| Equipment | Bluetooth LE Wireless Module |
| FRN | 0023683360 |
| Grantee Code | 2ACIJ |
| Product Code | 71050-3 |
| Applicant Business | LAPIS Semiconductor Co.,Ltd. |
| Business Address | 2-4-8 Shinyokohama,Kouhoku-ku , Yokohama,N/A Japan 222-8575 |
| TCB Scope | A4: UNII devices & low power transmitters using spread spectrum techniques |
| TCB Email | [email protected] |
| Applicant | Makoto Terada – |
| Applicant Phone | |
| Applicant Fax | +81-45-476-9317 |
| Applicant Email | [email protected] |
| Applicant MailStop | |
| Test Firm | SGS RF Technologies Inc. |
| Test Firm Contact | Toshiro Ikegami |
| Test Firm Phone | |
| Test Firm Fax | 81455340646 |
| Test Firm Email | [email protected] |
| Certified By | Makoto Terada – Manager |