Users Manual

FCC ID: 2AAQS-ISP1507

Users Manual

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FCCID_3193274

Preliminary Data Sheet ISP1507 High Performance Bluetooth+ANT+NFC Low Energy Module with MCU and Antenna This ultra-small LGA module, 8 x 8 x 1 mm, is based on the nRF52832 Chip. Its powerful Cortex™ M4 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. Multiple digital and analogue interfaces give optimum flexibility for sensor integration. Key Features Applications Multi-protocol 2.4GHz Ultra Low Power Connected sensors for medical devices, RF Transceiver healthcare, sport, fitness, industrial … Single Mode BLE V4.2 stack IoT applications, connected objects ANT/ANT+ stack Wearable technology 2.4 GHz proprietary stack Home automation NFC-A Tag for OOB pairing Beacons Fully integrated RF matching and Antenna Integrated 32 MHz & 32kHZ Clock DC/DC converter with loading circuit Based on Nordic Semiconductor nRF52 32-bit ARM Cortex M4 CPU 512 kB Flash 64 kB SRAM Certifications Configurable 30 GPIOs including 8 ADC Many interfaces SPI, UART, PDM, I2C Fully FCC pre-certified module Single 1.7 to 3.6 V supply Fully CE pre-certified module Very small size 8.0 x 8.0 x 1.0 mm Fully IC pre-certified module Temperature -40 to +85 °C Bluetooth SIG certified QDL listing RoHS compliant September 5, 2016 Page 1/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet Contents 1. Block Diagram ............................................................................................................................................................ 3 2. Specifications ............................................................................................................................................................. 4 2.1. Absolute Maximum Ratings........................................................................................................................... 4 2.2. Operating Conditions ..................................................................................................................................... 4 2.3. Power Consumption ...................................................................................................................................... 5 2.4. Clock Sources ............................................................................................................................................... 5 2.5. Radio Specifications ...................................................................................................................................... 5 2.6. Electrical Schematic ...................................................................................................................................... 8 3. Pin Description ........................................................................................................................................................... 9 4. Mechanical Outlines ................................................................................................................................................11 4.1. Mechanical Dimensions .............................................................................................................................. 11 4.2. SMT Assembly Guidelines .......................................................................................................................... 12 4.3. Antenna Keep-Out Zone ............................................................................................................................. 12 5. Product Development Tools ..................................................................................................................................13 5.1. Hardware ..................................................................................................................................................... 13 5.2. Firmware...................................................................................................................................................... 13 5.3. Development Tools ..................................................................................................................................... 14 6. Packaging & Ordering information .......................................................................................................................15 6.1. Marking ........................................................................................................................................................ 15 6.2. Prototype Packaging ................................................................................................................................... 15 6.3. Jedec Trays ................................................................................................................................................. 15 6.4. Tape and Reel ............................................................................................................................................. 16 6.5. Ordering Information ................................................................................................................................... 16 7. Storage & Soldering information ..........................................................................................................................17 7.1. Storage and Handling .................................................................................................................................. 17 7.2. Moisture Sensitivity ..................................................................................................................................... 17 7.3. Soldering information .................................................................................................................................. 18 8. Quality & User information.....................................................................................................................................19 8.1. Certifications ................................................................................................................................................ 19 8.2. USA – User information............................................................................................................................... 19 8.3. Canada – User information ......................................................................................................................... 19 8.4. Discontinuity ................................................................................................................................................ 20 8.5. Disclaimer .................................................................................................................................................... 20 September 5, 2016 Page 2/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 1. Block Diagram This module is based on nRF52832 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC) integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4 CPU, a 512 kB flash memory, a 64 kB RAM and analog and digital peripherals. It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic Semiconductor. Fully qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevices which can be freely downloaded. ISP1507 can then be used in Central, Peripheral or both roles for BLE and for both ends of other proprietary protocols. nRF52832 platform also provides extensive software support for ANT applications with S212 SoftDevices and dual ANT/BLE stack S332 SoftDevices. Ultra low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF matching circuit and antenna in addition to the wireless SoC. Only the addition of a suitable DC power source is necessary for BLE and/or ANT connectivity. Sensor applications require the further addition of appropriate sensors. The antenna was designed to be optimized with several standard ground plane sizes. The NFC tag antenna can be connected externally. September 5, 2016 Page 3/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 2. Specifications The specifications of the module follow those of the nRF52832. The following high level parameters are given for the module. 2.1. Absolute Maximum Ratings Parameter Min Typ Max Unit Supply Voltage respect to ground - VCC -0.3 3.9 V IO Pin Voltage -0.3 3.9 V RF Input Level 10 dBm NFC Antenna pin current 80 mA Storage Temperature -40 +125 °C Moisture Sensitivity Level 5 - ESD Human Body Model 4000 V ESD Charged Device Model 750 V Flash Endurance 10000 cycles ATTENTION CONSERVE PRECAUTION FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Human Body Model Class 3A 2.2. Operating Conditions Parameter Min Typ Max Unit Operating Supply Voltage, internal LDO setup 1.7 3.0 3.6 V Operating Supply Voltage, DCDC converter setup 2.1 3.0 3.6 V Extended Industrial Operating Temperature Range -40 +25 +85 °C September 5, 2016 Page 4/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 2.3. Power Consumption Parameter Min Typ Max Unit (1) Peak current, Receiver active 6.1 mA (2) Peak current, Transmitter active +4 dBm Output Power 7.9 mA (2) Peak current, Transmitter active 0 dBm Output Power 5.4 mA System OFF current, no RAM retention 0.4 µA System ON base current, no RAM retention 1.2 µA Additional RAM retention current per 4 KB block 40 N nA (1) DCDC enable, Power supply 3V, 1 Msps (2) DCDC enable, Power supply 3V 2.4. Clock Sources Parameter Min Typ Max Unit Internal High Frequency Clock for RF Stability: (1) +/- 40 ppm 32 MHz Crystal Frequency Tolerance Internal Low Frequency Clock for BLE Synchronization: (1) +/- 40 ppm 32.768 kHz Crystal Frequency Tolerance Internal Low Frequency Clock for BLE Synchronization: (2) +/- 250 ppm RC Oscillator RF Frequency tolerance: +/- 40 ppm For BLE operation Channels 0 to 39 (1) including initial tolerance, drift, aging, and frequency pulling (2) Frequency tolerance after calibration 2.5. Radio Specifications Parameter Min Typ Max Unit Frequency Range 2402 2480 Mhz Channel 0 to 39 Spacing 2 Mhz Output Power Channels 0 to 39 -20 +4 dBm Rx sensitivity Level for BER <0,1% ideal Tx -96 dBm Antenna Gain 0.6 dBi EIRP -19.4 4.6 dBm Range Open field @1m height 100 m Data Rate 1000 / 2000 kbps September 5, 2016 Page 5/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet Typical Antenna Return Loss Module mounted on a USB dongle ground plane Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane Gain measurement in dBi @ 2.45 GHz. September 5, 2016 Page 6/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet Ground Plane Effect Simulation USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane (size : 18 x 30 mm²) (size : 40 x 100 mm²) (size : 40 x 100 mm²) Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane (size : 40 x 100 mm²) (size : 40 x 100 mm²) September 5, 2016 Page 7/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 2.6. Electrical Schematic Electrical schematic showing ISP1507 module connections September 5, 2016 Page 8/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 3. Pin Description The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability (drop test). Pin Name Pin function Description 1 NC Not Connected Isolated pad on application PCB for mechanical stability 2 P0_09 Digital I/O General purpose I/O pin NFC1 NFC Input NFC antenna connection 3 P0_12 Digital I/O General purpose I/O pin 4 P0_10 Digital I/O General purpose I/O pin NFC2 NFC Input NFC antenna connection 5 P0_14 Digital I/O General purpose I/O pin TRACEDATA3 Trace port output 6 P0_26 Digital I/O General purpose I/O pin 7 NC Not Connected Isolated pad on application PCB for mechanical stability 8 VSS Ground Should be connected to ground plane on application PCB 9 P0_16 Digital I/O General purpose I/O pin TRACEDATA1 Trace port output 10 VSS Ground Should be connected to ground plane on application PCB 11 P0_18 Digital I/O General purpose I/O pin TRACEDATA0 Trace port output 12 VSS Ground Should be connected to ground plane on application PCB 13 P0_21 Digital I/O General purpose I/O pin RESET Configurable as system RESET pin 14 VSS Ground Should be connected to ground plane on application PCB 15 P0_20 Digital I/O General purpose I/O pin TRACECLK Trace port clock output 16 VSS Ground Should be connected to ground plane on application PCB 17 P0_22 Digital I/O General purpose I/O pin 18 VSS Ground Should be connected to ground plane on application PCB 19 P0_24 Digital I/O General purpose I/O pin 20 OUT_MOD Antenna I/O This pin is the RF I/O pin of the BLE module It should be connected to Pin 22 OUT_ANT for normal operation 21 VSS Ground Should be connected to ground plane on application PCB 22 OUT_ANT Antenna I/O This pin is connected to the internal antenna It should be connected to Pin 20 OUT_MOD for normal operation 23 VSS Ground Should be connected to ground plane on application PCB 24 VSS Ground Should be connected to ground plane on application PCB 25 NC Not Connected Isolated pad on application PCB for mechanical stability 26 VCC Power Power supply (1.7 – 3.6V) 27 P0_17 Digital I/O General purpose I/O pin 28 SWDIO Digital I/O Serial Wire Debug I/O for debug and programming 29 P0_13 Digital I/O General purpose I/O pin 30 SWDCLK Digital Input Serial Wire Debug clock input for debug and programming 31 NC Not Connected Isolated pad on application PCB for mechanical stability 32 P0_08 Digital I/O General purpose I/O pin 33 P0_07 Digital I/O General purpose I/O pin September 5, 2016 Page 9/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet Pin Name Pin function Description 34 P0_06 Digital I/O General purpose I/O pin 35 P0_04 Digital I/O General purpose I/O pin AIN2 Analog Input SAADC/COMP/LPCOMP input 36 P0_05 Digital I/O General purpose I/O pin AIN3 Analog Input SAADC/COMP/LPCOMP input 37 P0_15 Digital I/O General purpose I/O pin TRACEDATA2 Trace port output 38 P0_03 Digital I/O General purpose I/O pin AIN1 Analog Input SAADC/COMP/LPCOMP input 39 P0_27 Digital I/O General purpose I/O pin 40 P0_02 Digital I/O General purpose I/O pin AIN0 Analog Input SAADC/COMP/LPCOMP input 41 P0_25 Digital I/O General purpose I/O pin 42 P0_31 Digital I/O General purpose I/O pin AIN7 Analog Input SAADC/COMP/LPCOMP input 43 P0_11 Digital I/O General purpose I/O pin 44 P0_30 Digital I/O General purpose I/O pin AIN6 Analog Input SAADC/COMP/LPCOMP input 45 P0_19 Digital I/O General purpose I/O pin 46 P0_29 Digital I/O General purpose I/O pin AIN5 Analog Input SAADC/COMP/LPCOMP input 47 P0_23 Digital I/O General purpose I/O pin 48 P0_28 Digital I/O General purpose I/O pin AIN4 Analog Input SAADC/COMP/LPCOMP input 49 NC Not Connected Isolated pad on application PCB for mechanical stability to 62 48 46 44 42 40 38 36 34 32 ISP1507 1 31 pad placement and pin assignment 47 45 43 41 39 37 35 33 for the LGA QFN package 2 30 3 29 4 28 TOP VIEW 5 27 6 26 9 11 13 15 17 19 21 23 7 25 8 10 12 14 16 18 20 22 24 49 62 50 61 51 60 52 59 53 54 55 56 57 58 September 5, 2016 Page 10/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 4. Mechanical Outlines 4.1. Mechanical Dimensions Dimensional drawing for 8 x 8 x 1 mm, 62-Pad LGA Package 8.00 2.375 2.05 1.725 1.40 0.95 0.25 0.50 0.30 0.30 0.10 0.30 0.95 0.50 1 1.40 1.725 2.05 2.375 2.70 3.15 3.60 3.80 0.25 4.55 5.55 6.55 0.30 7.50 8.00 7.70 0.60 0.35 0.60 1.50 0.40 2.50 0.40 0.80 0.40 0.80 September 5, 2016 Page 11/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 4.2. SMT Assembly Guidelines For PCB Land Patterns and Solder Mask layout, Insight SiP recommends to use the same dimensions as module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads. Please contact Insight SiP for more detailed information. 4.3. Antenna Keep-Out Zone For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of the board: no metal, no traces and no components on any application PCB layer except mechanical LGA pads. Application PCB 1 4.0 mm Keep Out Zone 18.0 mm min September 5, 2016 Page 12/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 5. Product Development Tools 5.1. Hardware In order to assist clients in developing their Bluetooth Smart solutions based on the ISP1507, Insight SIP offers a Development Kit containing: - One Interface Board - J-Link Lite CortexM-9 JTAG/SWD Emulator - One Test Board - A Development Dongle - 5 ISP1507 module samples - Cables, power supply and coin battery holder Using this development kit, product developers can use a working solution as starting point to develop their own products. Time to market is saved by avoiding starting from a blank sheet of paper. In addition, there may be some applications that use the hardware as is. Please refer to the documentation for more information: http://www.insightsip.com/fichiers_insightsip/pdf/ble/isp_ble_DS1507_DK.pdf 5.2. Firmware 1507 supports Bluetooth Low Energy protocol stacks, ANT protocol stacks as well as 2.4 GHz protocol stacks, including Gazell. All are available as downloads at www.nordicsemi.com. The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution supporting up to three Central and one Peripheral simultaneous connections and concurrent Observer and Broadcaster roles. It integrates a low energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy System on Chip (SoC) solutions. The S212 SoftDevice is an ANT protocol stack solution that provides a full and flexible Application Programming Interface (API) for building ANT System on Chip (SoC) solutions for the nRF52832 chip. The S212 SoftDevice simplifies combining the ANT protocol stack and an application on the same CPU. The S332 SoftDevice is a concurrent ANT/Bluetooth® Low Energy (BLE) SoftDevice September 5, 2016 Page 13/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 5.3. Development Tools The following development tools and software are recommended for using and testing ISP1507 module: Nordic Semiconductor nRFgo Studio: Downloadable after registering at www.nordicsemi.com. Nordic Semiconductor Master Control Panel: Downloadable after registering at www.nordicsemi.com. Keil MDK-ARM Lite: Downloadable from https://www.keil.com/demo/eval/arm.htm. Segger J-Link Lite: Downloadable from http://www.segger.com/jlink-software.html. nRF52 Software Development Kit (SDK): nRF52 SDK can be downloaded after registering at www.nordicsemi.com. It contains example of source codes applications (C language): - Precompiled HEX files - Source code - Keil ARM project files - IAR project files September 5, 2016 Page 14/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 6. Packaging & Ordering information 6.1. Marking M /N : I S P 1 5 0 7 T T Y Y W W R ISP1507 Part Number 2 letters Module Type (see TT section 6.5) YY 2 digits year number WW 2 digits week number R 1 letter Hardware revision 6.2. Prototype Packaging For engineering samples and prototype quantities up to 99 units, deliveries are provided in thermoformed trays. Please order with “ST” code packaging suffix. These parts must be backed prior to assembly (see section 7.2). CAUTION LEVEL MOISTURE SENSITIVE DEVICES 5 6.3. Jedec Trays For higher quantities and volume production, ISP1507 are available in Jedec trays. They are delivered in sealed pack with desiccant pack and humidity sensors. These Jedec trays are also suitable for further baking. Please see section 7.2 for more information on moisture sensitivity. Jedec trays are proposed in standard quantities of 100 units, 200 units and multiples of 200 units only. Please order with “J1” code packaging suffix for 100-unit tray and “J2” for 200 and multiple unit trays. Complete information on Jedec trays is available on request. September 5, 2016 Page 15/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 6.4. Tape and Reel ISP1507 are also available in Tape & Reel. They are delivered in sealed pack with desiccant pack and humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units (330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for 2000-unit reels. Complete information is available on request. 6.5. Ordering Information I S P 1 5 0 7 - T T - Z Z ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ I S P 1 5 0 7 Part Number - A ANT & BLE protocol type - X 512 kB Flash / 64 kB RAM memory type - D K Development kit (1) - T B Test board (1) - S T Unsealed Tray Packaging - J 1 Jedec Tray with less than 100 units - J 2 Jedec Tray with multiple of 200 units - R S Reel of 500 units - R 2 Reel of 2000 units (1) Please see section 5.1 and refer to the following documentation for more information on development kit and test board: http://www.insightsip.com/fichiers_insightsip/pdf/ble/isp_ble_DS1507_DK.pdf September 5, 2016 Page 16/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 7. Storage & Soldering information 7.1. Storage and Handling Keep this product away from other high frequency devices which may interfere with operation such as other transmitters and devices generating high frequencies. Do not expose the module to the following conditions: - Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX - Extreme humidity or salty air - Prolonged exposure to direct Sunlight - Temperatures beyond those specified for storage Do not apply mechanical stress Do not drop or shock the module Avoid static electricity, ESD and high voltage as these may damage the module ATTENTION CONSERVE PRECAUTION FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES 7.2. Moisture Sensitivity All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of the plastic mold compound, then it is possible to crack the package. Even if the package does not crack, interfacial delamination can occur. Since the device package is sensitive to moisture absorption, it is recommended to bake the product before assembly. The baking process for dry packing is 24 hours at 125°C. ISP1507 has been tested MSL-5 according to standards. After baking, modules can be exposed to ambient room conditions (approximately 30 °C/60%RH) during 48 hours before assembly on the PCB. CAUTION LEVEL MOISTURE SENSITIVE DEVICES 5 September 5, 2016 Page 17/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 7.3. Soldering information Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles. Preheat/Soak 260°C Peak package body temperature (Tp) Temperature Min (Tsmin) 150 °C (+0/-5°C) Temperature Max (Tsmax) 200 °C Classification Temperature (T c) 260 °C Time (ts) from (Tsmin to Tsmax) 60-120 sec Time (tp) maintained above TC-5 °C 30 sec Ramp-up rate (TL to Tp) 3 °C/sec max Ramp-down rate (Tp to TL) 6 °C/sec max Liquidous temperature (TL) 217 °C Time 25 °C to peak temperature 8 mn max Time (tL) maintained above TL 60-150 sec September 5, 2016 Page 18/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet 8. Quality & User information 8.1. Certifications FCC – Certification pending CE – Certification pending IC – Certification pending Bluetooth SIG – Certification pending RoHS compliant 8.2. USA – User information This intends to inform how to specify the FCC ID of our module “ISP1507” on the product. Based on the Public Notice from FCC, the host device should have a label which indicates that it contains our module. The label should use wording such as: “Contains FCC ID: 2AAQS-ISP1507” Any similar wording that expresses the same meaning may be used. The label of the host device should also include the below FCC Statement. When it is not possible, this information should be included in the User Manual of the host device: “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference (2) This device must accept any interference received, including interference that may cause undesired operation. Caution: Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.” 8.3. Canada – User information This intends to inform how to specify the IC ID of our module “ISP1507” on the product. According to Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label which indicates that it contains our module. The label should use wording such as: “Contains IC: 11306A-ISP1507” Any similar wording that expresses the same meaning may be used. The label of the host device should also include the below IC Statement. When it is not possible, this information should be included in the User Manual of the host device: September 5, 2016 Page 19/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

BLE MODULE ISP1507 Preliminary Data Sheet “This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.” 8.4. Discontinuity Normally a product will continue to be manufactured as long as all of the following are true: - The manufacturing method is still available. - There are no replacement products. - There is demand for it in the market. In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A Product Discontinuation Notice (PDN) will be sent to all distributors and made available on our website. After this, the procedure goes as follows: - Last Order Date will be 6 months after the PDN was published. - Last Shipment Date will be 6 months after Last Order Date, i.e. 12 months after PDN. 8.5. Disclaimer Insight SiP’s products are designed and manufactured for general consumer applications, so testing and use of the product shall be conducted at customer’s own risk and responsibility. Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment. Please also pay attention (i) to apply soldering method that don’t deteriorate reliability, (ii) to minimize any mechanical vibration, shock, exposure to any static electricity, (iii) not to overstress the product during and after the soldering process. The products are not designed for use in any application which requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party's life, body or property, including and not limited to (i) aircraft equipment, (ii) aerospace equipment, (iii) undersea equipment, (iv) power plant control equipment, (v) medical equipment, (vi) transportation equipment, (vii) traffic signal equipment, (viii) disaster prevention / crime prevention equipment. The only warranty that Insight SiP provides regarding the products is its conformance to specifications provided in datasheets. Insight SiP hereby disclaims all other warranties regarding the products, express or implied, including without limitation any warranty of fitness for a particular purpose, that they are defect-free, or against infringement of intellectual property rights. Insight SiP customers agree to indemnify and defend Insight SiP against all claims, damages, costs and expenses that may be incurred, including without any limitation, attorney fees and costs, due to the use of products. September 5, 2016 Page 20/20 Document Ref: isp_ble_DS1507_R2.docx Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.


Document Created: 2016-09-05 14:31:11
Document Modified: 2016-09-05 14:31:11
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