User manual

FCC ID: 2ADBM-LS9AC11DBT

Users Manual

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FCCID_3586795

              LibreSync & GC4A
  High Performance Network Media Module
       1x1 Dual Band 802.11 a/b/g/n/ac
With Integrated Bluetooth 4.1 Low Energy (BLE)




              LS9 Data Sheet
            Module: LS9-AC11DBT

                        Rev: 2.3




              Libre Wireless Technologies © 2017

                      Libre Confidential


                                                                             LS9-AC11DBT Module



1. Introduction
Libre Wireless, LS9-AC11DBT is a high performance media / audio streaming module. LS9-AC11DBT
comes with Dual core Coretex-A7 CPU and Dual Neon/VFPU subsystems running at 1.3GHz, 256MB
of DDR3 DRAM memory and 256MB of NAND Flash, an 802.11a/b/g/n/ac, Bluetooth v4.1 Low
Energy (BLE), Multi- standard video encoding, 2D/3D Graphics Engine and a USB OTG.


2. Module Feature Summary
Key Features


       •   Dual core Cortex-A7 CPU and Dual core Neon/VFPU running ate 1.3GHz

       •   Features: Hi-Rez Audio (192KHz/24bits), Stereo Decode, HD Graphics and HD Video On
           Screen Display

       •   LPCM, MP3, AAC/AAC+,AC3, OGG Vorbis, HE-AAC, WMA decode capability

       •   Lossless audio decode, like FLAC, APE and DSD

       •   Support for JPEG/GIF

       •   Supports WMV9, AVS, VP6,

       •   Libre’s advanced multi-zone audio streaming technology (DDMS)

       •   Libre Crypto IC for code protection and secure transaction feature options

       •   Data Transport De-MUX

       •   1DES/3DES/AES/CSS/CPRM/DTCP copy protection

       •   Feature Rich 2D/3D Hardware Graphics Engine,

       •   I2S interface

               o    LS9 module can be configured only as I2S-Master mode
               o DSD over PCM
       •   SPDIF Output (Muxed with I2S port TXD Line - optional)




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                       • In LS9, SPDIF and I2S are mutually exclusive. I2S is available only
                         when SPDIF output is disabled, and vise versa.

       •   HDMI1.4 transmitter MAC and PHY with HDCP 1.4

       •   1x USB 2.0 OTG (For Debug Shell, Ethernet, Firmware update, USB Media Playback)

       •   1x UART (For HOST-MCU communication)

       •   2x I2C, 1x SPI, GPIOs

       •   Wi-Fi 1x1 Dual Band 802.11a/b/g/n/ac

       •   3x Antenna(5 GHz WLAN, 2.4GHz WLAN, and 2.4GHz BT)

       •   Bluetooth 4.1 and Low Energy

       •   Standard configuration includes 256MB NAND FLASH and 256MB DDR3


WLAN Features


       •   IEEE 802.11 a/b/g/n and 802.11ac compliant

       •   Dual band 1T1R supporting STB and Receive Beamforming


Bluetooth Features


       •   Bluetooth specification v2.1+EDR

       •   Bluetooth specification 3.0+HS (802.11 AMP) compliance

       •   Bluetooth v4.1 Low Energy (LE)

       •   Best-in-class BT/Wi-Fi coexistence performance

       •   BT Profiles: A2DP 1.2, AVRCP 1.3, SPP, HFP, HSP, HOGP




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3. LibreSync Features
LibreSync modules have extensive software features for connected media streaming and control
applications. These include system level control and interface features as well as networking
features.
Please refer to the full “LibreSync Feature List” for details of supported features.

                       Platform features can vary based on module configuration/derivatives and
                       commercial engagement details.




4. Block Diagram




                              Figure 4-1: LS9-AC11DBT MODULE Block Diagram



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                                                                            LS9-AC11DBT Module



5. Specifications
    5.1. General Specification
               Parameter                            Description / Values

          Model                LS9-AC11DBT MODULE

          Product Name         Network Media Module

          Standard                    •   Wi-Fi – IEEE802.11a, IEEE802.11b, IEEE802.11g,
                                          IEEE802.11n, IEEE802.11ac standards

                                      •   BT – v2.1+EDR, v3.0+HS, v4.1 BT Low Energy
                                          (BLE)

          Data Transfer Rate   1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120,150, 300,
                               and maximum of physical layer rate of 390 Mbps

          Frequency Band       2.4 / 5.0 GHz

          Input Voltage        3.3 V ± 5 %

          Ripple               20-30 mVpk-pk
          Requirement

          Operating            -5˚C to + 70˚C
          Temperature

          Dimensions           63mm x 41 mm x 6.8 mm (L x W x H ) ± 0.2mm



    5.2. Wi-Fi Specification
               Parameter                            Description / Values

          Standard             IEEE802.11a, IEEE802.11b, IEEE802.11g, IEEE802.11n, and
                               IEEE802.11ac (draft compliant)

          Data Rate               •   802.11b : 11, 5.5, 2, 1 Mbps
                                  •   802.11g : 54, 48, 36, 24, 18, 12, 9, 6 Mbps



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                                                                           LS9-AC11DBT Module



               Parameter                           Description / Values
                                 •   802.11n : MCS 0 to 7 for HT20MHz
                                               MCS 0 to 7 for HT40MHz
                                 •   802.11ac : MCS 0 to 9 for HT40MHz
                                                MCS 0 to 9 for HT80MHz

          Modulation                 •   802.11b : CCK, DQPSK, DBPSK

                                     •   802.11g : 64QAM, 16QAM, QPSK, BPSK

                                     •   802.11n : 64QAM, 16QAM, QPSK, BPSK

                                     •   802.11ac : 256 QAM, 64QAM, 16QAM, QPSK,
                                         BPSK

          Network                    •   Ad-hoc mode (Peer-to-Peer)
          Architecture
                                     •   Infrastructure Mode

          Operation Channel   2.4GHz
                                     •   11: (Ch. 1-11) – United States

                                     •   13: (Ch. 1-13) – Europe

                                     •   5.0 GHz

                                     •   21: (Ch. 36, 40, 44, 48, 52……161, and 165) – USA

                                     •   19: (Ch. 36, 40, 44, ………136, and 140) - Europe

          Frequency Range     2.4GHz: 2.412 ~ 2.483 GHz
                              5.0 GHz: 5.150GHz ~ 5.825GHz

          Transmit Max               •   2.4 GHz
          Output Power
                                             o 802.11b : 16 dBm (11Mbps)

                                             o 802.11g : 15 dBm (54Mbps)

                                             o 802.11n : 14 dBm (MCS 7)

                                     •   5.0 GHz



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                                                                           LS9-AC11DBT Module



               Parameter                           Description / Values

                                             o 802.11a : 15 dBm (54Mbps)

                                             o 802.11n : 14 dBm (MCS 7)

                                             o 802.11ac: 13 dBm (MCS 0)

                                             o 802.11ac: 13 dBm (MCS7)

                                    •    802.11ac : 12 dBm (MCS 9)

          Receiver                  •    2.4 GHz
          Sensitivity
                                             o 802.11b : < -92 dBm (1Mbps)

                                             o 802.11g : < - 70 dBm (54Mbps)

                                             o 802.11n : < -69 dBm (MCS 7)

                                    •    5.0 GHz

                                             o 802.11a : < -65 dBm (54Mbps)

                                             o 802.11n : < -64dBm (MCS 7)

                                    •    802.11ac :

                                             o -76 dBm (MCS 0)

                                             o -60 dBm (MCS7)

                                             o -54 dBm (MCS 9)

          Security            WEP 64&128 bit, WPA, WPA-PSK, WPA2, WPA2-PSK,
                              WPS, IEEE 802.1x, IEEE 802.11i




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    5.3. Bluetooth Specification
               Parameter                           Description / Values

          Standard            V2.1+EDR, V3.0+HS, V4.1 BT Low Energy (BLE)

          Audio CODEC         SBC
          Support

          Profile Support     A2DP 1.2, AVRCP 1.3, SPP, HFP, HSP, HOGP

          Sampling Rates         •   44.1 KHz, 48 KHz
                                 •   Joint Stereo 32 KHz

          Coexistence         Intelligent AFH (Advanced Frequency Hopping) – Channel
          Support             Assessment
                              WLAN/Bluetooth Coexistence (BCA) Protocol Support

          Data Rate              •   GFSK : 1 Mbps
                                 •   π/4 DQPSK : 2 Mbps
                                 •   8DPSK : 3 Mbps

          Modulation          GFSK, π/4 DQPSK, 8DPSK

          Operation Channel   0 to 78 for BDR / EDR
                              0 to 39 for BLE

          Frequency Range     2.4 GHz (2402 -2480 MHz)

          Security            AES Encryption

          Transmit Output        •   BDR : 6 dBm
          Power (+/- 1dBm
                                 •   EDR : 4 dBm
          tolerance)
                                 •   LE : 6 dBm

          Receiver               •   BDR: < -86 dBm
          Sensitivity
                                 •   EDR : < - 84 dBm
                                 •   LE : <-86 dBm




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                                                                                   LS9-AC11DBT Module




    5.4. Antenna Specification
            Antenna Module            LSANT-1C-180

             Antenna Gain             ≤ 3.5dBi

            Manufacturer of           Golden Smart International Co., Ltd
            Antenna

            Antenna Images




    5.5. LS9-AC11DBT Module Ordering Information
           Product               Wi-Fi Tx/Rx           Wi-Fi Bands              Bluetooth      Module Height*
         Number                                                                                       (±0.2mm)
          LS9-AC11DBT         802.11 b/g/n/ac         2.4 / 5.0 GHz      4.1 BLE              65 mm x 41mm
                              1x1                                                             x 6.8 mm (L x W
                                                                                              x H) ± 0.2mm



                        The LS9-AC11DBT module height does not include the measurement of bottom-
                       side media-connector.



6. Mechanical, Connectors and Interfaces
    6.1. Physical Module

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                                                                             LS9-AC11DBT Module


Physical module dimension is 63 mm x 41mm x 6.8 mm (L x W x H) ± 0.2mm.
Height of the module varies depending on the LS9 Module variant used; for information on height of
the module see Section 5.2.2. LS9-AC11DBT Module Ordering Information.
Figure 6-1 and Figure 6-2 represent module’s top and bottom.




                              Figure 6.1-1: LS9-AC11DBT Module Top




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                                                                              LS9-AC11DBT Module




                              Figure 6.1-2: LS9-AC11DBT Module Bottom




             Figure 6.1-3: LS9-AC11DBT MODULE Top view Mechanical Dimension (1)

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                                                                               LS9-AC11DBT Module




            Figure 6.1-4: LS9-AC11DBT MODULE Top View Mechanical Dimension (2)




            Figure 6.1-5: LS9-AC11DBT MODULE Top View Mechanical Dimension (3)

                       The module dimensions are measured in millimetres (mm).




    6.2. Media Connector Specification




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                                                                             LS9-AC11DBT Module




                                    Figure 6.2-1: Media Connector

    6.3. Pin Descriptions

  6.3.1. Connector-1

                                    LS9-Media Connector J1 pin outs

       Functionality           Signal Name                      Signal Name         Functionality

 3V3 Power Supply Input       3V3                 1      2      3V3             3V3 Power Supply
                                                                                Input

 3V3 Power Supply Input       3V3                 3      4      NC              No Connect



 Ground                       GND                 5      6      GND             Ground

 I2C Serial Clock output.     I2C0_SCL            7      8      MCLK            I2S Mater Clock Output

 I2C Serial Data.             I2C0_SDA            9      10     BCLK            I2S Bit Clock Output

 Power On Reset input.        RESET#              11     12     LRCLK           I2S LR clock Output
 Active Low. Add RC
 network (10k, 0.1uF)



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                                                                             LS9-AC11DBT Module



 No Connect                   NC                  13     14     I2S_TXD1/I2S    I2S_TXD1/I2S_RXD2
                                                                _RXD2 /SPDIF    /SPDIF Output *1
                                                                Output          (LS9 supports one I2S input output
                                                                                in I2S Master mode or LS9 supports
                                                                                two I2S input in I2S Slave/Master
                                                                                mode or this pin can be used for
                                                                                SPDIF Output)


 No Connect                   NC                  15     16     NC              No Connect

 USB VBUS power input         USB VBUS            17     18     NC              No Connect
 required only for USB
 device mode operation

 Ground                       GND                 19     20     I2S_RXD1        I2S Receive Data 1

 USB DP                       USB DP              21     22     NC              No Connect



 USB DM                       USB DM              23     24     NC              No Connect



 Ground                       GND                 25     26     GND             Ground

 No Connect                   NC                  27     28     NC              No Connect



 No Connect                   NC                  29     30     NC              No Connect



 No Connect                   NC                  31     32     NC              No Connect



 No Connect                   NC                  33     34     I2S_RXD1        I2S Receive Data 1

 Ground                       GND                 35     36     NC              No Connect



 No Connect                   NC                  37     38     GND             Ground

 No Connect                   NC                  39     40     NC              No Connect




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                                                                              LS9-AC11DBT Module



 No Connect                   NC                   41     42     GND             Ground

 Debug UART TXD. Add          UART1_TXD            43     44     NC              No Connect
 10k Pullup

 Debug UART RXD. Add          UART1_RXD            45     46     GND             Ground
 10k Pullup.

 Ground                       GND                  47     48     NC              No Connect

 Host MCU UART              UART0_TXD              49     50     NC              No Connect
 interface. Use 10k Pullup.

 Host MCU UART              UART0_RXD              51     52     NC              No Connect
 interface. Use 10k Pullup.

 SPI Clock Output or          SPI_SCLK/GPIO        53     54     NC              No Connect
 GPIO08                       8

 SPI Data Out or GPIO09       SPI_SDO/GPIO9        55     56     NC              No Connect

 Ground                       GND                  57     58     NC              No Connect

 SPI Data In or GPIO10        SPI_SDI/GPIO10       59     60     NC              No Connect

 No Connect                   NC                   61     62     NC              No Connect

 No Connect                   NC                   63     64     GND             Ground

 SPI CS or GPIO05             SPI_CS/GPIO5         65     66     NC              No Connect

 USB_ID                       USB_ID               67     68     NC              No Connect

 Ground                       GND                  69     70     NC              No Connect



              •   Revision 1.1 module of LS9, HOST MCU communication is on pin 43(Tx) and
                  45(Rx).
              •   Revision 1.2 module of LS9, HOST MCU communication is on pin 49(Tx) and
                  51(Rx).




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                                                                            LS9-AC11DBT Module



  6.3.2. Connector-2

                                    LS9-Media Connector J2 pin outs

       Functionality           Signal Name        Pin #      Pin #     Signal Name     Functionality

 Ground                       GND                1          2         GND            Ground

 HDMI TX DATA2 +              HDMI_TX_2P         3          4         NC             No Connect

 HDMI TX DATA2 -              HDMI_TX_2M         5          6         NC             No Connect

 Ground                       GND                7          8         GND            Ground

 HDMI TX DATA1 +              HDMI_TX_1P         9          10        NC             No Connect

 HDMI TX DATA1 -              HDMI_TX_1M         11         12        NC             No Connect

 Ground                       GND                13         14        GND            Ground

 HDMI TX DATA0 +              HDMI_TX_0P         15         16        NC             No Connect

 HDMI TX DATA0 -              HDMI_TX_0M         17         18        NC             No Connect

 Ground                       GND                19         20        GND            Ground

 HDMI TX CLOCK +              HDMI_TX_CLKP       21         22        NC             No Connect

 HDMI TX CLOCK -              HDMI_TX_CLKM 23               24        NC             No Connect

 Ground                       GND                25         26        GND            Ground

 HDMI TX CEC/ GPIO14          CEC                27         28        NC             No Connect

 HDMI I2C CLOCK/              HDMISCLK           29         30        NC             No Connect
 GPIO12

 HDMI I2C DATA / GPIO13 HDMISD                   31         32        NC             No Connect

 HDMI HOT PLUG /              HTPLG              33         34        NC             No Connect
 GPIO15

 Ground                       GND                35         36        NC             No Connect

 No Connect                   NC                 37         38        GND            Ground

 No Connect                   NC                 39         40        NC             No Connect

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                                                                             LS9-AC11DBT Module



 Ground                       GND                 41         42        GND            Ground

 No Connect                   NC                  43         44        NC             No Connect

 No Connect                   NC                  45         46        NC             No Connect

 Ground                       GND                 47         48        NC             No Connect

 No Connect                   NC                  49         50        NC             No Connect

 No Connect                   NC                  51         52        GND            Ground

 Ground                       GND                 53         54        NC             No Connect

 No Connect                   NC                  55         56        NC             No Connect

 No Connect                   NC                  57         58        GND            Ground

 Ground                       GND                 59         60        NC             No Connect

 SPI Data Out                 SPI_SDO             61         62        NC             No Connect

 SPI CS                       SPI_CS              63         64        GND            Ground

 SPI Clock output             SPI_SCLK            65         66        NC             No Connect

 SPI Data In                  SPI_SDI             67         68        NC             No Connect

 Ground                       GND                 69         70        GND            Ground




7. Power Consumption
       •   The default power consumption when not connected to Access-Point is 330mA at average
           operational condition and 360mA at peak operational condition.

       •   Power consumption during Google Cast for Audio (GCast) play back is 360mA at average
           operational condition and 375mA at peak operational condition.



            • Input voltage measured is 3.3V rail at the module connector pin.



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8. Environmental
    8.1. Storage Conditions
The calculated shelf life in a sealed bag is 12 months if stored between -5°C and 70˚C at less than
90% relative humidity (RH).
After the bag is opened, devices that are subjected to solder reflow or other high temperature
processes must be handled in the following manner:
       •   Mounted within 168 hours in factory conditions, i.e. <30°C at 60% RH.

       •   Storage humidity needs to maintained at <10%RH.

       •   Baking is necessary if the customer exposes the component to air for over 168 hrs.

            - Baking conditions: 125℃ for 8hrs.




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                                                                                LS9-AC11DBT Module



9. Reference Schematics
           For detailed schematics of LS9 refer to the latest LS9-EVK Schematic, file
           in the portal



    9.1. EVK Block Diagram




                                   Figure 8-1: LS9 EVK Block Diagram

    9.2. MFI 2.0C Authentication Circuit




                                   Figure 8-2: LS9 EVK Block Diagram

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                                                                               LS9-AC11DBT Module



10. Disclaimer
THE MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND,
EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A Pas RTICULAR PURPOSE OR NON-INFRINGEMENT.
We use reasonable efforts to include accurate and up-to-date information in this document. It does
not however, make any representations as its accuracy or completeness of information. Use of this
document is at your own risk. Libre Wireless Technologies, its suppliers, and other parties involved
in creating and delivering this document’s contents shall not be liable for any special, indirect,
incidental, or consequential damages, including without limitation, lost revenues or lost profits.




11. Appendix
    11.1. FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
                    i. This device may not cause harmful interference, and
                    ii. This device must accept any interference received, including interference that
                        may cause undesired operation.

Any Changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment. The modular can be installed or integrated in
mobile or fix devices only. This modular cannot be installed in any portable device.


FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
This modular must be installed and operated with a minimum distance of 20 cm between the
radiator and user body. If the FCC identification number is not visible when the module is installed
inside another device, then the outside of the device into which the module is installed must also
display a label referring to the enclosed module. This exterior label can use wording such as the
following: “Contains Transmitter Module FCC ID: 2ADBM-LS9AC11DBT Or Contains FCC ID:
2ADBM-LS9AC11DBT

When the module is installed inside another device, the user manual of the host must contain below
warning statements;


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            1   This device complies with Part 15 of the FCC Rules. Operation is subject to the following
                two conditions:
                    i. This device may not cause harmful interference.
                    ii. This device must accept any interference received, including interference that
                        may cause undesired operation.
            2   Changes or modifications not expressly approved by the party responsible for
                compliance could void the user's authority to operate the equipment.

The devices must be installed and used in strict accordance with the manufacturer's instructions as
described in the user documentation that comes with the product.
Any company of the host device which install this modular with limit modular approval should
perform the test of radiated emission and spurious emission according to FCC part 15C: 15.247,
15.407 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 , 15.407
and 15.209 requirement,then the host can be sold legally.




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Document Created: 2017-09-29 15:45:47
Document Modified: 2017-09-29 15:45:47

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