Manual

FCC ID: A8TBM77SPPSYC2A

Users Manual

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FCCID_2096896

             Datasheet of Bluetooth

          BM77SPPS5MC2 Module




                         ISSC Technologies Corp.
Revision History

      Date                             Revision Content                 Version
   2013/07/03      First Version                                          1.0
   2013/07/09      Add descriptions in current consumption part           1.1
   2013/08/20      Update UART baud rate information                      1.2
   2013/10/01      Update current consumption & Timing Sequence photo     1.3


                                                                            Content

1.          Introduction ..................................................................................................................... 3
     1.1.      Major Components ................................................................................................................................ 3
     1.2.      Features ............................................................................................................................................... 3
     1.3.      Application ............................................................................................................................................ 3

2.          Product Specification ..................................................................................................... 4
     2.1.      Chipset ................................................................................................................................................. 4
     2.2.      Interfaces .............................................................................................................................................. 4

3.          Hardware Architecture .................................................................................................... 5

4.          Compatibility Requirements ........................................................................................... 5

5.          Environmental Requirements......................................................................................... 6
     5.1.      Temperature.......................................................................................................................................... 6
     5.2.      Humidity................................................................................................................................................ 6

Appendix A: Dimension and Foot Print ................................................................................... 7

Appendix B: Product Image ...................................................................................................... 7

Appendix C: Reflow Profile ....................................................................................................... 7

Appendix D: Label Information................................................................................................. 8

Appendix E: Reversion History ................................................................................................ 9




CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.
                                                                                                                                                                        2


                                                                                                        Y

                                                                 sooreiftin@ e                      #   I SS c
                        4F, No.8, Dusing Rd., Hsinchu Science Park, Hsinchu City 30078, Tamwan, R.0.C               k
                                                         TEL Bee—3—577—8385 FAX sec.c.srmss01           IRNRIRIDSIRAq
                                                                                   wwwissc—tech.com     ISSC Technologles Corp.



1. Introduction
Part Name: ISSC BM77SPPSSMC2 Bluetooth module
Part Number: BM77SPPSSMC220000%
The ISSC BM77SPPSSMC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for

iPad logos) and Bluetooth standard SPP/ BLE electronic accessories via Bluetooth connectivity. It is available in the

2.4GHz ISM band Class 2 Radio, compatible with Blustooth Core Specification Version 3.0/ 4.0 + EDR.
ISSC IS1677NM single chip solution combinestranscsiver and baseband function to decrease the external
components. It narows down the module size and minimizes its cost.

The optimized power design minimize power consumption to keep low battery and the module is integrated with
shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification.

1.1. Major Components
— ISSC IS1677NM (40 pin QFN, single—chip Bluetooth transceiver and baseband processor)

— Serial EEPROM 8K (1024"8) TSSOP 8P
1.2. Features
— Bluetooth 3.0/ 4.0+ EDR compliant
— Low power 1.8V RF operation

— RF transmitter output power Class 2
— RF receiver GFSK typical —90dBm, z/4 PSK typical —90dBm, 8DPSK typical —83dBm, BLE typical —92dBm

— Internal ROM and 4Miibts of flash
— I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and

the iPod, iPhone and iPad)
— 1 LED driver
1.3. Application
— GPS
— Printers
— Electric Scale
— Blood Pressure Monitors
— Bar code Scanner
— Industrial Applications (CNC, PLC, RFID)
— Embedded systems




CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.


2. Product Specification
2.1. Chipset
        2
6x6 mm 40 pin QFN IS1677NM
2.2. Interfaces
- Multi function GPIO interface
- Bluetooth RF interface
- UART up to 921600 bps
- I2C for external EEPROM and authentication chip




CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.
                                                    4


3. Hardware Architecture
Block Diagram




Power Tree




4. Compatibility Requirements
The BM77SPPS5MC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility
and reliability, and software compatibility test.




CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.
                                                                                                             5


                                                              sooreffiNeTxEERMGR)BtaR                  ]SSC
                      4F, No.8, Dusing Rd., Hsinchu Science Park, Heinchu City 30078, Taiwan, R.0.C.                       k
                                                       TEL Bee—3—577—8385 FAX sec.c.srmss01            IRNRIRIDSIRAq
                                                                                 wwwissc—tech.com      ISSC Technologles Corp.



5. Environmental Requirements
5.1. Temperature


        Conditions     Operating Temperature            Non—Operating Temperature

        Minimum                  ~10 °C                               —40°C
        Maximum                 +70 °C                               +85 °C


5.2. Humidity


        Conditions       Operating Humidity                Non—Operating Humidity
        Minimum                   10%                                  5%
        Maximum                   90%                                  95%




CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.


Appendix A: Dimension and Foot Print
1. Dimension




-    Dimension: 22 mm* 12 mm* 1.86 mm (Length* Width* Height)
-    Tolerance: +/- 0.25 mm

2. Suggested Load Board Foot Print




Appendix B: Product Image




Appendix C: Reflow Profile
1.) Follow: IPC/JEDEC J-STD-020 C
2.) Condition:


CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.
                                                                7


                                                                 smcs                            198C
                                                                                                         w



                          4F, No.8, Dusing Rd., Hsinchu Science Park, Hsinchu cuy 30078, Tawan, R.0.C.               k
                                                           TEL Bee—3—577—8385 FAX sec.c.srmss01          IRNRIRIDSIRAq
                                                                                    wwwissc—tech.com     ISSC Technologles Corp.



                Average ramp—up rate (217°C to peak): 1~2°C/sec max.
                 Preheat : 150~200C > 60~180 seconds
                Temperature maintained above 217°C : 60~150 seconds

                Time within 5°C of actual peak temperature: 20 ~ 40 sec.
                 Peak temperature : 250+0/—5°C or 260+0/—5°C
                 Ramp—down rate : 3°C/sec. max.
                Time 25°C to peak temperature : 8 minutes max.
                Cycle interval : 5 minus




                                                                           Peak: 250+0—5°C
                                 Stope: 1~2°C/ see max.                      Or 260+07—5C
                                      (217°C to peak)


                                                                                               Ramp down rate:
                                                                                                Max. 3‘C/sec.



                     Preheat: 150~200°C



                                                                         20~40 seo.




                                   60~180 seo.                            60~150 see.




                                                                                                    Time (see)

Appendix D: Label Information
FCC Label Instructions:
The outside of final products that contains this module device must display a label referring to the enclosed module.
This exterior label can use wording such as the following: "Contains Transmitter Module FCC ID:

ABTBM77SPPSYC2A " or "Contains FCC ID: A8TBMZ7SPPSYC2A." Any similar wording that expresses the same
meaning may be used.



Changes or modifications not expressly approved by the party responsible for compliance could void the
user‘s authority to operate the equipment.


CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.


Appendix E: Reversion History
    Version        Date                                            History
    0.2        2012/8/15      Modified support baud rate
    0.3        2012/10/31     Modified the values of Calibration LDO18
                              Fixed for module schematic
    0.4        2013/01/30     Modified Figure Error in page_15
    1.0        2013/07/03     First Version
    1.1        2013/07/09     Add descriptions in current consumption part
    1.2        2013/08/20     Update UART Baud rate information
    1.3        2013/10/01     Update current consumption & Timing Sequence photo




CONFIDENTIAL
© 2000~2012 iSSC Technologies Corp.
                                                                                   9



Document Created: 2019-10-13 13:56:41
Document Modified: 2019-10-13 13:56:41

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