2ACIJ71251

FCC ID

Application Frequency Range	Final Action Date Granted
4BN/Jm2XxxfeM2SNr2sv4g== 2402.0-2480.0	2016-03-03 APPROVED

File Name	Document Type	Date	Direct
Modular Letter	Cover Letter(s)	2016-03-03 00:00:00	pdf
Confidentiality Letter	Cover Letter(s)	2016-03-03 00:00:00	pdf
Agency Letter	Cover Letter(s)	2016-03-03 00:00:00	pdf
Block Diagram	Block Diagram	2016-03-03 00:00:00	pdf
External Photos	External Photos	2016-03-03 00:00:00	pdf
Internal Photos	Internal Photos	2016-03-03 00:00:00	pdf
Labeling Info Revised	ID Label/Location Info	2016-03-03 00:00:00	pdf
RF Exposure Info	RF Exposure Info	2016-03-03 00:00:00	pdf
Test Report	Test Report	2016-03-03 00:00:00	pdf
Test Photos	Test Setup Photos	2016-03-03 00:00:00	pdf
Users Manual Rev 2	Users Manual	2016-03-03 00:00:00	pdf
BOM	Parts List/Tune Up Info		N/A
Operational Dscription	Operational Description		N/A
Schematics	Schematics		N/A

Equipment	Bluetooth LE Wireless Module
FRN	0023683360
Grantee Code	2ACIJ
Product Code	71251
Applicant Business	LAPIS Semiconductor Co.,Ltd.
Business Address	2-4-8 Shinyokohama,Kouhoku-ku , Yokohama,N/A Japan 222-8575
TCB Scope	A4: UNII devices & low power transmitters using spread spectrum techniques
TCB Email	[email protected]
Applicant	Makoto Terada –
Applicant Phone
Applicant Fax	+81-45-476-9317
Applicant Email	[email protected]
Applicant MailStop
Test Firm	SGS RF Technologies Inc.
Test Firm Contact	Kazuharu Yanagisawa
Test Firm Phone
Test Firm Fax	81-45-592-7506
Test Firm Email	[email protected]
Certified By	Makoto Terada – Manager