User Manual

FCC ID: 2ABRUBDLEM201P

Users Manual

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FCCID_2446314

m BDF: : BDE—BLEM2O01P E Size: 16.55mm x10.88mm x 1.5mm Bluetooth Low Energy (Without Shielding) Module 16.55mm x10.88mm x 2.2mm (With Shielding) Descriptions Key Features BDE—BLEM2O1P is a Bluetooth 4.0 E® Bluetooth 4.0 single—mode compliant single—mode compliant Bluetooth low E Support master and slave modes, 3+ energy module targeted at low power simultaneous connections in master sensors and PC/Phone accessories. mode E_ Integrated Bluetooth Low Energy stack, BDE—BLEM2O1P highly integrates Bluetooth no external MCU needed Low Energy radio, stack, profile and E_ RF performance applications in a SoC, without the need of * TX power: —23dBm to OdBm using an external MCU. The module also » RX sensitivity: up to —94dBm offers flexible hardware interfaces for the E_ Communication range: 100m (LOS) sensor application. E_ Ultra low power 8051 microcontroller core It enables ultra low power connectivity and x 8K RAM with retention data transfer for the applications that are 128K /256K in—system—programming sensitive to power consumption, size and flash cost. 23 GPIOs (21x4mA¥, 2x20mA) V¥ V¥ 12—bit ADC with eight channels and configurable resolution Data interfaces: 12C x 1, USART x 2 Applications V¥ Y¥ Integrate high—performance comparator E_ Ultra low power consumption: Medical devices 14.3mA@Transmit, Sports and fitness equipments 0.5uA@PowerMode3 Home electronics E_ Antenna: PCB antenna Mobile and PC accessories Industry automation

BDF: : BDE—BLEM2O0 1P Block Diagram BDE BLEM201P Bluetooth 4.0 Fig. 1: Block diagram of BDE—BLEM2O1P Electrical Characteristics E_ Absolute maximum rating Rating Min Typ Max Unit Storage Temperature —40 — 125 °C VDD —0.3 — 3.9 V Other Terminals —0.2 — VDD+0.3=<3.9 V

_ BDF: : BDE—BLEM2O0 1P E_ Recommended operating conditions Rating Min Typ Max Unit Operating Temperature —40 — 85 °C VDD 2 3.3 3.6 V Overall Dimensions Fig. 2 shows the overall dimensions of BDE—BLEM2O1P. The module measures 16.55mm long by 10.88mm wide by 1.5mm high without board level shield. All Dimensions are in nilimeter Fig. 2: Overall Dimensions of BDE—BLEM2O1P

_ BDF: : BDE—BLEM2O0 1P Pin Definitions i— onp axnp |—33 i— AvDD RESET |—33 I— P22 Po_0 |—32 35— P21 PO_1 |—s$3 2— P20 PO2 |—37 S P1_7 PO3 |—33 3—| VDD_UsB Po5 |——#] —@—| USB—/SDA P06 —3; 1—| UsB+/sCL GND |—f3 GND DpVDD wi fl-IM-INIv—'lOIl\ & &A & & & & & ~lool +/ n w/r—| co =— ~— —| — —|—| — Fig. 3: The pinout of BDE—BLEM2O1P Table 2: Pin definitions of BDE—BLEM2O1P Pin Number Pin Name Definitions 1 GND Power ground 2 AVDD Power supply for analog circuit 3 P2.2 GPIO 4 P2.1 GPIO 5 P2.0 GPIO 6 P1.7 GPIO 7 P1.6 GPIO 8 NC NC 9 SDA Serial clock of 12C 10 SCL Serial data of 120C 11 GND Power ground

BDE—BLEM2O01P 12 P1.5 GPIO 13 P1.4 GPIO 14 P1.3 GPIO 15 P1.2 GPIO 16 P1.1 GPIO 17 P1.0 GPIO 18 PO.7 GPIO 19 DVDD Power supply of digital circuit 20 GND Power ground 21 PO.6 GPIO 22 PO.5 GPIO 23 PO.4 GPIO 24 PO.3 GPIO 25 PO.2 GPIO 26 PO.1 GPIO 27 PO.O GPIO 28 RESET Reset pin, active low 29 GND Power ground 30 RF GND RF ground 31 RF Power port 32 RF GND RF ground

BDEF: : BDE—BLEM2O01P Table 3: Peripheral 10 pin mapping PERIPHERAL / Po. FUNCTION 7 6 5 4 3| 2 1| 0 7 6 ADC A7 A6 A5 A4 A3 A2 A1 AO amplifier 9 =| # Analog USART 0 SPI SS MOJ MI 2 Mmo| Mi USART 0 UART CT TX RX Alt.2 TX RX USART 1 SPI MOJ C SS Alt.2 MI MOJ C SS USART 1 UART TX RT CT Alt.2 RX TX RT CT TIMER 1 TIMER 3 Alt.2 TIMER 4 DEBUG OBSSEL Module Location In order to get a fine performance when integrate the module to your product, it is advised to use the recommended module location to the respective PCB.

w BDF: : BDE—BLEM201P E_ Location in X—Y plane Antening Should be NO ground in this area Should be NO ground in this area BLE Module Shield Case Fig. 4: Recommended location in X—Y plane Fig. 5: Not recommended location in X—Y plane

_ BDEF: : BDE—BLEM2O01P E_ Location in Z plane BLE Module I\/Ietal ‘ Metal Antenna Antenna Sheild Case L%; NO ground I\/Iother Board NO ground Fig. 6: Recommended location in Z plane Metal ele Metal Metal ppps H «C ¥ Mess I ] C 1 —| Fig. 7: Not recommended location in Z plane Caution: The user is cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

_ BDDEF: BDE—BLEM2O01 P —— Reorient or relocate the receiving antenna. —— Increase the separation between the equipment and receiver. —— Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —— Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co—located or operating in conjunction with any other antenna or transmitter. The module in this product is labeled with its own FCC ID and IC No.. The FCC ID and IC is not visible when the module is installed inside another device. Therefore, the outside of the device into which the module is installed must also display a label referring to the module. The final end device must be labeled in a visible area with the following "Contains FCC ID: 2ABRUBDLEM2O1P" Contacts BDE Technology Co. Ltd Address: Innovation Building C1—1105, 182 Science Ave, Science City, Guangzhou, 510663, China 494 E Thorniill Ln, Palatine, IL 60074, USA Tel: +86—020—28065335 Fax: +86—020—28065338 Website: www.bdecomm.com Email: info@bdecomm.com


Document Created: 2014-08-25 14:04:30
Document Modified: 2014-08-25 14:04:30
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