Antenna Specification

FCC ID: JNF-Z-107X

Parts List/Tune Up Info

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FCCID_752100

Walsin Technology Corporation MULTILAYER CERAMIC ANTENNA RFANT BROADBAND Series 2.4 GHz ISM Band Working Frequency *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation REVISION HISTORY Rev P/N Description Date V01 RFANT7635110A1T First Version 2004-07-13 V06 RFANT7635110A1T Increase Revision History as Page-2 2004-12-08 Update the “±” Mark. Page 2 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation FEATURES 3 Surface Mounted Devices with a small dimension of 7.6 x 3.5 x 1.1 mm meet future miniaturization trend. 380MHz broad bandwidth design makes less influence, less frequency shifting due to outside environmental deviation. 70% small footprint compared to normal band design (140MHz). Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product. High Stability in Temperature / Humidity Change Free Impedance Matching APPLICATIONS Bluetooth Wireless LAN HormRF ISM band 2.4GHz wireless applications DESCRIPTION Walsin Technology Corporation develops a new ceramic embedded antenna specified for 2.4 GHz ISM Band application, TM as shown in below “CONSTRUCTION”. Both of Wireless LAN IEEE 802.11b and Bluetooth typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the friendly usage for antenna, this antenna has been designed to a typical 400MHz bandwidth through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. 3 This antenna has a rectangular ceramic body with a tiny dimension of 7.6 x 3.5 x 1.1 mm meet the future SMT automation and miniaturization requirements on modern portable devices. CONSTRUCTION Fig 1. Outline of 2.4GHz Chip Antenna DIMENSIONS Figure Dimension Port definition L L 7.60 0.30 mm - W 3.50 0.20 mm - G P1 T 1.10 0.10 mm - WTC Fd 0.50 0.20 mm Feed termination W Fd P3 G 0.80 0.20 mm Ground termination G P2 C 0.50 0.20 mm C D 0.50 0.20 mm D T P1 0.80 0.20 mm Solder termination P2 0.80 0.20 mm Solder termination P3 0.50 0.10 mm Solder termination MARKING: Upon customer requested, max. 5-digit code is allowed. Page 3 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation SOLDER LAND PATTERN DESIGN Figure Symbol Dimension Wp L 8.10 0.10 mm Lp Ws Lp 1.00 0.10 mm L Wp 1.20 0.10 mm Lh Wf Lf Lf 1.50 0.10 mm Lg Wf 0.80 0.10 mm Wg Lg 1.50 0.10 mm Wg 1.50 0.10 mm Ws 0.40 0.10 mm Ω Lh 0.50 0.10 mm ELECTRICAL CHARACTERISTICS Item Specification Central frequency 2.450 GHz (Note-1) Bandwidth 380 MHz (Typical value) Gain 0 ~ 2 dBi VSWR 2 max. Polarization Linear Azimuth Bandwith Omni-directional Impedance 50Ω Rated Power (max.) 5 Watts Maximum Input Power 10 Watts for 5 minutes Operation Temperature -40 C ~ +85 C Note-1. Central Frequency should be defined after customers’ application approval. Page 4 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation RADIATION PATTERN Radiation Pattern and Gain were dependent on measurement board design. Walsin’s LTCC chip antenna is an electrically small antenna (size smaller than 1/10λ). The specification of RFANT7635110A1x series chip antenna was measured based on the PCB size and installation position as shown in the below figure Test Board Return Loss (S11) 50 Ω ! " E-Plane (dBi) H-Plane (dBi) The typical tuning range of Walsin’s chip antenna is about ±150MHz. The performance of embedded ceramic antenna is sensitive influenced by customer's ground area, PC board size, thickness, material, mechanical design and the material of housing for end product. WTC engineers have significant expertise on embedded antenna designs and applications. We can work closely with you to ensure the requirements are met, and optimise the WTC’s antenna performance when installing on your application. Page 5 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation RELIABILITY TEST Mechanical performance Test item Test condition / Test method Specification Solderability Solder temp. : 235 5°C 95% min. coverage of all metabolised area Immersion time: 2 1 sec Solder: SN63 Resistance to soldering heat Solder: Sn63 No mechanical damage. Preheating temperature: 150 10°C Ceramic surface shall not be exposed in the middle of the Solder Temperature: 260 5°C termination or on the terminated product edge by leaching. Immersion time: 10 1 sec Measurement to be made after keeping at room temp. for 24 2 hrs. Drop test Height : 75 cm No mechanical damage. Direction : 3 directions Samples shall satisfy electrical specification after test.. Times : 3 times for each direction. Environmental characteristics Test item Test condition / Test method Specification Humidity Resistance Humidity:90% to 95% R.H. No mechanical damage. Tempertaure:40 2°C Samples shall satisfy electrical specification after test. Time: 500 24 hours. Measurement: After placing for 24 hours Minimum. Temperature cycle 1. 30 3 minutes at -40°C 3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical specification after test. 3. 30±3 minutes at +85° 3°C, 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement after placing for 48 2 hrs min. High temperature Temperature: 85°C 2°C No mechanical damage. Test duration: 24 hours Samples shall satisfy electrical specification after test. Measurement must be taken after subjection to the above conditions, followed by exposure in room environment for 1 to 2 hours. Low temperature Temperature: -40°C 3°C No mechanical damage. Test duration: 24 hours Samples shall satisfy electrical specification after test. Measurement must be taken after subjection to the above conditions, followed by exposure in room environment for 1 to 2 hours. Page 6 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2 Fig 2. Infrared soldering profile ORDERING CODE RF ANT 763511 0 A 1 - T Walsin Product Dimension Unit of Application Specification Packing RF code code dimension A : 2.4GHZ ISM Code from 0 ~ 9 T : 7” Reeled device ANT : Per 2 digits of 0 : 0.1 mm Band dependent on G : 10” Reeled Antenna Length, Width, 1 : 1.0 mm B : GSM 900/1800 different electrical B : Bulk Thickness : Dual Band specification X : SFC product e.g. : C : GSM 900 763511 = Length D : GSM 1800 76, Width 35, E : GPS Thickness 11 F : W-CDMA G : PHS PACKAGING: Plastic Tape specifications (unit :mm) Φ' & % # % ( % ( % ( % ( % ( $ Index Ao Bo ΦD T W Dimension (mm) 3.86 0.10 7.92 0.10 1.55 0.05 1.35 0.10 16.0 0.30 Index E F Po P1 P2 Dimension (mm) 1.75 0.10 7.50 0.10 4.00 0.10 8.00 0.10 2.00 0.10 Page 7 of 8 ASC_ANT7635110A1T_V06 Dec.-2004

Walsin Technology Corporation Reel dimensions C B A D Index A B C D Dimension (mm) Φ178 Φ60.0 Φ13.5 16.5 0.1 Typing Quantity: 1000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Page 8 of 8 ASC_ANT7635110A1T_V06 Dec.-2004


Document Created: 2006-12-05 17:56:03
Document Modified: 2006-12-05 17:56:03
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