user_manual

FCC ID: 2AOFDLSD4BT-E66A

Users Manual

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Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group LSD4BT-E66 Series User Manual Lierda Science & Technology Group Product Name: E66 Standard Module (PCB Antenna) Product Model: LSD4BT-E66 Rev044 File Version: Rev0 Page 1 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Revision History Serial Reviewed File Revision Revision Log Revised by No. by Version Date Wang Sun May 31, 1 Initial version Rev01 Hongyang Xiangtao 2018 Update the communication distance of the module, and add the power consumption Wang Sun October 2 Rev02 data under different connection and Hongyang Xiangtao 11, 2018 broadcast intervals Correct the working parameters of the Lierda Science & Technology Group module, the transmittance state and the basic frequency of CPU, distinguish the Wang Sun December 3 different TRX current of the module in the Rev03 Hongyang Xiangtao 11, 2018 ACTIVE mode and in the SLEEP mode, and add the power consumption data under more time intervals Wang Sun March 4 Add Module Authentication information Rev04 Hongyang Xiangtao 1,2019 Page 2 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Contents Overview...................................................................................................................................... 4 Chapter 1 Overview 1.1 Functional Characteristics of Module............................................................................................... 4 1.2 Application Occasions...................................................................................................................... 4 Parameters....................................................................................................... 4 Chapter 2 Specification & Parameters Chapter 3 Hardware Layout and Interface Description Description........................................................................... 7 3.1 Dimensions....................................................................................................................................... 7 3.2 Interface Description.........................................................................................................................8 3.3 Module Authentication....................................................................................................................10 Lierda Science & Technology Group Chapter 4 Application Instructions Instructions........................................................................................................... 11 4.1 Notices to Typical Application........................................................................................................ 11 Guidance................................................................................................................ 13 Chapter 5 Production Guidance 5.1 Production Guide............................................................................................................................ 13 5.2 Requirements on Positions of Module on Backplane..................................................................... 14 5.3 Opening Design of Steel Mesh....................................................................................................... 14 5.4 Standard Operation Procedure (SOP) for Reflow........................................................................... 15 Package....................................................................................................................... 16 Chapter 6 Product Package 6.1 Packaging Method.......................................................................................................................... 16 6.2 Strip Size.........................................................................................................................................16 6.3 Product Direction............................................................................................................................ 16 Reminder..................................................................................................................................................... 17 Reminder Page 3 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Chapter 1 Overview E66 series of Bluetooth module is a low-energy and high-performance Bluetooth module which is researched and developed based on the low-energy and high-performance Bluetooth SOC chip. The module adopts the stamp hole-type interface, and is pre-reserved with two optional interfaces: PCB antenna and external antenna; the module is in small size, is led out by full port, is convenient to use, and can help you reduce the investment in software and hardware, and easily realize the development of Bluetooth application. Table 1-1 Model Description Model Description PCB antenna. This model does not include software. For the product Lierda Science & Technology Group LSD4BT-E66 with software, please communicate with the salesman over the specific model, MPQ and other information 1.1 Functional Characteristics of Module � Working voltage: 1.6~3.6V � Designed frequency: 2402MHz~2480MHz � Transmittance power: Max 7dBm � Ultra-high receiving sensitivity: -93±1dBm � Ultra-far effective communication distance: 30m@0dBm 1.2 Application Occasions � Smartphone and tablet peripherals � Wireless wearable Bluetooth equipment � Intelligent light control, smart home, smart city Chapter 2 Specification & Parameters Table 2-1 Limit Parameters of the Product Main Parameters Performance Remarks Page 4 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Minimum Value Maximum Value Power supply voltage (V) 1.6 3.6 Working temperature (℃) -40 +85 ESD (KV) 3 / All PINS, HBM MADE Table 2-2 Working Parameters of the Module @ 25℃ Performance Main Parameters Minimum Typical Maximum Remarks Value Value Value The ripple of the power supply Working voltage (V) 1.6 3.3 3.6 requires the peak value to be Lierda Science & Technology Group within 30mV Working temperature -40 / +85 Normal communication (℃) Working frequency 2402 / 2480 ISM frequency band band (MHz) Standard number of channels Number of channels / 40 / under BLE Agreement Transmittance state 2402MHz, 0dBm@16M The (mA) / 10.5 / whole CPU works ACTIVE Power Transmittance state 2402MHz, 0dBm@16M Only Consumption (mA) / 6.58 / the RF part of the CPU works SLEEP Receiving state (mA) 2402MHz@16M The whole / 10.3 / ACTIVE CPU works Page 5 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Receiving state (mA) 2402MHz@16M Only the RF / 6.09 / SLEEP part of the CPU works SLEEP (μA) / 2 / Transmittance power (dBm) -15 / 7 Software configurable PER<30.8% Receiving sensitivity (dBm) / -93 / (BER<0.1%) Communication protocol BLE4.0/4.2 Interface Type 1.27mm of spacing, 3-sided stamp hole Chip Communication distance1 30m@0dBm configuration@0dBm Lierda Science & Technology Group 1. “Communication distance” is affected by the measuring environment, air humidity and other factors around. The distance is measured via the communication between the mobile phone and the module, and is only for reference. Table 2-3 Power Consumption of the Module under Different Broadcast Intervals Mode Average Power Consumption (μA) Broadcast Interval (ms) 122.3 100 60.8 200 29.4 500 22.2 700 0dBm 19.6 1000 Broadcast 12.1 2000 mode 8.1 3000 6.7 5000 5.3 7000 4.4 10000 Page 6 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Table 2-4 Power Consumption of the Module under Different Connection Intervals Mode Average Power Consumption (μA) Connection Interval (ms) 61.1 100 31.1 200 16.3 500 0dBm 14.7 700 Connection 12.1 1000 mode 8.9 2000 7.2 3000 6.6 4000 Lierda Science & Technology Group Note: The power consumption data tested in the connection mode is tested via the non-data communication between the mobile phone and the module. Chapter 3 Hardware Layout and Interface Description 3.1 Dimensions The physical view of LSD4BT-E66 is as shown in the following Fig. 3-1: Fig. 3-1 Physical View of LSD4BT-E66 Series of Module When this product is designed, the tantalum capacitors and PCBs have optional material models. On Page 7 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group the premise that the performance requirements are met, the appearance color may be different, and the actual product shall prevail. The main materials (main chips, crystal oscillators, etc.) do not have any substitutional models. Any change will be notified in advance. The dimensions of the module LSD4BT-E66 are as shown in the following Fig. 3-2: Lierda Science & Technology Group Fig. 3-2 Dimension Diagram of LSD4BT-E66 Series of Module The dimensional tolerance which is not marked in the figure is subject to the standard GB/T1804-m. 3.2 Interface Description The following figure shows the serial number of the pins of the module and describes the corresponding pins: Page 8 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Lierda Science & Technology Group Table 3-1 Functional Description of Pins of LSD4BT-E66 Series of Module Module Chip Pin Name Function Remarks Pin 1 / NC Not connected 2 41 GND Grounded 3 23 P3/PADC GPIO 4 24 P4/PADC GPIO 5 25 P5/PADC GPIO 6 26 P6/PADC GPIO 7 27 P9 GPIO 8 28 P10 GPIO 9 29 P11 GPIO 10 18 VBAT Power supply Page 9 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group 11 41 GND Grounded 12 32 RSTN Reset 13 6 SWCLK Programmed 14 7 SWD Programmed 15 34 P15 GPIO 16 35 P16 GPIO 17 36 P17 GPIO 18 37 P18 GPIO 19 38 P19 GPIO 20 39 Lierda Science P20 & Technology Group GPIO 21 1 P24 GPIO 22 2 P25 GPIO 23 3 P26 GPIO 24 4 P27 GPIO 25 5 P28 GPIO 26 41 GND Grounded 27 10 ANT External antenna 3.3 Module Authentication This module has been certified by SRRC (China) and FCC (United States). CMIIT ID number is xxxxxxxx, and FCC ID number is 2AOFDLSD4BT-E66A. Three display modes of CMIIT ID and FCC ID are provided. The first shield laser scheme is defaulted. 1.Shield shield laser: display module product serial number, CMIIT ID, FCC ID, RoHS logo, lierda Page 10 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group registered trademark, CE certification logo, etc., with shield as the specific criterion; 2.Back label: display module product serial number, CMIIT ID, FCC ID, module P/N, lierda registered trademark, etc, specific to the manufactured product; Fig. 3-3 Back label 3.Display by the terminal Lierda device Science & Technology ： The SRRC Group ID, FCC ID, etc, can be referenced by the terminal device according to relevant standards. Chapter 4 Application Instructions 4.1 Notices to Typical Application 1. Power Supply It is suggested supplying power to the module with the DC regulated power supply. The ripple coefficient of the power supply shall be smaller as possible, and the module shall be grounded reliably. Please pay attention to the correct connection of the positive and negative poles of the power supply, because reverse connection may lead to the permanent damage of the module; 2. Antenna Selection 2.1 PCB Antenna The module is an on-board PCB antenna. During the layout of the board, please make sure the area right below the antenna is completely clear, as shown in the following figure. The red part is the user’s backplane area or the copper-clad area, the grey part is the clear area of the antenna of the user’s backplane, and the boundary point of the clear area is the upper edge of the shielding cover. Make sure there is no any Page 11 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group metal in 360 degrees around the antenna; otherwise, the radiation efficiency of the antenna will be affected, and the communication distance will be greatly affected. Fig. 4-1 Description of Clear Area of Antenna 2.2 External Antenna The module is connectedLierda with Science & Technology the external Groupthe stamp hole. It is suggested antenna through pre-reserving π matched network on the backplane. The external interface can be SMA or IPEX. As shown in the following figure 4-2, for the RF wiring of the highlight part, it needs to lay the 50ohm impedance line; the relationship between the width of the 50ohm impedance line, wiring and the copper-clad spacing, board thickness is as shown in Figure 4-3. Page 12 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group 50ohm impedance control IPEX block or SMA connector Lierda Science & Technology Group Fig. 4-2 Recommended Circuit of External Antenna Recommended values of FR4 dual panel (H=Board thickness, W=Line width, D=Spacing between wiring and copper-clad): H=1.0mm, W=0.8mm, D=0.2mm H=1.0mm, W=1.0mm, D=0.254mm (Recommended) H=1.2mm, W=1.0mm, D=0.2mm (Recommended) H=1.6mm, W=1.0mm, D=0.2mm (Recommended) Fig. 4-3 Recommended Wiring of 50ohm Impedance Line 3. Electrostatic Notices The user shall pay attention to the electrostatic requirements (as shown in Table 2-1) of the product when in design, and add the electrostatic prevention measures when designing the end products. Chapter 5 Production Guidance 5.1 Production Guide Page 13 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group It is suggested the stamp hole packaging module mounted by an SMT machine, and the mounting shall be finished within 24 hours after unpacking. Otherwise, its need to repackage by vacuumizing, so as to prevent poor mounting effect due to damp. If the package includes a humidity indicator card, it is suggested judging if the module needs to be baked according to the indication of the humidity indicator card. The baking conditions are as follows: Baking temperature: 125℃±5℃; The alarm temperature is set to be 130℃; SMT mounting can be carried out after the temperature cools down to be <36℃ under natural conditions; If the product is unpacked for over 3 months, please pay special attention if the product is affected Lierda with damp, because the PCB gold Science immersion & Technology process may lead to Group the oxidation of the land after more than 3 months, and may lead to such problems as false welding and missing welding during the mounting process. In order to ensure the pass rate of reflow, it is suggested picking 10% of products for visual inspection and AOI detection in the first time of mounting, so as to ensure the reasonableness of the furnace temperature, device absorption method and placement method; Operators at all stations must wear the anti-electrostatic gloves during the whole production process; 5.2 Requirements on Positions of Module on Backplane It is suggested the green oil thickness at the module position of the backplane be less than 0.02mm, so as to prevent the phenomenon that the green oil is too thick, the module is blocked up and cannot be effectively contacted with solder paste, and the welding quality is affected. In addition, please do not place other devices within 2mm around the module position on the interface board, so as to ensure the convenience for repairing the module. 5.3 Opening Design of Steel Mesh The thickness of the steel mesh on the backplane shall be selected by comprehensively considering the packaging type of the devices in the board, and special attention shall be paid to the following Page 14 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group requirements: The land position of the module can be locally thickened to 0.15~0.20mm, so as to prevent void solder; 5.4 Standard Operation Procedure (SOP) for Reflow Note: This SOP is only applicable to lead-free operation, and only for reference. Revie Gener Gener Approved wed ated ation by by by Date Reflow Lierda Science & Technology Group Curve Chart Operation Items Tempe rature Zone Param eters Peak temperature Soaking Tin fusion Slope of Curve Slope of reflow Slope of cooling temperature temperature increase Param eters Used Used Specificat Material 位号 Amount Tool/Equipment Amount No Date Revision Contents ion No. Thermometer Thermometric plate High temperature-resistant gloves Page 15 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Chapter 6 Product Package 6.1 Packaging Method ■Tape □Foam □Electrostatic bag 6.2 Strip Size Technical Requirement 1 Lierda Science & Technology Group Reference Size Technical Requirements: 1. The accumulative error of every 10 driving holes shall be within ±0.2; 2. The side bend within 250MM must be no more than 1; 3. Material of carrier tape: Black PS, thickness: 0.30±0.05; 4. The surface impedance is from 106 to 1011ohm; 5. Each roll is packed by a 21m 13’’ plastic tray, and can contain 1000 Pcs elements 6. A0 and B0 shall be measured at 0.3mm upwards at the bottommost of the inner side of the die cavity, and K0 refers to the inner depth. The unmarked R Ver Revision Contents Date angle is 0.3 sion 7. The product meets the standard EIA-481; Client No.: LSD4BT-E66ASTD001 8. The product is required to meet “ROHS”; 6.3 Product Direction The placement direction of the tape packaging module is as shown in the following figure: Page 16 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group Protecting tape Lierda Science & Technology Group Cover tape Round hole Carrier tape rubber wheel Depression Carrier tape Discharge direction Product information label Oval hole Reminder Welcome to use the products of Lierda Science & Technology Group Co., Ltd.. Prior to the use of our products, please first read this reminder; if you have started to use the Instructions, you will be considered as having read and accepted the reminder. Lierda Science & Technology Group Co., Ltd. reserves the final interpretation and revision rights Page 17 of 18

Securities Code Lierda Science & IoT Interconnection, Smart Life Technology Group over all attached materials, and any modification of them will not be further notified. Lierda Science & Technology Group Page 18 of 18

FCC Statement： This device complies with part 15 of the FCC rules Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help - This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. RF Exposure Information and Statement : This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter Instructions to the OEM/Integrator: This module has been granted modular approval for mobile applications. OEM integrators for host products may use the module in their final products without additional FCC certification if they meet the following conditions. Otherwise, Additional FCC approvals must be obtained.

 The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: ”Contains transmitter module FCC ID:2AOFDLSD4BT-E66A,Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation.”  The user’s manual for the host product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.  The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.  This Module is full modular approval, it is limited to OEM installation ONLY.  The module is limited to installation in mobile application.  A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations.  The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module.  The Grantee will provide guidance to the Host Manufacturer for compliance with the Part 15B requirements if requested.


Document Created: 2019-06-21 19:11:44
Document Modified: 2019-06-21 19:11:44
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