Users Manual

FCC ID: 2AOUK-DHANM

Users Manual

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FCCID_3896728

DHAN-M Module
DECT-ULE Platform

   Datasheet
    Version: 3.0




      May 29, 2018


Version 3.0                                                      DHAN-M Module                                                    Worldwide Sites




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                                                                                                                 11F-7, No. 77, Sec. 1
                                                                                                                 Hsin Tai Wu Rd.,
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   This document is provided by DSP Group, Inc. and/or one or more of its subsidiaries (“DSP Group”). All information and data contained
   in this document is for informational purposes only, without any commitment on the part of DSP Group, and is not to be considered as an
   offer for a contract. DSP Group shall not be liable, in any event, for any claims for damages or any other remedy in any jurisdiction
   whatsoever, whether in an action in contract, tort (including negligence and strict liability) or any other theory of liability, whether in law
   or equity including, without limitation, claims for damages or any other remedy in whatever jurisdiction, and shall not assume responsibility
   for patent infringements or other rights to third parties, arising out of or in connection with this document. Further, DSP Group reserves
   the right to revise this publication and to make changes to its content, at any time, without obligation to notify any person or entity of such
   revision changes. These materials are copyrighted and any unauthorized use of these materials may violate copyright, trademark, and other
   laws. Therefore, no part of this publication may be reproduced, photocopied, stored on a retrieval system, or transmitted without the express
   written consent of DSP Group. Any new issue of this document invalidates previous issues.
   DSP Group reserves the right to revise this publication and to make changes to its content, at any time, without obligation to notify any
   person or entity of such revision changes.
   © 2018 DSP Group Confidential. All rights reserved.




May 2018                                                    DSP Group Confidential                                                               2/24


Version 3.0                                                                        DHAN-M Module                                                           Table of Contents



                                                              TABLE OF CONTENTS
1.     INTRODUCTION ........................................................................................................................................... 5
     General Description ............................................................................................................................................ 5
     Features ............................................................................................................................................................... 5
     Block Diagram .................................................................................................................................................... 5

2.      PIN AND SIGNAL DESCRIPTION............................................................................................................... 6

3.     MODULE ELECTRICAL SPECIFICATIONS .............................................................................................. 8
     Absolute Maximum Rating ................................................................................................................................. 8
     Recommended Operating Conditions ................................................................................................................. 8
     Peak Currents and Hibernation Current .............................................................................................................. 8
     Transmitter .......................................................................................................................................................... 9
     Receiver .............................................................................................................................................................. 9

4.      PROTOCOL STACKS .................................................................................................................................. 10

5.     REFERENCE SCHEMATICS ...................................................................................................................... 11
     Interface to Host Processor via UART and 3.3V Logic .................................................................................... 11
         Host to DHAN-M Interface ........................................................................................................................ 11
         Power Supply & (Optional) JTAG ............................................................................................................. 11
     Interface to the Host Processor via UART and 1.8V Logic .............................................................................. 12
         Host to DHAN-M Interface ........................................................................................................................ 12
         Power Supply ............................................................................................................................................. 12
     Interface to the Host Processor via USB and 3.3V Logic ................................................................................. 13
         Host to DHAN-M Interface ........................................................................................................................ 13
         Power Supply & (Optional) JTAG ............................................................................................................. 13
     JTAG Interface ................................................................................................................................................. 14
     RSTN Input ....................................................................................................................................................... 14
     MIC and Ear Speaker Interfaces ....................................................................................................................... 14

6.      APPLICATION PCB DESIGN RECOMMENDATIONS............................................................................ 15

7.      DIVERSITY ANTENNA (OPTION)............................................................................................................ 16

8.     ASSEMBLY INFORMATION ..................................................................................................................... 17
     Mechanical Drawing ......................................................................................................................................... 17
     PCB Metal Land Pattern Recommendation ...................................................................................................... 18
     PCB Solder Mask Recommendation ................................................................................................................. 19
     PCB Stencil Pattern Recommendation.............................................................................................................. 20
     Pick & Place, Reflow ........................................................................................................................................ 20

9.     SUPPLEMENTARY INFORMATION ........................................................................................................ 21
     Labeling (appended to the module shield) ........................................................................................................ 21
     RF Exposure information and statement ........................................................................................................... 21
     FCC & IC Interference statement
     RFPI and EMC.................................................................................................................................................. 22
     (DoC) Declaration of conformity
     OEM Notes
     IC labeling requirements for the final end product
     Ordering Information ........................................................................................................................................ 23



May, 2018                                                                   DSP Group Confidential                                                                                3/24


       Version 1.5                                            DHX91 DHAN Module Datasheet                                                         Table of Contents


 Change Log ....................................................................................................................................................... 24




May 2018                                                            DSP Group Confidential                                                                               4/24


Yerion 20                                   DHANM Modite                                 Invoducion


1.   Introduction
General Description
 "The DSPG DHAN M modile is bsed on thwate o0 h an DCXE a 2@‘generaion DECT SCC. The DHAN:
 M modite is suted foDECT—ULE appliaions tacerploy a processorexiema o the DHAN.M. The DHAN M
 can serv as a DECT—UUE Hub (=Base Staton) whenloaded with a CMBS SW image Thiimage nclides
 sundadd DECTUUE MAG—PHIY comectviy as wel as CAT—1Q ineonaliy o bradtionl DECT elphony d
 HANIEUN e te ULE AllinceSandart) Aincionality for ULE Cow pover packet mode)
 ‘The DHAN.M en alsbe loaded with a SW image that hatempouersh medule witha DECT hanisn" proil
 (CMFIS) Asabove, oth UART and USB imerfces m avlable orcontal and, in e case where audlo medsto
 be ransfmed btween the CMS aigetandtheFosProcesso, TDM orUSB Audko Class n be uilied
 Teithercae,the DHANM imerfceswth h Hot Processr ia UART or USB. Audl is ramfened itvia
 "TDM (wil comet via UART) orvia USB (Audo Clasn

Featres
       + Exelntradlo performance,withover 12308 system gain
       + A prined aniema is included in tb modite, A 2 anerna pouis provided and cbe routed to an
         optonal dversiy anennalocted elsetne i heappleaton housing
       + Rako cover alegional DECTbands. A simplee—contiuraton of he EEPROM isrequired
       + Rakis filly compllanwl ETST DECT and ULE sandards. Repulatery (EU, CC)cenfexion s
         pending
       + Compact medile frin 0(27.2k15 223 (ncluding e RE shield heigho
       + Operaing Temperaine spaming 40Cio 65°C
Block Diagram
                   *********shaum
                                                              I

                                                              I
                                      poxst          |——— ‘
                                                      o
                                                       8      |

                   ,,,,,,,,,,,, I


                                 DHAN—M Module Block Diagram



Naycore                                DSP Greup Contdewiat                                   sna


Version 3.0                              DHAN-M Module                               Pin and Signal Description




2. Pin and Signal Description

              PIN NO.       NAME                          DESCRIPTION/TYPE
                 1           GND            Place many vias in the vicinity of this pin
                                            Optional port for connection to a diversity antenna
                 2           ANT2           located elsewhere in the housing. Otherwise
                                            terminate with a 51-Ohm resistor
                 3           GND            Place many vias in the vicinity of this pin

                                            Resets the DCX81 SOC. See reference schematic
                 4           RSTN
                                            and comments

                 5          GPIO17
                                            GPIO or I2C Clock. Open Drain, reset value is
                 6        SCL (GPIO0)
                                            floating
                                            GPIO or I2C Data. Open Drain, reset value is
                 7        SDA (GPIO1)
                                            floating
                 8      GPIO2 (PCM_Tx)      TDM Tx Data
                 9      GPIO3 (PCM_Rx)      TDM_Rx Data
                            GPIO4
                10                          TDM Frame Sync
                         (PCM_FSYNC)
                            GPIO5
                11                          TDM SCLK
                          (PCM_CLK)
                            GPIO6
                12                          SPI Data Input to the DHAN-M
                          (SPI_MOSI)
                            GPIO7
                13                          SPI Data Output from the DHAN-M
                          (SPI_MISO)
                14      GPIO8 (SPI_CLK)     SPI Clock
                         GPIO9 (RxD or
                15                          UART Rx (most typically) or SPI Chip Select
                            SPI_CS)
                            GPIO28
                16
                           (DM_USB)         USB Positive Pin
                17      GPIO29 (DP_USB)     USB Negative Pin
                18           GND
                19           TDI            JTAG Data In. Should be connected to TP
                20           TMS            JTAG Mode Select. Should be connected to TP
                21           TDO            JTAG Data Out. Should be connected to TP
                22           TCK            JTAG Clock. Should be connected to TP
                23          RTCK            JTAG Reset. Should be connected to TP
                24       GPIO10 (TxD)       GPIO or UART Tx
                25           GND
                26           GND




May 2018                                  DSP Group Confidential                                          6/24


Yerion 0                            DHANM Modite                        Pinand SiznatDescripion
           pinio.          Name                       bescuirnioniyer
             =             veay         Pover Supgly ow
             2s            vearo        Tovers e 10 levl shers 1.8or 33¥.See
                                        reference schemaies
             2o         veatana         Tover
                                        (oZ Supply Inp To e andog porion af t
             5o       vovscare
             31      tepsmwoont
             x          vons            ADC Chedk o Power Seerefeence schemaic
             3          Pm
             x           Now            Merephone nesuive mpn
             3               ho         Merephone posiveow
             s             wssror       FndseiNedit poiive pesier cup
             x7             tour        Line Ouipacor HandeNeadsc regaive spenir
                                        cupm
             3:             Fimo
             E3              ane
             «o             verr        Tover Supply in to RF Add 10pFbypass
                                        capacior adcent hiin
             @1            anm          Texpn Leme incommsed
             a             ono          Fiacmanyvias n t vcinty tts pn
                                                           Gno
                                                           cno——
                                                          ant2
                                                          astn




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                                                        criou7

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                  Too                   DHAN—M_MODULE
                  Tok
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                  no




                         27
                         2s
                         Em


                        351
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                                    jerl nouscarze
                                    351 tepsing/octNi
                                    31
                                    3
                                    351
                                    361
                                    37
                                    361
                                    «)
                                    301
                                    2
                                    321
NMay2018                              DSP Group Contdenial                                 es


Version 3.0                                    DHAN-M Module                            Module Electrical Specifications




3. Module Electrical Specifications
      All parameters are for 25ºC.

Absolute Maximum Rating

                                     Table 3-1: Absolute Maximum Rating
Minimum Voltage Applied to all pins: -0.3V
Maximum Voltage Applied to all pins: +4.6V
Storage Temperature Range: -45 to 90ºC
      Note: Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for
        extended periods may affect device reliability.

Recommended Operating Conditions

                             Table 3-2: Recommended Operating Conditions

                      RATING             CONDITIONS         MIN       TYP         MAX        UNIT
                 Operating ambient                         -40      +25           +85        °C
                 temperature
                 VccRF, VCC                                  2      3.0           3.6        V
                 JTAG, UART              VIL                                      0.8        V
                                         VIH                 2.0
                                         VOL                                      0.4
                                         VOH                 2.4
                                         (VCC is at
                                         nominal 3V)
                 DCIN3                                       2      3.0           VCC        V


Peak Currents and Hibernation Current

                     PARAMETER           TEST CONDITIONS           TYP      MAX          UNIT
                     Tx Current         VccRF=3 V                  400      480         mA
                                        VCC=3 V
                                        Band=EU @ 23dBm
                     Tx Current         VccRF=3 V                  250      300         mA
                                        VCC=3 V
                                        Band=US @ 21 dBm
                     Rx Current         VccRF=3 V                  125      135         mA
                                        VCC=3 V




May 2018                                       DSP Group Confidential                                             8/24


Version 3.0                                   DHAN-M Module                         Module Electrical Specifications




Transmitter

                                       Table 3-3: Tx Characteristics

           CHARACTERISTICS          TEST CONDITIONS          MIN            TYP     MAX        UNIT
           NTP                      VccRF=3 V               21.5        23         24        dBm
                                    VCC=3 V
                                    Band=EU


           NTP                      VccRF=3 V               19          20         21        dBm
                                    VCC=3 V
                                    Band=US
           Harmonics                VccRF=3 V                           -40        -35       dBm
                                    VCC=3 V
                                    Band=EU & US
           Transmission Mask        EN 301406                           Comply               N/A
                                    Paragraph 5.3.3
           Frequency Offset         EN 301406               -50         8          +50       KHz
                                    Paragraph 5.3.1
           Frequency Drift          EN 301406               -15         0          +15       KHz/Slot
                                    Paragraph 5.3.5
           Emission Due             EN 301406                                                dBm
           Modulation               Paragraph 5.3.6.2
                                    M±1                                 -20        -8
                                    M±2                                 -42        -30
                                    M±3                                 -47        -40
                                    M>±3                                -50        -44
Receiver

                                       Table 3-4: Rx Characteristics

              CHARACTERISTICS           TEST CONDITIONS           MIN        TYP   MAX       UNIT
              Sensitivity, BER <        VccRF=3 V                           -96    -93      dBm
              1000ppm                   VCC=3 V

              Maximum input power       VccRF=3 V                                  15       dBm
                                        VCC=3 V




May 2018                                      DSP Group Confidential                                          9/24


Version 3.0                                   DHAN—M Module                                         Schematic Guide




4.     Protocol Stacks
      The module comes configured for the role of a DECT—ULE Hub (=Base Station) with control via the 2—pin
      UART interface according to the CMBS API. This API supports both traditional telephony functionality (per
      the CAT—IQ standard as well as ULE HAN—FUN functionality. Concurrent audio paths are supported at the
      TDM (IOM) interface running between the Host Processor and the DHAN—M. The "division of labor" and
      interface between the Host Application and the standard CMBS protocol stack is depicted below:


                                                                                   DHAN—M with CMBS
                                                                                           e
                     CMBS   C        UART
                     API    a        driver                                   driver       B

               HOST Board                                                                                Octopus

                     Host                                                     PCM
                      APP                                                     driver




Alternatively, the customer can request to download an image which uses the USB interface for both control and
audio — as depicted below:



                                                                      DHAN—M with CMBS USB
                       C                                                               C
              CMBS     p    UART                                     UART              e   cCmMBS   -
               API          driver                                   driver
                       R                                                               R

        HOST Board                                                                                  Octopus
              HOST                                                   PCM
              APP                                                    driver




Similarly, customers wanting to implement a high—end DECT—ULE Device (=end point or PP), can request a CMHS
image, with either UART or USB interface options. Reference Schematics for both USB and UART options are
supplied in the following Section.




May 2018                                       DSP Group Confidential                                         10/24


Version 3.0                                                      DHAN—M Module                                                                                   Schematic Guide




5.          Reference Schematics
General Note: The 3.3V regulator should be capable of regulating the output with the module drawing 450mA for
0.5mS during the Tx burst!


Interface to Host Processor via UART and 3.3V Logic
Host to DHAN—M Interface
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Power Supply & (Optional) JTAG


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1                                                                ————avecioavs                                      i
1                                                                                                                   i

Note: The PCM (=TDM =I°S) Interface is required only in applications where audio must be exchanged between the
DHAN—M and the Host Processor.




May 2018                                                          DSP Group Confidential                                                                                   11/24


Version 3.0                                                    DHAN—M Module             Schematic Guide




Interface to the Host Processor via UART and 1.8V Logic
Host to DHAN—M Interface


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Power Supply




May 2018                                                        DSP Group Confidential             12/24
1


Version 3.0                          DHAN—M Module                               Schematic Guide




Interface to the Host Processor via USB and 3.3V Logic
Hostto DHAN—M Interface



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Power Supply & (Optional) JTAG




May 2018 DSP Group Confidential 13724
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Version 3.0                                       DHAN—M Module                                      Schematic Guide




JTAG Interface
Easy access to the JTAG interface is a MUST for customers requiring a SW image other than the CMBS UART stack
which is standard on the DHAN—M. The standard 20—pin connector shown in the reference schematic is convenient if
the application board can accommodate it. Alternatively, test pins should be added which can be accessed both during
prototyping and production.

RSTN Input
At power—up, the Application Host should hold this pin at logic Low until it is ready to establish communication (via
UART) with the DHAN—M. When ready, the MCU should apply Logic High and wait for the "Hello" indication
from the DHAN—M. If at some point later on the MCU cannot communicate with the DHAN—M, it can apply a low
going pulse of >100uS to reset the DCXB1 on the DHAN—M.

MIC and Ear Speaker Interfaces
Some CMHS applications will need to route toffrom the DHAN—M MIC and Speaker interfaces — reference
schematiesfor these connections are shown below:



                    MICROPHONE
                       R1   Oohm
              vewr

                            c1 I                  ro
                            our                   2.2Kohm
                                S         c                 i
                                          sonF              $
              mip                         1|                &
                                          11       1        &
                     cs     rs                              8
                       =— 1Kohm                    2        5
                    2rpF                                    ;
              MN                          1|           uz
                            ra
                                          l
                                          c+
                                                            &
                            1Kohm         SenF    $RS
                                                  2.2Kohm




                                    ~~ C9
                                           10pF
               Hsspoutr
                                                                a1
                                 cro |_
                                 220C
               routo                                            soigsns

                                    m o2
                                           tor EAR SPEAKER



May 2018                                           DSP Group Confidential                                       14724


Version 3.0                                   DHAN—M Module                                         Schematic Guide
[




6.    Application PCB Design Recommendations
      It is recommended that unused pads on the Application PCB not be left as isolated islands of copper but rather
      be anchored with via to inner layers of the PCB. It is also recommend that GND vias be applied liberally in the
      vicinity of GND pins 1,3 and 42.
      The following layout recommendations need to be apply on Main Board:
      1.   Implement a solid ground under the DHAN—M module.
      2.   Do not route signal traces under the module. Use the bottom layer for signal routing.
      3.   Locate the on—board printed antenna on the edge of the PCB —as pictured below
      4.   Locate the antenna in the housing in such a way that minimizes obstruction of the radiation pattern by
           metallic objects




                                                      DCXK81MDOCFAESAMI
                                                      1726000800.01.0001




May 2018                                       DSP Group Confidential                                           15/24


Version 3.0                                   DHAN-M Module                                        Schematic Guide




7. Diversity Antenna (OPTION)
 If no diversity antenna is planned, a 51-Ohm chip resistor should be placed as close as possible from Pin2 to GND.
 Alternatively, Pin2 can be routed to a Diversity antenna. There are several options for a diversity antenna:
 a)   Route a 50-ohm line to an RF connector on the Application Board and RF cable to a connectorized
      commercial antenna mounted in elsewhere in the device housing
 b) Route the 50-ohm line to the antenna feed point located ~8cm from the on-board antenna feed-point. This
    antenna can be a ¼ wave monopole wire antenna, chip or printed antenna (similar to the on-board antenna).
    Guidelines for such antennas are given below:
              A wire antenna can be inserted through a via at the feed-point. It should extend vertically with
               respect to the face of the PCB. The total length of the wire antenna should be ¼ Lambda (~40.0
               mm). It is important to ensure an adequate ground plane near the feed point in order to obtain
               maximal antenna gain and efficiency
              Off the shelf chip antennas:

                                  P/N                         Manufacturer
                                  H2U74W1H1M0100              Unictron
                                  ANT8868LL00R1880A           Yageo
                                  CAN4311112001881K           Yageo
                                  W3022                       Pulse Elect

              Inverted-F printed antenna – See www.dspg.com for analysis and database for such an antenna. In
               this case, the orientation of the antenna should be rotated 90⁰ with respect to the DHAN-M antenna




May 2018                                       DSP Group Confidential                                             16/24


Version 3.0 DHAN—M Module Schematic Guide
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8.     Assembly Information
An electronic version of the information in this Section can be downloaded from the DSP Group website, in the HW
Developer‘s Collateral section. Thefiles

Mechanical Drawing


                                           Mechanical Drawing
                                                                     —E= 6.7imm t!~
                                               <)—— 20.50mm ——E>)                                     .
                                                      (PCB Length)                          RF Shield
                                               <3—— 27.20mm                    m
                (Shield Thickness)                     .
                           0.20                    (Shield Length)
                            Aomm 0.97mm| [3—— 19.52mn —E                                                          |<— 0.80mm
            W                        W                                                                                 (PCB Thickness)
       3.15mm         I                                                                                   \

            4                            ?1                                                 13.17mm       40i|
                                                                                             (Shield Width)        15.20mm(PCB Width)
     {PCB Width)15.20mm                  s1f                              C                                   i
                                                                       o                                      i
                     {7
                      17mm                                               | ‘               47                 ©      {Z


                                                                      127mm(Pitch)                   3.3mm %{ S
                                                                      (Same for all connectors)




May 2018                                                     DSP Group Confidential                                                 17/24


Version 3.0                              DHAN—M Module                                       Schematic Guide




PCB Metal Land Pattern Recommendation




                                             #4}
                                   ars                175                Area without
                                                                       Comp‘s and routes
                                                                        in all fayers




                                                                                           150 Circk copper free

     Connect Top side pour to ~                                          v33—'|
     GND plane using ample vias




                                   A PADS                          OTHER PADS




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                                         ALL DIMENSIONS in MM




May 2018                                  DSP Group Confidential                                            1824


Version 3.0                         DHAN—M Module                             Schematic Guide
mmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmmm



PCB Solder Mask Recommendation

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                   A                                           A

              A PADS                                     OTHER PADS


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smm


Version 3.0                                DHAN—M Module                                      Schematic Guide




PCB Stencil Pattern Recommendation




                                 A PADS                         OTHER PADS


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                                                                 0711     ’@*1 36




                                      ALL DIMENSIONS in MM
Pick & Place, Reflow
      The DHAN—M module uses a flat shield cover to facilitate a fully automatic assembly process. For backing
      and reflow recommendations, use MSL 3 in the JEDEC/IPC standard J—STD—20b. The temperature
      classification (TC) for the module is 245° C.




May 2018                                    DSP Group Confidential                                       20024


 Version 3.0                                     DHAN—M Module                                      Schematic Guide




9.     Supplementary Information

Labeling (appended to the module shield)




             CE
             FCC ID: 2AOUK—DHANM IC: 23573—1DHANM
             Model: DHAN—M    DCX81MDOCFAESAMI




                  The part number
         |     YYWMMOCOCOLHH.SSSS            |



       1)     Year
       2)     Week
       3)      6—digit serial#
       4)     HW Version
       5)     SW Version


Handling Guidance
This module includes highly sensitive electronic circuity. Handling without proper ESD protection may damage the
module permanently.

RF Exposure Information and Statement
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance of 20 em between the radiator and your body.
This transmitter must not be co—located or operating in conjunction with any other antenna or transmitter.
Cet équipement est conforme aux limites d‘ exposition aux ravonnements de 1a IC établies pour un
environnement non controé. Cet équipement doit étre installé et fonctionner a au moins 20 cm de

FCC & IC Interference Statement _
This device complies with part 15 of the FCC rules and RSS—213 of Industry Canada. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.




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mm


Version 3.0                                      DHAN-M Module                                            Schematic Guide



Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications
to this equipment. Such modifications could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in
a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help
- This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or
transmitter

Declaration of Conformance (DOC)
Hereby, DSP Group Ltd declares that the radio equipment type DHAN-M is in compliance with Directive
2014/53/EU.
The full text of the EU Declaration of Conformity is available at the following internet address:

       www.dspg.com.hk

ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES:
 The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and

15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into
devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.


The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then
an additional permanent label must be applied on the outside of the finished product which states: “Contains transmit
ter module FCC ID: 2AOUK-DHANM
Additionally, the following statement should be included on the label and in the final product’s
user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditi
ons: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received
including interference that may cause undesired operation.”

The module is limited to installation in mobile or fixed applications. Separate approval is required for all other opera-
ting configurations, including portable configuration with respect to Part 2.1093 and different antenna configurations
.



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Version 3.0                                     DHAN-M Module                                           Schematic Guide




A module or modules can only be used without additional authorizations if they have been tested and granted under
same intended end-use operational conditions, including simultaneous transmission operations.

When they have not been tested and granted in this manner, additional testing and/or FCC application
filing may be required. The most straightforward approach to address additional testing conditions is to have

The grantee responsible for the certification of at least one of the modules submit a permissive change application.

When having a module grantee file a permissive change is not practical or feasible, the following guidance provides
some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC app
lication filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance inf
ormation (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requ
irements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together
.

This Module is full modular approval,it is limited to OEM installation ONLY. Integration into devices that are directly
or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure
compliance of the entire end product including the integrated Module. Additional measurements (15B) and/or
equipment authorizations (e.g Verification) may need to be addressed depending on co-location or simultaneous
transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be
made available to the end user of the final host device.

IC labeling requirement for the final end product
The final end product must be labeled in a visible area with the following “Contains IC:23573-DHANM”

The Host Marketing Name (HMN) must be indicated at any location on the exterior of the host product or product
packaging or product literature, which shall be available with the host product or online.


RFPI and EMC
Each DHAN-M Module is shipped to the customer with a unique RFPI – its DECT identity.
DHAN-M will ship with an “EMC” of 0xFEB. This is the DSP Group “generic” EMC. The EMC setting identifies a
Device as belonging to a specific group of ULE Devices/Hubs that utilize some proprietary signaling.
In either case, the customer is free to re-program these parameters.



Ordering Information
Part #: DCX81MD0CFAE5AMI




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Version 3.0                             DHAN-M Module                              Schematic Guide




Change Log

                                    Table 9-1: List of Changes

   REVISION      DATE                                      DESCRIPTION
       1.0    May 24, 2017 Baseline release

                            *Add PCB metal, mask and stencil information
                            *Modify Pinout and Pinout Numbering
                            *Modify App Schematics to match new pinout
              September 13,
       2.0                  *Modify Vmin from 1.95 to 2V
                  2017
                            *Add SW Stack description with options for CMHS, CMBS & UART/USB
                            *Add detail regarding antenna layout and options for Diversity
                            *Add reference schematic for MIC and Ear SPK

       3.0     In progress   *Need to add USB and CMHS Parts

       4.0    May 5 2018     *Add OEM Notes

       5.0    May 5 2018     *IC Labeling requirements for the final end product




May 2018                                  DSP Group Confidential                               24/24



Document Created: 2018-05-29 10:24:12
Document Modified: 2018-05-29 10:24:12

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