Antenna spec.

FCC ID: 2AS8DSC1

Cover Letter(s)

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FCCID_4303824

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245C0X 規格 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type 02,04,06 版本 VERSION ： V3.3 日期 ISSUE DATE ： 2016/09/14 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 確 認 製 作 APPROVAL CHECKED DRAWN Ray Jason Eric Hong Kong 富廷科技股份有限公司 RIMON TECHNOLOGY CO., LTD. RIMON TECHNOLOGY CO., LTD. 香港九龍旺角彌敦道 582-592 號信和中心 804 室 114 台北市內湖區內湖路 2 段 352 號 4 樓之 6 RM804, Sino Centre., 582-592 Nathan Rd., Kln, Hong Kong 4F-6, No.352, Sec. 2, Neihu Rd., Neihu District,Taipei 114, Taiwan 電話: +886-2-2796-2568 傳真: +886-2-2796-6433 E-mail : service@rimon.com.tw

3216 Chip antenna For Bluetooth / WLAN Applications P/N: WAN3216F245C02 WAN3216F245C04 WAN3216F245C06 Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 RIMON TECHNOLOGY CO., LTD. 2/11

Part Number Information WAN 3216 F 245 C 0X A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+‐0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type 0X=02,04,06 / Type=02,04,06 1. Electrical Specification Specification WAN3216F245C02 Part Number WAN3216F245C04 WAN3216F245C06 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss ‐6.5 (Max) dB Peak Gain 1.05 dBi Impedance 50 Ohm Operating Temperature ‐40～+85 ℃ Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260℃) sec. Polarization Linear Azimuth Beamwidth Omni‐directional Termination Ni / Au (Leadless) Remark : Bandwidth & Peak Gain was measured under evaluation board of next page RIMON TECHNOLOGY CO., LTD. 3/11

2. Recommended PCB Pattern Evaluation Board Dimension  2nd Evaluation Board Dimension Suggested Matching Circuit RIMON TECHNOLOGY CO., LTD. 4/11

Layout Dimensions in Clearance area( Size=5.9*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm)  2nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) RIMON TECHNOLOGY CO., LTD. 5/11

3. Measurement Results Return Loss RIMON TECHNOLOGY CO., LTD. 6/11

Radiation Pattern X Z Y Efficiency Peak Gain Directivity 2450MHz 85.65% 1.75 dBi 2.89 dBi Chamber Coordinate System RIMON TECHNOLOGY CO., LTD. 7/11

4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage Pre‐heating temperature:150℃/60sec. 2. No visible mechanical damage Solder temperature:230±5℃ Duration:4±1sec. TEMP (℃) Solder:Sn‐Ag3.0‐Cu0.5 230℃ 4±1 sec. Flux for lead free: rosin 150℃ 60sec Solder heat 1. No visible mechanical damage Pre‐heating temperature:150℃/60sec. Resistance 2. Central Freq. change :within ± 6% Solder temperature:260±5℃ TEMP (℃) Duration:10±0.5sec. Solder:Sn‐Ag3.0‐Cu0.5 10±0.5 sec. 260℃ Flux for lead free: rosin 150℃ 60sec Component 1. No visible mechanical damage The device should be reflow Adhesion soldered(230±5℃ for 10sec.) to a tinned (Push test) copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component 1. No visible mechanical damage Insert 10cm wire into the remaining open Adhesion eye bend ,the ends of even wire lengths (Pull test) upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage +85℃=>30±3min -40℃=>30±3min 2. Central Freq. change :within ±6% Test cycle:10 cycles Phase Temperature(℃) Time(min) The chip shall be stabilized at normal 1 +85±5℃ 30±3 condition for 2~3 hours before 2 Room Within measuring. Temperature 3sec 3 -40±2℃ 30±3 4 Room Within Temperature 3sec Resistance to 1. No visible mechanical damage Temperature: 85±5℃ High Duration: 1000±12hrs 2. Central Freq. change :within ±6% Temperature The chip shall be stabilized at normal 3. No disconnection or short circuit. condition for 2~3 hours before measuring. Resistance to 1. No visible mechanical damage Temperature:-40±5℃ Low Duration: 1000±12hrs 2. Central Freq. change :within ±6% Temperature The chip shall be stabilized at normal 3. No disconnection or short circuit. condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage Temperature: 40±2℃ 2. Central Freq. change :within ±6% Humidity: 90% to 95% RH Duration: 1000±12hrs 3. No disconnection or short circuit. The chip shall be stabilized at normal condition for 2~3 hours before measuring. RIMON TECHNOLOGY CO., LTD. 8/11

5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. RIMON TECHNOLOGY CO., LTD. 9/11

6.Packaging Information Tape Specification: P0 P2 T D0 E F B0 W P A0 K0 W Ao Bo Ko P F E D Po P2 t 8.0 1.77 3.51 1.04 4.00 3.50 1.75 1.50 4.00 2.00 0.25 ±0.30 ±0.05 ±0.10 ±0.10 ±0.05 ±0.05 ±0.10 ±0.10 ±0.10 ±0.05 ±0.05 Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 RIMON TECHNOLOGY CO., LTD. 10/11

7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. RIMON TECHNOLOGY CO., LTD. 11/11


Document Created: 2016-11-07 14:30:36
Document Modified: 2016-11-07 14:30:36
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