Users Manual

FCC ID: 2AOUK-DHANM

Users Manual

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FCCID_3896728

DHAN-M Module DECT-ULE Platform Datasheet Version: 3.0 May 29, 2018

Version 3.0 DHAN-M Module Worldwide Sites Headquarters APAC Japan USA China DSP Group (Japan) Inc. DSP Group Inc. DSP Group (HK) Limited 1-29-1 Nishi-Gotanda 161 S San Antonio Rd Unit 1-4, 11/F, Shinagawa-Ku Tokyo 141-0031 Suite 10 909 Cheung Sha Wan Rd. Tel:+81-(3)-3493-3050 Los Altos, CA 94022 Kowloon Tel: (408)986-4300 Hong Kong Tomen Electronics Fax:(408)986-4323 Tel: +852-(3965)-5888 8-27, Kohnan 1 Chome, Minato-ku, Tokyo Israel DSP Group (Shenzhen) Limited 108-8510, Japan DSP Group Ltd. Room 1819, 18/F Tel: +81-(3)-5462-9619 5 Shenkar Street Kerry Centre, Renminnan Road, Fax: +81-(3)-5462-9686 Herzelia, Israel 4672505 Shenzhen, China 518001 Tel: 972-9-952-9696 Tel: +(86 755) 2518 1214 Korea Fax: 972-9-954-1234 Daesung Semiconductors Ascend Technology Inc. 140-848, RM 401 Europe Room 1303, Wonhyo BD. 46-1 Germany New World Center, Wonhyo-ro 3ka, Yongsan-gu, DSPG Technologies GmbH No.6009 Yitian Road, Seoul, Korea Nelson-Mandela-Platz 18 Futian District, Tel: +82-(2)-3272-7300 90459 Nurnberg Shenzhen City, China Fax: +82-(2)-712-4632-3 Tel: +49-911-2001-0 Tel: +86-755-820-24598 Fax: +49-911-2001-1210 Fax: +86-755-239-82986 India DSP Technology Indian Private Scotland Ascend Technology Inc. Limited DSPG Edinburgh Ltd. Rm 607, Information Technology Park Geddes House Hui Huang International Center, Nagawara Village Kasaba Hobli Kirkton North 1st Place, Shangdi 10th Road, Bangalore 560045 Livingston EH54 6GU Haidian District, Beijing City, P.R. Tel: +91 80 4024 8399 Tel: +44-1223-772200 Taiwan Ascendtek Electronics, Inc 11F-7, No. 77, Sec. 1 Hsin Tai Wu Rd., Hsi Chih Taipei Hsien, Taiwan, R.O.C Tel: 886-2-2698-8696 Fax: 886-2-8698-2138 This document is provided by DSP Group, Inc. and/or one or more of its subsidiaries (“DSP Group”). All information and data contained in this document is for informational purposes only, without any commitment on the part of DSP Group, and is not to be considered as an offer for a contract. DSP Group shall not be liable, in any event, for any claims for damages or any other remedy in any jurisdiction whatsoever, whether in an action in contract, tort (including negligence and strict liability) or any other theory of liability, whether in law or equity including, without limitation, claims for damages or any other remedy in whatever jurisdiction, and shall not assume responsibility for patent infringements or other rights to third parties, arising out of or in connection with this document. Further, DSP Group reserves the right to revise this publication and to make changes to its content, at any time, without obligation to notify any person or entity of such revision changes. These materials are copyrighted and any unauthorized use of these materials may violate copyright, trademark, and other laws. Therefore, no part of this publication may be reproduced, photocopied, stored on a retrieval system, or transmitted without the express written consent of DSP Group. Any new issue of this document invalidates previous issues. DSP Group reserves the right to revise this publication and to make changes to its content, at any time, without obligation to notify any person or entity of such revision changes. © 2018 DSP Group Confidential. All rights reserved. May 2018 DSP Group Confidential 2/24

Version 3.0 DHAN-M Module Table of Contents TABLE OF CONTENTS 1. INTRODUCTION ........................................................................................................................................... 5 General Description ............................................................................................................................................ 5 Features ............................................................................................................................................................... 5 Block Diagram .................................................................................................................................................... 5 2. PIN AND SIGNAL DESCRIPTION............................................................................................................... 6 3. MODULE ELECTRICAL SPECIFICATIONS .............................................................................................. 8 Absolute Maximum Rating ................................................................................................................................. 8 Recommended Operating Conditions ................................................................................................................. 8 Peak Currents and Hibernation Current .............................................................................................................. 8 Transmitter .......................................................................................................................................................... 9 Receiver .............................................................................................................................................................. 9 4. PROTOCOL STACKS .................................................................................................................................. 10 5. REFERENCE SCHEMATICS ...................................................................................................................... 11 Interface to Host Processor via UART and 3.3V Logic .................................................................................... 11 Host to DHAN-M Interface ........................................................................................................................ 11 Power Supply & (Optional) JTAG ............................................................................................................. 11 Interface to the Host Processor via UART and 1.8V Logic .............................................................................. 12 Host to DHAN-M Interface ........................................................................................................................ 12 Power Supply ............................................................................................................................................. 12 Interface to the Host Processor via USB and 3.3V Logic ................................................................................. 13 Host to DHAN-M Interface ........................................................................................................................ 13 Power Supply & (Optional) JTAG ............................................................................................................. 13 JTAG Interface ................................................................................................................................................. 14 RSTN Input ....................................................................................................................................................... 14 MIC and Ear Speaker Interfaces ....................................................................................................................... 14 6. APPLICATION PCB DESIGN RECOMMENDATIONS............................................................................ 15 7. DIVERSITY ANTENNA (OPTION)............................................................................................................ 16 8. ASSEMBLY INFORMATION ..................................................................................................................... 17 Mechanical Drawing ......................................................................................................................................... 17 PCB Metal Land Pattern Recommendation ...................................................................................................... 18 PCB Solder Mask Recommendation ................................................................................................................. 19 PCB Stencil Pattern Recommendation.............................................................................................................. 20 Pick & Place, Reflow ........................................................................................................................................ 20 9. SUPPLEMENTARY INFORMATION ........................................................................................................ 21 Labeling (appended to the module shield) ........................................................................................................ 21 RF Exposure information and statement ........................................................................................................... 21 FCC & IC Interference statement RFPI and EMC.................................................................................................................................................. 22 (DoC) Declaration of conformity OEM Notes IC labeling requirements for the final end product Ordering Information ........................................................................................................................................ 23 May, 2018 DSP Group Confidential 3/24

Version 1.5 DHX91 DHAN Module Datasheet Table of Contents Change Log ....................................................................................................................................................... 24 May 2018 DSP Group Confidential 4/24

Yerion 20 DHANM Modite Invoducion 1. Introduction General Description "The DSPG DHAN M modile is bsed on thwate o0 h an DCXE a 2@‘generaion DECT SCC. The DHAN: M modite is suted foDECT—ULE appliaions tacerploy a processorexiema o the DHAN.M. The DHAN M can serv as a DECT—UUE Hub (=Base Staton) whenloaded with a CMBS SW image Thiimage nclides sundadd DECTUUE MAG—PHIY comectviy as wel as CAT—1Q ineonaliy o bradtionl DECT elphony d HANIEUN e te ULE AllinceSandart) Aincionality for ULE Cow pover packet mode) ‘The DHAN.M en alsbe loaded with a SW image that hatempouersh medule witha DECT hanisn" proil (CMFIS) Asabove, oth UART and USB imerfces m avlable orcontal and, in e case where audlo medsto be ransfmed btween the CMS aigetandtheFosProcesso, TDM orUSB Audko Class n be uilied Teithercae,the DHANM imerfceswth h Hot Processr ia UART or USB. Audl is ramfened itvia "TDM (wil comet via UART) orvia USB (Audo Clasn Featres + Exelntradlo performance,withover 12308 system gain + A prined aniema is included in tb modite, A 2 anerna pouis provided and cbe routed to an optonal dversiy anennalocted elsetne i heappleaton housing + Rako cover alegional DECTbands. A simplee—contiuraton of he EEPROM isrequired + Rakis filly compllanwl ETST DECT and ULE sandards. Repulatery (EU, CC)cenfexion s pending + Compact medile frin 0(27.2k15 223 (ncluding e RE shield heigho + Operaing Temperaine spaming 40Cio 65°C Block Diagram *********shaum I I poxst |——— ‘ o 8 | ,,,,,,,,,,,, I DHAN—M Module Block Diagram Naycore DSP Greup Contdewiat sna

Version 3.0 DHAN-M Module Pin and Signal Description 2. Pin and Signal Description PIN NO. NAME DESCRIPTION/TYPE 1 GND Place many vias in the vicinity of this pin Optional port for connection to a diversity antenna 2 ANT2 located elsewhere in the housing. Otherwise terminate with a 51-Ohm resistor 3 GND Place many vias in the vicinity of this pin Resets the DCX81 SOC. See reference schematic 4 RSTN and comments 5 GPIO17 GPIO or I2C Clock. Open Drain, reset value is 6 SCL (GPIO0) floating GPIO or I2C Data. Open Drain, reset value is 7 SDA (GPIO1) floating 8 GPIO2 (PCM_Tx) TDM Tx Data 9 GPIO3 (PCM_Rx) TDM_Rx Data GPIO4 10 TDM Frame Sync (PCM_FSYNC) GPIO5 11 TDM SCLK (PCM_CLK) GPIO6 12 SPI Data Input to the DHAN-M (SPI_MOSI) GPIO7 13 SPI Data Output from the DHAN-M (SPI_MISO) 14 GPIO8 (SPI_CLK) SPI Clock GPIO9 (RxD or 15 UART Rx (most typically) or SPI Chip Select SPI_CS) GPIO28 16 (DM_USB) USB Positive Pin 17 GPIO29 (DP_USB) USB Negative Pin 18 GND 19 TDI JTAG Data In. Should be connected to TP 20 TMS JTAG Mode Select. Should be connected to TP 21 TDO JTAG Data Out. Should be connected to TP 22 TCK JTAG Clock. Should be connected to TP 23 RTCK JTAG Reset. Should be connected to TP 24 GPIO10 (TxD) GPIO or UART Tx 25 GND 26 GND May 2018 DSP Group Confidential 6/24

Yerion 0 DHANM Modite Pinand SiznatDescripion pinio. Name bescuirnioniyer = veay Pover Supgly ow 2s vearo Tovers e 10 levl shers 1.8or 33¥.See reference schemaies 2o veatana Tover (oZ Supply Inp To e andog porion af t 5o vovscare 31 tepsmwoont x vons ADC Chedk o Power Seerefeence schemaic 3 Pm x Now Merephone nesuive mpn 3 ho Merephone posiveow s wssror FndseiNedit poiive pesier cup x7 tour Line Ouipacor HandeNeadsc regaive spenir cupm 3: Fimo E3 ane «o verr Tover Supply in to RF Add 10pFbypass capacior adcent hiin @1 anm Texpn Leme incommsed a ono Fiacmanyvias n t vcinty tts pn Gno cno—— ant2 astn anti criou7 mopute: Too DHAN—M_MODULE Tok arek ertoro no 27 2s Em 351 424 veatana jerl nouscarze 351 tepsing/octNi 31 3 351 361 37 361 «) 301 2 321 NMay2018 DSP Group Contdenial es

Version 3.0 DHAN-M Module Module Electrical Specifications 3. Module Electrical Specifications All parameters are for 25ºC. Absolute Maximum Rating Table 3-1: Absolute Maximum Rating Minimum Voltage Applied to all pins: -0.3V Maximum Voltage Applied to all pins: +4.6V Storage Temperature Range: -45 to 90ºC Note: Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability. Recommended Operating Conditions Table 3-2: Recommended Operating Conditions RATING CONDITIONS MIN TYP MAX UNIT Operating ambient -40 +25 +85 °C temperature VccRF, VCC 2 3.0 3.6 V JTAG, UART VIL 0.8 V VIH 2.0 VOL 0.4 VOH 2.4 (VCC is at nominal 3V) DCIN3 2 3.0 VCC V Peak Currents and Hibernation Current PARAMETER TEST CONDITIONS TYP MAX UNIT Tx Current VccRF=3 V 400 480 mA VCC=3 V Band=EU @ 23dBm Tx Current VccRF=3 V 250 300 mA VCC=3 V Band=US @ 21 dBm Rx Current VccRF=3 V 125 135 mA VCC=3 V May 2018 DSP Group Confidential 8/24

Version 3.0 DHAN-M Module Module Electrical Specifications Transmitter Table 3-3: Tx Characteristics CHARACTERISTICS TEST CONDITIONS MIN TYP MAX UNIT NTP VccRF=3 V 21.5 23 24 dBm VCC=3 V Band=EU NTP VccRF=3 V 19 20 21 dBm VCC=3 V Band=US Harmonics VccRF=3 V -40 -35 dBm VCC=3 V Band=EU & US Transmission Mask EN 301406 Comply N/A Paragraph 5.3.3 Frequency Offset EN 301406 -50 8 +50 KHz Paragraph 5.3.1 Frequency Drift EN 301406 -15 0 +15 KHz/Slot Paragraph 5.3.5 Emission Due EN 301406 dBm Modulation Paragraph 5.3.6.2 M±1 -20 -8 M±2 -42 -30 M±3 -47 -40 M>±3 -50 -44 Receiver Table 3-4: Rx Characteristics CHARACTERISTICS TEST CONDITIONS MIN TYP MAX UNIT Sensitivity, BER < VccRF=3 V -96 -93 dBm 1000ppm VCC=3 V Maximum input power VccRF=3 V 15 dBm VCC=3 V May 2018 DSP Group Confidential 9/24

Version 3.0 DHAN—M Module Schematic Guide 4. Protocol Stacks The module comes configured for the role of a DECT—ULE Hub (=Base Station) with control via the 2—pin UART interface according to the CMBS API. This API supports both traditional telephony functionality (per the CAT—IQ standard as well as ULE HAN—FUN functionality. Concurrent audio paths are supported at the TDM (IOM) interface running between the Host Processor and the DHAN—M. The "division of labor" and interface between the Host Application and the standard CMBS protocol stack is depicted below: DHAN—M with CMBS e CMBS C UART API a driver driver B HOST Board Octopus Host PCM APP driver Alternatively, the customer can request to download an image which uses the USB interface for both control and audio — as depicted below: DHAN—M with CMBS USB C C CMBS p UART UART e cCmMBS - API driver driver R R HOST Board Octopus HOST PCM APP driver Similarly, customers wanting to implement a high—end DECT—ULE Device (=end point or PP), can request a CMHS image, with either UART or USB interface options. Reference Schematics for both USB and UART options are supplied in the following Section. May 2018 DSP Group Confidential 10/24

Version 3.0 DHAN—M Module Schematic Guide 5. Reference Schematics General Note: The 3.3V regulator should be capable of regulating the output with the module drawing 450mA for 0.5mS during the Tx burst! Interface to Host Processor via UART and 3.3V Logic Host to DHAN—M Interface rewe ty rek l sow Pm FOk Q® i P & 4 wat m —+ HOST CPU usat prtersace c saumer wont manety ~ wat SoxC BONDDDREGgER¢! $§Ei090¢5¢*"§®5# L / we -- ons #4_MODuLr e & me tf 1if $ les nse n GAHHAT *BE% PA B0 #oXs row can <» nejenjein v lefa seue_rem,povig wos rink vOCn) + ; ww rew t% wou i us t s row mx #CM. TX ® ¥ voon.M? * 7 + . a + wOOs# e ind us WOMe—+ i sums voukd Mn paa 7 romm .c« nost 5tw sesit Power Supply & (Optional) JTAG M ue i i i | veosus f1 RSs boo i i 1 0R veern i i 1 1i ii 11 10 Rrok i rse 1 i To i 0A veere 1 I 1 i i I Ees i 1 i 1000 Rss i 1 I ovs 0R i I i t———M———oveays Aiicininininininininininininininininiainininiaiaiataintainis i = i I r i i oR i 1 ————avecioavs i 1 i Note: The PCM (=TDM =I°S) Interface is required only in applications where audio must be exchanged between the DHAN—M and the Host Processor. May 2018 DSP Group Confidential 11/24

Version 3.0 DHAN—M Module Schematic Guide Interface to the Host Processor via UART and 1.8V Logic Host to DHAN—M Interface B5 MOSt Cu wert perwex t 200 0h awessssswww,,........ stt 90 w smer mc3 catt is mar ow }e._._...@3 #% t seute ns n oo foswww——_—__£3 K JPR wat 0t t puuwww_.c33 Mn $ mruum _ rr t smy _33 s t Power Supply May 2018 DSP Group Confidential 12/24 1

Version 3.0 DHAN—M Module Schematic Guide Interface to the Host Processor via USB and 3.3V Logic Hostto DHAN—M Interface & & wost cru Gnn prece auoer sC ¢ wure } w STHEH mubi0tont ts t— w2 —try 4 vame—y nxame | vonre 27 rows.ox sesesee f wser Power Supply & (Optional) JTAG May 2018 DSP Group Confidential 13724 mmz

Version 3.0 DHAN—M Module Schematic Guide JTAG Interface Easy access to the JTAG interface is a MUST for customers requiring a SW image other than the CMBS UART stack which is standard on the DHAN—M. The standard 20—pin connector shown in the reference schematic is convenient if the application board can accommodate it. Alternatively, test pins should be added which can be accessed both during prototyping and production. RSTN Input At power—up, the Application Host should hold this pin at logic Low until it is ready to establish communication (via UART) with the DHAN—M. When ready, the MCU should apply Logic High and wait for the "Hello" indication from the DHAN—M. If at some point later on the MCU cannot communicate with the DHAN—M, it can apply a low going pulse of >100uS to reset the DCXB1 on the DHAN—M. MIC and Ear Speaker Interfaces Some CMHS applications will need to route toffrom the DHAN—M MIC and Speaker interfaces — reference schematiesfor these connections are shown below: MICROPHONE R1 Oohm vewr c1 I ro our 2.2Kohm S c i sonF $ mip 1| & 11 1 & cs rs 8 =— 1Kohm 2 5 2rpF ; MN 1| uz ra l c+ & 1Kohm SenF $RS 2.2Kohm ~~ C9 10pF Hsspoutr a1 cro |_ 220C routo soigsns m o2 tor EAR SPEAKER May 2018 DSP Group Confidential 14724

Version 3.0 DHAN—M Module Schematic Guide [ 6. Application PCB Design Recommendations It is recommended that unused pads on the Application PCB not be left as isolated islands of copper but rather be anchored with via to inner layers of the PCB. It is also recommend that GND vias be applied liberally in the vicinity of GND pins 1,3 and 42. The following layout recommendations need to be apply on Main Board: 1. Implement a solid ground under the DHAN—M module. 2. Do not route signal traces under the module. Use the bottom layer for signal routing. 3. Locate the on—board printed antenna on the edge of the PCB —as pictured below 4. Locate the antenna in the housing in such a way that minimizes obstruction of the radiation pattern by metallic objects DCXK81MDOCFAESAMI 1726000800.01.0001 May 2018 DSP Group Confidential 15/24

Version 3.0 DHAN-M Module Schematic Guide 7. Diversity Antenna (OPTION) If no diversity antenna is planned, a 51-Ohm chip resistor should be placed as close as possible from Pin2 to GND. Alternatively, Pin2 can be routed to a Diversity antenna. There are several options for a diversity antenna: a) Route a 50-ohm line to an RF connector on the Application Board and RF cable to a connectorized commercial antenna mounted in elsewhere in the device housing b) Route the 50-ohm line to the antenna feed point located ~8cm from the on-board antenna feed-point. This antenna can be a ¼ wave monopole wire antenna, chip or printed antenna (similar to the on-board antenna). Guidelines for such antennas are given below:  A wire antenna can be inserted through a via at the feed-point. It should extend vertically with respect to the face of the PCB. The total length of the wire antenna should be ¼ Lambda (~40.0 mm). It is important to ensure an adequate ground plane near the feed point in order to obtain maximal antenna gain and efficiency  Off the shelf chip antennas: P/N Manufacturer H2U74W1H1M0100 Unictron ANT8868LL00R1880A Yageo CAN4311112001881K Yageo W3022 Pulse Elect  Inverted-F printed antenna – See www.dspg.com for analysis and database for such an antenna. In this case, the orientation of the antenna should be rotated 90⁰ with respect to the DHAN-M antenna May 2018 DSP Group Confidential 16/24

Version 3.0 DHAN—M Module Schematic Guide mmmmmmmmmmmmmmmy 8. Assembly Information An electronic version of the information in this Section can be downloaded from the DSP Group website, in the HW Developer‘s Collateral section. Thefiles Mechanical Drawing Mechanical Drawing —E= 6.7imm t!~ <)—— 20.50mm ——E>) . (PCB Length) RF Shield <3—— 27.20mm m (Shield Thickness) . 0.20 (Shield Length) Aomm 0.97mm| [3—— 19.52mn —E |<— 0.80mm W W (PCB Thickness) 3.15mm I \ 4 ?1 13.17mm 40i| (Shield Width) 15.20mm(PCB Width) {PCB Width)15.20mm s1f C i o i {7 17mm | ‘ 47 © {Z 127mm(Pitch) 3.3mm %{ S (Same for all connectors) May 2018 DSP Group Confidential 17/24

Version 3.0 DHAN—M Module Schematic Guide PCB Metal Land Pattern Recommendation #4} ars 175 Area without Comp‘s and routes in all fayers 150 Circk copper free Connect Top side pour to ~ v33—'| GND plane using ample vias A PADS OTHER PADS *T it ;J 'j\.lfl ;;:¢ .‘J\JO ALL DIMENSIONS in MM May 2018 DSP Group Confidential 1824

Version 3.0 DHAN—M Module Schematic Guide mmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmm PCB Solder Mask Recommendation A A BBBBBBpppnnonenn—— Baneaaenenenseened ——— A A A PADS OTHER PADS _2 my—*> 3 m—** M Pss 4t May 2018 DSP Group Confidential 19/24 smm

Version 3.0 DHAN—M Module Schematic Guide PCB Stencil Pattern Recommendation A PADS OTHER PADS & ugo 0711 ’@*1 36 ALL DIMENSIONS in MM Pick & Place, Reflow The DHAN—M module uses a flat shield cover to facilitate a fully automatic assembly process. For backing and reflow recommendations, use MSL 3 in the JEDEC/IPC standard J—STD—20b. The temperature classification (TC) for the module is 245° C. May 2018 DSP Group Confidential 20024

Version 3.0 DHAN—M Module Schematic Guide 9. Supplementary Information Labeling (appended to the module shield) CE FCC ID: 2AOUK—DHANM IC: 23573—1DHANM Model: DHAN—M DCX81MDOCFAESAMI The part number | YYWMMOCOCOLHH.SSSS | 1) Year 2) Week 3) 6—digit serial# 4) HW Version 5) SW Version Handling Guidance This module includes highly sensitive electronic circuity. Handling without proper ESD protection may damage the module permanently. RF Exposure Information and Statement This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 em between the radiator and your body. This transmitter must not be co—located or operating in conjunction with any other antenna or transmitter. Cet équipement est conforme aux limites d‘ exposition aux ravonnements de 1a IC établies pour un environnement non controé. Cet équipement doit étre installé et fonctionner a au moins 20 cm de FCC & IC Interference Statement _ This device complies with part 15 of the FCC rules and RSS—213 of Industry Canada. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. May 2018 DSP Group Confidential 21/24 mm

Version 3.0 DHAN-M Module Schematic Guide Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help - This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter Declaration of Conformance (DOC) Hereby, DSP Group Ltd declares that the radio equipment type DHAN-M is in compliance with Directive 2014/53/EU. The full text of the EU Declaration of Conformity is available at the following internet address: www.dspg.com.hk ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES: The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmit ter module FCC ID: 2AOUK-DHANM Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditi ons: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received including interference that may cause undesired operation.” The module is limited to installation in mobile or fixed applications. Separate approval is required for all other opera- ting configurations, including portable configuration with respect to Part 2.1093 and different antenna configurations . May 2018 DSP Group Confidential 22/24

Version 3.0 DHAN-M Module Schematic Guide A module or modules can only be used without additional authorizations if they have been tested and granted under same intended end-use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have The grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC app lication filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance inf ormation (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requ irements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together . This Module is full modular approval,it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product including the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user of the final host device. IC labeling requirement for the final end product The final end product must be labeled in a visible area with the following “Contains IC:23573-DHANM” The Host Marketing Name (HMN) must be indicated at any location on the exterior of the host product or product packaging or product literature, which shall be available with the host product or online. RFPI and EMC Each DHAN-M Module is shipped to the customer with a unique RFPI – its DECT identity. DHAN-M will ship with an “EMC” of 0xFEB. This is the DSP Group “generic” EMC. The EMC setting identifies a Device as belonging to a specific group of ULE Devices/Hubs that utilize some proprietary signaling. In either case, the customer is free to re-program these parameters. Ordering Information Part #: DCX81MD0CFAE5AMI May 2018 DSP Group Confidential 23/24

Version 3.0 DHAN-M Module Schematic Guide Change Log Table 9-1: List of Changes REVISION DATE DESCRIPTION 1.0 May 24, 2017 Baseline release *Add PCB metal, mask and stencil information *Modify Pinout and Pinout Numbering *Modify App Schematics to match new pinout September 13, 2.0 *Modify Vmin from 1.95 to 2V 2017 *Add SW Stack description with options for CMHS, CMBS & UART/USB *Add detail regarding antenna layout and options for Diversity *Add reference schematic for MIC and Ear SPK 3.0 In progress *Need to add USB and CMHS Parts 4.0 May 5 2018 *Add OEM Notes 5.0 May 5 2018 *IC Labeling requirements for the final end product May 2018 DSP Group Confidential 24/24


Document Created: 2018-05-29 10:24:12
Document Modified: 2018-05-29 10:24:12
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