User Manual

FCC ID: 2ANDL-TYBT3

Users Manual

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FCCID_3933339

TYBT3 DATASHEET Tuya Smart BLE Module 1. Product Overview TYBT3 is a Bluetooth (BLE) module designed by Hangzhou Tuya Information Technology Co., Ltd. The BLE Module consists of a highly integrated wireless Bluetooth chip TLSR8267 and some extra electric circuits that have been programed with Bluetooth network protocol and plenty of software examples.TYBT3 include a 32-bit CPU, BLE, 512K byte flash, 16k SRAM, and 9 multiplex IO pins. Figure 1 shows the block diagram of the TYBT3. Figure 1. The block diagram of the TYBT3 3.3V input BLE 12M IO interface Crystal MCU FREQ FLASH I2C 48MHz 512K UART PCB SRAM 16K Bytes BLE on-board PWM antenna 1.1 Features  Integrated low power consumption 32-bit CPU, also known as application processor  Basic frequency of the CPU can support 48 MHz  Supply voltage range: 1.9V to 3.6V  Peripherals: 5*PWM,1*I2C, 1*UART  BLE RF features:  Compatible with BLE 4.2  Transmitting data rate can go up to 1Mbps  TX transmitting power: +6.06dBm  RX receiving sensitivity: -92dBm  AES hardware encryption  On-board PCB antenna

TYBT3 DATASHEET  Operating temperature range: -20℃ to 85℃ 1.2 Main Application Fields  Intelligent LED  Intelligent household applications  Intelligent low-power consumption sensors

TYBT3 DATASHEET 2. Dimensions and Footprint 2.1Dimensions TYBT3 have double sides of pins. The distance between each Pin is 2.0mm. Size of TYBT3: 15mm(W)*16.5mm(L). Figure 2 shows the dimensions of TYBT3. Figure 2. The dimensions of TYBT3 2.2 Pin Definition Table 1 shows the general pin attributes of TYBT3 Table 1. The typical pin definition of TYBT3 PIN NO. NAME TYP DESCRIPTION E 1 SDA I/O I2C, data interface,internal pull-up 4.7k resistance 2 SCL I/O I2C, clock interface, internal pull-up 4.7k resistance 3 G I/O normal IO pin, can be used as PWM output pin, default for Green LED line 4 B I/O normal IO pin, can be used as PWM output pin, default for Blue LED line 5 WW I/O normal IO pin, can be used as PWM output pin, default for Warm White LED line 6 CW I/O normal IO pin, can be used as PWM output pin, default for Cold White LED line 7 R I/O normal IO pin, can be used as PWM output pin, default for Red LED line 8 3.3V P Supply voltage

TYBT3 DATASHEET 9 TX I/O UART TX,can be used as normal IO pin 10 RX I/O UART RX,can be used as normal IO pin 11 GND P Ground 12 SW I/O Bluetooth chipset burning pin 13 RST I reset pin for the module,internal pull-up 4.7k resistance 14 GND P Ground Note: P: Power supply pins; I/O: Digital input or output pins. SW pin is ONLY used for burning firmware, Can NOT be used for other functions. There are 4.7 pull-up resistance internally for I2C pins, external pull-up resistances are not necessary. When WW pin is outputting PWM signal, It has opposite phase comparing the PWM signal from R/G/B/CW pin. If there’s any customization needed for PWM output, please contact our BD manager.

TYBT3 DATASHEET 3. Electrical Characteristics 3.1 Absolute Maximum Ratings Table 2. Absolute Maximum Ratings PARAMETERS DESCRIPTION MIN MAX UNIT Ts Storage -20 85 ℃ temperature VCC Supply voltage -0.3 3.9 V Electrostatic release quantity TAMB-25℃ - 2 KV (Human body model) Electrostatic release quantity TAMB-25℃ - 0.5 KV (Machine model) 3.2 Electrical Conditions Table 3. Electrical Conditions PARAMETERS DESCRIPTION MIN TYPIC MAX UNIT AL Ta Temperature for Commercial grade -20 - 85 ℃ VCC Supply voltage 1.9 3.3 3.6 V VIL IO negative level input -0.3 - VCC*0.3 V VIH IO positive level input VCC*0.7 - VCC V VOL IO negative level output VSS - 0.3 V VoH IO positive level output VCC-0.3 - VCC V 3.3Transmitting Current Consumptions Table 4. TX current consumption PARAMETERS MODE TYPICAL UNIT Itx Continuously transmitting, 0dBm power output 15 mA Irx Continuously receiving 12 mA IDC Normal working mode 27 mA Sleep mode 18 uA Ideepsleep

TYBT3 DATASHEET 4. Radio Specification 4.1 Basic Radio Frequency Characteristics Table 5.Basic Radio frequency characteristics PARAMETERS DESCRIPTION Working Frequency 2.4GHz ISM band Radio standard BLE 4.2 Data transmitting rate 1Mbps Type of Antenna On-board PCB Antenna 4.2Transmitting Power Table 6. Transmitting power PARAMETERS MIN TYPICAL MAX UNIT RF Average output power 5.46 5.70 6.06 dBm consumption 4.3Receiving Sensitivity Table 7. Receiving sensitivity PARAMETERS MIN TYPICAL MAX UNIT 1Mbps -93 -92 -90 RX sensitivity dBm 1Mbps -300 - +300 Frequency bias error KHz Co-channel interference Restrain - - -7 - dB

TYBT3 DATASHEET 5. Antenna Information 5.1 Antenna Type Antenna for TYBT3 modulodule m e is is using 2.4 GHz MIFA On-board PCB antenna. 5.2 Reduce Antenna Interference nterference In n order order totohave havethethe best RF st performance, it’s recommended to keep to akeep minimum 15mm distance betweenbetween the antethe antenna rt andnna thepaother part metal and the other metal pieces. pieces. Since PCBA A manufacture use SMT process to weld TYBT3 module and other electrical components onto the PCB board, RF performance will depend on the layout location and patt pattern of the On-boardboard PCB antenna. The following figures are some recommended and dis-recommended demonstrations from out R&D team. In demonstration 1 and 2 of figure 3, the on on-board PCB antenna lays outside of the PCB frame. It’s recommended to use layout pattern shown in demonstration 1 and 2. Either the on-board PCB antenna lays outside of the PCB frame directly or PCB frame car carve out a certain area for the antenna. The overall PCBA performance for these two ways will be the same as testing the module independently. Restricted due to some reason, iif the on-board PCB antenna layout ut has to be inside the PCB frame, it’s suggested to refer er to demonstration 3. The antennaenna lays inside the PCB frame, but no copperor wire beneath the antenna. RF performance will have some loss, approximately 1~2 dBm. It’s NOT recommended to use demonstra demonstration 4, the antenna lays inside the PCB frame, and there are copper and wire beneath it. RF performance will have significantatte attenuanuation. tion Figure 3.layout demostrations Demonstration 1: Antenna lay outside the Demonstration 2: Antenna lay outside PCB frame the PCB frame with carved area

TYBT3 DATASHEET Demonstration 3: Antenna lay inside the PCB Demonstration 4: Antenna lay inside the PCB frame without copper or wire beneath it frame with copper or wire beneath it

TYBT3 DATASHEET 6. Packaging Information And Production Guide 6.1 Mechanical Dimensions Figure 4.Dimensions of the module 6.2 Production Guide  The storage for the delivered module should meet the following condition: 1. The anti-moisture bag should be kept in the environment with temperature< 30℃ and humidity< 85% RH. 2. The expiration date is 6 months since the dry packaging products was sealed.  Cautions: 1. All the operators should wear electrostatic ringin the whole process of production. 2. While operating, water and dirt should not have any contact with the modules.

FCC Statement: Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. FCC Label Instructions: The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID: 2ANDL-TYBT3 ”,or “Contains FCC ID: 2ANDL-TYBT3 ”, Any similar wording that expresses the same meaning may be used.


Document Created: 2018-07-20 17:40:22
Document Modified: 2018-07-20 17:40:22
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