Users Manual

FCC ID: 2AHMR-ESP32S

Users Manual

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FCCID_3390390

ESP-32S User Manual ESP-32S User Manual REV 1.0 2017.3

ESP-32S User Manual FCC STATEMENT This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: 2AHMR-ESP32S” any similar wording that expresses the same meaning may be used. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cmbetween the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B requirements. Copyright © 2017 Ai-Thinker Technology Co., Ltd. All rights reserved.

ESP-32S User Manual Contents 1.Preface................................................................................................................................................ 1 2. Pin Definitions....................................................................................................................................3 2.1 Pin Layout.................................................................................................................................3 2.2 Pin Description......................................................................................................................... 4 2.3 Strapping Pins...........................................................................................................................5 3. Functional Description.......................................................................................................................7 3.1 CPU and Internal Memory........................................................................................................7 3.2 External Flash and SRAM..........................................................................................................7 3.3 Crystal Oscillators.....................................................................................................................7 3.4 Power Consumption.................................................................................................................8 3.5 Peripherals and Sensors........................................................................................................... 9 3.5.1 Peripherals and Sensors Description.............................................................................9 3.5.2 Peripheral Schematics.................................................................................................14 4. Electrical Characteristics..................................................................................................................15 4.1 Absolute Maximum Ratings................................................................................................... 15 4.2 Recommended Operating Conditions....................................................................................15 4.3 Digital Terminal Characteristics............................................................................................. 15 4.4 Wi-Fi Radio............................................................................................................................. 16 4.5 Bluetooth LE Radio................................................................................................................. 16 4.5.1 Receiver.......................................................................................................................16 4.5.2 Transmit...................................................................................................................... 17 4.6 Reflow Profile......................................................................................................................... 17 5. Schematics....................................................................................................................................... 18

ESP-32S User Manual 1.Preface ESP-32S is a powerful, generic Wi-Fi +BT+BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. At the core of this module is the ESP32-D0WDQ6 chip*, which is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled or powered, and the clock frequency is adjustable from 80 MHz to 240 MHz . The user may also power off the CPU and make use of the low-power coprocessor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, low-noise sense amplifiers, SD card interface, Ethernet, high speed SDIO/SPI, UART, I2S and I2C. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is future proof: using Wi-Fi allows a large physical range and direct connection to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. ESP-32S supports data rates of up to 150 Mbps, and 22 dBm output power at the PA to ensure the widest physical range. As such the chip does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is free RTOS with LWIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continually upgrade their products even after their release. Table 1 provides the specifications of ESP-32S. Table 1: ESP-32S Specifications Categories Items Specifications Standards FCC/CE/IC/TELEC/KCC/SRRC/NCC 802.11 b/g/n/d/e/i/k/r (802.11n up to 150 Mbps) Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support Frequency range 2.4 〜2.5 GHz Protocols Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with -98 dBm sensitivity Bluetooth Radio Class-1, class-2 and class-3 transmitter AFH Audio CVSD and SBC Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Categories Items Specifications SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, I2C, IR Module interface GPIO, capacitive touch sensor, ADC, DAC, LNA pre- amplier On-chip sensor Hall sensor, temperature sensor Hardware On-board clock 40 MHz crystal Operating voltage 2.2 〜3.6V Operating current Average: 80 mA Operating temperature range -40°C ~ 85°C * Ambient temperature range Normal temperature Package size 18 mm x 25.5 mm x 2.8 mm Wi-Fi mode Station/SoftAP/SoftAP+Station/P2P Security WPA/WPA2/WPA2-Enterprise/WPS Encryption AES/RSA/ECC/SHA UART Download / OTA (via network) / download and Firmware upgrade Software write firmware via host Supports Cloud Server Development / SDK for custom Software development firmware development Network protocols IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT User configuration AT instruction set, cloud server, Android/iOS app Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 2. Pin Definitions 2.1 Pin Layout Figure 1: Top and Side View of ESP-32S Table 2: ESP-32S Dimensions Length Width Height PAD size (bottom) Pin pitch Shielding can height PCBthickness 18 mm 25.5 mm 2.8± 0.1 mm 0.85 mm x 0.9 mm 1.27 mm 2 mm ±0.1mm Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 2.2 Pin Description ESP -32S has 39 pins. See pin definitions in Table 3. Table 3: ESP-32S Pin Definitions Name No. Type Function GND 1 P Ground 3V3 2 P Power supply. EN 3 I Chip-enable signal. Active high. SENSOR_VP 4 I GPI036, SENS0R_VP, ADC_H, ADC1_CH0, RTC_GPI00 SENSOR_VN 5 I GPI039, SENS0R_VN, ADC1_CH3, ADC_H, RTC_GPI03 IO34 6 I GPI034, ADC1_CH6, RTC_GPI04 IO35 7 I GPI035, ADC1_CH7, RTC_GPI05 GPI032, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4， IO32 8 I/O T0UCH9, RTC_GPI09 GPI033, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, IO33 9 I/O T0UCH8, RTC_GPI08 IO25 10 I/O GPI025, DAC_1, ADC2_CH8, RTC_GPI06, EMAC_RXD0 IO26 11 I/O GPI026, DAC_2, ADC2_CH9, RTC_GPI07, EMAC_RXD1 IO27 12 I/O GPI027, ADC2_CH7, T0UCH7, RTC_GPI017, EMAC_RX_DV GPraM，ADC2_CH6, T0UCH6,MTMS, HSPHK， HS2_CLK, SD_CLK, IO14 13 I/O EMAC_TXD2 GPI012, ADC2_CH5, T0UCH5, RTC_GPI015, MTDL HSPIQ, HS2_DATA2, IO12 14 I/O SD_DATA2, EMAC_TXD3 GND 15 P Ground GPI013, ADC2_CH4, T0UCH4, RTC_GPI014, MTCK, HSPID, HS2_DATA3, IO13 16 I/O SD_DATA3, EMAC_RX_ER SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICSO, HS1_CMD, U1RTS SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS GPIO15, ADC2_CH3, T0UCH3, MTD0, HSPICSO, RTC_GPI013, HS2_CMD, IO 15 23 I/O SD_CMD, EMAC_RXD3 IO 2 24 I/O GPIO2, ADC2_CH2, T0UCH2,HSPIWP, HS2_DATA0, SD_DATA0 IO 0 25 I/O GPIO0, ADC2_CH1, T0UCH1, CLK_0UT1, EMAC_TX_CLK GPIO4,ADC2_CH0,T0UCH0, RTC_GPI010, HSPIHD, HS2_DATA1, IO 4 26 I/O SD_DATA1, EMAC_TX_ER IO 16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_0UT IO 17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_0UT_180 IO 5 29 I/O GPIO5, VSPICSO, HS1_DATA6, EMAC_RX_CLK IO18 30 I/O GPIO18, VSPHK，HS1_DATA7 IO19 31 I/O GPIO19, VSPIQ, UOCTS, EMAC—TXDO Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Name No. Type Function NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP，U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground GND 39 P Ground Note: * Pins SCK/CLK，SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on ESP-32S and are not recommended for other uses. 2.3 Strapping Pins ESP32-D0WDQ6 has five strapping pins. Software can read the value of these five bits from the register ”GPIO_STRAPPING”. During the chip power-on reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”，and hold these bits until the chip is powered down or shut down. Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strap-ping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host MCU5s GPIOs to control the voltage level of these pins when powering ESP32 on. After reset, the strapping pins work as the normal functions pins. Refer to Table 4 for detailed boot modes of configuration by strapping pins. Table 4: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default 3.3V 1.8V MTDI Pull-down 0 1 Booting Mode Pin Default SPI Flash Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don’t-care 0 Debugging Log on U0TXD During Booting Pin Default U0TXD Toggling U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave Falling-edge Input Falling-edge Input Rising-edge Input Rising-edge Input Pin Default Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output MTDO Pull-up 0 0 1 1 GPIO5 Pull-up 0 1 0 1 Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Note: Firmware can configure register bits to change the settings of ”Voltage of Internal LDO(VDD_SDIO)” and ”Timing of SDIO Slave” after booting. Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 3. Functional Description This chapter describes the modules and functions integrated in ESP-32S. 3.1 CPU and Internal Memory ESP32-DOWDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes: • 448 KB of ROM for booting and core functions. • 520 KB of on-chip SRAM for data and instruction. • 8KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. • 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. • 1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID. 3.2 External Flash and SRAM ESP32-DOWDQ6 supports up to four 16-MB external QSPI flash and SRAM with hardware encryption based on AES to protect developer’s programs and data. ESP32 can access the external QSPI flash and SRAM through high-speed caches. • Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. • Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and 32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM. ESP-32S integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIO. 3.3 Crystal Oscillators The frequencies of the main crystal oscillator supported include 40 MHz, 26 MHz and 24 MHz. The accuracy of crystal oscillators applied should be ±10PPM,and the operating temperature ranges from-40°C to 85°C. When using the downloading tools, remember to select the right crystal oscillator type. In circuit design, capacitors C1 and C2 that connect to the earth are added to the input and output terminals of the crystal oscillator, respectively. The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF. However, the specific capacitive values of C1 and C2 depend on further tests and adjustments of the overall performance of the whole circuit. Normally, the capacitive values ofC1 and C2 are within 10 pF when the crystal oscillator frequency is 26 MHz, or 10 pF<C1 and C2<22 pF when the crystal oscillator frequency is 40 MHz. The frequency of the RTC crystal oscillator is typically 32 kHz or 32.768 kHz. The accuracy can be out of the range of ±20 PPM, when the internal calibration is applied to correct the frequency offset. When the chip Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual operates in low-power modes, the application chooses the external low-speed (32 kHz) crystal clock, rather than the internal RC oscillators, to achieve the accurate wakeup time. 3.4 Power Consumption With the advanced power management technology, ESP32-D0WDQ6 can switch between different power modes as follows: • Power mode - Active mode: chip radio is powered on. The chip can receive, transmit, or listen. - Modem-sleep mode: the CPU is operational and the clock is configurable. Wi-Fi / Bluetooth baseband and radio are disabled. - Light-sleep mode: the CPU is paused. The RTC and ULP-coprocessor are running. Any wake-up events (MAC, host, RTC timer, or external interrupts) will wake up the chip. - Deep-sleep mode: Only RTC is powered on. Wi-Fi and Bluetooth connection data are stored in RTC memory. The ULP-coprocessor can work. - Hibernation mode: The internal 8MHz oscillator and ULP-coprocessor are disabled. The RTC recovery memory is powered down. Only one RTC timer on the slow clock and some RTC GPIOs are active. The RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode. • Sleep Pattern - Association sleep pattern: The power mode switches between the active mode and Modem-sleep/Light- sleep mode during this sleep pattern. The CPU, Wi-Fi, Bluetooth, and radio wake up at pre-determined intervals to keep Wi-Fi / BT connections on. - ULP sensor-monitored pattern: The main CPU is in the Deep-sleep mode. The ULP co-processor does sensor measurements and wakes up the main system, based on the measured data from sensors. The power consumption varies with different power modes/sleep patterns, and work status, of functional modules (see Table 5). Table 5: Power Consumption by Power Modes Power mode Comment Power consumption Wi-Fi Tx packet 13 dBm ~ 21 dBm 160 〜260 mA Wi-Fi / BT Tx packet 0 dBm 120mA Active mode (RF working) Wi-Fi / BT Rx and listening 80 〜90 mA Association sleep pattern (by Light- 0.9 mA@DTIM3, 1.2 mA@DTIM1 Max speed: 20 mA Modem-sleep mode The CPU is powered on. Normal: 5 〜10 mA Slow speed: 3 mA Light-sleep mode - 0.8 mA The ULP-coprocessor is powered on. 0.15 mA Deep-sleep mode ULP sensor-monitored pattern 25 µA@1% duty RTC timer + RTC memories 20 µA Hibernation mode RTC timer only 5µA Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 3.5 Peripherals and Sensors 3.5.1 Peripherals and Sensors Description Table 6: Peripherals and Sensors Description Interface Signal Pin Function ADC1_CH0 SENSOR_VP ADC1_CH3 SENSOR_VN ADC1_CH4 IO32 ADC1_CH5 IO33 ADC1_CH6 IO34 ADC1_CH7 IO35 ADC2_CH0 IO4 ADC ADC2_CH1 IO0 Two 12-bit SAR ADCs ADC2_CH2 IO2 ADC2_CH3 IO15 ADC2_CH4 IO13 ADC2_CH5 IO12 ADC2_CH6 IO14 ADC2_CH7 IO27 ADC2_CH8 IO25 ADC2_CH9 IO26 Ultra Low Noise SENSOR_VP IO36 Provides about 60dB gain by using larger Analog Pre-Amplifier SENSOR_VN IO39 capacitors on PCB DAC_1 IO25 DAC Two 8-bit DACs DAC_2 IO26 TOUCH0 IO4 TOUCH1 IO0 TOUCH2 IO2 TOUCH3 IO15 TOUCH4 IO13 Touch Sensor Capacitive touch sensors TOUCH5 IO12 TOUCH6 IO14 TOUCH7 IO27 TOUCH8 IO33 TOUCH9 IO32 Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Interface Signal Pin Function SD/SDIO/MMC Host HS2_CLK MTMS Supports SD memory card V3.01 standard HS2_CMD MTDO HS2_DATA0 IO2 HS2_DATA1 IO4 HS2_DATA2 MTDI HS2_DATA3 MTCK Motor PWM PWMO_OUTO~2 Any GPIOs* Three channels of 16-bit timers generate PWM1_OUT_INO~2 PWM0_FLT_IN0~2 PWM1_FLT_IN0~2 PWM0_CAP_IN0~2 PWM1_CAP_IN0~2 PWM0_SYNC」N0~2 PWM1_SYNC」N0~2 LED PWM ledc_hs_sig_out0~7 Any GPIOs* 16 independent channels @80MHz Iedc_Is_sig_out0~7 UART U0RXD_in Any GPIOs* Two UART devices with hardware U0CTS_in U0DSR_in U0TXD_out U0RTS_out U0DTR_out U1RXD_in U1CTS_in U1TXD_out U1RTS_out U2RXD_in U2CTS_in U2TXD_out U2RTS_out I2C I2CEXT0_SCL_in Any GPIOs* Two I2C devices in slave or master modes I2CEXT0_SDA_in I2CEXT1_SCL_in I2CEXT1_SDA_in I2CEXT0_SCL_out I2CEXT0_SDA_out I2CEXT1_SCL_out I2CEXT1_SDA_out Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Interface Signal Pin Function I2S0l_DATA_in0~15 I2SOO_BCK_in I2S0O_WS_in I2S0I_BCK_in I2S0I_WS_in I2S0I_H_SYNC I2S0I_V_SYNC I2S0I_H_ENABLE I2S0O_BCK_out I2S0O_WS_out I2S0I_BCK_out I2S0I_WS_out I2S0O_DATA_out0~23 Stereo input and output from/to the audio I2S Any GPIOs* I2S1l_DATA_inO~15 codec, and parallel LCD data output I2S1O_BCK_in I2S1O_WS_in I2S1I_BCK_in I2S1LWS_in I2S1LH_SYNC I2S1I_V_SYNC I2S1I_H_ENABLE I2S1O_BCK_out I2S1O_WS_out I2S1l_BCK_out I2S1l_WS_out I2S1O_DATA_outO~23 RMT_SIG_IN0~7 Eight channels of IR transmitter and Remote Controller Any GPIOs* RMT_SIG_OUTO~7 receiver for various waveforms Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Interface Signal Pin Function SPIHD SHD/SD2 SPIWP SWP/SD3 SPICS0 SCS/CMD SPICLK SCK/CLK SPIQ SDO/SD0 SPID SDI/SD1 HSPICLK IO14 HSPICS0 IO15 Supports Standard SPI, Dual SPI, and Parallel QSPI HSPIQ IO12 Quad SPI that can be connected to the HSPID IO13 external flash and SRAM HSPIHD IO4 HSPIWP IO2 VSPICLK IO18 VSPICS0 IO5 VSPIQ IO19 VSPID IO23 VSPIHD IO21 VSPIWP IO22 HSPIQ_in/_out Standard SPI consists of clock, HSPID_in/_out chip-select, MOSI and MISO. These SPIs HSPICLK_in/_out can be connected to LCD and other HSPI_CS0_in/_out external devices. They support the HSPI_CS1_out following features: General Purpose HSPI_CS2_out • both master and slave modes; Any GPIOs* SPI VSPIQ_in/_out • 4 sub-modes of the SPI format VSPID_in/_out transfer that depend on the clock VSPICLK_in/_out phase (CPHA) and clock polarity VSPI_CS0_in/_out (CPOL) control; VSPI_CS1_out • CLK frequencies by a divider; VSPI_CS2_out • up to 64 bytes of FIFO and DMA. MTDI IO12 MTCK IO13 JTAG JTAG for software debugging MTMS IO14 MTDO IO15 Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual Interface Signal Pin Function SD_CLK IO6 SD_CMD IO11 SDIO interface that conforms to the SD_DATA0 IO7 industry standard SDIO 2.0 card SDIO Slave SD_DATA1 IO8 specification. On ESP -32S these pins are SD_DATA2 IO9 connected to the integrated SPI flash. SD_DATA3 IO10 EMAC_TX_CLK IO0 EMAC_RX_CLK IO5 EMAC_TX_EN IO21 EMAC—TXDO IO19 EMAC—TXD1 IO22 EMAC—TXD2 IO14 EMAC—TXD3 IO12 EMAC_RX_ER IO13 EMAC_RX_DV IO27 EMAC_RXD0 IO25 EMAC Ethernet MAC with MII/RMII interface EMAC_RXD1 IO26 EMAC_RXD2 TXD EMAC_RXD3 IO15 EMAC_CLK_OUT IO16 EMAC_CLK_OUT_180 IO17 EMAC_TX_ER IO4 EMAC_MDC_out Any GPIOs* EMAC_MDI_in Any GPIOs* EMAC_MDO_out Any GPIOs* EMAC_CRS_out Any GPIOs* EMAC_COL_out Any GPIOs* Note: • Functions of Motor PWM,LEDPWM,UART,l2C,l2S,general purpose SPI and Remote Controller can be configured to any GPIO except GPIO6,GPIO7,GPIO8,GPIO9,GPIO10 and GPIO11. • In Table6, for the items marked with ”Any GPIOs*” in the ”Pin” column, users should note that GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11 are connected to the integrated SPI flash of ESP-32S and are not recommended for other uses. Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 3.5.2 Peripheral Schematics Figure 2: ESP-32S Peripheral Schematics Note: The MTDI should be kept at low electric level. Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 4. Electrical Characteristics Note: The specifications in this chapter have been tested under the following generalcondition: Vbat =3.3V’Ta =27°C，unless otherwise specified. 4.1 Absolute Maximum Ratings Table 7: Absolute Maximum Ratings Rating Condition Value Unit Storage temperature - -40 ~ 85 °C Maximum soldering temperature - 260 °C Supply voltage IPC/JEDEC J-STD-020 +2.2 〜+3.6 V 4.2 Recommended Operating Conditions Table 8: Recommended Operating Conditions Operating condition Symbol Min Typ Max Unit Operating temperature - -40 20 85 °C Supply voltage VDD 2.2 3.3 3.6 V Operating current IVDD 0.5 - - A 4.3 Digital Terminal Characteristics Table 9: Digital Terminal Characteristics Terminals Symbol Min Typ Max Unit Input logic level low VIL -0.3 - 0.25VDD V Input logic level high VIH 0.75VDD - VDD+0.3 V Output logic level low VOL N - 0.1VDD V Output logic level high VOH 0.8VDD - N V Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 4.4 Wi-Fi Radio Table 10: Wi-Fi Radio Characteristics Description Min Typ Max Unit General Characteristics Input frequency 2412 - 2484 MHz Input impedance - 50 - Q Input reflection - - -10 dB Output power of PA 15.5 19.5 21.5 dBm Sensitivity DSSS, 1 Mbps - -98 - dBm CCK, 11 Mbps - -90 - dBm OFDM, 6 Mbps - -93 - dBm OFDM, 54 Mbps - -75 - dBm HT20, MCS0 - -93 - dBm HT20, MCS7 - -73 - dBm HT40, MCS0 - -90 - dBm HT40, MCS7 - -70 - dBm MCS32 - -91 - dBm Adjacent Channel Rejection OFDM, 6 Mbps - 37 - dB OFDM, 54 Mbps - 21 - dB HT20, MCS0 - 37 - dB HT20, MCS7 - 20 - dB 4.5 Bluetooth LE Radio 4.5.1 Receiver Table 11: Receiver Characteristics - BLE Parameter Conditions Min Typ Max Unit Sensitivity @0.1% BER - - -98 - dBm Maximum received signal @0.1% BER - 0 - - dBm Co-channel C/I - - +10 - dB F = F0+1 MHz - -5 - dB F = F0-1 MHz - -5 - dB F = F0 + 2 MHz - -2 5 - dB Adjacent channel selectivity C/I F = F0-2 MHz - - 35 - dB F = F0 + 3 MHz - -25 - dB F = F0-3 MHz - -45 - dB 30 MHz - 2000 MHz -10 - - dBm 2000 MHz - 2400 MHz -27 - - dBm Out-of-band blocking performance 2500 MHz - 3000 MHz -27 - - dBm 3000 MHz-12.5GHz -10 - - dBm Intermodulation - -36 - - dBm Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 4.5.2 Transmit Table 12: Transmit Characteristics – BLE Parameter Conditions Min Typ Max Unit RF transmit power - - +7.5 +10 dBm RF power control range - - 25 - dB F=F0+1 MHz - -14.6 - dBm F=F0-1 MHz - -12.7 - dBm F=F0 + 2 MHz - -44.3 - dBm F=F0-2 MHz - -38.7 - dBm Adjacent channel transmit power F=F0 + 3 MHz - -49.2 - dBm F=F0-3 MHz - -44.7 - dBm F=F0+>3 MHz - -50 - dBm F=F0->3 MHz - -50 - dBm △ f1avg - - - 265 kHz A f2 - 247 - - kHz △ f2avg/△ f1avg - - -0.92 - - ICFT - - -10 - kHz Drift rate - - 0.7 - kHz/50 µs Drift - - 2 - kHz 4.6 Reflow Profile Table 13: Reflow Profile Item Value Ts max to TL (Ramp-up Rate) 3°C/second max Preheat Temperature Min. (Ts Min.) 150°C Temperature Typ. (Ts Typ.) 175°C Temperature Min. (Ts Max.) 200°C Time (Ts) 60 ~180 seconds Ramp-up rate (TL to Tp) 3°C/second max Time maintained above: -Temperature (TL)/Time (TL) 217°C/60 ~150 seconds Peak temperature (Tp) 260°C max, for 10 seconds Target peak temperature (Tp Target) 260°C +0/-5°C Time within 5°C of actual peak (tp) 20~40 seconds Ts max to TL (Ramp-down Rate) 6°C/second max Tune25°C to Peak Temperature (t) 8 minutes max Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com

ESP-32S User Manual 5. Schematics Figure 3: ESP-32S Schematics Note: The capacitance of Gland C2 varies with the selection of the crystal. Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com


Document Created: 2017-05-09 11:48:46
Document Modified: 2017-05-09 11:48:46
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