User Manual

FCC ID: 2AANZHELX-

Users Manual

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FCCID_4493727

2AANZHELX-Module Guideline Bluetooth module operating manual Product description: 2AANZHELX-Module Bluetooth module is smart wireless audio data input product, is a low cost and efficient mono wireless transmission solution. It’s adopt domestic Jieli Bluetooth chip AC6925B. It’s provides the module with high quality sound and compatibility, and overall performance more optimized. 2AANZHELX-Module Bluetooth module is using for driveless mode. You only need input the module to the application products, connect with power, then it can achieve the wireless music transfer, enjoy the funny of wireless music. Application fields: This module is used for short distance music transfer, is easy to connect with smart computer, phone, PDA etc. Products’ Bluetooth device, to gain the wireless music transfer. ※ Bluetooth speaker ※ Bluetooth headphone ※ Hands-free calls ※ Wireless transfer audio. Product Specification: Item No. 2AANZHELX-Module Bluetooth version Bluetooth V5.0+EDR Support bluetooth AVRCP 1.0，GAVDP 1.0，AVDTP 1.0，A2DP 1.2， agreement: Hands-Free Profile 1.5，Headset Profile v1.1 Working Ampere ≤30mA Standby Voltage < 300uA Working Voltage 3.3V-5.5V Temperature Range -40ºC to +80ºC Wireless Range >10 M Transmit Power Class2 Max 4dB

Sensitivity —80dEm@0.1%BER Frequency Range 24020H22.480GHe External interface Po, UART Audio Performance High quality music Audio signal to noise ratio 275dB Distortion <0.1% Module sze 46. OOX35.00X1.00mm Product Size drawing: on isC) cuC J G C 31.8mm § T 5 T 5 zn cor SBnBOT SPH sp— 20190523 44.7mm

Warning： This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help This device complies with Part 15, Part 15.247 of the FCC Rules. The FCC ID for this device is 2AANZHELX-. If the FCC ID is not visible with the module is installed inside another device，then it must be still responsible for the FCC compliance requirement of the end product which referring to the enclosed module and it also must display a label, such as the following: Contains Transmitter module FCC ID: 2AANZHELX- or contains FCC ID: 2AANZHELX- The Module can be installed in Portable or fix device only, and it can not be installed in any Mobile Device. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information / warning as shown in this manual, include: The portable has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.

Antenna Specification Summary ITEM ANT SPEC Model Name 2.4G ANT Horizontal Vertical Center 2400MHz 2400MHz 2500MHz 2400MHz 2400MHz 2500MHz Frequency -1.26 -0.76 -0.58 -5.25 -2.46 -1.86 MAX. Gain -0.58dB Polarization Horizontal and Vertical Azimuth Beam Omni-directional Pattern Impedance 50 Ohm Antenna Length 38.20mm Manufacture ZHUHAI JIELI TECHNOLOGY CO.,LTD Antenna Photo & Length (mm)

Horizontal: 2400 MHz 2450 MHz 2500 MHz Power (dBm) Max: 0 Min: -40 Scale: 5/div Frequency Gain(dB) (MHz) Max Min Avg 2400 -1.26174 -30.0801 -7.18716 2450 -0.765802 -36.5604 -7.48023 2500 -0.585582 -22.0315 -6.59127

Vertical: 2400 MHz 2450 MHz 2500 MHz Power (dBm) Max: 0 Min: -30 Scale: 5/div Frequency Gain(dB) (MHz) Max Min Avg 2400 -5.2537 -22.1424 -12.4294 2450 -2.4652 -24.5837 -10.4702 2500 -1.86120 -29.5214 -9.20432 ANT Test Labs：Attestation of Global Compliance Co., Ltd.

Hardware Design Guidance Power supply、ground wire 1、 Ground wire The bluetooth ground wire are divided into AGND、PGND、and GND： a） AGND and GND must be strictly distinguished, connected at the battery entrance or in the front of IC ground side; in the case of limited PCB board space, priority should be given to ensuring the connectivity of GND and the battery ground circuit, and the route must be thick . b） PGND and GND must be strictly distinguished,PGND go back to chip side behind of base pin and connect GND nearby. 2、DCDC Picture 1. DC-DC switching power circuit Like picture 1，DC-DC switching power circuit is composed of SW、PGND、BT_AVDD、 L2、C3、C4、C9 （marked red color）；L2/C3/C4/C9 should be as close as possible to the base pin in layout;C3/C4/C9 ground circuit must return to the PGND pin at the shortest distance (no holes and as thick as possible), L2 + 1.5V routing must first pass the C4 (106) capacitort then go into IC (refer to picture 2)；L2 should be as far away from the easily disturbed parts (such as RF and DAC) as possible;. Do not install any signal line under the inductor or L2 should choose winding inductor or power laminated inductor with minimum impedance Picture 2. Ground Circuit of DC-DC Switching Power Supply

+1.5V power supply should as thick as possible and ,routing should first pass the capacitor then go into IC,it is not allow to through the hole connect IC after passing capacitor . 3、LDOIN LDOIN decoupling capacitor C5 is placed as close as possible to the pin of the chip and connected to PGND, same time LDOIN should be as thick as possible, routing should first pass the capacitor then go into IC 4、VDDIO The decoupling capacitor C6 of VDDIO should place as close as possible to the chip 2 pin side. Signal line 1、Crystal oscillator Picture 3. a） CrystaloscillatorY1shouldplaceascloseaspossibletothechippin,capacitorC23、C24 centralizedlayout(avoidC23、C24atthe eachsideof crystaloscillator),andfindtheshortestwaytothechippin2(VSSIO); b）IncaseofPCBsizeislimited,C24isallowedtobeplacednearthechipandmakesureitistheshortestdistancebacktochippin 2(VSSIO). c）CrystaloscillatorY1 requires good stability and consistency,frequency deviation within （± 10PPM);the size of loading capacitor C23 and C24 depend on the size of crystal oscillator loading capacitor,be subjected to actual testing(recommend use JL matched crystal oscillator). 2、RF antenna Picture 4. Antenna layout

a）RF try place at the PCB side, can not have metal components on both front and back sides, use three - side hollow-out way (top,left and right like picture 4). Picture5. b）RF and DAC circuit must in 1800 layout to minimize the interference from RF to DAC . c）If PCB have enough space be sure to use inverted F-shaped antenna. d）Try to place RF like I -shaped. 3、DAC、MIC、VCOM、DACVDD a） DAC circuits and solder joints must be placed 180 degrees with RF to reduce the radiation and interference from RF. b） DAC circuits and solder joints ,AGND on the back or not, must not place under the DC-DC power GND,otherwise there will be high- frequency noise, refer to picture 6. Picture6. Wrong Layout and Routing of DAC Circuit Placed under DC-DC Power Circuit c)MIC circuits and solder joints ,VCOM and DACVDD decoupling capacitors，with or without AGND,otherwise easily be interfered byRF and make high frequency noise. d) Do not lay “digital GND” under the three signal lines DACL、DACR and VCOMO ,as well as anti- interference capacitors and inductors , stay away from “digital GND”.

Additions Picture7. DAC restrain RF interference circuit 1、RF antenna、TDD radiation noise a）Picture7 is the circuit of DAC retrain RF antenna and TDD interference，itisrecommendedtoreserve,ifhas limitedspacethencanjustreserveR6/R7/R8. b)DAC、power supply lead and speaker cavity should avoid the RF position, the back of RF is the best position for speaker and battery connection point.(Note: the noise disposing circuit of DAC will increase cost,if solution design is reasonable enough and not highly require noise it can not be reserved. 2、ESD disposing Picture8. ESD static electricity disposing circuit a） Likepicture8nearthechipDACVDD pin，AGND of C1 decoupling capacitor tandem connect capacitor 105 to GND nearby. b） Likepicture8nearthechipRTCVDD pin ,RTCVDD tandem connect magnetic bead L1 ，then tandem connect GND of capacitor C3.(Note: ESD dispose will increase material, it can not be considered if solution have no this requirement.)

Version information Date Version Description No. 2016.03.30 V1.0 Original version 1、 increased +1.5V power supply description 2、increased LDOIN power supply description 2016.04.28 V1.1 3、 increased crystal oscillator description（ point b ） 4、 increased RF layout description（point d ） 5、 increased DAC description（point c and d ） 1、 increased ground description. 2016.05.18 V1.2 2、 the decoupling capacitor of LDOIN connect PGND. 3、 updated picture 1 and 2.


Document Created: 2019-08-28 15:57:12
Document Modified: 2019-08-28 15:57:12
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