NASA Spectrum Mgt Memo Re StangSat

0285-EX-CN-2016 Text Documents

California Polytechnic State University

2017-11-29ELS_201737

FOR AGENDA SPS-22640/1 National Aeronautics and Space Administration Spectrum Management Office Cleveland, OH 44135-3191 Reply to 31 August 2017 Attn of: Space Communications and Navigation Mr. Stephen J. Butcher Chairman, Spectrum Planning Subcommittee National Telecommunications and Information Administration U.S. Department of Commerce Room 4082, Herbert C. Hoover Building 14th and Constitution Avenue NW Washington, DC 20230 SUBJECT: NASA Memo – StangSAT Use of Non-Licensed Device in Space On behalf of NASA, the enclosed information is provided in response to the requirement in Section 10.3.7 of the NTIA Manual of Regulations and Procedures for Federal Frequency Management to notify the SPS and NTIA of NASA’s intent to operate non-licensed devices in space. StangSAT is a small satellite that will operate with another small satellite called LeoSAT on a future launch of the SpaceX Falcon-9 launch vehicle. The two satellites will operate during ascent of the launch vehicle in what amounts to a Faraday cage. StangSAT will use a commercial WiFi device to transmit ascent data to LeoSAT. StangSAT will be shut off slightly before or immediately after it is ejected from the launch vehicle and will be inactive in orbit. The WiFi device is a Microchip MRF24WB0MA module with an integrated antenna with FCC ID W7OZG2100-ZG2101. The FCC Grant of Equipment Authorization and the Data Sheet are attached. Additional information can be found at: http://www.microchip.com/wwwproducts/en/MRF24WB0MA Should you have any questions, please contact me at 216-433-3469 or via e-mail at jezuzek@nasa.gov or my Alternates, Bryan Rhodes at 216-433-2473 or via e-mail at bryan.a.rhodes@nasa.gov, Jacki Houts at 216-433-5468 or via e-mail at jacquelynne.houts@nasa.gov and Dan Bishop at 216-433-5220 or via e-mail at daniel.w.bishop@nasa.gov. John E. Zuzek NASA Representative Spectrum Planning Subcommittee Enclosures: 1. FCC Grant of Equipment Authorization 2. Microchip MRF24WB0MA Data Sheet

FCC - OET TCB Form 731 Grant of Equipment Authorization Page 1 of 1 TCB GRANT OF EQUIPMENT AUTHORIZATION TCB Certification Issued Under the Authority of the Federal Communications Commission By: Eurofins Product Service GmbH Date of Grant: 03/19/2009 Storkower Strasse 38c D-15526 Reichenwalde, Application Dated: 03/19/2009 Germany Microchip Technology Incorporated 2355 West Chandler Boulevard Chandler, AZ 85224-6199 Attention: Steve Caldwell , Director, RF Products Division NOT TRANSFERABLE EQUIPMENT AUTHORIZATION is hereby issued to the named GRANTEE, and is VALID ONLY for the equipment identified hereon for use under the Commission's Rules and Regulations listed below. FCC IDENTIFIER: W7OZG2100-ZG2101 Name of Grantee: Microchip Technology Incorporated Equipment Class: Part 15 Spread Spectrum Transmitter Notes: WiFi module Modular Type: Single Modular Frequency Output Frequency Emission Grant Notes FCC Rule Parts Range (MHZ) Watts Tolerance Designator 15C 2412.0 - 2462.0 0.047 Modular Approval. Power Output listed is conducted. Approval is limited to OEM installation only. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM integrators must be provided with antenna installation instructions. OEM integrators and end- users must be provided with transmitter operation conditions for satisfying RF exposure compliance. This grant is valid only when the device is sold to OEM integrators. https://fjallfoss.fcc.gov/oetcf/tcb/reports/Tcb731GrantForm.cfm?mode=COPY&RequestTi... 6/15/2010

MicrocHip MRF24WBOMA/MRF24WBOMB MRF24WBOMA/MRF24WBOMB Data Sheet 2.4 GHz IEEE 802.11b"¥ Features * Integrated RSSI ADC and /Q DACs, RSSI readings available to host * IEEE 802.11—compliant RF Transceiver * Balanced receiver and transmitter characteristics + Serialized unique MAC address for low power consumption + Data Rate: 1 and 2 Mbps * Compatible with IEEE 802.11b/g/n networks MAC/Baseband Features * Small size: 21 mm x 31 mm 36—pin Surface Mount * Hardware CSMA/CA access control, automatic Module ACK, and FCS creation and checking * Integrated PCB antenna (MRF24WBOMA) * Automatic MAC packet retransmit * External antenna option (MRF24WBOMB) with * Hardware Security Engine for AES and ultra miniature coaxial (UFL) connector RC4—based ciphers * Range: up to 400m (1300 ft.) * Supports 802. 1x, 802. 1i security: WEP, + Easy integration into final product — accelerates WPA—PSK, and WPA—2—PSK. product development, provides quicker time to * Supports Infrastructure, ad hoc market * Radio regulation certification for United States (FCC), Canada (IC), Europe (ETSI1) and Japan Applications (ARIB) * Utility and Smart Energy * Wi—Fi® certified (WFA ID: WFA7150) — Thermostats * Designed for use with Microchip microcontroller — Smart Meters families (PIC18, PIC24, dsPIC33, and PIC32) with — HVAC downloadable Microchip TCP/IP Stack * Consumer Electronics — Remote Control Operational — Internet Radio * Single operating voltage: 2.7V—3.6V (3.3V typical) * Industrial Controls + Temperature Range: —40° C to +85° C — Chemical Sensors + Simple, four—wire SPI interface with interrupt — HVAC * Low—current consumption: — Security Systems — RX mode— 85 mA (typical) — M2M Communication — TX mode— 154 mA (+10 dBm typical) * Remote Device Management — Sleep — 250 pA (typical) — Location and Asset Tracking — Hibernate —<0.1 uA (typical) — Automotive RF/Analog Features * Retail — POS Terminals * ISM Band 2.400—2.484 GHz operation — Wireless Price Tags * 14 Channels selectable individually or domain— — Digital Remote restricted * Medical, Fitness, and Health care + DSSS Modulation — Patient Asset Tracking + Data Rate — 1000 kbps * —91 dBm Typical sensitivity at 1 Mbps * +10 dBm Typical output power with control Note: For products that are intended for use with * Integrated low phase noise VCO, RF frequency any Access Point, it is recommended to synthesizer, PLL loop filter and PA use MRF24WGOMA/MB. * Digital VCO and filter calibration © 2010—2013 Microchip Technology Inc. DS70632C—page 1

MRF24WBOMA/MRF24WBOMB Pin Diagram GND 1 36 GND NC 2 35 SDI JTAG_TOO 3 3'f SCK JTAG_TCK 'f 33 INT JTAG_TMS 5 32 soo JTAG TOI 6 31 NC RESET 7 30 GND __,,._,,,___..N_C 8 29 VDD JTAG_RST 9 28 GND GND 10 27 DEBUG_TX NC 11 26 DEBUG_RX NC 12 25 GND NC 13 2'f NC NC l'f 23 cs NC 15 22 NC WP 16 21 JTAG_EN VDD 17 20 HIBERNATE GND 18 19 GND Note: Antenna connector on MRF24WBOMB only. DS70632C-page 2 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB Table of Contents 1.0 Devices Overview............ ... ....................................... .................................................................................................................. 5 2.0 Circuit Description ......... ........................................................................................................................... ................. ................. 11 3.0 Regulatory Approval ................................................................................................................................................................... 21 4 .0 Electrical Characteristics ............................................................................................... ................... ....................... ................... 27 Appendix A: Revision History ............................................................................................................... ............................................... 31 The Microchip Web Site .... ...... ............................................................................................................................................................. 33 Customer Change Notification Service ............................................... ........... ..................... ................................................................. 33 Customer Support ................................................................................................................................................................................ 33 Reader Response .............................................................................................................................. .................................................. 34 Product Identification System ......... ....... ... .. ... ....... .. ........ ........... ... ........... ....... ............ .. ...... .. ......................... ....................... 35 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g .. DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device. please check with one of the following: • Microchip's Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office. please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. © 2010-2013 Microchip Technology Inc. DS70632C-page 3


MRF24WBOMA/MRF24WBOMB 1.0 DEVICES OVERVIEW The MRF24WBOMA/MRF24WBOMB modules have received regulatory approvals for modular devices in The MRF24WBOMA and MRF24WBOMB are low-power, the United States (FCC), Canada (IC), and Europe 2.4 GHz, IEEE 802.11-compliant, surface mount (ETSI). The modular approval removes the need for modules with all associated RF components such as expensive RF and antenna design, and allows the end crystal oscillator, bypass and bias passives with user to place the modules inside a finished product and integrated MAC, baseband, RF and power amplifier, and not require regulatory testing for an intentional radiator built-in hardware support for AES, and TKIP (WEP, WPA, (RF transmitter). They also have Radio Type Approval WPA2 security). The integrated module design frees the Certification for Japan. See Section 3 0, Regulatory designer from RF and antenna design tasks and Approval, for the specific requirements that should be regulatory compliance testing, ultimately providing adhered to by the integrator. quicker time to market. The MRF24WBOMA module is approved for use with the integrated PCB meander 1.1 Interface Description antenna. The MRF24WBOMB has an ultra miniature coaxial Figure 1-1 represents a MRF24WBOMA/ connector (U .FL) and is approved for use with a list of MRF24WBOMB module. It interfaces to Microchip pre-certified antennas. See Section 2.8, External PIC18, PIC24, dsPIC33, or PIC32 microcontrollers Antenna, for specific recommendations. through a four-wire serial slave SPI interface, such as interrupt, hibernate, Reset, power and ground signals. The MRF24WBOMA/MRF24WBOMB modules are The module runs on a single supply voltage of designed to be used with Microchip's TCP/IP software nominally 3.3V. It also supports optional JTAG and stack. The software stack has an integrated driver that serial debug for testability. The debug port operates at implements the API that is used in the modules for 3.3V and requires a level shifter for operation with RS· command and control , and for management and data 232 devices. Figure 1-2 shows a simplified connection packet traffic. between a Microchip's PIC MCU and the module. The Microchip TCP/IP software stack is available in the Table 1-1 lists the pin descriptions. Microchip Application Libraries for free download Data communications with the MRF24WBOMA/ (including example applications and source code) from MRF24WBOMB are through the SPI interface, for the Microchip web site, http.//www.microchip com/ more information see Section 2 0, Circuit Descrip- wireless. tion . Microchip's PIC MCUs communicates with the The combination of the module and a PIC running the module through a command API within the Microchip TCP/IP stack results in support for IEEE 802.11 and IP TCP/IP stack. The command API is detailed in the services. This allows the immediate implementation of Microchip TCP/IP stack online help that is available in a wireless web server. the Microchip Application Libraries for free download . © 2010-2013 Microchip Technology Inc. DS70632C-page 5

MRF24WBOMA/MRF24WBOMB FIGURE 1—1: MRF24WBOMA/MRF24WBOMB BLOCK DIAGRAM MRF24WBOMA 2.4 GHz IEEE Std. 802.1 1b RF Transceiver Module AES, TKIP < SPI Digital /O FLASH Encryption Interface Accelerator > interrupt *— P 24 GHz ower Transceiver RAM |<@fffmimmite JTAG Ar?tgr?na Matching Detug (MRF24WBOMA) Circuitry Antike: rom t Reset <f Hibernate FIGURE 1—2: MICROCONTROLLER TO MRF24WBOMA/MRF24WBOMB INTERFACE MRF24WBOMx PIC Microcontroller External _ Antenna <——@ CS Le———| 0o (MRF24WBOMB) SD1 fag————j SDO SDO |————J»| SDI SCK fhag————J SCK TNT |—————p»| INTx +3.3V (Typ) ——@»| VDD HIBERNATE L&———— 110 GND ——i»| GND WP |La&————] 110 RESET fLeg——— 1/O DS70632C—page 6 © 2010—2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB TABLE 1-1: Pin Description Pin Symbol Type Description 1 GND p Ground 2 NC NC Do not connect 3 JTAGTDO 0 JTAG test data output 4 JTAGTCK I: Constant<1> JTAG clock input (drive or pull-up only) 5 JTAGTMS I JTAG mode input 6 JTAGTDI I JTAG test data input 7 RESET I: Constant< 1l Module Reset input 8 NC NC Do not connect 9 JTAGRST I JTAG Reset input (optional; see Section 2 0, Circuit Description) 10 GND p Ground 11 NC NC Do not connect 12 NC NC Do not connect 13 NC NC Do not connect 14 NC NC Do not connect 15 NC NC Do not connect 16 wp(2) I Write protect (this pin is used to enable FLASH update) 17 Voo p Power 18 GND p Ground 19 GND p Ground 20 HIBERNATE I Hibernate mode enable (high input will disable the module) 21 JTAGEN I JTAG test enable 22 NC NC Do not connect 23 cs I: Constant< 1l SPI Chip Select input, constant drive or pull-up required 24 NC NC Do not connect 25 GND p Ground 26 DEBUG RX I Serial debug port input (see Section 2 0, Circuit Description) 27 DEBUGTX 0 Serial debug port output (see Section 2 0, Circuit Description) 28 GND p Ground 29 Voo p Power 30 GND p Ground 31 NC NC Do not connect 32 SDO 0 SPI data out 33 INT 0 Interrupt output (open drain - requires a pull-up) 34 SCK I SPI clock input 35 SDI I SPI data in 36 GND p Ground Legend: Pin type abbreviation: P =Power input, I =Input, 0 =Output, NC =Do Not Connect Note 1: Signals of Type "I: Constant" must either be constantly driven by the host or have a pull-up or pull-down (in case the host is likely to tri-state the signal during power down modes). The constant drive is used to ensure defined operation of the part and to minimize leakage current during low power modes. 2: WP is used as write-protect for the internal module SPI Flash. For production use, this pin should be pulled low. This pin can be controlled by the host microcontroller to enable in field Flash updates. © 2010-2013 Microchip Technology Inc. DS70632C-page 7

MRF24WBOMA/MRF24WBOMB 1.2 Mounting Details The MRF24WBOMA/MRF24WBOMB is a surface mountable module. Module dimensions are shown in Figure 1—3. The module Printed Circuit Board (PCB) is 1 mm thick with castellated mounting points on two sides. FIGURE 1—3: MRF24WBOMA/MRF24WBOMB MODULE PHYSICAL DIMENSIONS |<; 21.0mm *-b' tge—«— _ r 1 36 ’i‘ 24.65mm B 31.0mm — 18 19 A 7LTLL || 18.¢4mm Note: ~Antenna connector on MRF24WBOMB only. € £ R 18.6mm ad +¥ | 4 ——t 5— A 3.70mm 1.29mm DS70632C—page 8 © 2010—2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB The MRF24WBOMA has an integrated PCB antenna. underneath the module. Do not "cut—out" host PCB For best performance, mount the module on the PCB material under the antenna. Figure 1—4 shows the without metal obstructions in the keep out area. The recommended host PCB footprint for the module. antenna is tuned to have FR4 . PCB material FIGURE 1—4: RECOMMENDED HOST PCB FOOTPRINT ’4721.0nm *—‘ t [ | 1.73mm : i 36 :—4— mm m m m m m m m m m ~ :_L 1.27mm m m 4 m m 31.0mm m m m m m m m m m m m ®___j —g——® 18 19 l_4_0.80mm 7.68mm (<—0.85mm 19.9mm x 9 .650m 6.60mm Note 1 8.65mm 25.0mm Note 1: The "Note 1" demarcation specifies the host PCB copper plane "keep—out" area on underlying board layers. Users can route surface escape traces in this area. The module has exposed copper test points on bottom side in the "keep out" zone. Ensure that there is no exposed cop— per on mounting board that may short these. © 2010—2013 Microchip Technology Inc. DS70632C—page 9

MRF24WBOMA/MRF24WBOMB Figure 1—5 illustrates the module reflow profile that is recommended for mounting the device onto the host PCB. FIGURE 1—5: RECOMMENDED MODULE REFLOW PROFILE AND SETPOINTS Zones 1 2 3 4 5 6 7 8 300 250 | // R / & 200 [|.—+ h $ Loclest k11 ~ 3 ./ \ g & 150 y 71 & & [ > 100 |—L E/ [ 50 |7 0 0 50 100 150 200 250 300 Time (Seconds) The following table lists the module re—flow profile TABLE 1—2: MODULE RE—FLOW PROFILE® Zone 1 2 3 4 5 6 7 8 Temperature (°C) 180° 180° 200° 200° 200° 220° 265° 270° Note 1: Conveyor Speed: 90 cm/min. details. DS70632C—page 10 © 2010—2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB 2.0 CIRCUIT DESCRIPTION The MRF24WBOMA/MRF24WBOMB interfaces to Microchip‘s PIC18, PIC24, dsPIC33, and PIC32 microprocessors with a minimal of external components through digital—only connections. This section details use of the module, starting with an example host connection as shown in Figure 2—1. 2.1 Schematic FIGURE 2—1: MRF24WBOMA/MRF24WBOMB EXAMPLE APPLICATION SCHEMATIC +330 +330 un is ssm > MRFSWBOMA < 47k0 47Kn ; wo mo : 4 «— ne =5f nc sor B2 < 2y 5) stas.to0 sox + 4; s.7% To JTAG m 5) srac_rox it Fo m mm Interfoce —f 2| Jtac_tms soo [ pame _z Reaet Controlier o Foucaa‘s ym wc _:‘ xc 0 k woo : + sBav raay JHGER on —| IatEsT co 2 To Hoet * ;i se negus_tx [5e nc Werocontratter > nc 4| NC neBuc_Rx F2 NC 17kn he ) he NC <3] 1 NC e Em + ce m1. sb 10uF 1 tm To Host —> L= 7$ o Ex : o. omect to T<— erscontrolter M, [hfi(e el sn < O oo 4.7kn = = 10uF I 2.2 Power—On Sequence The internal regulators for the digital and analog core power supplies are disabled by driving the HIBERNATE pin high. Figure 2—2 shows the power up sequence for the MRF24WBOMA/MRF24WBOMB. An internal Power—on Reset (POR) circuit which keeps the module in Reset until Vop is within the specification. The Hibernate and Reset signals are also used to control startup. In Figure 2—2, section A is controlled by the internal POR and section B is an allowance for the SPI bus to stabilize when the module supplies are enabled. After Hibernate is disabled, the host software provides 1mS ofstartup to allow the SPI to stabilize. This time is pre—programmed into the host driver, and may need to be increased if insufficient initial drive current is not provided to the MRF24WBOM module. Section C is the driver controlled release from Reset period. This takes approximately 300 mS and is monitored by the stack driver. No additional time needs to be provided by user software for startup. © 2010—2013 Microchip Technology Inc. DS70632C—page 11

MRF24WBOMA/MRF24WBOMB FIGURE 2—2: MRF24WBOMA/MRF24WBOMB POWER—ON SEQUENCE TIMING 1m§ SPI Host driver auto—timed boot, POR Stabilize approx. 50—300mS, after reset /\,f/\ A Ready A B C Vdd 27V Time DS70632C—page 12 © 2010—2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB 2.3 Power States state affects system behavior, and overall power con- sumption or battery life. Addition to that there is one The MRF24WBOMA/MRF24WBOMB has the following "Standby" state that is not user-controlled. power states: Hibernate, Sleep and Active (two sub- states), as shown in Figure 2.4. The selection of power FIGURE 2-3: MRF24WBOMA/MRF24WBOMB POWER-STATE DIAGRAM TX On 200 µs 200 µs Note 1: See Section 2 2, Power-On Sequence. 2.3.2 SLEEP STATE 2.3.1 HIBERNATE STATE The Sleep state is a low power dynamic state that implements the 802.11 Power Save feature. In this An "Off" state is defined as no power applied to the mode, if enabled, the module will enter Power Save device. The Hibernate mode is the closest to controlled mode when all activity is complete. off that the module can approach. It is controlled The module will wake autonomously to any PIC through the HIBERNATE pin (high input puts the intervention to check DTIM beacons from the Access module into Hibernate) . When in Hibernate, the module Point (AP). If any traffic is listed as queued for the only consumes leakage current, but does not maintain module, then it will awaken and get the data from the state. Hibernate has to be fully controlled by the PIC MCU and requires the TCP/IP stack to restart on an AP on the next possible opportunity. When data is acquired, the module will interrupt the PIC awake. microcontroller on a normal "data available" indication. The module contains about 70µF of internal bulk If no data is available on a DTIM check, the module capacitance. Supplies should be provisioned to supply reenters the Power Save state until the next DTIM. The sufficient charge on release of hibernate for required DTIM interval is programmed at the AP. This state can start time or sufficient delay must be provided in provide "as if on" behavior of the radio with a significant software after hibernate release and before Reset power savings versus "always on". The battery life release. expectation of this mode is several days to several This state provides the best battery life for embedded weeks. This mode is characterized by a very-low products. Entering Hibernate for intervals of less than latency (as low as 200 mS) to begin data transfer from 30 seconds is not likely to save power. Battery life the low-power state. expectation can be more than a year for devices operating on AA cells that is in Hibernate except to 2.3.3 ACTIVE STATE wake up every hour for a small data transfer (<500 The Active state is identified as one of the two states Bytes). where the radio circuitry is fully on. The two active states are the Receive state (RX ON) and Transmit state (TX ON). © 2010-201 3 Microchip Technology Inc. DS70632C-page 13

MRF24WBOMA/MRF24WBOMB 2.3.4 STANDBY STATE The Standby state is not user-controlled, but it is noted as it helps identify and track certain operations of the module during power tracing. TABLE 2-1: MRF24WBOMA/MRF24WBOMB POWER STATE DEFINITIONS State Voe Hibernate Description Off ov ov Power is disconnected Hibernate 3.3V 3.3V All internal power regulators are OFF - enabled by HIBERNATE pin Sleep 3.3V ov Enabled by TCP/IP driver RXON 3.3V ov Receive circuits are ON and receiving TXON 3.3V ov Transmit circuits are ON and transmitting Standby 3.3V ov State machine transition state only - not user controlled DS70632C-page 14 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB 2.4 JTAG Interface It is recommended that the module be mounted on the edge of the host PCB. It is permitted for PCB material Joint Test Action Group (JTAG) is the common name to be below the antenna structure of the module as long used for IEEE 1149.1 entitled Standard Test Access as no coppertraces or planes are on the host PCB in Port and Boundary—Scan Architecture for test access that area. For best performance, place the module on ports that are used for testing printed circuit boards the host PCB according to the details shown in using boundary scan. The MRF24WBOMA/ Figure 1—4. MRF24WBOMB supports JTAG boundary scan. The JTAG port provides the optional hardware JTAG Reset Figure2—4, Figure2—5 and Figure 2—6 show the input, JTAGRST. JTAG_EN and JTAGRST need to be antenna and simulated radiation patterns expected driven high to enable JTAG mode. JTAG should not be from the PCB antenna. Refer to three separate axis of enabled during normal functional operation which measurementthat corresponds to the orientation of the affects power state current module (drawn in the center of each plot). The horizontal and vertical data, blue and red, in each 2.5 Debug Serial Interface plot correspond to the orientation (polarization) of the measurement antenna rotated 360 degrees around the The MRF24WBOMA/MRF24WBOMB incorporates a module. Transmit Data pin (DEBUGTX) and a Receive Data pin The horizontal measurement was done with the receive (DEBUGRX) for serial debugging purposes. These pins antenna parallel to the module PCB. Thevertical mea— can be connected to commercially available RS—232 line surement was done perpendicular to the module PCB. drivers/receivers with appropriate external level shifters. The serial interface operates at 19200, 8, N, 1, N. These patterns allow the designer to understand the performance of the module with respectto the position of the receive or transmit antenna at the other end of the link. 2.6 SPI Interface The slave Serial Peripheral Interface (SP!) is used to interface with the host PIC microcontroller.The slave SPI interface works with the Interrupt line (INT). When data is available_for the PIC microcontroller during operation, the INT line is asserted (logic low)by the MRF24NBOMA/MRF24WBOMB module. The INT line is de—asserted (logic high) by the MRF24WBOMA/ MRF24WBOMB after the data is transferred to the host PIC microcontroller. The SPI SCK frequency can be up to 25 MHz The slave SPI interface implements the [CPOL = 0; CPHA = 0] and [CPOL = 1; CPHA = 1] modes (0 and 3) of operation. That is, data is clocked in on the first rising edge of the clock after Chip Select (CS) is asserted. Data is placed on the bus with most significant bit (MSb) first. The CS pin must be toggled with transfer blocks and cannot be held low permanently. The falling edge of CS is used toindicate the start of a transfer. The rising edge of CS is used to indicate the completion of a transfer. Figure 4—1 in Section 4.0, Electrical Characteristics shows the SPI timing diagram. Table 4—7 details the SPI timing AC characteristics. 2.7 PCB Antenna For MRF24WBOMA, the PCB antenna is fabricated on the top copper layer and covered in solder mask. The layers below the antenna have no coppertrace. © 2010—2013 Microchip Technology Inc. DS70632C—page 15

MRF24WBOMA/MRF24WBOMB FIGURE 2-4: AZIMUTH RADIATION PATTERN, 2.44 GHz oo 180° DS70632C-page 16 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB FIGURE 2-5: RADIATION PATTERN ON SIDE WITH PCB ANTENNA, 2.44 GHz oo 180° © 2010-2013 Microchip Technology Inc. DS70632C-page 17

MRF24WBOMA/MRF24WBOMB FIGURE 2-6: RADIATION PATTERN ALONG PIN EDGE, 2.44 GHz oo goo 180° DS70632C-page 18 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB 2.8 External Antenna The choice of an external antenna is limited to the antenna types the module is tested with. Refer to Section 3.0, Regulatory Approval for specific country- wise regulatory requirements. A list of antennas types tested with the MRF24WBOMB modules is provided in Table 2-2. TABLE 2-2: TESTED EXTERNAL ANTENNA TYPES VSWR Part Number Type Gain (dBi) Connector Vendor Max. RFA-02-P05 PCB 2 2.0 IPEX Aristotle RFA-02-L6H 1-70-35 Dipole 2 2.0 IPEX Aristotle RFA-02-D3 Dipole 1.5 2.0 IPEX Aristotle RFA-02-L2H1 Dipole 2 2.0 IPEX Aristotle RFA-02-3-C5H1 Dipole 3 2.0 IPEX Aristotle RFA-02-5-C7H1 Dipole 5 2.0 IPEX Aristotle RFA-02-5-F? H 1 Dipole 5 2.0 IPEX Aristotle WF2400-15001A Dipole 5 2.0 IPEX Saytec WF2400-15001AR Dipole 5 2.0 RF-IPEX Saytec WF2400-10001 I Dipole 2 2.0 IPEX Saytec WF2400-10001R Dipole 2 2.0 RF-IPEX Saytec AN2400-5901RS, used with connector Omni 9 2.0 IPEX Saytec SMASFR8-3152H-OOXOOI AN2400-5901RS, used with connector Omni 9 2.0 RF-IP EX Saytec SMASFR8-3152H-OOXOOIR © 2010-2013 Microchip Technology Inc. DS70632C-page 19


MRF24WBOMA/MRF24WBOMB 3.0 REGULATORY APPROVAL This exterior label can use wording as follows: This section outlines the regulatory information for the Contains Transmitter Module FCC ID: MRF24WBOMNMRF24WBOMB module for the following W10ZG21OO-ZG2101 countries: or • United States Contains FCC ID: W10ZG2100-ZG2101 • Canada This device complies with Part 15 of the FCC • Europe Rules. Operation is subject to the following two • Australia conditions: • New Zealand (1) this device may not cause harmful interference, • Korea and (2) this device must accept any interference received, including interference that may cause • Other undesired operation. 3.1 United States A user's manual for the product should include the following statement: The MRF24WBOMNMRF24WBOMB module has received Federal Communications Commission (FCC) This equipment has been tested and found to CFR47 Telecommunications, Part 15 Subpart C "Inten- comply with the limits for a Class B digital device, tional Radiators" modular approval in accordance with pursuant to part 15 of the FCC Rules. These limits Part 15.212 Modular Transmitter approval. Modular are designed to provide reasonable protection approval allows the end user to integrate the against harmful interference in a residential MRF24WBOMNMRF24WBOMB module into a finished installation. This equipment generates, uses and product without obtaining subsequent and separate can radiate radio frequency energy, and if not FCC approvals for intentional radiation, provided no installed and used in accordance with the changes or modifications are made to the module cir- instructions, may cause harmful interference to cuitry. Changes or modifications could void the user's radio communications. However, there is no authority to operate the equipment. The end user must guarantee that interference will not occur in a comply with all of the instructions provided by the particular installation. If this equipment does cause Grantee, which indicate installation and/or operating harmful interference to radio or television conditions necessary for compliance. reception , which can be determined by turning the The finished product is required to comply with all appli- equipment off and on, the user is encouraged to try cable FCC equipment authorizations regulations, to correct the interference by one or more of the requirements and equipment functions not associated following measures: with the transmitter module portion. For example, com- • Reorient or relocate the receiving antenna. pliance must be demonstrated to regulations for other • Increase the separation between the equipment transmitter components within the host product; to and receiver. requirements for unintentional radiators (Part 15 Subpart • Connect the equipment into an outlet on a circuit B "Unintentional Radiators"), such as digital devices, different from that to which the receiver is computer peripherals, radio receivers, etc; and to addi- connected. tional authorization requirements for the non-transmitter • Consult the dealer or an experienced radiofTV functions on the transmitter module (i.e., Verification, or technician for help. Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB 3.1.1 LABELING AND USER Publication 784748 available at the FCC Office of Engi- INFORMATION REQUIREMENTS neering and Technology (OET) Laboratory Division The MRF24WBOMNMRF24WBOMB module is labeled Knowledge Database (KDB), with its own FCC ID number. If the FCC ID is not visible http.l/apps fee gov/oetcf/kdb/index.cfm. when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. © 2010-2013 Microchip Technology Inc. DS70632C-page 21

MRF24WBOMA/MRF24WBOMB 3.1.2 RF EXPOSURE 3.2 Canada All transmitters regulated by FCC must comply with RF The MRF24WBOMA/MRF24WBOMB module is certi- exposure requirements. OET Bulletin 65, Evaluating fied for use in Canada under Industry Canada (IC) Compliance with FCC Guidelines for Human Exposure Radio Standards Specification (RSS) RSS-210 and to Radio Frequency Electromagnetic Fields, provides RSSGen. Modular approval permits the installation of a assistance in determining whether proposed or existing module in a host device without the need to recertify transmitting facilities, operations or devices comply the device. with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications 3.2.1 LABELING AND USER Commission (FCC). The bulletin offers guidelines and INFORMATION REQUIREMENTS suggestions for evaluating compliance. Labeling requirements for the Host Device (from Sec- If appropriate, compliance with exposure guidelines for tion 3.2 .1, RSS-Gen, Issue 3, December 2010): The mobile and unlicensed devices can be accomplished host device must be labeled to identify the module by the use of warning labels and by providing users within the host device. with information concerning minimum separation distances from transmitting structures and proper The Industry Canada certification label of a module installation of antennas. must be clearly visible at all times when installed in the host device, otherwise the host device must be labeled The following statement must be included as a caution to display the Industry Canada certification number of statement in manuals and OEM products to alert users the module, preceded by the words "Contains transmit- of FCC RF exposure compliance: ter module", or the word ·contains", or similar wording expressing the same meaning, as follows: To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a Contains transmitter module IC: separation distance of 20 cm or more should be 8248A-G21ZEROG maintained between the antenna of this device and User Manual Notice for License-Exempt Radio Appara- persons during operation. To ensure compliance, tus (from Section 7.1.3, RSS-Gen, Issue 3, December operation at closer than this distance is not 2010): User manuals for license-exempt radio apparatus recommended. must contain the following or equivalent notice in a con- The antenna(s) used for this transmitter must not spicuous location in the user manual or alternatively on be co-located or operating in conjunction with any the device or both: other antenna or transmitter. This device complies with Industry Canada license-exempt RSS standard(s). Operation is If the MRF24WBOMA/MRF24WBOMB module is used subject to the following two conditions: (1) this in a portable application (i.e., the antenna is less than device may not cause interference, and (2) th is 20 cm from persons during operation), the integrator is device must accept any interference, including responsible for performing Specific Absorption Rate interference that may cause undesired operation of (SAR) testing in accordance with FCC rules 2.1091 . the device. 3.1.3 APPROVED EXTERNAL ANTENNA Le present appareil est conforme aux CNR TYPES d'lndustrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee To maintain modular approval in the United States, only aux deux conditions suivantes: (1) l'appareil ne doit tested antenna types must be used. It is permissible to pas produire de brouillage, et (2) l'utilisateur de use different manufacturer antenna provided the same l'appareil doit accepter tout brouillage radioelec- antenna type and antenna gain (equal to or less than) trique subi, meme si le brouillage est susceptible is used. d'en compromettre le fonctionnement. MRF24WBOMB module testing was performed with the antenna types listed in Table 2-2 in Section 2 8 Exter- nal Antenna. 3.1.4 HELPFUL WEB SITES Federal Communications Commission (FCC): http //www fee gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http //apps fee gov/oetcf/kdb/index cfm DS70632C-page 22 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB Transmitter Antenna (from Section 7.1.2, RSS-Gen, 3.2.2 APPROVED EXTERNAL ANTENNA Issue 3, December 2010): User manuals for transmit- TYPES ters must display the following notice in a conspicuous Transmitter Antenna (from Section 7 .1.2 RSS-Gen, location: Issue 3, December 2010): Under Industry Canada regulations, this radio The MRF24WBOMAIMRF24WBOMB module can only transmitter may only operate using an antenna of a be sold or operated with antennas with which it was type and maximum (or lesser) gain approved for approved. Transmitter may be approved with multiple the transmitter by Industry Canada. To reduce antenna types. An antenna type comprises antennas potential radio interference to other users, the having similar in-band and out-of-band radiation pat- antenna type and its gain should be so chosen that terns. Testing shall be performed using the highest gain the equivalent isotropically radiated power (e.i.r.p.) antenna of each combination of transmitter and is not more than that necessary for successful antenna type for which approval is being sought, with communication. the transmitter output power set at the maximum level. Conformement a la reglementation d'lndustrie Any antenna of the same type having equal or lesser Canada, le present emetteur radio peut fonction- gain as an antenna that had been successfully tested ner avec une antenne d'un type et d'un gain maxi- with the transmitter, will also be considered approved mal (ou inferieur) approuve pour l'emetteur par with the transmitter, and may be used and marketed lndustrie Canada. Dans le but de reduire les ris- with the transmitter. ques de brouillage radioelectrique a !'intention des When a measurement at the antenna connector is autres utilisateurs, ii taut choisir le type d'antenne used to determine RF output power, the effective gain et son gain de sorte que la puissance isotrope ray- of the device's antenna shall be stated, based on onnee equivalente (p.i.r.e.) ne depasse pas l'inten- measurement or on data from the antenna site necessaire a l'etablissement d'une manufacturer. For transmitters of output power greater communication satisfaisante. than 1O milliwatts, the total antenna gain shall be added to the measured RF output power to demonstrate The above notice may be affixed to the device instead compliance to the specified radiated power limits. of displayed in the user manual. Approved external antenna types for the User manuals for transmitters equipped with MRF24WBOMB module are listed in Table 2-2 in detachable antennas shall also contain the following Section 2 8, External Antenna. notice in a conspicuous location: This radio transm itter (identify the device by certifi- 3.2.3 HELPFUL WEB SITES cation number, or model number if Category II) has Industry Canada: http //www ic.gc.ca/ been approved by Industry Canada to operate with the antenna types listed below with the maximum 3.3 Europe permissible gain and required antenna impedance for each antenna type indicated. Antenna types not The MRF24WBOMAIMRF24WBOMB module is an included in this list, having a gain greater than the R&TTE Directive assessed radio module that is CE maximum gain indicated for that type , are strictly marked, and manufactured and tested with the inten- prohibited for use with this device. tion of being integrated into a final product. Conformement a la reglementation d'lndustrie The MRF24WBOMAIMRF24WBOMB module tested to Canada, le present emetteur radio peut fonction- R&TIE Directive 1999/5/EC Essential Requirements for ner avec une antenne d'un type et d'un gain maxi- Health and Safety (Artide (3.1(a)), Electromagnetic Com- mal (ou inferieur) approuve pour l'emetteur par patibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) lndustrie Canada. Dans le but de reduire les ris- and are summarized in Table 3-1. A Notified Body Opin- ques de brouillage radioelectrique a !'intention des ion has also been issued. All test reports are available on autres utilisateurs, ii taut choisir le type d'antenne the MRF24WBOMAIMRF24WBOMB product web page at et son gain de sorte que la puissance isotrope ray- http/ lwww.microchip com . onnee equivalente (p.i.r.e.) ne depasse pas l'inten- The R&TTE Compliance Association provides guid- site necessaire a l'etablissement d'une ance on modular devices in the document "Technical communication satisfaisante. Guidance Note 01", which is available at http:// www rtteca .com/html/download_area htm. After the preceding notice, the manufacturer must pro- vide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each. © 2010-2013 Microchip Technology Inc. DS70632C-page 23

MRF24WBOMA/MRF24WBOMB does not require further involvement of an R& TTE Note: To maintain conformance to the testing listed Directive Notified Body for the final product. See in Table 3-1 : European Compliance Testing, the Section 2.3.4, Standby State. module shall be installed in accordance with the installation instructions in this data sheet and shall The European Compliance Testing listed in Table 3-1 not be modified. was performed using the antenna types listed in Section 2.8 , External Antenna. When integrating a radio module into a completed product the integrator becomes the manufacturer 3.3.3 HELPFUL WEB SITES of the final product and is therefore responsible for demonstrating compliance of the final product with A document that can be used as a starting point in the essential requirements of the R& TIE Directive. understanding the use of Short Range Devices (SRO) in Europe is the European Radio Communications Com- mittee (ERC) Recommendation 70-03 E, which can be 3.3.1 LABELING AND USER downloaded from the European Radio Communications INFORMATION REQUIREMENTS Office (ERO) at: http://wwwero dk/. The label on the final product which contains the Additional helpful web sites are: MRF24WBOMA/MRF24WBOMB module must follow CE marking requirements. The R&TTE Compliance Associ- • Radio and Telecommunications Terminal Equipment (R&TTE): ation document "Technical Guidance Note 01" provides guidance on final product CE marking. http://ec europa eu/enterprise/rtte/index_en htm • European Conference of Postal and Telecommu- 3.3.2 EXTERNAL ANTENNA nications Administrations (CEPT): REQUIREMENTS http://www.cept.org From the R&TTE Compliance Association document Technical Guidance Note 01 : • European Telecommunications Standards Institute (ETSI): Provided the integrator installing an assessed radio module with an integral or specific antenna and http://www.etsi.org installed in conformance with the radio module manu- • European Radio Communications Office (ERO): facturer's installation instructions requires no further http://www.ero dk evaluation under Article 3.2 of the R&TTE Directive and TABLE 3-1: EUROPEAN COMPLIANCE TESTING Certification Standards Article Laboratory Report Number Date Safety IEC 60950-1 :2001 (3. 1(a)) TUV Rheinland 30883573.001 2009-03-11 EMC EN 301 489-1 V1 .8.1 (2008-04) (3.1(b)) 30853571 .004 2009-03-16 EN 301 489-17 V1 .2.1 (2002-04) Radio EN 300 328 V1 .7.1 (2006-10) (3.2) 30853571 .003 2009-04-28 3.4 Australia Conformity (DoC) and so on. Integrator must know what is required in the compliance folder for ACMA The Australia radio regulations do not provide a modu- compliance. All test reports are available on the lar approval policy similar to the United States (FCC) MRF24WBOMA/MRF24WBOMB product web page at and Canada (IC). However, MRF24WBOMA/ http://www.microchip.com. For more information on MRF24WBOMB module RF transmitter test reports can Australia compliance. refer to the Australian be used in part to demonstrate compliance in accor- Communications and Media Authority web site http:// dance with ACMA Radio communications "Short www.acmagov.au/. Range Devices" Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 3.4 .1 EXTERNAL ANTENNA industry standard). The MRF24WBOMA/ REQUIREMENTS MRF24WBOMB module test reports can be used as part of the product certification and compliance folder. The compliance testing listed in Table 3-1 was per- For more information on the RF transmitter test reports. formed using the antenna types listed in Table 2-2 in contact Microchip Technology Australia sales office. Section 2.8, External Antenna . To meet overall Australian final product compliance, the 3.4.2 HELPFUL WEB SITES developer must construct a compliance folder The Australian Communications and Media Authority: containing all relevant compliance test reports. for http://www acma gov au/. example RF, EMC, electrical safety and Declaration of DS70632C-page 24 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB 3.5 New Zealand 3.6.1 LABELING AND USER INFORMATION REQUIREMENTS The New Zealand radio regulations do not provide a modular approval policy similar to the United States The label on the final product which contains the (FCC) and Canada (IC). However, MRF24WBOMA/ MRF24WBOMA/MRF24WBOMB module must follow MRF24WNBOMB module RF transmitter test reports can KC marking requirements. The integratorof the module be used in part to demonstrate compliance against the should refer to the labeling requirements for Korea New Zealand "General User Radio License for Short available on the Korea Communications Commission Range Devices". New Zealand Radio communications (KCC) web site. (Radio Standards) Notice 2010 calls up the AS/NZS The MRF24WBOMA/MRF24WBOMB moduleis labeled 4268:2008 industry standard. The MRF24WBOMA/ withits own KC mark. The final product requires the KC MRF24WNBOMB module test reports can be used as mark and certificate number of the module: part of the product certification and compliance folder. All test reports are available on the MRF24WBOMA/ MRF24WBOMB product web page at http://mww.micro— KOB« MRF24WBOMB chip.com. For more information on the RF transmitter test reports, contact Microchip Technology sales office. 362 EXTERNAL ANTENNA Information on the New Zealand short range devices REQUIREMENTS license can be found in the following web sites: The Korea compliance testing was performed using the http://www.rsm.govt.nz/cms/licensees/types—oflicence/ antenna typeslisted in Table 2—2 in Section 2.8, External general—user—licences/short—range—devices. Antenna. and 3.6.3 HELPFUL WEB SITES http://www.rsm.govt.nz/cms/policy—and—planning/spec— Korea Communications Commission (KCC): trum—policy—overview/legislation/gazette—notices/prod— http://www.keo.go.kr. uct—compliance/radiocommunications—radiostandards— notice—2010. National Radio Research Agency (RRA): http://rra.go.kr To meet overall New Zealand final product compliance, the developer must construct a compliance folder with all relevant compliance test reports, for example RF, 3.7 Other Regulatory Jurisdictions EMC, electrical safety and DoC (Declaration of Confor— Other regulatory jurisdiction certification must be mity) etc. The developer must know whatis required in required by the customer, or the customer need to the compliance folder for New Zealand Radio commu— recertify the module for other reasons, a certification nications. For more information on New Zealand com— utility is available. The utility runs on a Window‘s PC pliance, refer to the web site http—//www.rem.govt.nz/. and utilizes a USB to SPI converter to interface to the MRF24WBOM module. To use the utility, the 3.5.1 EXTERNAL ANTENNA MRF24WBOM module must be out of Reset and not REQUIREMENTS accessed by the system host. That is, the SPI signals The compliance testing listed in Table 3—1 was per— to the MRF24WBOM must be tri—state, with Reset and formed using the antenna types listed in Table 2—2 in Hibernate deasserted. The following signals will need Section 2.8, External Antenna. to be brought from the MRF24WBOM for connection to the PC (through the USB adapter): 3.5.2 HELPFUL WEB SITES + SDO Radio Spectrum Ministry of Economic Development: + SDI http://www.rsm.govt.nz!. * CS * SCK 3.6 Korea + INT The MRF24WBOMA/MRF24WBOMB module has + GND received certification of conformity in accordance with For further regulatory Certification Utility— and the Radio Waves Act. Integration of this module into a documentation, contact local Microchip sales office. final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. © 2010—2013 Microchip Technology Inc. DS70632C—page 25

MRF24WBOMA/MRF24WBOMB 3.8 Wi-Fi® Alliance Per the Wi-Fi Alliance approved ASD test plan, the definition of the Microchip MRF24WBOMA and Wi-Fi Alliance Certification focuses on interoperability MRF24WBOMB modular solutions is expressed in the testing of devices based on 802.11 standards. following statements: Historically, when the certification process and "Member Wireless solution is a single-chip programs were developed by Wi-Fi Alliance members, 802.11b module including MAC, baseband, RF the vast majority of the 802.11 clients were PC-centric, and power amplifier personal STA It utilizes a and certification testing adequately addressed those simple to use API for embedded markets, and an types of devices. In subsequent years, the number of OS is not a requirement for operation. It supports Wi-Fi devices that are not PC-centric has grown 1 and 2 Mbps (TX and RX). It also supports WEP, significantly. WPA Personal, and WPA2 Personal security. These non-standard devices, as a class of products, Ciphers supported are AES and TKIP. The have been dubbed Application Specific Devices Member Wireless solution interfaces with the (ASDs) by the Wi-Fi Alliance. ASDs are 802.11 HOST through SPI Bus. Some applications for devices, for example clients or access points (APs), the Member Wireless solution are as following: which cannot be tested under a standard Alliance test • Sensors/Controls such as Industrial and Factory plan because they do not comply with the standard test sensors, HVAC, and Lighting configuration , and because they are designed to perform a specific application. For example, bar code • Consumer Electronic such as remote controls, scanners, pagers, recording devices, monitoring toys, and internet radio equipment, and cable modems. This certification ensures that the MRF24WBOMA and MRF24WBOMB modules have passed The APs or clients that are used to validate ASD compliance (from the standard test bed) will meet all of rigorous testing for interoperability across existing the requirements specified in the applicable System consumer and business Wi-Fi equipments, and Interoperability Test Plans (referred to as the "standard their certifications are completed (WFA ID: WFA7150) . The certification effort undertaken will test plan"), unless specifically exempted. The MRF24WBOMA and MRF24WBOMB modules are in save customers time and money. For modular the ASD category. policy, refer to WFA Module Policy (Version 2.2; MARCH 2006). The modules are certified under Wi-Fi 802. 11 with WPA2, WPA, and WEP System Interoperability ASD Model Test Plan with Test Engine For IEEE 802.11a, b, and g Devices (Version 1.0). DS70632C-page 26 © 2010-2013 Microchip Technology Inc.

MRF24WBOMA/MRF24WBOMB 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: DIGITAL ELECTRICAL CHARACTERISTICS (NOMINAL CONDITIONS : 25C, = Voo 3.3V) Parameters Min Typ Max Units VIL (Input low voltage) -0.3 - 0.8 v V1H (Input high voltage) 2 - 5.5 v VOL (Output low voltage) - - 0.4 v VOH (Output high voltage) 2 .4 - - v IOL (Output low level current at VOL Max) - 8.5 - mA IOH (Output high level current at VOH Min) - 15.4 - mA TABLE 4-2: ABSOLUTE MAXIMUM RATINGS( 1l Parameters Min Max Notes Storage Temperature -40C +125C - Voo ov 4 .2V for 0.5 mS Voo above this level and duration will disable Radio VIN on SDI, CS, SCK -0.3V 5.5V - Note 1: Listed Absolute Maximum Ratings are not meant for functional operation. Operation at these levels 1s not guaranteed, and may reduce the operating life of the component. TABLE 4-3: RECOMMENDED OPERATING CONDITIONS Parameters Min Typ Max Units Ambient Temperature -40 - +85 Degrees Celsius Voo - for FCC and IC 2.70 3.3 3.63(1 ) Volts .. Note 1: While 3.63V 1s the maximum operating voltage, the module will detect an overvoltage cond1t1on at 4.2V and disable the RF Transmit function after 0.5 ms. This is an RF certification requirement pertaining to disabling transmission in unforeseen over-voltage conditions. © 2010-2013 Microchip Technology Inc. DS70632C-page 27

MRF24WBOMA/MRF24WBOMB TABLE 4-4: CURRENT CONSUMPTION(3 ) (NOMINAL CONDITIONS: 25C, Voo = 3.3V) Parameters Min Typ Max Units loo, Hibernate = 3.3V - 0.1 - µA loo, Sleep (software enabled) - 2501 11 - µA loo, Standby (transitional state) - 10 - mA loo core1 2 1, RX on, Receive @-83 dBm with 2 Mbps - 85 - mA modulated signal at antenna port loo core, TX on, +O dBm - 115 - mA loo core, TX on, +10 dBm - 154 - mA n Note 1: Sleep current 1s current consumed during periods of "standby between DTIM beacons. The module will awake 2 mS before a DTIM and turn on its receiver, and possibly its transmitter (if data is available for it). 2: loo core is current consumed by the part not including the 1/0 consumption of the SPI port. 3: Current Consumption values represent Typical Peak currents, and the measured current conditions were done with 85% duty cycle modulated signal. Wi-Fi® applications typically operate at less than 85% TX duty cycle. TX current is dependent on such criteria as transmit power setting, and transmit data rate and bandwidth being used. RX current is affected by connection distance. TABLE 4-5: RECEIVER AC CHARACTERISTICS( 1 ) Parameters Min Typ Max Units Flo 2412 - 2484 MHz RX Min Input Level Sensitivity, 1 Mbps, 8% PER - -91 - dBm RX Min Input Level Sensitivity, 2 Mbps, 8% PER - -88 - dBm RX Max Input Level (Power), 1 Mbps, 8% PER - -4 - dBm RX Max Input Level (Power), 2 Mbps, 8% PER - -4- dBm .. Note 1: Nominal cond1t1ons: 25C, Voo = 3.3V, Flo= 2437 MHz, measurements at antenna port. TABLE 4-6: TRANSMITTER AC CHARACTERISTICS( 1l Parameters Min Typ Max Units Flo 2412 - 2484 MHz Average Pout (transmit spectrum mask compliant) - +10 - dBm Average Pout gain step resolution from +5 to +10 dBm - 0.5 - dB Average Pout gain step resolution from -5 to +5 dbm - 1.0 - dB Average Pout settled variation -0.5 - 0.5 dB .. Note 1: Nominal cond1t1ons: 25C, V oo =3.3V, Flo =2437 MHz, 2 Mbps. modulated signal measured at antenna port. DS70632C-page 28 © 2010-2013 Microchip Technology Inc.


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Document Modified: 2017-09-28 13:03:54
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