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r Application Note： me Assembly And Maintenance to Manual for Telink BLE 1x1 Test System 2.1 s AN-16052600-E3 cu Ver 1.2.0 r 2016/9/26 TELINK SEMICONDUCTOR fo Brief： This document is the assembly and maintenance guide for Telink BLE 1x1 Test System 2.1. nk li Te

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Published by Telink Semiconductor Bldg 3, 1500 Zuchongzhi Rd, Zhangjiang Hi-Tech Park, Shanghai, China r © Telink Semiconductor All Right Reserved me Legal Disclaimer to Telink Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Telink Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. s cu Telink Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others r The products shown herein are not designed for use in medical, life-saving, or fo life-sustaining applications. Customers using or selling Telink Semiconductor products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Telink Semiconductor for any damages arising or resulting from such use or sale. nk Information: li For further information on the technology, product and business term, please contact Telink Semiconductor Company (www.telink-semi.com). For sales or technical support, please send email to the address of: Te telinkcnsales@telink-semi.com telinkcnsupport@telink-semi.com AN-16052600-E3 1 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Revision History Version Major Changes Date Author 1.0.0 Initial release 2016/5 H.Z.F., L.X., Cynthia Updated buzzer related contents, r including: buzzer module photo, me cable connection between buzzer and EVK daughter board, cable to 1.1.0 2016/8 T.J.B., Cynthia connection chart, test system photo, Amic test item, buzzer spec in s hardware list, and dimension chart of buzzer board. cu Updated the “spec” column in 1.2.0 2016/9 H.Z.F., Cynthia hardware list. r fo nk li Te AN-16052600-E3 2 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Table of contents 1 Overall Architecture Of 1x1 Test System 2.1 .......................................................... 5 2 Hardware Platform Building ................................................................................... 7 2.1 Check External Antenna ................................................................................... 7 r 2.2 Cable connection ............................................................................................. 8 me 2.2.1 Connection points on EVK daughter board .............................................. 8 2.2.2 Cable connection between EVK daughter board and PCB antenna ......... 9 to 2.2.3 Cable connection between EVK daughter board and buzzer ................... 9 2.2.4 Cable connection between EVK daughter board and Mechanical s structure ................................................................................................................. 9 2.2.5 2.2.6 cu Cable connection between EVK daughter board and DUT ..................... 10 Other cable connection .......................................................................... 11 3 Firmware Burning For EVK Daughter Board ......................................................... 12 3.1 Folder structure for Test Bench Firmware..................................................... 12 r 3.2 Firmware burning for EVK daughter board ................................................... 15 fo 4 Observe Test Result Via PC Software EvkMonitor ............................................... 18 5 Update PCBA (DUT) Firmware .............................................................................. 21 Appendix 1 Test Item List On PC Software “EvkMonitor” ...................................... 23 nk Appendix 2：Hardware List ......................................................................................... 26 Appendix 3：Dimension chart of EVK daughter board and buzzer board .................. 27 li Te AN-16052600-E3 3 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Table of figures Figure 1 EVK daughter board............................................................................... 5 Figure 2 PCB antenna board and RF cable .......................................................... 5 Figure 3 Buzzer module ....................................................................................... 6 Figure 4 System connection chart ....................................................................... 6 r Figure 5 Telink PCB antenna board ...................................................................... 7 me Figure 6 Telink PCB antenna dimensions............................................................. 7 Figure 7 Connection points on EVK daughter board ........................................... 8 Figure 8 Cable connection chart........................................................................ 10 to Figure 9 BLE 1x1 Test System 2.1 ....................................................................... 11 Figure 10 Connection chart between EVK daughter board and PC .................... 15 s Figure 11 Firmware burning interface 1 for EVK daughter board ....................... 16 cu Figure 12 Firmware burning interface 2 for EVK daughter board ....................... 16 Figure 13 EvkMonitor tool interface ................................................................... 18 Figure 14 Dimension chart of EVK daughter board ............................................. 27 r Figure 15 Dimension chart of buzzer board ........................................................ 28 fo nk li Te AN-16052600-E3 4 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 1 Overall Architecture Of 1x1 Test System 2.1 Telink BLE 1x1 Test System 2.1 consists of test bench and mechanical structure. The test bench includes hardware platform and firmware folder, and it’s provided by Telink; while customer needs to make the mechanical structure suitable for DUT (Device Under Test), and connect cables according to the guide in this document. A set of 1x1 Test Bench mainly contains the following hardware resources. 1) An EVK daughter board provided by Telink. The EVK board should be burned with the EVK firmware for test bench. Figure 1 EVK daughter board 3) A buzzer module (Dimension: 50.2x16mm): The buzzer is connected to corresponding GPIO and 3V3DUT of the EVK daughter board via Dupont cables. AN-16052600-E3 5 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 The buzzer module is used for Amic test, and it should be placed as close to Amic as possible. Note: Do not contact buzzer board with Amic directly, and there should be no obstacle between them. Figure 3 Buzzer module 4) A PC. On PC side, the EvkMonitor tool can be used to burn firmware for EVK daughter board (refer to Section 3), and user can also observe test result via the EvkMonitor (refer to Section 4). Figure below shows the system connection chart. LED1 LED2 Display LED3 LED4 BUTTON GPIO SWire DUT USB Power EVK PC GPIO Digital buzzer Power PCB ANT Antenna Figure 4 System connection chart AN-16052600-E3 6 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 2.2 Cable connection 2.2.1 Connection points on EVK daughter board Figure 7 marks connection points on EVK daughter board to be connected with DUT, PCB antenna and mechanical structure in any application. RF LED4 RED LED1 Green LED2 Yellow LED3 White PIN45 PIN48 Button SWM 3V3DUT GND GND GND Figure 7 Connection points on EVK daughter board AN-16052600-E3 8 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 2.2.2 Cable connection between EVK daughter board and PCB antenna The connection point “RF” on EVK daughter board should be connected with PCB antenna board via an RF cable. 2.2.3 Cable connection between EVK daughter board and buzzer Table 1 shows the connection correspondence between EVK daughter board and buzzer board. Table 1 Cable connection between EVK and buzzer Connection points on EVK Connection points on buzzer board daughter board PIN48 VCC 3V3DUT 3V3B GND GND 2.2.4 Cable connection between EVK daughter board and Mechanical structure Table 2 shows the connection correspondence between EVK daughter board and Mechanical structure. Table 2 Cable connection between EVK and Mechanical structure Connection points on EVK Connection points on Mechanical structure daughter board LED1 Green Green LED+ LED2 Yellow Yellow LED+ LED3 White White LED+ LED4 RED Red LED+ Button Button+ GND Green LED-, Yellow LED-, White LED-, Red LED-, Button- AN-16052600-E3 9 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 2.2.5 Cable connection between EVK daughter board and DUT Table 3 shows the connection correspondence between EVK daughter board and DUT. Table 3 Cable connection between EVK and DUT Connection points on EVK daughter board Connection points on DUT 3V3DUT BAT+ GND BAT- SWM SWS (DUT) If the DUT is a remote control board, it’s also needed to connect wakeup pin of the DUT with PIN45 of the EVK board. EVK Buzzer Mechanical Structure 3V3B + Button - VCC PIN48 GND + Yellow LED - + Red LED - + Green LED - + White LED - GND GND Figure 8 Cable connection chart AN-16052600-E3 10 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 3 Firmware Burning For EVK Daughter Board 3.1 Folder structure for Test Bench Firmware Telink test bench firmware folder is generally named as “BLE_System_V3.0_xxx”. The structure of the “BLE_System_V3.0_xxx” folder is shown as below: “DB”: This folder contains db files. “Sch”: This folder contains schematics, cable connection illustration, and etc. The structure of the “Script” folder is shown as below: 4 1 3 2 1) platform: This folder contains project files. E.g. AN-16052600-E3 12 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Double click “tlsr8266f512et32_1x1Jig_2in1” to open the following interface.  test.tls: Jig test script to determine PCBA test items.  product.ini: EVK product information to determine PCBA RF test frequency point and ID.  boot.bin: Image file to download into PCBA finally. 2) uart: Double click “uart.bat” to open uart window and display real-time log for the convenience of test status check. Only one uart window is allowed at the same time. 3) conti_test_uart.bat: Double click the file, a uart window will pop up; data won’t be available on the window, but only saved in “log.txt” under this directory for convenience of analysis. AN-16052600-E3 13 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 4) Monitor: This folder contains the “EvkMonitor” tool on PC side. AN-16052600-E3 14 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 3.2 Firmware burning for EVK daughter board EVK daughter board should be burned with firmware before it’s ready for use. First connect the EVK daughter board with PC via an USB cable, as shown in Figure 10. EVK Connect EVK with PC via USB cable Figure 10 Connection chart between EVK daughter board and PC Then double click the “EvkMonitor.exe” under the “BLE_System_V3.0_xxx\Script\Monitor” folder. Click “download” under the menu “Evk” to open the burning interface. AN-16052600-E3 15 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Figure 11 Firmware burning interface 1 for EVK daughter board First click the “Select Project Folder” button and select the target project folder (i.e. the project under “platform”) in the pop-out window. The selected project path will be available in the box next to the “Select Project Folder” button; test script and product configuration information files will be available in the “test.tls” and “product.ini” editing window, respectively. test.tls product.ini Figure 12 Firmware burning interface 2 for EVK daughter board AN-16052600-E3 16 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 During first time of firmware burning, it’s needed to configure product information (product.ini) for the EVK daughter board. Tick the “USB Id” box and set “Evk number” as “0” (always). Then click the “Download” button to start burning. The log window keeps scrolling until it’s as shown in the figure below. Now the EVK daughter board is already burned with evk_testbench.bin, test.tls, product.ini, id and other bin files in the folder. After power cycle, the EVK daughter board is ready for use. AN-16052600-E3 17 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 4 Observe Test Result Via PC Software EvkMonitor Double click the “Monitor” folder under “BLE_System_V3.0_xxx\Script”. Double click the “EvkMonitor.exe” to open the software interface. If a prompt information of “NO usb device” pops up as shown below, it indicates communication problem such as USB cable connection with the EVK and PC; though software interface still pops up, user must check and make sure the connection is OK, then restart the software. After the software is started properly, the interface is shown as below: 5 3 1 6 4 7 8 2 Figure 13 EvkMonitor tool interface AN-16052600-E3 18 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1  show log: Tick the “show log” box (as shown in mark 1 of Figure 13) to enable the “log window” to display dynamic information.  log window: As shown in mark 2 of Figure 13, it’s the area to display dynamic information.  Stop: As shown in mark 3 of Figure 13, the software is in the state of stop by default.  File: Click “open” under the “File” menu (as shown in mark 4 of Figure 13), a window to set the storage path for database files will pop up. Select the storage path as needed, input file name and then click the “Open” button. Test result will be automatically stored under the directory by the software. Note：Only storage path and file name in English are allowed, otherwise it will invalidate the database creation.  start: Click the “start” icon (as shown in mark 5 of Figure 13), the software enters the state waiting for receiving the test result.  Run: Click the “Run” icon (as shown in mark 6 of Figure 13) to start testing. AN-16052600-E3 19 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1  status: As shown in mark 7 of Figure 13, it serves to display running state of the EVK. The figure above indicates the state of “Ongoing”. The figure above indicates the state of “Success”. The figure above indicates the state of “Failure”. For convenience of subsequent maintenance, it’s highly recommended to mark the error items and classify them.  data: As shown in mark 8 of Figure 13, it serves to display test result. Please refer to Appendix 1 Test Item List On PC Software “EvkMonitor” for details about test items and corresponding maintenance suggestions. AN-16052600-E3 20 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 5 Update PCBA (DUT) Firmware Connect the EVK daughter board with PC via an USB cable. Double click the “EvkMonitor.exe” under the folder “BLE_System_V3.0_20160316\Script\Monitor”. Click “download” under the menu “Evk” to open the burning interface. To update firmware only, it’s not needed to modify test.tls and product.ini for the EVK daughter board. 1. Tick the box in front of “Burning file”. Then click the “Burning file” button and select the target bin file (no limitation to the file name) in the pop-out window. The path of the selected bin file will be available in the box behind the “Burning file” button. The MD5 code calculated by the bin file will be available in the box AN-16052600-E3 21 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 next to the “MD5”. 2. Click the “Download” button. The target bin file automatically replaces the previous boot.bin under the project directory, and it will be burned into the EVK daughter board. After firmware is burned, user can check if the firmware is successfully updated in the EVK daughter board by clicking the “Check boot.bin” button. The result will be available in the log window and the box next to the “Check boot.bin” button. Firmware update success Firmware update failure After the firmware is successfully updated, power cycle the EVK daughter board, then it’s ready for use. AN-16052600-E3 22 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Appendix 1 Test Item List On PC Software “EvkMonitor” Maintenance Index Name Description Parameter Suggestion current protection: 0 CurProtection current value test DUT current Maybe soldering show the two pins if problem. test if there is any GPIO pins there is a short; 1 GpioShort Re-solder IC. short wired if not, its value will be 0 TP high/ low frequency test: 2 TpHigh Carry out Tx modulation cap value calibration to ensure RF Tx 3 TpLow quality cap value tx high frequency counting 4 TxHiCnt value/power/frequency cnt num offset/current test: EVK receives packets 5 TxHiPower transmitted by DUT at high rf energy frequency point, and thus to test DUT Tx performance at 6 TxHiFreoffset frequency offset RF related. high frequency point. Test again; if Test parameters are DUT Tx failed, temporarily packet number, DUT Tx power, mark it as rejected 7 TxHiCurrent DUT Tx frequency offset and current value product, and wait DUT Tx current, successively. for subsequent tx low frequency counting analysis. 8 TxLoCnt value/power/frequency cnt num offset/current test: EVK receives packets 9 TxLoPower transmitted by DUT at low rf energy frequency point, and thus to test DUT Tx performance at 10 TxLoFreoffset low frequency point. frequency offset Test parameters are DUT Tx packet number, DUT Tx power, 11 TxLoCurrent DUT Tx frequency offset and current value DUT Tx current, successively. AN-16052600-E3 23 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Maintenance Index Name Description Parameter Suggestion rx low frequency counting 12 RxLoCnt value/power/current test: cnt num DUT receives packets transmitted by EVK at low frequency point, and thus to 13 RxLoPower test DUT Rx performance at rf energy low frequency point. Test parameters are EVK Tx RF related. packet number, EVK Tx power 14 RxLoCurrent current value Test again; if and EVK Tx current, failed, temporarily successively. mark it as rejected rx high frequency counting product, and wait 15 RxHiCnt value/power/current test: cnt num for subsequent DUT receives packets analysis. transmitted by EVK at high frequency point, and thus to 16 RxHiPower test DUT Rx performance at rf energy high frequency point. Test parameters are EVK Tx packet number, EVK Tx power 17 RxHiCurrent current value and EVK Tx current, successively. cancel flash protection: Cancel DUT flash write 18 CancleFlashProtection 0, always Flash related. protection for following flash Maybe soldering erase and test. problem, re-solder set flash as 0/ 0xff: 19 FlashZero size pins related to Write DUT flash with all “0” or Flash. all “1” to test flash write 20 FlashErase size operation. deep sleep current/wakeup, 21 DsSlpCur current value suspend current/wakeup test: Maybe bad Make DUT enter low-power contact with 22 DsSlpWkp mode (deep sleep/suspend) reg value thimble. Check if and then wake it up via EVK, there’s enough thus to test current in deep 23 SuspendCur current value solder paste for sleep mode, wakeup function the test points of from deep sleep mode, current thimble and PCBA. 24 SuspendWkp in suspend mode and wakeup reg value function from suspend mode. AN-16052600-E3 24 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Maintenance Index Name Description Parameter Suggestion IR current test: IR current Make DUT enter IR state via 25 IRCur current value problem. Check IR EVK and test the current at IR circuit. state. Amic test: 3V3DUT of EVK supplies power for buzzer, while PIN48 outputs high level to make buzzer 26 Amic register value Detect Amic circuit board generate square wave signal which drives buzzer to beep. Test DUT register value at this state. Flash related. Maybe soldering write flash: If err, err address; 27 FlashWrite problem, re-solder write bin file into DUT flash if ok it’s 0 pins related to Flash. write id(part of ieee id): IEEE address to 28 WriteID write ID information into DUT id verify Jig status. flash Index 27 is fixed value; write bytes (part of ieee id): Index 28 is 29 WriteBytes write specific information into id dynamically DUT flash increasing value protect flash: 30 FlashProtect carry out write protect 1, always Flash related. operation for DUT flash Maybe soldering write flash: problem, re-solder check DUT flash content to If err, err address; pins related to 31 FlashWriteLarger ensure correct burning if ok it’s 0 Flash. operation Contact problem. load status: Check contact 32 Load test connection between EVK No para between thimble and DUT and PCBA. AN-16052600-E3 25 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Appendix 2：Hardware List Type Number Spec BLE EVK daughter board 1 C1T42A20_V3.3 Buzzer board 1 C1T64A3_V2.0 Long RF cable 1 SMA-MMCX dual-shielded cable -30cm Dupont cable Several USB2.0/28AWG/30cm, Mini USB cable 1 30V/80℃/A3-B AN-16052600-E3 26 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Appendix 3：Dimension chart of EVK daughter board and buzzer board Figure 14 Dimension chart of EVK daughter board AN-16052600-E3 27 Ver 1.2.0

Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Figure 15 Dimension chart of buzzer board FCC COMPLIANCE STATEMENT: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. AN-16052600-E3 28 Ver 1.2.0


Document Created: 2019-04-16 16:14:59
Document Modified: 2019-04-16 16:14:59
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