Modular Approval Letter

FCC ID: NKR-DFCN267

Cover Letter(s)

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FCCID_1915357

Module Approval Request Letter Subject: Module Approval request letter Date: 3/11/2013 FCC ID: NKR-DFCN267 Dear Reviewer, We, Wistron NeWeb Corporation, would request NFC Module approved under module approval authorization. The requirements regulated in 15.212 have been fulfilled and clearly explained below. 1. The requirement of RF shielding: The shielding of the radio portion can be demonstrated in exhibition External Photo. 2. The requirement of buffered inputs: Buffered data inputs stage has been integrated in chip (PN544PC2ET). 3. The requirement of power supply regulation: The part number of the power regulator is (PN544PC2ET). 4. The requirements of section 15.203 and 15.204(C): The requirements of antenna connector and spurious emission have been fulfilled. Please reference the exhibition Test Report. 5. The requirement of stand-alone test configuration: Please reference exhibition Test Configuration Photo for the stand-alone test configuration. 6. The requirement of labeling: The instruction on the labeling rule of the end product has been stated in the users manual of this module. Please also see the exhibition Label Sample. 7. The requirement of compliance on specific rule or operating requirements: The required FCC rule has been fulfilled and all the instructions for maintaining compliance has been clearly stated in the Users Manual. 8. The requirement of RF exposure: NFC devices subject to §15.225 are generally excluded from the RF Exposure requirements due to its very low radiating power. Please do not hesitate to contact me for any questions of this request letter. Thank you. Applicant’s company name : Wistron NeWeb Corporation Applicant’s company address : 20 Park Avenue II Hsinchu Science Park Hsinchu 308 Taiwan Signature : _________________________________ Job Title and Dept. : Troy Chien / Associate Technical Director E-mail : troy.chien@wnc.com.tw Tel. : 886-3-666-7799 Ex 6361


Document Created: 2013-03-11 10:50:49
Document Modified: 2013-03-11 10:50:49
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