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802.11g Wireless LAN SiP Module (WM-BG-MR -01) Data Sheet Apr 28’th. 2005 Rev 2.2 www.usi.com.tw PRODUCT SPECIFICATION of 802.11g WM-BG-MR -01 B2B Wireless Lan +BT Combo Module All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Introduction The 802.11 Wireless SiP module WM-BG-MR-01 which refers as “SiP-g combo module” is a small size module that provides full function of 802.11g/b and Bluetooth class 2 on a tiny module via 60 pins board to board connector. This multi- functionality and board to board physical interface provides 16 bit PC Card /CF+ bus interface for WiFi and UART for Bluetooth. The small size & low profile physical design make it easier for system design to enable high performance wireless connectivity without space constrain. The low power consumption (Sleep mode 1 mA) and excellent radio performance make it the best solution for OEM custom ers who require embedded Features 802.11g Wi-Fi + Bluetooth featuress, such as, l Lead Free design which supporting Green Wireless PDA, Scanner Smart phone, Media player design requirement. slim type Notebook, barcode ,mini-Printer, VoIP phone etc. l 2 wires, hardware signaling BT WiFi co- existence supported. For 802.11g feature, Marvell “Libertas” chipset l Small size suitable for low volume system solution is adopted and CSR BlueCore 03-ROM for integration.PCM audio interface Bluetooth. The Radio architecture & high integration supported. MAC/BB chip provide excellent sensitivity with rich l Low power consumption & excellent system performance. Two antenna connectors power management performance, extend provide antenna connectivity for each function. battery life. WM-BG-AG-01 provides outstanding BT WiFi co- l 2.412-2.484 GHz two SKUs for worldwide existence solution through internal 2 wires , market. hardware interface to optimized connection with CSR Bluetooth solution even without good antenna l Easy for integration into mobile and isolation between BT & WiFi module. handheld device with flexible system configuration and antenna design. In addition to WEP 64/128, WPA and TKIP, AES is supported to provide the latest security requirement on your network. For the software and driver development, USI provides extensive technical document and reference software code for the system integration under the agreement of Marvell International Ltd. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Change Sheet Rev. Date Description of change Approval & Date Page Par Change(s) 1.0 10/1/04 All All Draft version for Review 2.0 04/11/05 6,15, 1. Executive summary for target available 17,22 date from “the middle of 1Q 2005 ” to ,23, “ the end of 2Q” 25~2 2. Output power for 11g is 13 +/- 1dBm 7 3. Update the mech. Drawing . 4. Modify the function description for Marvell Transceiver from ”8010” to “8015” 5. Correct the Pin Definition for xxx_B is for “active_high” 6. add description for Pin 28;36;43;58 ; which reserved for BT’s PCM interface , make it no confuse in customer reading. 2.1 04/18/05 25 1. correct the pin definition for Pin24 from “Control signal to enable engineer testing mode “ to “Output signal to indicate 16 bit IO operation. This signal is connected to ground at module side to indicate 16 bit IO..” then Type is for GND to indicate the module under the mode for 16bit IO. 2.2 04/28/05 24 1. Pin A10 pin definition change from “ the pin is open to “This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode.” , Type change from “ No connection” to “Input , PD,5VT” All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 TABLE OF CONTENTS 1. EXECUTIVE SUMMARY ................................................................................................................ 6 2. DELIVERABLES ............................................................................................................................. 6 3. REFERENCE DOCUMENTS ......................................................................................................... 7 4. TECHNICAL SPECIFICATION..................................................................................................... 8 4.1. ABSOLUTE MAXIMUM RAT ING ............................................................................................... 8 4.2. RECOMMENDABLE OPERATION CONDITION ...................................................................... 8 4.2.1. TEMPERATURE, HUMIDIT Y............................................................................................. 8 4.2.1. VOLTAGE AND CURRENT ............................................................................................... 8 BLUETOOTH...................................................................................................................................... 8 4.3. COMPACTFLASH SPECIFICATION ......................................................................................... 9 4.3.1. DC ELECTRICALS............................................................................................................. 9 4.3.2. AC ELECTRICALS ............................................................................................................. 9 4.3.3. COMPACTFLASH PROTOCAL TIMING......................................................................... 10 4.4. WIRELESS SPECIFICATIONS ................................................................................................ 14 4.5. RADIO SPECIFICATIONS 802.11G ........................................................................................ 15 4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH ................................................................... 15 4.7. BLUETOOTH RADIO CHARACTERISTICS............................................................................ 16 4.8. DIMENSIONS, WEIGHT AND MOUNTING............................................................................. 17 4.8.1. DIMENSIONS ................................................................................................................... 17 4.8.2. WEIGHT ............................................................................................................................ 17 4.8.3. MOUNTING ...................................................................................................................... 17 4.9. SHOCK AND VIBRATION ........................................................................................................ 17 5. COMPATIBILITY AND INTEROPERABILITY......................................................................... 18 5.1. WI-FI LOGO .............................................................................................................................. 18 5.2. WHQL COMPLIANCE .............................................................................................................. 18 6. CONFIGURABILITY ..................................................................................................................... 18 7. SECURITY ...................................................................................................................................... 18 8. OPERATING SYSTEM COM PATIBILITY................................................................................. 18 9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS..................................... 18 9.1. EMC .......................................................................................................................................... 19 9.2. PRODUCT SAFETY SPECIFICATIO N .................................................................................... 19 9.3. COMPONENT SPECIFICAT ION ............................................................................................. 19 9.4. RADIO REQUIREMENTS AND APPROVALS ........................................................................ 20 9.5. PRODUCT MARKING .............................................................................................................. 21 9.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS .................................................... 21 10. FUNCTIONAL DESCRIPTION ................................................................................................ 22 10.1. HARDWARE............................................................................................................................. 22 10.2. HOST INTERFACE .................................................................................................................. 23 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 10.2.1. LED INTERFACE ............................................................................................................. 27 10.2.2. ANTENNA INTERFACE................................................................................................... 27 10.2.3. BLUETOOTH INTERFACE .............................................................................................. 28 10.3. SOFTWARE.............................................................................................................................. 28 11. DESIGN FOR EXCELLENCE (DFX)...................................................................................... 28 11.1. TESTABILITY........................................................................................................................... 28 11.2. LOGISTICS ............................................................................................................................... 28 12. HUMAN FACTORS ................................................................................................................... 29 13. INDUSTRIAL DESIGN.............................................................................................................. 29 14. RELIABILITY.............................................................................................................................. 29 15. PACKAGE .................................................................................................................................. 29 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 1. EXECUTIVE SUMMARY The WM-BG-MR-01 module - is one of the product families in USI’s product offering, targeting for system integration requiring a smaller form factor. It also provides the standard migration to high data rate to USI’s current SIP customers. The WM-BG-MR-01 module providing B to B type connector is provided as option for customers, who want to have Board to board type assembly. This document outlines the product requirements for a “system in Package” 802.11g/(b) combo module – here after referred as WM-BG-MR-01 Module. This product is targeted for first shipments by end of 2Q 2005 and is designated for use in embedded applications mainly in the mobile device, which required, small size and high data rate wireless connectivity. The application such as, Wireless PDA, slim type Notebook, Media Adapter, Barcode scanner, mini-Printer, VoIP phone, Data storage device could be the potential application for wireless WM-BG-MR-01. 2. DELIVERABLES The following products and software will be part of the product. • WM-BG-MR-01 Module with packaging • Evaluation kits, including application (CF, PCMCIA Adapter card, RF cable with SMA connector, antenna), • Software ut ility which supporting customer for integration, performance test, and homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the WM-BG-MR-01 module. • Unit Test / Qualification report • Product Specifications. • Agency certification pre-test report base on adapter boards All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 3. REFERENCE DOCUMENTS C.I.S.P.R. "Limits and methods of measurement of radio interference Pub. 22 characteristics of information technology equipment." International Special Committee on Radio Interference (C.I.S.P.R.), Third Edition, 1997. CB Bulletin "Adherence to IEC Standards: “Requirements for IEC 950, 2nd Edition No. 96A and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing to Standards for Safety of Electrical Equipment (IECEE), April 2000. CFR 47, "Unintentional Radiators". Title 47 of the Code of Federal Regulations, Part 15-B Part 15, FCC Rules, Radio Frequency Devices, Subpart B. CFR 47, "Intentional Radiators". Title 47 of the Code of Federal Regulations, Part 15-C Part 15, FCC Rules, Subpart C. URL: http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html CSA C22.2 "Safety of Information Technology Equipment including Electrical No. 950-95 Business Equipment, Third Edition." Canadian Standards Association, 1995, including revised pages through July 1997. EN 60 950 "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization (CENELEC), 1996, (IEC 950, Second Edition, including Amendment 1, 2, 3 and 4). IEC 950 "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization, Intentional Electrotechnical Commission. 1991, Second Edition, including Amendments 1, 2, 3, and 4. IEEE 802.11 “Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY) Specifications.” Institute of Electrical and Electronics Engineers. 1999. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 4. TECHNICAL SPECIFICATION The WM-BG- MR-01 is a B2B type assembly part, technical supporting, package requirement needs to be taken into consideration. 4.1. ABSOLUTE MAXIMUM RATING Supply Power Max +3.6 Volt Non Operating Temperature - 40° to 85° Celsius Voltage ripple +/- 2% Max. Values not exceeding Operating voltage 4.2. RECOMMENDABLE OPERAT ION CONDITION 4.2.1. TEMPERATURE, HUMIDITY The WM-BG-MR-01 module has to withstand the operational requirements as listed in the table below. Operating Temperature -20° to 60° Celsius Humidity range Max 95% Non condensing, relative humidity 4.2.1. VOLTAGE AND CURRENT Power supply for the WM-BG-MR-01 module will be provided by the host via the power pins There will be separated power source for WiFi and Bluetooth. 802.11 g(b) Voltage : VDD Operating Voltage 3.3 Volt +- 10% Current Transmit 450 mA Typical Receive 275 mA Sleep connected 1mA Average Inrush current 3000 mA Max. The power consumption is standard related. Bluetooth Voltage : VDD Operating Voltage 3.3 Volt +- 10% All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Current Transmit 50 mA Typical Receive ?40 mA Sleep connected ? mA Average 4.3. COMPACTFLASH SPECIFICATION 4.3.1. DC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended Operation Condition” unless specified. Power supply : VDD=3.3V Symbol Parameter Condition Min Typ Max Units VIH Input high voltage 0.5 VDD - VDD+0.5 V VIL Input low voltage -0.5 - 0.35VDD V VOH Output high voltage 2.4 - - V VOL Output low voltage - - 0.4 V 4.3.2. AC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended Operation Condition” unless specified. Power supply : VDD = 3.3V Symbol Parameter Condition Min Typ Max Units IOH Input high voltage =0.7 VDD 11.3 - 32 mA IOL Input low voltage =0.18VDD 10.5 - 38 mA VOH Output high voltage 0.2VDD- 0.6VDD 2.4 0.518 4.0 V/ns VOL Output low voltage 0.6VDD-0.2VDD - 0.592 4.0 V/ns All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 4.3.3. COMPACTFLASH PROTOCAL TIMING 4.3.3.1. RESET SPECIFICATION All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 4.3.3.2. ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 4.3.3.3. I/O READ/WRITE TIMING SPECIFICATION All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 4.4. WIRELESS SPECIFICATIONS The WM-BG-MR-01 module comply with the following features and standards; All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Features Description WLAN Standards IEEE 802 Part 11G (802.11G) Bluetooth BluetoothTM 1.1 and 1.2 compliance Antenna Connector Two antenna connectors support 802.11 and BT one for each. Coexistence Hardware signaling Frequency Band 2.400 – 2.484 GHz 4.5. RADIO SPECIFICATIONS 802.11G Features Description Frequency Band 2.4000 – 2.497 GHz (2.4 GHz ISM Band) Number of selectable Sub 14 channels channels Modulation OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM Supported rates 1,2, 5.5,11,6,9,12,24,36,48,54 Mbps Maximum receive level - 10dBm (with PER < 8%) Output Power 15 dBm +/- 1 dBm 802.11b 13 dBm +/- 1 dBm 802.11g Receive Data Rate Sensitivity -72 dBm 54Mbps 48 Mbps 36Mbps 24Mbps 18Mbps 12Mbps - 85 dBm 11 Mbps 9 Mbps 6 Mbps - 89 dBm 5.5 Mbps - 91 dBm 2.0 Mbps - 93 dBm 1.0 Mbps 4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH The Radio specification is compliant with the BluetoothTM 1.1 and 1.2 class 2 specification Features Description Frequency Band 2400 ~ 2483.5 MHz All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Number of Channels 79 channels Modulation FHSS (Frequency Hopping Spread Spectrum) , GFSK Antenna Connector One Hirose W.FL –R –SMT(10) RF connector 4.7. BLUETOOTH RADIO CHARACTERISTICS Features Description Maximum Receive Level 3 dBm ( Typical ) Output Power 1 dBm ( Typical ) Sensitivity -81 dbm @ 0.1% BER @ 25 ° Celsius ( Typical ) All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 4.8. DIMENSIONS, WEIGHT AND MOUNTING The following paragraphs provide the requirements for the size, weight and mounting of the WM-BG-MR-01 module. 4.8.1. DIMENSIONS The size and thickness of the WM-BG-MR-01 module is listed below: The height – will be finalized after the module design is frozen. 4.8.2. WEIGHT Weight shall not exceed 10 gram including the shielding. 4.8.3. MOUNTING The WM-BG-MR-01 module is B2B mounted type component. The B2B connector and additional screw hole provide mounting mechanism to secure the WM-BG-MR-01 module against vibration and shock on the host system. 4.9. SHOCK AND VIBRATION All shock and vibration test will be performed by using an interface adapter card. Additional shock and vibration tests can be performed – on request – by using the real host being PDA, Textbook or any other application. The interface card will provide mounting facility base on the recommendation /application guide provided. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Vibration Operating Frequency sweep from 3-150-3 Hz with a constant 0.25 G input Non-Operational Frequency sweep from 3-150-3 Hz with a constant 0.5 G input Shock Operational 25 G peak within 3.75 msec in normal base position Non-Operational 65 G peak in 3.75 msec in normal base position. 30 G within 8 msec square or trapezoidal shock in + and - direction along the 3 axis. (Total 6 shocks) Note: Above tests are executed without packaging material. 5. COMPATIBILITY AND INTEROPERABILITY 5.1. WI-FI LOGO The product needs to be verified with Wi-Fi certification base on CF form factor to prove the hardware compatibility. For the other specific application, Wi-Fi certification is dependent on the capability and application of the host system. 5.2. WHQL COMPLIANCE Not required for WM-BG-MR-01 module 6. CONFIGURABILITY No user configuration needed. The CIS and MAC Address will be loaded during production of the WM-BG-MR-01 module. 7. SECURITY The WM-BG-MR-01 module supports WEP64/128,WPA , AES-CCM which including TKIP (full version TKIP SSN /WPA) . Refer to Marvell Libertas solution. 8. OPERATING SYSTEM COMPATIBILITY Drivers are supported for the following OS: • Windows CE 3.0 /.NET , Win CE 5.0 ( 2005) • Linux. • Pocket PC 2003.2004 9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS The WM-BG-MR-01 module is pre-tested to ensure that all requirements met as set forth in the following sections. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Final certification (module certification) requires the antenna of targeted system with a lead- time of 6 weeks. The product deliverable shall be a pre-tested WM-BG- MR-01 module. No module level certification on WM-BG-MR-01 module. 9.1. EMC The module will be pre-tested to ensure that we can certify the product in the following countries when final certification will be performed on products and or platforms. • US. FCC CFR47 Part 15-B, Class B • Canada. CSA C22.2, Class B • Europe. 89/336/EEC, EMC Directive, including CE Mark • ETS300 826, EMC standard for 2.4GHz wideband transmission systems • EN55022, Class B (Emissions) EN50082-1 (Immunity) EN61000-3-2 (Harmonic AC current emissions) • Japan. VCCI Standard, Class 2 (Emissions) • Korea (MIC) 9.2. PRODUCT SAFETY SPECIFICATION The WM-BG-MR-01 module is tested and pass successfully the following criteria; The testing is to assure the quality of safety requirement on module. Final certification will be conducted on system level. • UL1950 /CSA C22.2.950 • EN60 950 (IEC 950) • CB scheme certification from National certification body as listed in CB bulletin No. 96A. • 9.3. COMPONENT SPECIFICATION All components used in this device meet the following component approval requirements. PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board material shall be rated 130°C minimum. CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc. "Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated UL 94V-2 or less flammable when tested to UL 94. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105°C. PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL "Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94. “PB FREE” - The entire component Suppliers has to support Green requirement base on USI’s policy. All of the components which including process and materials has to be Lead Free. 9.4. RADIO REQUIREMENTS AND AP PROVALS The WM-BG-MR-01 module is tested with adapter card to comply with following standard. The testing is to assure the performance of regulatory requirement on module. Final certification will be conducted on system level. • US/CAN: FCC CFR47 Part 15.247 • Japan: TELEC • Korea: MIC All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 9.5. PRODUCT MARKING The Module is marked by laser marking which containing the following information: Description: WM-BG-XX-XX Serial number: yyllwkxxxx Revision: format to follow USI revision level in PDM System For the serial number the following format will be followed: yy = last two digits of current year ll = Assembly Location: UT = USI Taiwan UM = USI Mexico UC = USI China wk = current week (week period = starting on Monday) xxxx = consecutive number, starting at 0000 at beginning of each week. 9.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS The use of polychlorinated biphenyls (PCB’s) is prohibited (specifically) as dielectric in capacitors or transformers. Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or gamma-butyrolactone (i.e. no el caps allowed). No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product. The use of tantalum capacitors should be minimized in any product of the product family [including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions must be made in the manufacturing process to prevent reverse polarization. The WM-BG-MR-01 module hardware design should take the safety of operation into consideration and prevent the potential risk on Labor safety for manufacturing process. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 10. FUNCTIONAL DESCRIPTION The WM-BG-MR-01 module provides and interfaces between Compaq Flash or PC Card Interface, SDIO , SPI which suitable for wide range high-end processors or low cost ARM7 or other similar type of processors. The core of the WM-BG-MR-01 module is the Marvell 88W83 Chipset solution. The module is design base on the Marvell Libertas solution which contain the flip chip package MAC/BB chip - 88W8385 , The transceiver 88W8015 low profile package IC to reduce the size of module. All the other components can be implement by all means to reach the mechanical specification. A simplified block diagram of the WM-BG-MR-01 module is depicted in the Fig. below. 88W8385 To be updated with BT 10.1. HARDWARE The following sections provide the requirements for the different physical interfaces of the wireless module : • Host Interface • Antenna connections • LED control signal • Bluetooth WiFi coexistence control signals All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 • Power • GND 10.2. HOST INTERFACE The host interface will be compatible with CompactFlash (PCMCIA) standard, 16 bit I/O bus. Signals which are not used won’t be routed to the physical interface (connector). The host interface of Combo SiP Bluetooth portion is compliant with UART interface, the default baud rate setting is 115.2kbps and the optional range is from 9.6kbps to 921.6kbps. On Board connector Molex 53794-0608 or 55560-0607 [Socket, 60 pins, with positioning protection, stack height which is able to support 1.5 mm] Datasheet_Molex_53 Datasheet_Molex_55 794-0608.pdf 560-0607.pdf Host System: Host System Connector Molex 54722-0607 [Header, 60 pins, with positioning protection, stack height 1.5mm] Datasheet_Molex_54 722-0607.pdf Pin definition [ … ] means optional function of the pin. PD : Signal pull down internally in the chip by 50K ohm while initialization. PU : Signal pull up internally in the chip by 100K ohm while initialization. 5VT: 5 Volt tolerance pin xxx_B : Signal pins end with _B are “active high” Pin Definition Draft Description Type Number WM-BG- CF+ interface MR-01 1 GND GND GND 2 D03 HD3 Data Input/Output line constitute a bi-directional O, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 bus. HD[15:0] are used to access the MODULE Databus MAC Host Interface register 3 D04 HD4 Data Input/Output line constitute a bi-directional O, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE Databus MAC Host Interface register 4 D05 HD5 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE Databus MAC Host Interface register 5 D06 HD6 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 6 D07 HD7 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 7 -CE_1 HCE1_B Card Enable1 is driven by the host system and is Input, PU, 5VT used as select strobe in both I/O and memory mode. Enables even numbered address bytes. 8 A10 A10 ADDRESS BUS lines driven by the host system Input, PD,5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode.The pin is open in B2B module. 9 -OE HOE_B OUTPUT ENABLE is driven by the host during a Input, PU,5VT memory Read Access. 10 A09 HA9 ADDRESS BUS lines driven by the host system Input, PD,5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 11 A08 HA8 ADDRESS BUS lines driven by the host system Input, PD,5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 12 A07 HA7 ADDRESS BUS lines driven by the host system Input, PD,5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 13 VCC VCC_WLAN Power, 3.3V_WLAN Input 14 A06 HA6 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 15 A05 HA5 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 16 A04 HA4 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 17 A03 HA3 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC . This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 18 A02 HA2 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 19 A01 HA1 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 20 A00 HA0 ADDRESS BUS lines driven by the host system Input, PD, 5VT which enables addressing of 0.5K address range within MAC. This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode. 21 D00 HD0 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 22 D01 HD1 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 23 D02 HD2 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 24 -IOIS16 IOIS16_B Output signal to indicate 16 bit IO operation. This GND signal is connected to ground at module side to indicate 16 bit IO.. 25 -CD2 CD2 Normal operation, this pin is functionally for card Out, 6mA, 5VT. detection. 26 N/A TXD_B UART CMOS output data line Output,WPU, 1µA 27 N/A RTS_B UART CMOS output signal, request to sent Output ,WPU, 1µA 28 N/A PCM_In Reserved for BT portion , keep its open on host side if no use. 29 N/A VCC_WLAN Power_WLAN Input 30 GND GND 31 GND GND 32 D10 HD10 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 33 D09 HD9 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 34 D08 HD8 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 35 -STSCHG HSTSCHG_B STATUS CHANGE indication to the host. This Output, 4mA signal gets active when one of the bits in the PRR or CSR registers are set 36 -SPKR PCM_Sync Reserved for BT portion , keep its open on host side if no use. 37 -REG HREG_B ATTRIBUTE MEMORY SELECT is driven by the Input, PU, 5VT host system and is used to access the Attribute Memory 38 -INPACK HINPACK_B INPUT ACKNOWLEDGE is driven by MAC. Is Output, 2mA asserted when the device is selected and the device is responding to an I/O Read command. 39 -WAIT HWAIT_B HWAIT_B is driven by MAC and allows for Output, 4mA extending the memory or I/O cycle 40 RESET HRESET Used to asynchronously reset the complete Module Input, PU,5VT 41 -VS2 VS2_B Voltage sense signal Output , 5VT 4mA 42 N/A WLAN_LED_B WLAN LED control signal, driven the LED Output, 4mA indicating the link status of WLAN 43 N/A PCM_OUT Reserved for BT portion , keep its open on host side if no use. 44 IREQ IREQ_B INTERRUPT REQUEST to the host. In Memory Output, 4mA mode this pin signifies RDY/BSY_typically used during card initialization immediately after reset or power on. Indicates to the host that the device is not able to transfer data 45 -W E HWE_B WRITE ENABLE is driven by the host during a Input, PU,5VT memory Write Access 46 -IOWR HIOWR_B I/O Write Strobe is driven by the host and is Input, PU,5VT asserted when the host wants to write to an on-chip I/O register 47 -IORD HIORD_B I/O Read Strobe is driven by the host and is Input, PU,5VT asserted when the host wants to read from an on- chip I/O register 48 -VS1 -VS1 Reserved Output , 5VT 49 -CE2 HCE2_B CARD ENABLE2 is driven by the host system and Input, PU,5VT is used as select strobe in both I/O and memory mode. Enables odd numbered address bytes 50 D15 HD15 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 51 D14 HD14 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 52 D13 HD13 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 53 D12 HD12 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 54 D11 HD11 Data Input/Output line constitute a bi-directional IO, PD, 5VT, 4mA bus. HD[15:0] are used to access the MODULE MAC Host Interface register 55 N/A BT_LED_B BT LED control signal which drive the LED to Output 4mA indicate the activity of Bluetooth 56 N/A RXD_B UART data line CMOS input signal Input, WPD, 1µA 57 N/A CTS_B UART clear to sent COMS input signal Input, WPD, 1µA 58 N/A PCM_CLK Reserved for BT portion , keep its open on host side if no use. 59 VCC VCC_BT Power 3.3V_BT Input 60 GND GND Pin 1 Pin 60 Pin 59 Fig 1: Pin 1 assignment and indication Drawing ( To be updated with latest design) 10.2.1. LED INTERFACE The Wireless Module will provide two control signals to the host and capable to drive an LED to indicate the connectivity and operating status. The WM-BG-MR-01 have 2 LED’s (output) via 60 pins connector for feedback to the user on the current WLAN activity state. The signaling will reflect status / activity as described in the table below. Those two signals are provided via the board to board connector with the following pin assignment. Pin No Pin description Function description 42 WLAN_LED Link activity of Wireless LAN 55 BT Power status indication LED code to be defined ! 10.2.2. ANTENNA INTERFACE No antenna diversity supported on the Wireless Module. The output impedance of the cable is 50 Ohms. Antenna Connector: Hirose W-FL-R-SMT(10) All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 10.2.3. BLUETOOTH INTERFACE There are interfaces signal to routed between WiFi and Bluetooth to provide coexistence with 802.15 Bluetooth modules. The BT co-existence interface supported, which is 2 Wire CSR co-existence. The control signals are provided via the 60 pins B2B connector with the interface defined as below: Symbol Interface “Signal name” & description BTACT 2 Wire-CSR “BT _Priority” This pin indicates to WLAN BCA device that BT module is active or will soon be active to TX/RX stage. WLAN_active 2 Wire-CSR “Wlan_Active”, This pin indicates to BT module that WLAN is active or will soon be active to TX/RX stage. Note 1: “WLAN BCA” device is a functional block in 88W8385 works as Bluetooth co-existence management . 10.3. SOFTWARE The following source code will be provided for porting to the embedded system under the SLA with chipset supplier • Linux source code • Source code of development utility base on Windows CE 11. DESIGN FOR EXCELLENCE (DFX) 11.1. TESTABILITY The WM-BG-MR-01 module can be tested on the by using adapter card or similar interface. The adapter card must be such that from the FTS the WM-BG-MR-01 module is seen and recognized as PC Card or Compaq Flash. Ÿ No additional test pins are required to support in-circuit testing. 11.2. LOGISTICS All customer specific requirements – customization – will be implemented at the highest possible level to support build to order and keep the number of modules in SMT to a minimum. Additional module variants might be added base on business potential. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 12. HUMAN FACTORS Due to the nature of this product (embedded module) no human factors required 13. INDUSTRIAL DESIGN Due to the nature of this product (embedded module) no industrial design requirements are required. 14. RELIABILITY The WM-BG-MR-01 module guarantee an MTBF of 150,000 hrs based on an ambient temperature and workload of 2,920 hours. The workload is based on a unit working for 8 hours per day, 365 days per year. The MTBF estimation base on is Bell code standard, Class II. 15. PACKAGE To be updated. All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice

802.11g Wireless LAN+BT SiP combo Module V2.2 Marvell is Trademark of 3’rd Party. For Additional information, please contact the following: Universal Scientific Industrial Co., Ltd. Headquarters 141, Lane 351, Taiping Road, Sec. 1, Tsao-Tuen, Taiwan, Http://www.usi.com.tw Tel: + 886-49-2350876, 2325876 Fax: +886-49-3439561, 2337360,2351093 E-mail:usi@ms.usi.com.tw All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. Preliminary release for evaluation, Subject to be changed without Notice


Document Created: 2005-04-28 10:08:57
Document Modified: 2005-04-28 10:08:57
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