Users Manual

FCC ID: 2AOKI-LTM3210

Users Manual

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FCCID_4003682

AI-LINK LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Features：  Reserving System IEEE Std. 802.11b IEEE Std. 802.11g IEEE Std. 802.11n  Chip Solution WIFI ：Qualcomm QCA4010  Size 30.0mm*16.0mm*3.0mm Model Overview： Data Antenna Module Name Install Standard Band Note Rate Interface 3.3V power LTM3210 SMT IEEE 802.11b/g/n 135Mbps 2.4 GHz Stamp Hole supply Sichuan AI-Link Technology Co.,Ltd Add: Anzhou,Industrial park,Mianyang,Sichuan Tel： 13881190925 Web: http://www.changhong.com

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Feedback of customer’s Confirmation We accept the specification after Confirmed Customer name Customer signature Confirmation Date Please feed back this paper and first paper after your signature by the address,thanks! ADD： Anzhou,Industrial park,Mianyang,Sichuan Factory： Sichuan AI-Link Technology Co.,Ltd. Approved Checked Designed Product WiFi Module LTM3210 Model 2018-07-03 Date Sichuan AI-Link Technology Co., Ltd. page 2 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Record of Modification Date of Main content of Reason of Serial number of No Confirm modification modification modification modification V1.0 20180703 Initial release Fengjie Sichuan AI-Link Technology Co., Ltd. page 3 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 1. Brief description: IOT MODULE LTM3210 is based on Qualcomm QCA4010 complied with IEEE 802.11b/g/n standard in 2.4GHz ISM band.Supported for 135Mbps high speed wireless network connection. LTM3210 module includes the following components:  QCA4010 chip  An integrated Balun to save cost and size, minimize tuning and tolerance  A printed antenna  2MB SPI Flash memory and etc 2. Module Interface LTM3210 manufacturing interface USB 2.0 interface with integrated controller and PHY for manufacturing test and configuration. LTM3210 host interfaces UART host interface to a remote microcontroller with an AT style command set. 3. Package outline and Mounting: Figure 3.1 LTM3210 module dimensions Sichuan AI-Link Technology Co., Ltd. page 4 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Table 3.1 LTM3210 module dimensions NOTE: General tolerance ±0.2mm unless otherwise stated 4. Pin Definition: Figure 4.1 top view Sichuan AI-Link Technology Co., Ltd. page 5 of 17

79 ) || 2BX e e e e y e n en e e e e e n e e e en e e e e e Pin Signal/Interface ALT1 ALT2 ALT3 GPIO No 1 GND Ground 2 WIFI_UART1_RXD High speed UART RXD GPIO[24] 3 WIFI_UART1_TXD High speed UART TXD GPIO[23] 4 WIFI_UART1_RTS High speed UART RTS GPIO[22] 5 WIFI_UART1_CTS High speed UART CTS GPIO[21] 6 PW 7 PWIN 7 GPIO[13] 7 PWM6G PWMG GPIO[12] 8 PWMS_12CS_SDAO PWMS5 12C Slave SDAQ GPIO[11] 9 PWMAL_12CS_SCKO PWNMA 12C Slave SCKO GPIO[1O0] 10 PWMO PWMO GPIO[G] 11 PWNM2 PWNM2 GPIO[S] 12 GND Ground 13 SPI_MISO_SDIO_DO_UART2_RTS SPI MISO (master or slave) SDIO DataO0 UART RTS GPIO[4] 14 SPI_CLK_SDIO_CLK_UART2_CTS SPICLK {master or slave) SDIO CLK UART CTS GPIO[S] 15 SsPI_INT_SDIO_D1_UART2_RXD SPI Interrupt (slave) SDIO Data1 UART RXD GPIO[3] 16 SDIO_D2_UART2_TXD SDIO Data2 UART TXD GPIO][2] 17 SPI_MOSI_sDI0O_D3 SPI MOSI (master or slave) SDIO Data3 GPI0O[1] 18 SPI_CS5010_ CMO SPI CS (master or slave) S0I10 Command GPLIOLO] 19 CHIP_PWLO_L Module reset, active low 20 IQOT_MODE _EN Wakeup manager enable 21 GND Ground 22 VOO3S 3.3¥ power supply 23 VDOD33 3.3¥ power supply 24 GND Ground 25 GND Ground 26 USB_DPOS USB Data+ 24 USB_DONEG USB Data— 28 GND Ground 29 GPIQ_IOE1 external wakeup 30 SPIM_CS Flash memory /CS pin GPIQ[35] 31 GNC Ground S¥ WIAI_125S_MCLEK1 125 MCLEK1 GPIQ[33] 33 WIFI_12S_WS1I 125 WS1 GPIQO[32] 34 WIAF_125S_SD0O1 125 50O1 GPIQ[31] 35 WIFI_12S_SDIL 125 5D11 GPIQI30] 36 WIFI_125_BLK1I 125 BLK1I GPIQ[27] 34 GND Ground 36 A&DC6 Debug UART GPIQI29] ADC6é_UARTO_TX TXD 39 ADC7Z Debug LUART GPIQO[28] ADCZ_UARTO_RX RXD 40 ADC1 ADC1I 41 ADCO &DCQ 42 GND Ground 43 [2CM_SDAO 12C Master SDAQ GPIQI[25] 44 12CM_SCLO 12C. Master SCLO GPIQ[26] 45 GNC Ground 46 GND Ground o i m >

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 5.Bootstrap Signals Table 5.1 Bootstrap Signals 6.Timing specifications 6.1 SPI master interface timing Figure 6.1 SPI master timing Table 6.1 SPI master timing Sichuan AI-Link Technology Co., Ltd. page 7 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 6.2 SPI slave interface timing Figure 6.2 SPI slave timing Table 6.1 SPI slave timing 7.Product Pictures TOP VIEW BOTTOM VIEW Sichuan AI-Link Technology Co., Ltd. page 8 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 8.Key Materials Items Category MPN Description MFR Notes 1 IC QCA4010 116 QFN Qualcomm Sunlord 2 PCB LTM3210 FR-4,2LAY IQPCB JWT 3 Crystal E3SB40E000900E 40M Hosonic 9.General Requirements: No. Feature Description 7-1 Operation Voltage 3.3V+/-0.3 Total3.3V@Max 410mA 7-2 Current Consumption BW 40 MHZ@14dbm 7-3 Operation Temperature 0°C to +70°C 7-4 Antenna Type Integral PCB antenna 7-5 SDIO SDIO slave Interface 7-6 Storage Temperature -45°C to +135°C Sichuan AI-Link Technology Co., Ltd. page 9 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 10.Electrical Characteristics: 10-1 IEEE 802.11b Section: Items Contents Specification IEEE802.11b Mode DSSS Channel CH1 to CH11 Data rate 1, 2, 5.5, 11Mbps Min. Typ. Max. Unit Remark TX Characteristics 1. Power Levels(Calibrated) 1) for each data rate 18.5 dBm 2. Spectrum Mask @ target power 1) fc +/-11MHz to +/-22MHz - - -30 dBr 2) fc > +/-22MHz - - -50 dBr 3 Constellation Error(EVM)@ target power 1) 1Mbps - - -10 dB 2) 2Mbps - - -10 dB 3) 5.5Mbps - - -10 dB 4) 11Mbps - -10 dB 4. Frequency Error -10 -5 10 ppm RX Characteristics Min. Typ. Max. Unit 5 Minimum Input Level Sensitivity(each chain) 1) 1Mbps (FER ≦8%) - -83 dBm 2) 2Mbps (FER ≦8%) - -80 dBm 3) 5.5Mbps (FER ≦8%) - -79 dBm 4) 11Mbps (FER ≦8%) - -76 dBm 6 Maximum Input Level (FER ≦8%) -10 - - dBm Sichuan AI-Link Technology Co., Ltd. page 10 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 10-2 IEEE 802.11g Section: Items Contents Specification IEEE802.11g Mode OFDM Channel CH1 to CH11 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps Min. Typ. Max. Unit Remark TX Characteristics 1. Power Levels 1) for each data rate - 21.5 - dBm 2. Spectrum Mask @ target power 1) at fc +/-11MHz - - -20 dBr 2) at fc +/-20MHz - - -28 dBr 3) at fc > +/-30MHz - - -40 dBr 3 Constellation Error(EVM)@ target power 1) 6Mbps - - -5 dB 2) 9Mbps - - -8 dB 3) 12Mbps - - -10 dB 4) 18Mbps - - -13 dB 5) 24Mbps - - -16 dB 6) 36Mbps - - -19 dB 7) 48Mbps - - -22 dB 8) 54Mbps - -25 dB 4 Frequency Error -10 -5 10 ppm RX Characteristics Min. Typ. Max. Unit 5 Minimum Input Level Sensitivity(each chain) 1) 6Mbps (PER ≦10%) - -85 dBm 2) 9Mbps (PER ≦10%) - -84 dBm 3) 12Mbps (PER ≦10%) - -82 dBm 4) 18Mbps (PER ≦10%) - -80 dBm 5) 24Mbps (PER ≦10%) - -77 dBm 6) 36Mbps (PER ≦10%) - -73 dBm 7) 48Mbps (PER ≦10%) - -69 dBm 8) 54Mbps (PER ≦10%) - -65 dBm 6 Maximum Input Level (PER ≦10%) -20 - - dBm Sichuan AI-Link Technology Co., Ltd. page 11 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 10-3 IEEE 802.11n HT20 Section: Items Contents Specification IEEE802.11n HT20 @ 2.4GHz ISM Mode OFDM Channel CH1 to CH11 Data rate (MCS index) MCS0/1/2/3/4/5/6/7 Min. Typ. Max. Unit Remark TX Characteristics Min. Typ. Max. Unit 2. Power Levels 1) for each data rate - 19.5 - dBm 3. Spectrum Mask @target power 1) at fc +/-11MHz - - -20 dBr 2) at fc +/-20MHz - - -28 dBr 3) at fc > +/-30MHz - - -45 dBr 4. Constellation Error(EVM)@ target power 1) MCS0 - - -5 dB 2) MCS1 - - -10 dB 3) MCS2 - - -13 dB 4) MCS3 - - -16 dB 5) MCS4 - - -19 dB 6) MCS5 - - -22 dB 7) MCS6 - - -25 dB 8) MCS7 - -28 dB 5. Frequency Error -10 - 10 ppm RX Characteristics Min. Typ. Max. Unit 6. Minimum Input Level Sensitivity(each chain) 1) MCS0 (PER ≦10%) - -82 dBm 2) MCS1 (PER ≦10%) - -79 dBm 3) MCS2 (PER ≦10%) - -77 dBm 4) MCS3 (PER ≦10%) - -74 dBm 5) MCS4 (PER ≦10%) - -70 dBm 6) MCS5 (PER ≦10%) - -66 dBm 7) MCS6 (PER ≦10%) - -65 dBm 8) MCS7 (PER ≦10%) - -64 dBm 7. Maximum Input Level (PER ≦10%) -20 - - dBm Sichuan AI-Link Technology Co., Ltd. page 12 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 10-4 IEEE 802.11n HT40 Section: Items Contents Specification IEEE802.11n HT40 @ 2.4GHz ISM Mode OFDM Channel CH3 to CH9 Data rate (MCS index) MCS0/1/2/3/4/5/6/7 Min. Typ. Max. Unit Remark TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) for each data rate - 19.2 - dBm 2. Spectrum Mask @target power 1) at fc +/-22MHz - - -20 dBr 2) at fc +/-40MHz - - -28 dBr 3) at fc > +/-60MHz - - -45 dBr 3. Constellation Error(EVM)@target power 1) MCS0 - - -5 dB 2) MCS1 - - -10 dB 3) MCS2 - - -13 dB 4) MCS3 - - -16 dB 5) MCS4 - - -19 dB 6) MCS5 - - -22 dB 7) MCS6 - - -25 dB 8) MCS7 - -28 dB 4. Frequency Error -10 -5 10 ppm RX Characteristics Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity(each chain) 1) MCS0 (PER ≦10%) -79 dBm 2) MCS1 (PER ≦10%) -76 dBm 3) MCS2 (PER ≦10%) -74 dBm 4) MCS3 (PER ≦10%) -71 dBm 5) MCS4 (PER ≦10%) -67 dBm 6) MCS5 (PER ≦10%) -63 dBm 7) MCS6 (PER ≦10%) -62 dBm 8) MCS7 (PER ≦10%) - -61 dBm 6. Maximum Input Level(PER ≦10%) -20 - - dBm Sichuan AI-Link Technology Co., Ltd. page 13 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 11.Mechanical, Environmental and Reliability Tests Test Items Test Conditions Qty Criteria Condition The packed samples within 100Kg can be tested Drop height: After drop test, the outer box and inner box will 4-1 Drop test Face Side: 800/600/450mm 1xBox not been broken by appearance visual Edge line: 600/450/350mm inspection. Drop time: 1 each Face and edge. X-Y-Z direction, first Frequency changing from 10Hz to 30Hz to 10Hz After test, the Appearance, Power EVM and 4-2 ,amplitude 0.75mm, 5 times Vibration test 3 Frequency error shall be satisfied with the vibrations, then frequency specification. Changing from 30Hz to 55 Hz to 30 Hz, amplitude 0.15mm, 5 time vibration. Impact acceleration: After test, the Appearance, Power EVM and 50m/sec2; 4-3 Impact test 3 Frequency error shall be satisfied with the Impact duration: 16ms； specification. Impact times: 1000. 1. After soldering, the soldered area must be Soldering temperature: covered by a smooth bright solder layer, some Soldering ability 235±5℃ deficiencies such as a small amount of the 4-4 test Soldering duration: 3 pinhole, not wetting are allowed, but the 2±0.5S deficiencies can not be in the same place； 2. At least 90% of soldered area shall be covered continuously by the soldering material. Leave samples in standard test condition for 2 4-5 Humidity test Leave samples in 40±3℃, 3 hours then test, the Appearance, Power, EVM 93% RH @ 96 hours and Frequency error functional parameter shall be satisfied with the test specification. Thermostat cabinet temperature: 55±5℃ High temperature Applied voltage: After test, leave samples in standard condition 4-6 load life test 110% rated voltage 60 for 1 hour and test, Power, EVM and Frequency Working duration: 200 hour error shall be satisfied with the test specification. (Supply Voltage Cycle 23h power on, 1h power off) High temperature Temperature: 55±5℃ After test, the Appearance, Power, EVM and 4-7 load test Samples work for 16 hours 3 Frequency error shall be Satisfied with the test specification. Leave samples in standard test condition for 2 4-8 Low temperature Leave the samples in 3 hours then test, the Appearance, Power, EVM storage test -25±3℃@24 hours and Frequency error shall be satisfied with the test specification. Sichuan AI-Link Technology Co., Ltd. page 14 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Leave samples in After test, leave the samples in standard Low temperature -15±3℃@ 2 hours, condition and tested the Appearance, Power, 4-9 load test samples’ function 3 EVM and Frequency error shall be satisfied with shall be normal, the let the test specification. samples work for 1 hour One cycle duration After test, leave the samples in standard 4-10 Temperature circle -10±3℃ @3H 3 condition and tested Power EVM and Frequency test 40±3℃ @3H error shall be qualified and all the characters Total cycle: 10x shall be satisfied with the test specification. Twice cycle duration During test, There will not been appeared signal 4-11 Continuous -10±3℃@4H 3 disconnection or interruption between DUT and TP test +60±3℃@4H, AP. +25@2H@2H Discharge voltage: 2kV C: 150pF The products can recoverable smoothly after 4-12 ESD Discharge resistance：330Ω 3 ESD test. Positive10 times 1 time for each second Sichuan AI-Link Technology Co., Ltd. page 15 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 12.Package （1）put the products into the trays （2）tie up the trays （3）put the trays into the box （4）fill the interspace with cystosepiment （5）paste the sticker on the box Sichuan AI-Link Technology Co., Ltd. page 16 of 17

LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 13.FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Labeling Instruction for End User Device Integrator Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: XXXXXX” any similar wording that expresses the same meaning may be used. § 15.19 Labelling requirements shall be complied on end user device. Labelling rules for special device, please refer to §2.925, § 15.19 (a)(5) and relevant KDB publications. For E-label, please refer to §2.935. Installation Notice The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application, a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. FCC Part 15B Compliance Requirements for End User Device The OEM integrator is responsible for ensuring that the host product which is installed and operating with the module is in compliant with Part 15B requirements. Please note that For a Class B digital device or peripheral, the instructions furnished the user manual of the end-user product shall include statement set out in §15.105 Information to the user or such similar statement and place it in a prominent location in the text of the manual. Sichuan AI-Link Technology Co., Ltd. page 17 of 17


Document Created: 2018-08-24 16:07:28
Document Modified: 2018-08-24 16:07:28
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