Users Manual

FCC ID: 2ACCRMB05

Users Manual

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FCCID_3345802

EH-MB05 Bluetooth® technology audio module FCCID:2ACCRMB05 • Bluetooth radio - Fully embedded Bluetooth® v3.0 +EDR - Class2 module - 128-bit encryption security - Range up to 15m - Multipoint capability(7 transmit data devices connected at the same time) • Support profiles - SPP (Master and slave) - iAP (ipod accessory protocol) - HFP ,A2DP,AVRCP,HID(Salve) EH-MB05 • User interface - Send AT command over UART - Firmware upgrade over USB - With SPP service active: 560kbps transmission speed (UART) - PCM interface (I2S,SPDIF) - I2C interface(Master ) • Audio codec - 16bit internal stereo codec :95dB SNR for DAC - 64MIPS Kalimba DSP coprocessor - Support Apt-X ,AAC, Apt-XLL,SBC codec • General I/O - 11 general purpose I/Os - 2 analogue I/O • FCC and Bluetooth® qualified • Single voltage supply: 3.3V typical • Small form factor: 23.24 x 11.93 x 2.2mm • Operating temperature range: -40 °C to 85 °C • The operation distance >20cm Version 2.0 July 21 2014 Shanghai Ehong Technologies Inc

Bluetooth Audio Module 1. Contents 1. Description ................................................................................................................................................................ 4 2. Application................................................................................................................................................................. 4 3. EH-MB05 Product numbering ............................................................................................................................. 4 4. Electrical Characteristic ........................................................................................................................................ 5 4.1. Recommend operation conditions ................................................................................................................. 5 4.2. Absolute Maximum Rating .............................................................................................................................. 5 4.3. Power consumptions ........................................................................................................................................ 6 4.4. Input/output Terminal Characteristics ........................................................................................................... 6 4.4.1. Digital Terminals........................................................................................................................................ 6 4.4.2. USB .............................................................................................................................................................. 7 4.4.3. Internal CODEC Analogue to Digital Converter ................................................................................. 7 4.4.4. Internal CODEC Digital to Analogue Converter ................................................................................. 8 5. Pinout and Terminal Description ........................................................................................................................ 9 5.1. Pin assignment .................................................................................................................................................. 9 6. Physical Interfaces................................................................................................................................................ 11 6.1. Power Supply ................................................................................................................................................... 11 6.2. Reset .................................................................................................................................................................. 12 6.3. PIO ...................................................................................................................................................................... 12 6.4. AIO ...................................................................................................................................................................... 12 6.5. UART.................................................................................................................................................................. 13 6.6. I2C Master ........................................................................................................................................................ 13 6.6.1. Apple iOS CP reference design ........................................................................................................... 14 6.7. Digital Audio Interfaces .................................................................................................................................. 15 6.7.1 PCM ........................................................................................................................................................... 16 6.7.2 Digital Audio Interface (I2 S) .................................................................................................................. 16 6.7.3 IEC 60958 Interface (SPDIF) ............................................................................................................... 19 6.8 Microphone input ............................................................................................................................................. 20 6.9 Analog Output stage ....................................................................................................................................... 21 6.10 USB .................................................................................................................................................................... 21 7. EH-MB05 Reference Design ............................................................................................................................... 23 8. Mechanical and PCB Footprint Characteristics.......................................................................................... 24 Shanghai Ehong Technologies Inc

Bluetooth Audio Module 9. RF Layout Guidelines .......................................................................................................................................... 24 9.1 Feed Line and Antenna.................................................................................................................................. 25 9.2 Matching network in free space ................................................................................................................... 26 10. Reflow Profile ..................................................................................................................................................... 27 11. Contact Information ......................................................................................................................................... 28 2. Table of Tables TABLE 1: RECOMMENDED OPERATING CONDITIONS ............................................................................................... 5 TABLE 2: ABSOLUTE MAXIMUM RATING RECOMMENDED OPERATING CONDITIONS ................................................ 5 TABLE 3: POWER CONSUMPTIONS .......................................................................................................................... 6 TABLE 4: DIGITAL TERMINAL .................................................................................................................................. 7 TABLE 5: USB TERMINAL ....................................................................................................................................... 7 TABLE 6: ANALOGUE TO DIGITAL CONVERTER ....................................................................................................... 8 TABLE 7: DIGITAL TO ANALOGUE CONVERTER ....................................................................................................... 8 TABLE 8：PIN TERMINAL DESCRIPTION ............................................................................................................... 11 TABLE 9: PIN STATUS ON RESET .......................................................................................................................... 12 TABLE 10: POSSIBLE UART SETTINGS ................................................................................................................ 13 TABLE 11:ALTERNATIVE FUNCTIONS OF THE DIGITAL AUDIO BUS INTERFACE ON THE PCM INTERFACE .............. 16 TABLE 12 : DIGITAL AUDIO INTERFACE SLAVE TIMING .......................................................................................... 17 TABLE 13 : DIGITAL AUDIO INTERFACE MASTER TIMING ....................................................................................... 18 TABLE 14: USB INTERFACE COMPONENT VALUES ............................................................................................... 22 3. Table of Figures FIGURE 1： P I NOUT OF EH-MB05......................................................................................................................... 9 FIGURE 2： P OW ER SUPPLY PCB DESIGN .......................................................................................................... 11 FIGURE 3： C O NNECTION TO HOST DEVICE ........................................................................................................ 13 FIGURE 4 : EXAMPLE EEPROM CONNECTION WITH I2C INTERFACE .................................................................... 14 FIGURE 5 : APPLE CO-PROCESSOR 2.0C ............................................................................................................. 14 FIGURE 6 : APPLE CO-PROCESSOR 2.0B ............................................................................................................. 15 FIGURE 7 : AUDIO INTERFACE .............................................................................................................................. 15 FIGURE 8 : DIGITAL AUDIO INTERFACE MODES ..................................................................................................... 17 FIGURE 9 : DIGITAL AUDIO INTERFACE SLAVE TIMING .......................................................................................... 18 FIGURE 10 : DIGITAL AUDIO INTERFACE MASTER TIMING ..................................................................................... 18 FIGURE 11: EXAMPLE CIRCUIT FOR SPDIF INTERFACE (CO-AXIAL ) ..................................................................... 19 FIGURE 12: EXAMPLE CIRCUIT FOR SPDIF INTERFACE (OPTICAL) ....................................................................... 20 FIGURE 13: MICROPHONE BIASING (SINGLE CHANNEL SHOWN) ........................................................................... 20 FIGURE 14: SPEAKER OUTPUT ............................................................................................................................. 21 FIGURE 15: USB CONNECTIONS .......................................................................................................................... 22 FIGURE 16: REFERENCE DESIGN ......................................................................................................................... 23 FIGURE 17: RECOMMENDED PCB MOUNTING PATTERN (UNIT: MM, DEVIATION:0.02MM)TOP VIEW ................... 24 FIGURE 18: CLEARANCE AREA OF ANTENNA ......................................................................................................... 25 FIGURE 19: ANTENNA REFERENCE DESIGN .......................................................................................................... 26 FIGURE 20: PI MATCH NETWORK EXAMPLE ........................................................................................................... 26 FIGURE 21: RECOMMENDED REFLOW PROFILE ................................................................................................... 27 Shanghai Ehong Technologies Inc

Bluetooth Audio Module 1. Description The EH-MB05 is an easy to use Bluetooth module, compliant with Bluetooth v3.0+EDR. The module provides complete RF platform in a small form factor. The EH-MB05 enables electronic devices with wireless connectivity, not requiring any RF experience or expertise for integration into the final product. The EH-MB05 module, being a certified solution, optimizes the time to market of the final application. The module is designed for maximum performance in a minimal space including fast speed UART and 11general purpose I/O lines, 1 analogueI/O lines, several serial interface options, and up to 600 kbps transmission speed with SPP service active, 200 kbps with iAP service active. The module is , the impedance of the feed line between the RF port and the antenna shall be 50Ω.Embedded Bluetooth AT command firmware is a friendly interface, Supportdifferent Bluetooth profiles, such as SPP, A2DP, AVRCP, HFP, HID, iAP and etc. iAP over Bluetooth using apple’s authentication coprocessor. Customers using the Apple authentication IC must register as developers, to become an Apple certified MFI member. License fees may apply, for additional information visit: http://developer.apple.com/programs/which-program/index.html. Certified MFI developers developing electronic accessories that connect to an iPod®, iPhone ®, and iPad ® can gain access to technical documentation, hardware components, technical support and certification logos. Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured. 2. Application • Sports and fitness • Home entertainment • Service diagnostics • Office and mobile accessories • Commercial • Multimedia speaker • Automotive • Human interface devices 3. EH-MB05 Product numbering EH-MB05X A. EH ------------- Company Name(Ehong) B. MB05 ------------ Module Name Shanghai Ehong Technologies Inc

Bluetooth Audio Module 4. Electrical Characteristic 4.1. Recommend operation conditions Operating Condition Min Typical Max Unit Storage Temperature -40 -- +105 °C Operating Temperature Range -40 -- +85 °C PIO Voltage +1.7 +3.3 +3.6 V AIO Voltage +1.42 +1.5 +1.57 V VDD Voltage +2.7 +3.3 +3.6 V RF frequency 2400 2441 24800 MHz Table 1: Recommended Operating Conditions 4.2. Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +125 °C Operating Temperature -40 +85 °C PIO Voltage -0.4 +3.6 V AIO Voltage -0.4 +1.57 V VDD Voltage -0.4 +3.6 V USB_DP/USB_DN Voltage -0.4 +3.6 V VDD+0. Other Terminal Voltages except RF -0.4 V 4 Table 2: Absolute Maximum Rating Recommended Operating Conditions Shanghai Ehong Technologies Inc

Bluetooth Audio Module 4.3. Power consumptions Operating Condition Min Typical Max Unit Standby, without deep sleep 2.1 - 3.1 mA Standby, with deep sleep 0.11 - 0.7 mA (b) Inquiry window time - - 40 mA Connected (Deep sleep disable, sniff (a) enable ) - 3.3 - mA Connected (Deep sleep on, sniff enable) - 0.4 - mA (a) Connected with data transfer 18 20 22 mA Connected with audio streaming (A2DP) 35 40 mA Table 3: Power consumptions Note : Power consumption depends on the firmware used. Typical values are shown in the table. (a) Sniff mode ----- In Sniff mode, the duty cycle of the slave’s activity in the piconet may be reduced. If a slave is in active mode on an ACL logical transport, it shall listen in every ACL slot to the master traffic, unless that link is being treated as a scatter net link or is absent due to hold mode. With sniff mode, the time slots when a slave is listening are reduced, so the master shall only transmit to a slave in specified time slots. The sniff anchor points are spaced regularly with an interval of Tsniff. (b) Radio on(Inquiry )----Search time is 22 seconds 4.4. Input/output Terminal Characteristics 4.4.1.Digital Terminals Supply Voltage Levels Min Typ Max Unit Input Voltage Levels VIL input logic level low -0.3 - +0.25xVDD V VIH input logic level high 0.625VDD - VDD+0.3 V Output Voltage Levels VOL output logic level low, lOL = 4.0mA - - 0.125 V VOH output logic level high, lOH = -4.0mA 0.75xVDD - VDD V Input and Tri-state Current Ii input leakage current at Vin=VDD or 0V -100 0 100 nA Ioz tri-state output leakage current at Vo=VDD -100 0 100 nA or 0V With strong pull-up -100 -40 -10 uA With strong pull-down 10 40 100 μA Shanghai Ehong Technologies Inc


Bluetooth Audio Module mV Input full scale at maximum gain (differential) - 4 - rms Input full scale at minimum gain (differential) - - mV 800 rms 3dB Bandwidth - 20 - kHz Microphone mode input impedance - 6 - kΩ THD+N (microphone input) @ 30mv rms input 0.04 % Table 6: Analogue to Digital Converter 4.4.4.Internal CODEC Digital to Analogue Converter Parameter Conditions Min Typ Max Unit Resolution - - 16 Bits Output Sample Rate, Fsample 8 - 48 kHz Fsample fin=1kHz 8kHz - 95 - B/W=20Hz->20kHz 11.025kHz - 95 - Signal to Noise A-Weighted 16kHz - 95 - Ratio, SNR THD+N<0.01% 22.050kHz - 95 - dB 0dBFS signal 32kHz - 95 - Load = 100kΩ 44.1kHz - 95 - 48kHz - 95 Digital Gain Digital Gain Resolution = 1/32 dB -24 - 21.5 dB Analogue Gain Analogue Gain Resolution = 3dB 0 - -21 dB mV Output voltage full swing (differential) - 750 - rms Allowed Load Resistive 16 - OC Ω Capacitive - - 500 pF THD+N 100kΩ load - - 0.01 % THD+N 16Ω load - - 0.1 % SNR (Load=16Ω, 0dBFS input relative to digital - - 95 dB silence) Table 7: Digital to Analogue Converter Shanghai Ehong Technologies Inc

Bluetooth Audio Module 5. Pinout and Terminal Description 5.1. Pin assignment Figure 1： Pinout of EH-MB05 Pin Symbol I/O Type Description 1 GND Ground Ground Active LOW RESETB, input debounced CMOS input with weak 2 RESETB so must be low for >5ms to cause a internal pull-up RESETB Input with weak internal pull- Serial Peripheral interface clock for 3 SPI_CLK down programming only 4 SPI_MISO CMOS output, tri-state, with Serial Peripheral Interface output for weak internal pull-down programming only 5 SPI_MOSI CMOS input, with weak Serial Peripheral Interface input for internal pull-down programming only Chip select for Synchronous Serial Input with weak internal pull- 6 SPI_CSB Interface for programming only, active up low 7 LED0 Open drain output LED Driver Bi-directional with 8 PIO3 programmable strength Programmable input/output line internal pull-up/down CMOS output, tri-state, with 9 PCM_OUT Synchronous Data Output weak internal pull-down 10 MIC_RP Analogue Microphone input positive, right 11 MIC_RN Analogue Microphone input negative, right Shanghai Ehong Technologies Inc

Bluetooth Audio Module Bi-directional with 12 PIO0 programmable strength Programmable input/output line internal pull-up/down Bi-directional with 13 PIO1 programmable strength Programmable input/output line internal pull-up/down CMOS Input, with weak 14 PCM_IN Synchronous Data Input internal pull-down 15 GND Ground Ground 16 Bi-directional with weak PCM_SYNC Synchronous Data Sync internal pull-down 17 RF_GND RF Ground RF ground 18 RF_IN RF RF Transceiver input/output line 19 RF_GND RF Ground RF ground Bi-directional with weak 20 PCM_CLK Synchronous Data Clock internal pull-down 21 AIO0 Bi-directional Analogue programmable input/output line 22 GND Ground Ground 23 MIC_LP Analogue Microphone input positive, left 24 MIC_LN Analogue Microphone input negative, right 25 SPK_LN Analogue Speaker output negative, left 26 SPK_LP Analogue Speaker output positive, left 27 SPK_RN Analogue Speaker output negative, right 28 SPK_RP Analogue Speaker output positive, right Bi-directional with 29 PIO13 programmable strength Programmable input/output line internal pull-up/down 30 VDD 3V3 power input 3V3 power input 31 USB data plus with selectable internal USB_DP Bi-directional 1.5K pull up resistor 32 USB_DN Bi-directional USB data minus 33 GND Ground Ground Bi-directional with 34 PIO9 programmable strength Programmable input/output line internal pull-up/down Bi-directional with 35 PIO14 programmable strength Programmable input/output line internal pull-up/down 36 PIO4 Bi-directional with Programmable input/output line Shanghai Ehong Technologies Inc

Bluetooth Audio Module programmable strength internal pull-up/down 37 GND Ground Ground Bi-directional CMOS output, 38 UART_TX tri-state, with weak internal UART data output pull-up CMOS input with weak 39 UART_RX UART data input internal pull-down Bi-directional with 40 PIO8 programmable strength Programmable input/output line internal pull-up/down Bi-directional with 41 PIO7 programmable strength Programmable input/output line internal pull-up/down Bi-directional with 42 PIO6 Programmable input/output line programmable strength internal pull-up/down Table 8：PIN Terminal Description 6. Physical Interfaces 6.1. Power Supply - The module DC3.3V power input. - Power supply pin connection capacitor to chip and pin as far as possible close - Capacitor decouples power to the chip - Capacitor prevents noise coupling back to power plane. . Figure 2： Power Supply PCB Design Shanghai Ehong Technologies Inc

Bluetooth Audio Module 6.2. Reset The module may be reset from several sources: RESETB pin, power-on reset, a UART break character or via software configured watchdog timer. The RESETB pin is an active low RESETB and is internally filtered using the internal low frequency clock oscillator. A RESETB will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. At RESETB the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The pull-down state is shown below. Pin Name / Group Pin Status on RESETB USB_DP N/a USB_DN N/a UART_RX PD UART_TX PU SPI_MOSI PD SPI_CLK PD SPI_CSB PU SPI_MISO PD RESETB PU PIOs PD PCM_IN PD PCM_CLK PD PCM_SYNC PD PCM_OUT PD Table 9: Pin Status on Reset 6.3. PIO EH-MB05 has a total of 11 digital programmable I/O terminals. They are powered from VDD (3.3V). Their functions depend on firmware running on the device. PIO lines can be configured through software to have either weak or strong pull-ups or pull-downs. Note: All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. 6.4. AIO EH-MB05 has 2 analogue I/O terminals. Their functions depend on software. Typically ADC functions can be configured to battery voltage measurement. They can also be used as a digital PIO. Shanghai Ehong Technologies Inc

Bluetooth Audio Module 6.5. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. The UART CTS and RTS signals can be used to implement RS232 hardware flow control where both are active low indicators. Parameter Possible Values 1200 baud (≤2%Error) Minimum Baud Rate 9600 baud (≤1%Error) Maximum 3M baud (≤1%Error) Flow Control RTS/CTS or None Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Byte 8 Table 10: Possible UART Settings Figure 3： Connection To Host device 6.6. I2C Master PIO6, PIO7 and PIO8 can be used to form a master I C interface. The interface is formed using software to drive these lines. It is suited only to relatively 2 slow functions such as driving a LCD, keyboard scanner or EEPROM. In the case, PIO lines need to be pulled up through 2.2KΩ resistors. Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 4 : Example EEPROM Connection with I2C Interface 6.6.1.Apple iOS CP reference design The figures below give an indicative overview of what the hardware concept looks like. A specific MFI co-processor layout is available for licensed MFI developers from the MFI program. Figure 5 : Apple Co-processor 2.0C Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 6 : Apple Co-processor 2.0B 6.7. Digital Audio Interfaces The audio interface circuit consists of: ■ Stereo audio codec ■ Dual audio inputs and outputs ■ A configurable PCM, I²S or SPDIF interface Figure 2 outlines the functional blocks of the interface. The codec supports stereo playback and recording of audio signals at multiple sample rates with a resolution of 16-bit. The ADC and the DAC of the codec each contain 2 independent channels. Any ADC or DAC channel can be run at its own independent sample rate. Figure 7 : Audio Interface The interface for the digital audio bus shares the same pins as the PCM codec interface described in Table 11, which means each of the audio buses are mutually exclusive in their usage. Table 11 lists these alternative functions. Shanghai Ehong Technologies Inc

Bluetooth Audio Module PCM Interface SPDIF Interface I²S Interface PCM_OUT SPDIF_OUT SD_OUT PCM_IN SPDIF_IN SD_IN PCM_SYNC - WS PCM_CLK - SCK Table 11: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface The audio input circuitry consists of a dual audio input that can be configured to be either single-ended or fully differential and programmed for either microphone or line input. It has an analogue and digital programmable gain stage for optimization of different microphones. The audio output circuitry consists of a dual differential class A-B output stage. 6.7.1 PCM The audio pulse code modulation (PCM) interface supports continuous transmission and reception of PCM encoded audio data over Bluetooth. Hardware on EH-MB05 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time. EH-MB05 can operate as the PCM interface master generating PCM_SYNC and PCM_CLK or as a PCM interface slave accepting externally generated PCM_SYNC and PCM_CLK. EH-MB05 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. It supports 13-bit or 16-bit linear, 8-bit u-law or A-law companded sample formats and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. EH-MB05 interfaces directly to PCM audio devices including the following: ■ Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices ■ OKI MSM7705 four channel A-law and μ-law CODEC ■ Motorola MC145481 8-bit A-law and μ-law CODEC ■ Motorola MC145483 13-bit linear CODEC ■ STW 5093 and 5094 14-bit linear CODECs(8) ■ EH-MB05 is also compatible with the Motorola SSI interface 6.7.2 Digital Audio Interface (I2S) The digital audio interface supports the industry standard formats for I2S, left-justified or right- justified. The interface shares the same pins of the PCM interface as Table 11. The I2S interface can be enabled by using AT+ commands. The module is an I2S slave device with the default firmware. Contact with EHong for special firmware when use the module as an I2S master. The I2S support following formats: Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 8 : Digital Audio Interface Modes Symbol Parameter Min Typical Max Unit - SCK Frequency - - 6.2 MHz - WS Frequency - - 96 kHz tch SCK high time 80 - - ns tcl SCK low time 80 - - ns topd SCK to SD_OUT delay - - 20 ns tssu WS to SCK set up time 20 - - ns tsh WS to SCK hold time 20 - - ns tisu SD_IN to SCK set-up time 20 - - ns tih SD_IN to SCK hold time 20 - - ns Table 12 : Digital Audio Interface Slave Timing Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 9 : Digital Audio Interface Slave Timing Symbol Parameter Min Typical Max Unit - SCK Frequency - - 6.2 MHz - WS Frequency - - 96 kHz topd SCK to SD_OUT delay - - 20 ns tspd SCK to WS delay - - 20 ns tisu SD_IN to SCK set-up time 20 - - ns tih SD_IN to SCK hold time 10 - - ns Table 13 : Digital Audio Interface Master Timing Figure 10 : Digital Audio Interface Master Timing Shanghai Ehong Technologies Inc

Bluetooth Audio Module 6.7.3 IEC 60958 Interface (SPDIF) Through AT+ command to switch if SPDIF is used.The IEC 60958 interface is a digital audio interface that uses bi-phase coding to minimise the DC content of the transmitted signal and allows the receiver to decode the clock information from the transmitted signal. The IEC 60958 specification is based on the 2 industry standards: ■ AES/EBU ■ Sony and Philips interface specification SPDIF The interface is compatible with IEC 60958-1, IEC 60958-3 and IEC 60958-4. The SPDIF interface signals are SPDIF_IN and SPDIF_OUT and are shared on the PCM interface pins. The input and output stages of the SPDIF pins can interface to: ■ A 75Ω coaxial cable with an RCA connector, see Figure 11. ■ An optical link that uses Toslink optical components, see Figure 12. Figure 11: Example Circuit for SPDIF Interface (Co-Axial) Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 12: Example Circuit for SPDIF Interface (Optical) 6.8 Microphone input Figure 13: Microphone Biasing (Single Channel Shown) The audio input is intended for use in the range from 1μA @ 94dB SPL to about 10μA @ 94dB SPL. With biasing resistors R1 and R2 equal to 1kΩ, this requires microphones with sensitivity between about –40dBV and –60dBV. The microphone for each channel should be biased as shown in Figure 14. Shanghai Ehong Technologies Inc

Bluetooth Audio Module 6.9 Analog Output stage The output stage digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to a 2Mbits/s 5-bit multi-bit bit stream, which is fed into the analogue output circuitry. The output stage circuit is comprised a DAC with gain setting and class AB amplifier. The output is available as a differential signal between SPKR_LN and SPKR_LP for the right channel, as Figure 14 shows, and between SPKL_RN and SPKL_RP for the left channel. Figure 15: Speaker output 6.10 USB This is a full speed (12M bits/s) USB interface for communicating with other compatible digital devices. The module acts as a USB peripheral, responding to request from a master host controller, such as a PC. The USB interface is capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented can behave as specified in the USB section of the Bluetooth specification v2.1+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. The module has an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device. Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 16: USB Connections Identifier Value Function Impedance matching to USB Rs 27Ω Nominal cable Table 14: USB Interface Component Values Note: USB_ON is only used when the firmware need an input to detect if USB is connected and the USB function shall be enabled. In such case it is shared with the module PIO terminals. If detection is not needed (firmware already runs with USB, such as USB DFU or USB CDC), USB_ON is not needed. Shanghai Ehong Technologies Inc

Bluetooth Audio Module 7. EH-MB05 Reference Design Figure 17: Reference Design Shanghai Ehong Technologies Inc

Bluetooth Audio Module 8. Mechanical and PCB Footprint Characteristics Figure 18: Recommended PCB Mounting Pattern (Unit: mm, Deviation:0.02mm)TOP View 9. RF Layout Guidelines EH-MB05 has an on-board PCB antenna. PCB design to ensure enough clearance area of antenna, area length is 1.6 times of antenna length, area width is 4 times of antenna width, the bigger the better if the space allows. The specific size as shown figure below. Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 19: Clearance area of antenna 9.1 Feed Line and Antenna The impedance of the feed line between the RF port and the antenna shall be 50Ω.  A good ground directly under the feed line is always needed for impedance control.  Route the feed line as curve lines when needed, avoid 90 or even less degree angles style.  The width of the feed line, the distance of the feed line to the ground plane are keys to the impedance. Ask your PCB supplier to control the impedance of the feed line. For the antenna,  When PCB antenna is used, matching networks shall be used to optimize the antenna’s signal strength.  Use as many vias as possible to connect the ground planes nearby the antenna. Shanghai Ehong Technologies Inc

Bluetooth Audio Module Figure 20: Antenna reference design 9.2 Matching network in free space The specs of a Fractus standard antenna are measured in their evaluation board (in free space), which is an ideal case. In a real design, components nearby the antenna, semiconductors, LCD’s, batteries, covers, connectors, etc affect the antenna performance. This is the reason why it is highly recommended to place 0402 pads for a PI matching network as close as possible to the antenna feeding point. Do it in the ground plane area, not in the clearance area. This is a degree of freedom to tune the antenna once the design is finished and taking into account all elements of the system (batteries, displays, covers, etc). Figure 21: PI match network example Shanghai Ehong Technologies Inc

Bluetooth Audio Module 10. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 25 A B C D E 0 1 2 3 4 5 6 min Figure 22: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150to 210for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. Shanghai Ehong Technologies Inc

Bluetooth Audio Module 11. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom1505, Blk 1st ,No.833 South Hong mei Rd ,Ming hang district shanghai Note: FCC RF exposure requirements 1. Radiated transmit power must be equal to or lower than that specified in the FCC Grant of Equipment Authorization for FCC ID:2ACCRMB05. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: . Bluetooth <4.0 dBi 3. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received,including interference that may cause undesired operation. 4.The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. Ehong Technology Co., Ltd

Bluetooth Audio Module For portable devices, in addition to the conditions described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products.Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labelled with an FCC ID - Section 2.926 (see 2.2 Certification (labelling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labelling requirements,options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC ID: 2ACCRMB05” or “Contains FCC ID: 2ACCRMB05” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Ehong Technology Co., Ltd

Bluetooth Audio Module —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. In accordance with FCC Part 15C, this module is listed as a Limited Modular Transmitter device. Therefore, the final host product must be submitted to [ShangHai Ehong Technology Co.,Ltd.] for confirmation that the installation of the module into the host is in compliance with the regulations of FCC and IC Canada. Specifically, if an antenna other than the model documented in the Filing is used, a Class 2 Permissive Change must be filed with the FCC. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. Ehong Technology Co., Ltd


Document Created: 2017-03-28 14:02:29
Document Modified: 2017-03-28 14:02:29
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