Users Manual

FCC ID: 2AC7Z-ESPWROOMS2

Users Manual

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FCCID_3262599

ESP-WROOM-S2 Datasheet Version 1.1 Copyright © 2016

About This Guide This document introduces users to the specifications of ESP-WROOM-S2 hardware, including the following topics. Chapter Title Subject Introduction to ESP-WROOM-S2, including dimensions and Chapter 1 Overview specifications. Chapter 2 Pin Description Introduction to pin layout and the relevant description. Description of the major functional modules and protocols applied on Chapter 3 Functional Description ESP-WROOM-S2, including CPU, flash, memory and interfaces. Chapter 4 Electrical Characteristics Electrical data of ESP-WROOM-S2. Chapter 5 '$$8BSOJOH Release Notes Date Version Release notes 2016.06 V1.0 First release. Updated the operating temperature range; 2016.08 V1.1 Added NCC Wi-Fi standard; Updated Section 3.4 Interface Description.

Table of Contents 1. Overview .................................................................................................................................1 2. Pin Description ....................................................................................................................... 3 3. Functional Description ............................................................................................................ 5 3.1. MCU .......................................................................................................................................... 5 3.2. Memory...................................................................................................................................... 5 3.2.1. Internal SRAM and ROM .............................................................................................5 3.2.2. SPI Flash ......................................................................................................................5 3.3. Crystal Oscillator ....................................................................................................................... 6 3.4. Interface Description ................................................................................................................. 7 4. Electrical Characteristics ........................................................................................................8 4.1. Absolute Maximum Ratings....................................................................................................... 8 4.2. Recommended Operating Conditions ....................................................................................... 8 4.3. Digital Terminal Characteristics ................................................................................................. 8 4.4. RF Performance......................................................................................................................... 9 4.5. Sensitivity................................................................................................................................... 9 4.6. Power Consumption ................................................................................................................ 10 4.7. Reflow Profile...........................................................................................................................11 5. '$$8BSOJOH .........................................................................................................................12

1. Overview 1. Overview Espressif provides the SMD module - ESP-WROOM-S2 that integrates ESP8266EX. The module has received various adjustments to achieve better RF performance. We recommend using ESP-WROOM-S2 for tests or for further development. Note: For more information on ESP8266EX, please refer to ESP8266EX Datasheet. The module size is 16 mm x 23 mm x 3 mm (see Figure 1-1). The flash used on this module is a 2 MB SPI flash connected to HSPI, with the package size of SOP 8-150 mil. The gain of the on-board PCB antenna is 2 dBi. The ESP-WROOM-S2 works as the SDIO/SPI slave with the SPI speed of up to 8 Mbps. Figure 1-1. ESP-WROOM-S2 Module Table 1-1. ESP-WROOM-S2 Specifications Categories Items Specifications Standards FCC Wi-Fi Wi-Fi protocols 802.11 b/g/n Frequency range 24M)[ ~ 24.)[ UART/I2C/GPIO/PWM/SDIO/SPI/IR Remote Control/ ADC Peripheral interface GPIO/PWM Espressif 1/13 2016.08

1. Overview Categories Items Specifications Operating voltage 3.0V ~ 3.6V Operating current Average: 80 mA Hardware Operating temperature range -40°C ~ 85°C Storage temperature -40°C ~ 85°C Package size 16 mm x 23 mm x 3 mm External interface - Wi-Fi mode Station/SoftAP/SoftAP + Station Security WPA/WPA2 Encryption WEP/TKIP/AES UART Download / OTA (via network) / Download and Software Firmware upgrade burn firmware via host Supports Cloud Server Development Software development SDK for secondary development Network protocols IPv4, TCP/UDP/HTTP/FTP User configuration AT Instruction Set, Cloud Server, Android/iOS App Note: ESP-WROOM-S2 with high temperature range option (-40°C ~ 125°C) is available for custom order. Espressif 2/13 2016.08

2. Pin Description 2. Pin Description Figure 2-1 shows the pin distribution of the SMD Module. 16.00 6.00 PCB ANTENNA 1.86 GND EN 0.60 1.50 3V3 ADC_IN IO16 RST 23.00 IO15 IO5 IO2 4.50 1:GND TXD 15.70 IO0 RXD 4.50 SD1/INT IO4 SD2/IO9 SD0/MISO 7.30 SD3/CS SCLK CMD/MOSI GND 0.90 1.75 7.00 0.85 Unit: mm Figure 2-1. Top View of The ESP-WROOM-S2 Table 2-1. ESP-WROOM-S2 Dimensions Length Width Height PAD size (bottom) Pin Pitch 16 mm 23 mm 3 mm 0.9 mm x 0.85 mm 1.5 mm ESP-WROOM-S2 has 20 pins, please see the pin definitions in Table 2-2. Espressif 3/13 2016.08

2. Pin Description Table 2-2. ESP-WROOM-S2 Pin Definitions No. Pin Name Functional Description 1 GND Ground 3.3 V power supply (VDD) Note: 2 3V3 It is recommended the maximum output current a power supply provides be of 500 mA or above. 3 IO16 GPIO16; used for Deep-sleep wake-up when connected to RST pin. HSPICS 4 IO15 • UART download: pull down. • SDIO boot: floating (internal pull-up) or pull up. GPIO2; UART1_TXD 5 IO2 • UART download: pull down. • SDIO boot: don’t-care. GPIO0 6 IO0 • UART download: pull down. • SDIO boot: don’t-care. 7 IO4 GPIO4 8 SD2/IO9 SD_D2 (Series resistor: 100 ~ 200 Ω, 10 k pull-up resistor); GPIO9 9 SD3/CS SD_D3 (Series resistor: 100 ~ 200 Ω, 10 k pull-up resistor); SLAVE_ SPI_CS 10 CMD/MOSI SD_CMD (Series resistor: 100 ~ 200 Ω, 10 k pull-up resistor); SLAVE_ SPI_MOSI 11 GND Ground 12 SCLK SD_CLK (Series resistor: 100 ~ 200 Ω); SLAVE_ SPI_CLK 13 SD0/MISO SD_D0 (Series resistor: 100 ~ 200 Ω, 10 k pull-up resistor); SLAVE_ SPI_MISO 14 SD1/INT SD_D1 (Series resistor: 100 ~ 200 Ω, 10 k pull-up resistor); SLAVE_ SPI_INT UART0_RXD, receive end in UART download; 15 RXD GPIO3 UART0_TXD, transmit end in UART download, floating (internal pull-up) or pull up; 16 TXD GPIO1 17 IO5 GPIO5 18 RST Reset Tests the power-supply voltage of VDD3P3 and the input power voltage of TOUT. 19 ADC_IN These two functions cannot be used simultaneously. 20 EN Chip enable pin (cannot be floating). Active high. Espressif 4/13 2016.08

3. Functional Description 3. Functional Description 3.1. MCU ESP8266EX contained in the ESP-WROOM-S2 integrates Tensilica L106 32-bit micro controller (MCU) and a 16-bit RSIC. The CPU clock speed is 80 MHz and can reach a maximum value of 160 MHz. The system can readily run a Real Time Operating System (RTOS). Currently, the Wi-Fi stack only takes up 20% of CPU time. The remaining CPU time (80% of total MIPS) can be used for user application. The MCU can work in conjunction with the other parts of the chip through the following interfaces. • Programmable RAM/ROM interface (iBus) that connects to memory controller and can access the external flash. • Data RAM interface (dBus) that connects to memory controller. • AHB interface that accesses the register. 3.2. Memory 3.2.1. Internal SRAM and ROM ESP8266EX Wi-Fi SoC integrates memory controller including SRAM and ROM. MCU can access the memory controller through iBus, dBus, and AHB interfaces. All these interfaces can access ROM or RAM units. A memory arbiter determines the running sequence in the arrival order of requests. According to our current version of SDK, SRAM space available to users is assigned as below. • RAM size < 50 kB, that is, when ESP8266EX is working in Station mode and connects to the router, available space in Heap + Data sector is around 50 kB. • There is no programmable ROM in ESP8266EX, therefore, user program must be stored in the SPI flash integrated into the ESP-WROOM-S2. 3.2.2. SPI Flash ESP8266EX supports SPI flash. Theoretically speaking, ESP8266EX can support up to 16 MB SPI flash. ESP-WROOM-S2 currently integrates 2 MB SPI flash memory. ESP-WROOM-S2 supports these SPI modes: Standard SPI, DIO (Dual I/O), DOUT (Dual Output), QIO (Quad I/O) and QOUT (Quad Output). Espressif 5/13 2016.08

3. Functional Description Notice: Please use the most updated download tool and configure SPI MODE in the download tool as DIO or DOUT. 3.3. Crystal Oscillator ESP-WROOM-S2 uses 26 MHz crystal oscillator. The accuracy of the crystal oscillator should be ±10 PPM, and the operating temperature range is -20°C to 85°C. When using the download tool, please note to select the right crystal oscillator type. In circuit design, capacitors C1 and C2 which connect to the earth, are added to the input and output terminals of the crystal oscillator respectively. The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF, however, the specific capacitive values depend on further testing and adjustment on the overall performance of the whole circuit. Normally, the capacitive values of C1 and C2 are within 10 pF for the 26 MHz crystal oscillator. Crystal oscillator should be placed as close to the XTAL pins as possible (without the traces being too long). It is good practice to add high density ground vias around the clock trace for great insulation. There should be no vias on the input and output traces, which means the traces cannot cross layers. Place the input and output bypass capacitors on the near left or right side of the chip. Do not place them on the traces. Do not route high-frequency digital signal lines in the four-layer board. It is best not to route any signal line under the crystal oscillator. The larger the copper area on the top layer is, the better. As crystal oscillator is a sensitive component, do not place magnetic components such as high current inductance nearby. Espressif 6/13 2016.08

3. Functional Description 3.4. Interface Description Table 3-1. Interface Description Interface Pin Functional Description S2 can control SPI Slave as a Master or communicate with Host MCU as GPIO12/13/14/15 or SPI a Slave. In overlap mode, S2 can share the SPI interface with Flash, GPIO6/7/8/11 shifted by different CS signals. Currently the demo provides 4 PWM channels (users can extend to 6 Any available GPIO PWM channels). PWM interface can realize the control of LED lights, buzzers, (EXCEPT GPIO16) relays, electronic machines, etc. The functionality of infrared remote control interface can be realized via Any available GPIO IR software programming. The interface uses NEC coding, modulation, and (EXCEPT GPIO16) demodulation. The frequency of modulated carrier signal is 38 kHz. Tests the power supply voltage of VDD3P3 (Pin 3 and Pin 4) and the input ADC TOUT power voltage of TOUT (Pin 6). However, these two functions cannot be used simultaneously. This interface is typically used in sensors. Any available GPIO I2C Connects to external sensors and display screens, etc. (EXCEPT GPIO16) Communicates with UART device. UART0: Downloading: U0TXD + U0RXD or GPIO2 + U0RXD TXD(U0TXD), UART Communicating (UART0): U0TXD, U0RXD RXD(U0RXD) Debugging: UART1_TXD (GPIO2) can be used to print debugging UART1: IO2(TXD) information. Espressif 7/13 2016.08

4. Electrical Characteristics 4. Electrical Characteristics Note: Unless otherwise specified, measurements are based on VDD = 3.3 V, TA = 25°C. 4.1. Absolute Maximum Ratings Table 4-1. Absolute Maximum Ratings Rating Condition Value Unit Storage temperatue - -40 ~ 125 ℃ Maximum soldering - 260 ℃ temperature Supply voltage IPC/JEDEC J-STD-020 3.0 ~ 3.6 V 4.2. Recommended Operating Conditions Table 4-2. Recommended Operating Conditions Operating condition Symbol Min Typ Max Unit Operating temperature - -40 20 125 ℃ Supply voltage VDD 3.0 3.3 3.6 V 4.3. Digital Terminal Characteristics Table 4-3. Digital Terminal Characteristics Terminals Symbol Min Typ Max Unit Input logic level low VIL -0.3 - 0.25 VDD V Input logic level high VIH 0.75 VDD - VDD + 0.3 V Output logic level low VOL N - 0.1 VDD V Output logic level high VOH 0.8 VDD - N V Espressif 8/13 2016.08

4. Electrical Characteristics 4.4. RF Performance Table 4-4. RF Performance Description Min Typ Max Unit Input frequency 2400 - 2483.5 MHz Input impedance - 50 - ohm Input reflection - - -10 dB PA output power at 72.2 Mbps 15.5 16.5 17.5 dBm PA output power in 11b mode 16 17 18 dBm Sensitivity CCK, 1 Mbps - -98 - dBm CCK, 11 Mbps - -91 - dBm 6 Mbps (1/2 BPSK) - -93 - dBm 54 Mbps (3/4 64-QAM) - -75 - dBm HT20, MCS7 (65 Mbps, 72.2 Mbps) - -72 - dBm Adjacent channel rejection OFDM, 6 Mbps - 37 - dB OFDM, 54 Mbps - 21 - dB HT20, MCS0 - 37 - dB HT20, MCS7 - 20 - dB 4.5. Sensitivity Table 4-5. Sensitivity Parameters Min Typ Max Unit Input frequency 2412 - 24 MHz Input impedance - 50 - Ω Input reflection - - -10 dB PA output power at 72.2 Mbps 15.5 16.5 17.5 dBm PA output power in 11b mode 16 17 18 dBm Sensitivity DSSS, 1 Mbps - -98 - dBm Espressif 9/13 2016.08

4. Electrical Characteristics Parameters Min Typ Max Unit CCK, 11 Mbps - -91 - dBm 6 Mbps (1/2 BPSK) - -93 - dBm 54 Mbps (3/4 64-QAM) - -75 - dBm HT20, MCS7 (65 Mbps, 72.2 Mbps) - -72 - dBm Adjacent channel rejection OFDM, 6 Mbps - 37 - dB OFDM, 54 Mbps - 21 - dB HT20, MCS0 - 37 - dB HT20, MCS7 - 20 - dB 4.6. Power Consumption The following power consumption data were obtained from the tests with 3.3 V power supply and a voltage stabilizer, in 25°C ambient temperature. • All tests were performed at the antenna port without SAW filter. • All data are based on 90% duty cycle in continuous transmission mode. Table 4-6. Power Consumption Modes Min Typ Max Unit Tx 802.11b, CCK 11 Mbps, POUT = +17 dBm - 170 - mA Tx 802.11g, OFDM 54 Mbps, POUT = +15 dBm - 140 - mA Tx 802.11n, MCS7, POUT = +13 dBm - 120 - mA Rx 802.11b, 1024 bytes packet length , -80 dBm - 50 - mA Rx 802.11g, 1024 bytes packet length , -70 dBm - 56 - mA Rx 802.11n, 1024 bytes packet length , 65 dBm - 56 - mA Modem-Sleep - 15 - mA Light-Sleep - 0.9 - mA Deep-Sleep - 10 - μA Power Off - 0.5 - μA Espressif 10/ 13 2016.08

4. Electrical Characteristics Notes: Modem-Sleep is used when applications require CPU to be working, such as PWM or I2S applications. In the scenarios where Wi-Fi connectivity is maintained and data transmission is not required, Wi-Fi Modem circuit can be shut down to save power, according to 802.11 standards (such as U-APSD). For example, in DTIM3, when ESP8266EX sleeps for 300 ms and wakes up for 3 ms to receive Beacon packages from AP, the overall average current consumption is about 15 mA. Light-Sleep is used for applications whose CPU may be suspended, such as Wi-Fi switch. In the scenarios where Wi-Fi connectivity is maintained and data transmission is not required, Wi-Fi Modem circuit and CPU can be shut down to save power, according to 802.11 standards (such as U-APSD). For example, in DTIM3, when ESP8266EX sleeps for 300 ms and wakes up for 3 ms to receive Beacon packages from AP, the overall average current consumption is about 0.9 mA. Deep-Sleep is for applications that do not require Wi-Fi connectivity and only transmit data with long time lags, e.g., a temperature sensor that measures temperature every 100 s. For example, when ESP8266EX sleeps for 300 s then wakes up to connect to AP (taking about 0.3 ~ 1 s), the overall average current consumption is far less than 1 mA. 4.7. Reflow Profile Table 4-7. Reflow Profile Indicator Value Ramp-up Rate (TS Max to TL) 3℃/second max. Preheat Temperature Min. (TS Min.) 150℃ Temperature Typ. (TS Typ.) 175℃ Temperature Min. (TS Max.) 200℃ Time (TS) 60 ~ 180 seconds Ramp-up Rate (TL to TP) 3℃/second max. Time maintained above: Temperature (TL)/Time (TL) 217℃/60 ~ 150 seconds Peak temperature (TP) 260℃ max, for 10 seconds Target Peak Temperature (TP Target) 260℃ + 0/-5℃ Time within 5°C of actual Peak Temperature (TP) 20 ~ 40 seconds TS max to TL (Ramp-down Rate) 6℃/second max. Time 25°C to Peak Temperature (t) 8 minutes max. Espressif 11/ 13 2016.08

5. Schematics 5. '$$8BSOJOH ny Changes or modifications not e pressly approved by the party responsible for compliance could void the user s authority to operate the e uipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. &>ĂďĞů/ŶƐƚƌƵĐƚŝŽŶƐ͗ The outside of final products that contains this module device must display a label referring to the enclosed module. This e terior label can use wording such as: Contains Transmitter odule FCC ID: 2 C ROO 2 or Contains FCC ID: 2 C ROO 2 ny similar wording that e presses the same meaning may be used. &ZĂĚŝĂƚŝŽŶdžƉŽƐƵƌĞ^ƚĂƚĞŵĞŶƚ͗   To satisfy FCC RF posure re uirements for this transmission devices, a separation distance of 2 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co located or operating in conjunction with any other antenna or transmitter. Espressif 12/ 13 2016.08

Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are Espressif IOT Team property of their respective owners, and are hereby acknowledged. www.espressif.com Copyright © 2016 Espressif Inc. All rights reserved.


Document Created: 2017-12-21 00:39:04
Document Modified: 2017-12-21 00:39:04
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