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FCC ID: 2AMWOFSC-BW226

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FSC‐BW226 Datasheet FSC‐BW226 Single‐Chip 802.11b/g/n 1T1R WLAN with 4.2 Dual Mode Bluetooth Module Datasheet Version 1.4 Shenzhen Feasycom Technology Co.,Ltd. ‐1‐ www.feasycom.com

FSC‐BW226 Datasheet Copyright © 2013‐2019 Feasycom Technology. All Rights Reserved. Feasycom Technology reserves the right to make corrections, modifications, and other changes to its products, documentation and services at anytime. Customers should obtain the newest relevant information before placing orders. To minimize customer product risks, customers should provide adequate design and operating safeguards. Without written permission from Feasycom Technology, reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited. Revision History Version Data Notes 1.0 2017/05/27 Initial Version Devin Wan 1.1 2017/06/26 Revised some mistakes Devin Wan 1.2 2018/05/12 1.Modify Bluetooth Version: Upgrade from BT4.0 to BT4.2 Devin Wan 2.Modify Pin Definitions and Application Circuit Diagrams 1.3 2019/03/11 Modify the definition of pins 1, 2, 3, 4: Fish it can be either a serial communication or SPI communication 1.4 2019/05/24 Add Module accessories（WiFi Antenna） Devin Wan Contact Us Shenzhen Feasycom Technology Co.,LTD Email: sales@feasycom.com Address: Room 2004,20th Floor,Huichao Technology Building,Jinhai Road, Xixiang ,Baoan District,Shenzhen,518100,China. Tel: 86‐755‐27924639, 86‐755‐23062695 Shenzhen Feasycom Technology Co.,Ltd. ‐2‐ www.feasycom.com

FSC‐BW226 Datasheet C ontents 1. INTRODUCTION ........................................................................................................................................................... 5 2. GENERAL SPECIFICATION ............................................................................................................................................. 6 3. HARDWARE SPECIFICATION ...................................................................................................................................... 7 3.1 BLOCK DIAGRAM AND PIN DIAGRAM ......................................................................................................................................... 7 3.2 PIN DEFINITION DESCRIPTIONS ................................................................................................................................................. 8 4. PHYSICAL INTERFACE ................................................................................................................................................. 10 4.1 POWER SUPPLY..................................................................................................................................................................... 10 4.2 AUDIO INTERFACES ................................................................................................................................................................ 10 4.2.1 PCM Format ............................................................................................................................................................. 10 4.3 RESET ................................................................................................................................................................................. 10 4.4 GENERAL PURPOSE DIGITAL IO ................................................................................................................................................ 11 4.5 RF INTERFACE ...................................................................................................................................................................... 11 4.6 SERIAL INTERFACES ................................................................................................................................................................ 11 4.6.1 UART......................................................................................................................................................................... 11 4.6.2 I2C Interface ............................................................................................................................................................. 12 4.7 PWM GENERATOR AND CAPTURE TIMER (PWM) ...................................................................................................................... 13 4.7.1 PWM function features ............................................................................................................................................ 13 4.7.2 Capture function features ........................................................................................................................................ 13 4.8 SECURITY ENGINE（WIFI ONLY） ........................................................................................................................................... 14 4.8.1 Features ................................................................................................................................................................... 14 5. ELECTRICAL CHARACTERISTICS ................................................................................................................................... 14 5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................... 14 5.2 RECOMMENDED OPERATING CONDITIONS .................................................................................................................................14 5.3 INPUT/OUTPUT TERMINAL CHARACTERISTICS .............................................................................................................................. 15 5.4 TEMPERATURE CHARACTERISTICS ............................................................................................................................................. 15 5.5 SPECIFICATION OF LOW VOLTAGE RESET..................................................................................................................................... 15 5.6 SPECIFICATIONS OF POWER‐ON RESET ....................................................................................................................................... 16 5.7 I2C DYNAMIC CHARACTERISTICS .............................................................................................................................................. 16 5.8 POWER CONSUMPTIONS ......................................................................................................................................................... 17 6. MSL & ESD ................................................................................................................................................................ 18 7. RECOMMENDED TEMPERATURE REFLOW PROFILE ..................................................................................................... 18 8. MECHANICAL DETAILS ............................................................................................................................................... 20 8.1 MECHANICAL DETAILS ............................................................................................................................................................ 20 8.2 HOST PCB LAND PATTERN AND ANTENNA KEEP‐OUT FOR FSC‐BW226.......................................................................................... 21 9. HARDWARE INTEGRATION SUGGESTIONS .................................................................................................................. 21 9.1 SOLDERING RECOMMENDATIONS ............................................................................................................................................. 21 9.2 LAYOUT GUIDELINES(INTERNAL ANTENNA).................................................................................................................................22 9.3 LAYOUT GUIDELINES(EXTERNAL ANTENNA) ................................................................................................................................22 Shenzhen Feasycom Technology Co.,Ltd. ‐3‐ www.feasycom.com

FSC‐BW226 Datasheet 9.3.1 Antenna Connection and Grounding Plane Design .................................................................................................. 23 10. PRODUCT PACKAGING INFORMATION...................................................................................................................... 24 10.1 DEFAULT PACKING ............................................................................................................................................................... 24 10.2 PACKING BOX(OPTIONAL) ................................................................................................................................................... 25 11. APPLICATION SCHEMATIC ........................................................................................................................................ 26 Shenzhen Feasycom Technology Co.,Ltd. ‐4‐ www.feasycom.com

FSC‐BW226 Datasheet 1. INTRODUCTION Overview Application The FSC‐BW226 is a highly integrated WiFi + BT Combo Wireless POS module, it features a 2.4GHz ISM RF transceiver, Measurement and monitoring systems Bluetooth V4.2 baseband controller, single‐Chip low power 802.11n WLAN network controller(combines an Industrial sensors and controls ARM‐cortex M3);With on board antenna for BT(External Analogue and USB Multimedia Dongles Antenna is optional); Need external antenna for WIFI or Asset Tracking Equipped with the RF Connector, connect to the external antenna. With Feasycom’s Bluetooth stack running on a host, Module picture as below showing designers can easily customize their applications to support different Bluetooth profiles. The FSC‐BW226 is an appropriate product for designers who want to add wireless capability to their products. Features IPEX WIFI connector Bluetooth v4.2, Class 1.5 COMS MAC,Baseband PHY,and RF in a single‐Chip for Figure 1: FSC‐BW226 Picture 802.11 b/g/n compatible WLAN UART programming and data interface (baudrate can Module accessories up to 921600bps) PCM/I2S audio interface(BT only) I2C/AIO/PIO/PWM/SPI control interfaces Postage stamp sized form factor Embedded Bluetooth stack profiles support: SPP/iAP,HID,GATT,ANCS etc WiFi Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n WiFi : Light Weight TCP/IP protocol Support External Antenna Figure 2: FSC‐BW226 WiFi antenna Picture RoHS compliant Shenzhen Feasycom Technology Co.,Ltd. ‐5‐ www.feasycom.com

FSC‐BW226 Datasheet 2. General Specification Table 1: General Specifications Categories Features Implementation Version : V4.2 Dual Mode Frequency : 2.402 ‐ 2.480 GHz Bluetooth Transmit Power: +5.5 dBm (Maximum) Raw Data Rates (Air): 3 Mbps(Classic BT ‐ BR/EDR) IEEE 802.11 b/g/n compatible WLAN Wireless Frequency : 2.400～2.4835GHz Specification Transmit Power: 17.5dBm(11 b), 15.5dBm(11 g), 13.5dBm(11 n) 802.11e Qos Enhancement WiFi WiFi WPS & Direct support Light Weight TCP/IP protocol Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n Default antenna interface: IPEX TX, RX (Auto Flow Control) General Purpose I/O UART Interface Default 115200,N,8,1 Baudrate support from 1200 to 921600 5, 6, 7, 8 data bit character 11 (maximum – configurable) lines O/P drive strength (4 mA) Host Interface and GPIO Pull‐up resistor (33 KΩ) control Peripherals Read pin‐level I2C Interface 1 (configurable from GPIO total). Up to 400 kbps SPI Interface Support Master/Slave mode 16‐bit resolution 8‐bit prescaler and clock divider PWM Supports PWM interrupts supports input capture function Classic Bluetooth SPP (Serial Port Profile) ‐ Up to 600 Kbps Profiles Bluetooth Low Energy GATT Client & Peripheral ‐ Any Custom Services WiFi WiFi‐AP(access point), WiFi‐Station Maximum Classic Bluetooth 7 Clients(MAX) Connections Bluetooth Low Energy 5 Clients(MAX) Via UART(TBD) FW upgrade J‐link Supply Voltage Supply 3.0‐3.6V Max Peak Current(TX Power @ +5.5dBm TX): 84mA Bluetooth Standby Doze (Wait event) ‐ 19mA (TBD) Power Consumption Deep Sleep ‐ No Supports WiFi 3.3V Rating Current(with internal regulator and integrated COMS Shenzhen Feasycom Technology Co., Ltd. ‐6‐ www.feasycom.com

FSC‐BW226 Datasheet PA): 450mA (MAX) IO Rating Current(including VDD_IO): 200mA Physical Dimensions 13mm X 26.9mm X 2.0mm; Pad Pitch 1.5mm Operating ‐20°C to +70°C Environmental Storage ‐40°C to +85°C Lead Free Lead‐free and RoHS compliant Miscellaneous Warranty One Year Humidity 10% ~ 90% non‐condensing MSL grade: MSL 3 Human Body Model: Class‐2 ESD grade: Machine Model: Class‐B 3. HARDWARE SPECIFICATION 3.1 Block Diagram and PIN Diagram Figure 2: Block Diagram Shenzhen Feasycom Technology Co., Ltd. ‐7‐ www.feasycom.com

FSC‐BW226 Datasheet BT_EXT_ANT 36 GND 35 1 UART_TX PIO11 34 2 UART_RX PIO10 33 3 UART_CTS/PIO4 PIO9 32 4 UART_RTS/PIO8 UART_RTS/PIO8 31 5 PCM_CLK PIO7/I2C_SDA 30 6 PCM_OUT PIO6/I2C_SCL 29 7 PCM_IN NC 28 8 PCM_SYNC UART_CTS/PIO4 27 9 UART_LOG_OUT PIO3/SWDIO 26 10 UART_ LOG_IN PIO2/SWCLK 25 11 RESET/CHIP_EN NC 24 WiFi_RF_OUT PIO3/SWDIO PIO2/SWCLK 12 VDD_3V3 NC 23 13 GND GND GND 22 GND GND NC NC 14 15 16 17 18 19 20 21 Figure 3: FSC‐BW226 PIN Diagram(Top View) 3.2 PIN Definition Descriptions Table 2: Pin definition Pin Pin Name Type Pin Descriptions Notes 1 UART_TX O UART Data output Note 1 Alternative Function: SPI_MISO 2 UART_RX I UART Data input Note 1 Alternative Function: SPI_CS 3 UART_CTS/PIO4 I/O UART Clear to Send (active low) Note 1 Alternative Function 1: Programmable input/output line Alternative Function 2: PWM Alternative Function 3: SPI_CLK 4 UART_RTS/PIO8 I/O UART Request to Send (active low) Note 1 Alternative Function 1: Programmable input/output line Alternative Function 2: SPI_MOSI 5 PCM_CLK I/O PCM bit clock pin(BT only) 6 PCM_OUT O PCM data out(BT only) 7 PCM_IN I PCM data input(BT only) 8 PCM_SYNC I/O PCM left right channel clock(BT only) 9 UART_LOG_OUT O Debug Interface (Data OUT) 10 UART_ LOG_IN I Debug Interface (Data IN) 11 RESET/CHIP_EN I External reset input: Active LOW, with an inter an internal pull‐up. Set this pin low reset to initial state. 12 VDD_3V3 Vdd Power supply voltage 3.3V Shenzhen Feasycom Technology Co., Ltd. ‐8‐ www.feasycom.com

FSC‐BW226 Datasheet 13 GND Vss Power Ground 14 NC NC 15 NC NC 16 PIO2/SWCLK I/O Debugging through the clk line(Default) Alternative Function: Programmable input/output line 17 PIO3/SWDIO I/O Debugging through the data line(Default) Alternative Function 1: Programmable input/output line Alternative Function 2: PWM 18 GND Vss Power Ground 19 WiFi_RF_OUT O WiFi RF signal output . Note5 20 GND Vss Power Ground 21 GND Vss Power Ground 22 GND Vss Power Ground 23 NC NC 24 NC NC 25 PIO2/SWCLK I/O Debugging through the clk line(Default) Alternative Function: Programmable input/output line 26 PIO3/SWDIO I/O Debugging through the data line(Default) Alternative Function 1: Programmable input/output line Alternative Function 2: PWM 27 UART_CTS/PIO4 I/O UART Clear to Send (active low) Note 1 Alternative Function 1: Programmable input/output line Alternative Function 2: PWM 28 NC NC 29 PIO6/I2C_SCL I/O Programmable input/output line Note 2 30 PIO7/I2C_SDA I/O Programmable input/output line Note2 31 UART_RTS/PIO8 I/O UART Request to Send (active low) Note 1 Alternative Function 1: Programmable input/output line Alternative Function 2: SPI_MOSI 32 PIO9 I/O LED(Default) or Programmable input/output line Note 3 Alternative Function: PWM 33 PIO10 I/O BT Status(Default) or Programmable input/output line Note4 Alternative Function: PWM 34 PIO11 I/O Programmable input/output line 35 GND Vss RF Ground 36 BT_EXT_ANT O BT RF signal output . Note5 Module Pin Notes: Note 1 For customized module, this pin can be work as I/O Interface. Note 2 I2C Serial Clock and Data. It is essential to remember that pull‐up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module. Note 3 LED(Default)‐‐ Power On: Light Slow Shinning ; Connected: Steady Lighting. Note 4 BT Status(Default)‐‐ Disconnected: Low Level; Connected: High Level. Note 5 By default, this PIN is an empty feet. This PIN can connect to an external antenna to improve the Bluetooth Shenzhen Feasycom Technology Co., Ltd. ‐9‐ www.feasycom.com

FSC‐BW226 Datasheet signal coverage. If you need to use an external antenna, by modifying the module on the 0R resistance to block out the on‐board antenna; Or contact Feasycom for modification. 4. PHYSICAL INTERFACE 4.1 Power Supply The transient response of the regulator is important. If the power rails of the module are supplied from an external voltage source, the transient response of any regulator used should be 20μs or less. It is essential that the power rail recovers quickly. 4.2 Audio Interfaces 4.2.1 PCM Format FrameSync is the synchronizing function used to control the transfer of DAC_Data and ADC_Data. A Long FrameSync indicates the start of ADC_Data at the rising edge of FrameSync (Figure 4), and a Short FrameSync indicates the start of ADC_Data at the falling edge of FrameSync (Figure 5) Figure 4: FSC‐BW226 Long FrameSync (BT only) Figure 5: FSC‐BW226 Short FrameSync (BT only) 4.3 Reset The module may be reset from several sources: Power‐on Reset (POR), Low level on the nRESET Pin (nRST), Watchdog time‐out reset (WDT), Low voltage reset (LVR) or Software Reset(SYSRESETREQ, CPU Reset, CHIPRST). The RESET pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESET being active. It is recommended that RESET be applied for a period greater than 5ms. Shenzhen Feasycom Technology Co., Ltd. ‐10‐ www.feasycom.com

FSC‐BW226 Datasheet At reset the digital I/O pins are set to inputs for bi‐directional pins and outputs are tri‐state. The PIOs have weak pull‐ups. 4.4 General Purpose Digital IO GPO and GPI function Support interrupt detection with configurable polarity per GPIO Internal weak pull up and pull low per GPIO Multiplexed with other specific digital functions 4.5 RF Interface For This Module, the default mode for antenna is internal ,it also has the interface for external antenna(BT). If you need to use an external antenna, by modifying the module on the 0R resistance to block out the on‐board antenna; Or contact Feasycom for modification. Need external antenna for WIFI or Equipped with the RF Connector, connect to the external antenna.(Before you purchasing the samples, please confirm with our salesman for the antenna issues.) The user can connect a 50 ohm antenna directly to the RF port. Bluetooth basic parameter： 2402–2480 MHz Bluetooth 4.2 Dual Mode (BT and BLE); 1 Mbps to 3 Mbps over the air data rate. TX output power of +5.5dBm. Receiver to achieve maximum sensitivity ‐85dBm @ 1 Mbps BLE or Classic BT, 2 Mbps, 3 Mbps). WiFi basic parameter： 2402–2483.5 MHz IEEE 802.11 b/g/n compatible WLAN Transmit Power: 17.5dBm(11 b), 15.5dBm(11 g), 13.5dBm(11 n). Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n Receiver to achieve maximum sensitivity： ‐76dBm(11 b), ‐77dBm(11 g), ‐74dBm(11 n). 4.6 Serial Interfaces 4.6.1 UART Support 1 HS‐UART UART(RS232 Standard) Serial Data Format Transmit and Receive data FIFO Programmable asynchronous clock support Auto flow control Programmable Receive data FIFO trigger level UART signal level ranges 3.3V Shenzhen Feasycom Technology Co., Ltd. ‐11‐ www.feasycom.com

FSC‐BW226 Datasheet Table 3: Possible UART Settings Parameter Possible Values Minimum 1200 baud (≤2%Error) Baudrate Standard 115200bps(≤1%Error) Maximum 921600bps(≤1%Error) Flow control RTS/CTS, or None(TBD) Parity None, Odd or Even Number of stop bits 1 /1.5/2 Bits per channel 5/6/7/8 When connecting the module to a host, please make sure to follow . Figure 6: UART Connection 4.6.2 I2C Interface I2C is a two‐wire, bi‐directional serial bus that provides a simple and efficient method of data exchange between devices. The I2C standard is a true multi‐master bus including collision detection and arbitration that prevents data corruption if two or more masters attempt to control the bus simultaneously. Data is transferred between a Master and a Slave synchronously to SCL on the SDA line on a byte‐by‐byte basis. Each data byte is 8‐bit long. There is one SCL clock pulse for each data bit with the MSB being transmitted first. An acknowledge bit follows each transferred byte. Each bit is sampled during the high period of SCL; therefore, the SDA line may be changed only during the low period of SCL and must be held stable during the high period of SCL. A transition on the SDA line while SCL is high is interpreted as a command (START or STOP). Please refer to the following figure for more details about I2C Bus Timing. Three speeds: Standard mode(0 to 100Kb/S); Fast mode(<400 Kb/S); High‐speed mode(<3.4Mb/S) Master or slave I2C operation 7‐ or 10‐bit addressing Transmit and receive buffers Shenzhen Feasycom Technology Co., Ltd. ‐12‐ www.feasycom.com

FSC‐BW226 Datasheet Figure 7: I2C Bus Timing The device on‐chip I2C logic provides the serial interface that meets the I2C bus standard mode specification. The I2C port handles byte transfers autonomously. The I2C H/W interfaces to the I2C bus via two pins: SDA and SCL. Pull up resistor is needed for I2C operation as these are open drain pins. When the I/O pins are used as I2C port, user must set the pins function to I2C in advance. 4.7 PWM Generator and Capture Timer (PWM) FSC‐BW226 has 4 PWM generator. The PWM generator has a 16‐bit PWM counter and comparator, and the PWM generator supports two standard PWM output modes: Independent output mode and Complementary output mode with 8‐bit Dead‐time generator. Each mode can be used as a timer and issues interrupt independently. In addition, It also has an 8‐bit prescaler and clock divider with 5 divided frequencies (1, 1/2, 1/4, 1/8, 1/16) to support wide range clock frequency of PWM counter. For PWM output control unit, it supports polarity output function. The PWM generator also supports input capture function. It supports latch PWM counter value to corresponding register when input channel has a rising transition, falling transition or both transition is happened. 4.7.1 PWM function features Supports 4 PWM output channels with 16‐bit resolution(optional) Supports 8‐bit prescaler and clock divider Supports 4 PWM interrupts(optional) Supports One‐shot or Auto‐reload PWM counter operation mode Supports 8‐bit Dead‐time 4.7.2 Capture function features Supports 4 capture input channels with 16‐bit resolution(optional) Supports rising or falling capture condition Supports 4 Capture interrupts(optional) Shenzhen Feasycom Technology Co., Ltd. ‐13‐ www.feasycom.com

FSC‐BW226 Datasheet 4.8 Security Engine（WiFi only） 4.8.1 Features Provide low SW computing and high performance encryption Supported authentication algorichms: 1,MD5 2,SHA‐1 3,SHA‐2(SHA‐224/SHA‐256) 4,HMAC‐MD5 5,HMAC‐SHA1 6,HMAC‐SHA2 Supports Encryption/Decryption mechanisms: 1,DES(CBC/ECB) 2,3DES(CBC/ECB) 3,AES‐128(CBC/ECB/CTR) 4, AES‐192(CBC/ECB/CTR) 5, AES‐256(CBC/ECB/CTR) 5. ELECTRICAL CHARACTERISTICS 5.1 Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below. Exceeding these values causes permanent damage. The average PIO pin output current is defined as the average current value flowing through any one of the corresponding pins for a 100mS period. The total average PIO pin output current is defined as the average current value flowing through all of the corresponding pins for a 100mS period. The maximum output current is defined as the value of the peak current flowing through any one of the corresponding pins. Table 4: Absolute Maximum Rating Parameter Min Max Unit VDD‐VSS ‐ DC Power Supply ‐0.3 +3.6 V VIN ‐ Input Voltage Vss‐0.3 Vdd+0.3 V TA ‐ Operating Temperature ‐20 +70 °C TST ‐ Storage Temperature ‐40 +85 °C IIO ‐ Maximum Current sunk by a I/O pin 4 mA IIO ‐ Maximum Current sourced by a I/O pin 4 mA 5.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Parameter Min Type Max Unit VDD‐VSS ‐ DC Power Supply 3 3.3 3.6 V VIN ‐ Input Voltage Vss‐0.3 3.3 Vdd+0.3 V TA ‐ Operating Temperature ‐20 25 +70 °C Shenzhen Feasycom Technology Co., Ltd. ‐14‐ www.feasycom.com

FSC‐BW226 Datasheet TST ‐ Storage Temperature ‐40 25 +85 °C IIO ‐ Maximum Current sunk by a I/O pin 2 3 4 mA IIO ‐ Maximum Current sourced by a I/O pin 2 3 4 mA IDD‐ 3.3V Rating Current (With internal regulator ‐ ‐ 450 mA and integrated COMS PA) (Wifi only) 5.3 Input/output Terminal Characteristics Table 6: DC Characteristics (VDD ‐ VSS = 3 ~ 3.6 V, TA = 25C) Parameter Min Type Max Unit VDD ‐ Operation Voltage 3 3.3 3.6 V VSS ‐ Power Ground ‐0.3 ‐ ‐ V VDD12 ‐ Core Logic and I/O Buffer Pre‐Driver Voltage 1.08 1.2 1.32 V VOH ‐ High Level Output Voltage 2.4 ‐ ‐ V VOL ‐ Low Level Output Voltage ‐ ‐ 0.4 V VIH ‐ Input High Voltage 2.0 ‐ ‐ V VIL ‐ Input Low Voltage ‐ ‐ 0.8 V VTH ‐ Switch Threshold(Schmitt‐falling‐trigger) 1.36 1.45 1.56 V VTH ‐ Switch Threshold(Schmitt‐rising‐trigger) 1.78 1.87 1.97 V RPU ‐ Input Pull‐up Resist(VIN=VSS) 32 53 120 KΩ RPD ‐ Input Pull‐down Resist(VIN=VDD) 37 49 120 KΩ IL ‐ Input Leakage Current ‐10 ‐ 10 uA IOZ ‐ Tri‐State Output Leakage Current ‐10 ‐ 10 uA IOL ‐ Low level sink current(VOL=0.4V) 4 ‐ ‐ mA IOH ‐ High level source current (VOH=2.4V) 4 ‐ ‐ mA 5.4 Temperature Characteristics Table 7: Temperature Characteristics Power(W) PCB(layer) Theta ja(C/W) Theta jc(C/W) Psi jt(C/W) 1 4 28.1 11.1 0.24 5.5 Specification of Low Voltage Reset Table 8: Specifications of Low Voltage Reset Parameter Min Type Max Unit VDD ‐ Supply Voltage 0 ‐ 3.6 V TA ‐ Temperature ‐20 25 +70 °C ILVR‐ Quiescent Current ‐ 25 40 uA VLVR ‐ Threshold Voltage 2.16 2.4 2.64 V Shenzhen Feasycom Technology Co., Ltd. ‐15‐ www.feasycom.com

FSC‐BW226 Datasheet 5.6 Specifications of Power‐on Reset Table 9: Specifications of Power‐on Reset Parameter Min Type Max Unit TA ‐ Temperature ‐20 25 +70 °C IPOR‐ Quiescent Current(VDD>Reset Voltage) ‐ 33 50 uA VPOR ‐ Reset Voltage(TA=‐20~+70°C) 1.6 2 2.4 V VPOR ‐ VDD Start Voltage to Ensure Power on Reset ‐ ‐ 100 mV PRVDD‐ VDD Raising Rate to Ensure Power‐on Reset 0.025 ‐ ‐ V/ms tPOR‐ Minimum Time for VDD Stays at VPOR to Ensure Power on 0.5 ‐ ‐ ms Reset Figure 8: Power‐up Ramp Condition 5.7 I2C Dynamic Characteristics Table 10: I2C Dynamic Characteristics Standard Mode[1][2] Fast Mode[1][2] Parameter Unit Min Max Min Max tLOW ‐ SCL low period 4.7 ‐ 1.2 ‐ uS THIGH ‐ SCL high period 4 ‐ 0.6 ‐ uS tSU; STA ‐ Repeated START condition setup 4.7 ‐ 1.2 ‐ uS time tHD; STA ‐ START condition hold time 4 ‐ 0.6 ‐ uS tSU; STO ‐ STOP condition setup time 4 ‐ 0.6 ‐ uS tBUF ‐ Bus free time 4.7[3] ‐ 1.2[3] ‐ uS tSU;DAT ‐ Data setup time 250 ‐ 100 ‐ uS tHD;DAT ‐ Data hold time 0[4] 3.45[5] 0[4] 0.8[5] uS tr ‐ SCL/SDA rise time ‐ 1000 20+0.1CB 300 uS tf‐ SCL/SDA fall time ‐ 300 ‐ 300 uS Cb ‐ Capacitive load for each bus line ‐ 400 ‐ 400 pF Shenzhen Feasycom Technology Co., Ltd. ‐16‐ www.feasycom.com

FSC‐BW226 Datasheet Note: 1. Guaranteed by design, not tested in production. 2. HCLK must be higher than 2 MHz to achieve the maximum standard mode I2C frequency. It must be higher than 8 MHz to achieve the maximum fast mode I2C frequency. 3. I2C controller must be retriggered immediately at slave mode after receiving STOP condition. 4. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL. 5. The maximum hold time of the Start condition has only to be met if the interface does not stretch the low period of SCL signal. Figure 9: I2C Timing Diagram 5.8 Power consumptions Table 11: Power consumptions Parameter Test Conditions Type Unit Bluetooth Search ~35 mA Unconnected (Deep Sleep Idle Mode) No support ‐ mA Connected Idle ~19 mA Shutdown ＜50 uA WLAN 3.3V Rating Current (With internal 450 mA regulator and integrated COMS PA) Shutdown ＜50 uA Shenzhen Feasycom Technology Co., Ltd. ‐17‐ www.feasycom.com

FSC‐BW226 Datasheet 6. MSL & ESD Table 12: MSL and ESD Parameter Value MSL grade: MSL 3 Human Body Model: Class‐2 ESD grade: Machine Model: Class‐B 7. RECOMMENDED TEMPERATURE REFLOW PROFILE Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, please check the below Table 18 and follow instructions specified by IPC/JEDEC J‐STD‐033. Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in the below Table 13, the modules must be removed from the shipping tray. Any modules not manufactured before exceeding their floor life should be re‐packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30°C/60%RH. Table 13: Recommended baking times and temperatures 125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp. Saturated @ Floor Life Limit Saturated @ Floor Life Limit Saturated @ Floor Life Limit MSL 30°C/85% + 72 hours @ 30°C/85% + 72 hours @ 30°C/85% + 72 hours @ 30°C/60% 30°C/60% 30°C/60% 3 9 hours 7 hours 33 hours 23 hours 13 days 9 days Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to J‐STD‐020D1 standards for reflow temperatures. The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. Shenzhen Feasycom Technology Co., Ltd. ‐18‐ www.feasycom.com

FSC‐BW226 Datasheet Figure 10: Typical Lead‐free Re‐flow Pre‐heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re‐oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (C) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217  for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead‐free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer‐lasting joint. Typical cooling rate should be 4 C. Shenzhen Feasycom Technology Co., Ltd. ‐19‐ www.feasycom.com

FSC‐BW226 Datasheet 8. MECHANICAL DETAILS 8.1 Mechanical Details  Dimension: 13mm(W) x 26.9mm(L) x 2.0mm(H) Tolerance: ±0.1mm  Module size: 13mm X 26.9mm Tolerance: ±0.2mm  Pad size: 1mmX0.8mm Tolerance: ±0.2mm  Pad pitch: 1.5mm Tolerance: ±0.1mm Figure 11: FSC‐BW226 footprint Shenzhen Feasycom Technology Co., Ltd. ‐20‐ www.feasycom.com

FSC‐BW226 Datasheet 8.2 Host PCB Land Pattern and Antenna Keep‐out for FSC‐BW226 Please check the Figure 12 for Pad Structure and Keep Out Area: Figure 12: Host PCB‐Top View 9. HARDWARE INTEGRATION SUGGESTIONS 9.1 Soldering Recommendations FSC‐BT906 is compatible with industrial standard reflow profile for Pb‐free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. Shenzhen Feasycom Technology Co., Ltd. ‐21‐ www.feasycom.com

FSC‐BW226 Datasheet 9.2 Layout Guidelines(Internal Antenna) It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB edges. The mother board should have no bare conductors or vias in this restricted area, because it is not covered by stop mask print. Also no copper (planes, traces or vias) are allowed in this area, because of mismatching the on‐board antenna. Figure 13: FSC‐BW226 Restricted Area Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC problems caused by RF part of the module. Use good consideration to avoid problems arising from digital signals in the design. Ensure that signal lines have return paths as short as possible. For example if a signal goes to an inner layer through a via, always use ground vias around it. Locate them tightly and symmetrically around the signal vias. Routing of any sensitive signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and under the line. If this is not possible, make sure that the return path is short by other means (for example using a ground line next to the signal line). 9.3 Layout Guidelines(External Antenna) Placement and PCB layout are critical to optimize the performances of a module without on‐board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF‐IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF‐IN port to better match the impedance to minimize the return loss. Shenzhen Feasycom Technology Co., Ltd. ‐22‐ www.feasycom.com

FSC‐BW226 Datasheet As indicated in Figure below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB. Figure 14: Placement the Module on a System Board 9.3.1 Antenna Connection and Grounding Plane Design Figure 15: Leave 5mm Clearance Space from the Antenna General design recommendations are: The length of the trace or connection line should be kept as short as possible. Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness. Routing the RF close to digital sections of the system board should be avoided. To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45‐degree routing is preferred over Manhattan style 90‐degree routing. Shenzhen Feasycom Technology Co., Ltd. ‐23‐ www.feasycom.com

FSC‐BW226 Datasheet Antenna Antenna Antenna PCB PCB PCB Wrong Better Best Figure 16: Recommended Trace Connects Antenna and the Module Routing of the RF‐connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled. Use as many vias as possible to connect the ground planes. 10. PRODUCT PACKAGING INFORMATION 10.1 Default Packing a, Tray vacuum b, Tray Dimension: 180mm * 195mm Shenzhen Feasycom Technology Co., Ltd. ‐24‐ www.feasycom.com

FSC‐BW226 Datasheet Figure 17: Tray vacuum 10.2 Packing box(Optional) * If require any other packing, must be confirmed with customer * Package: 1000PCS Per Carton (Min Carton Package) Figure 18: Packing Box Shenzhen Feasycom Technology Co., Ltd. ‐25‐ www.feasycom.com

FSC‐BW226 Datasheet 11. APPLICATION SCHEMATIC Shenzhen Feasycom Technology Co., Ltd. ‐26‐ www.feasycom.com

FCC Statement 15.19 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 15.21 Note: The grantee is not responsible for any changes or modifications not expressly approved by the party responsible for compliance. Such modifications could void the user’s authority to operate the equipment. 15.105(b) NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ‐ Reorient or relocate the receiving antenna. ‐ Increase the separation between the equipment and receiver. ‐Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ‐Consult the dealer or an experienced radio/TV technician for help RF Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. Instructions to the OEM/Integrator: This module has been granted modular approval for mobile applications. OEM integrators for host products may use the module in their final products without additional FCC/ISED (Innovation, Science and Economic Development Canada) certification if they meet the following conditions. Otherwise, Additional FCC/IC approvals must be obtained. ⚫ The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: ”Contains transmitter module FCC ID: 2AMWOFSC‐BW226”. Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation.” ⚫ The user’s manual for the host product must clearly indicate the operating requirements and conditions that must be

observed to ensure compliance with current FCC / IC RF exposure guidelines. ⚫ The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. ⚫ This Module is full modular approval, it is limited to OEM installation ONLY. ⚫ The module is limited to installation in mobile application. ⚫ A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. ⚫ The OEM integrator is responsible for ensuring that the end‐user has no manual instruction to remove or install module. ⚫ The Grantee will provide guidance to the Host Manufacturer for compliance with the Part 15B requirements if requested.


Document Created: 2019-06-03 15:42:53
Document Modified: 2019-06-03 15:42:53
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