference




                                             EMW3072


                                                Datasheet                                            [Page 21]

6. Reference Circuit
The EMW3072 power supply reference circuit is shown in Figure 10, Figure 10 USB serial port reference circuit
and Figure 11 external interface reference design for user reference.




                                       Figure 10 Power Reference Circuit




                                     Figure 11 USB to UART Reference Circuit




                              Figure 12 EMW3072 External Interface Reference Design



EMW3072 UART is 3.3V UART. If the UART of the chip is 5V, the user needs to convert 5V U ART to 3.3V UART
to communicate with EMW3072 UART. The 5V-3.3V UART conversion circuit refers to the circuit shown in
Figure 13.




                                                  EMW3072


                   Datasheet                                [Page 22]




Figure 13 3.3V UART- 5V UART Conversion Reference Circuit




                    EMW3072


                                                           Datasheet                                                        [Page 23]

7. FCC and IC Information

     FCC Warning

Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This
equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

       - Reorient or relocate the receiving antenna.

       - Increase the separation between the equipment and receiver.

       - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

       - Consult the dealer or an experienced radio/TV technician for help.

The device has been evaluated to meet general RF exposure requirement.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

       (1) this device may not cause harmful interference, and

       (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be inst
alled and operated with minimum distance 20cm between the radiator & your body.


     IC warning

     - English:

     This device complies with Industry Canada license-exempt RSS standard(s).

     Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device
     must accept any interference, including interference that may cause undesired operation of the device.

     - French:

     Le présentappareilestconforme aux CNR d'Industrie Canada applicable aux appareils radio exempts de license.
     L'exploitationestautorisée aux deux conditions suivantes:

     (1) l'appareil ne doit pas produire de brouillage, et

     (2) l'utilisateur de l'appareildoit accepter tout brouillageradioélectriquesubi, mêmesi le brouillageest susceptible
     d'encompromettre le fonctionnement.




                                                             EMW3072


mxXCHIP®


                                          Datasheet                                           [Page 25]

8. Module MOQ and packaging information

                            Table 12 Module MOQ and packaging information

                                   Shipment
  Material number   MOQ(pcs)        packing       Outer packing box size           Remark
                                    method

                                                                              650pcs/volume,
     EMW3072          650          Tape reel          385*275*370(mm)       one volume in one box
                                                                            four boxes in one case.




                                               EMW3072


                                                   Datasheet                                    [Page 26]

9. Sales Information and Technical Support
If you need to get the latest information on this product or our other product information, you can visit:
http://www.mxchip.com/.

If you need to get technical support, please call us during the working hours.

From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00

Telephone: +86 (021)52655026

Email: sales@mxchip.com

Postcode: 200333

Contact address: 9F, 5 Building, No.2145 Jinshajiang Road, Shanghai, China




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Document Created: 2019-09-03 07:42:09
Document Modified: 2019-09-03 07:42:09

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