Exhibits

3388-EX-ST-1998 Text Documents

APPLIED MATERIALS, INC.

2002-06-12ELS_56493

[TTLLZILILLLT} /_""""" OPERATOR CRT * PROCESS CHAMBER CONTROLLER(S) D WATER COOLER 1 PROCESS CONTROLLER STOWED BELOW EACH PROCESS CHAMBER MAINFRAME MAINFRAME CONTROLLER #1 CONTROLLER #2 RF / DC CENERATOR RACK(S) STOWED UNDER CHAMBER F STOWED UNDER CHAMBER E o0 OG CA 18 £ CITI COMPRESSOR RACK 30O0mm MAINFRAME Figure 2.2 Overall Ilustration — 300mm System Sub—Components Identification

25 GENERAL INFORMATION The product identified within this TCF consist of the following equipment with the dimensions shown below. A detailed technical description of the overall systems may be found in the appropriate service manuals referenced in Annex E. 2.5.1 Dimension / Weight / Power Requirement Due to the variable configuration of the 300mm Metallization System, along with support equipment, input power requirements will vary. The main circuit breaker for the system is rated at 800 Amps, 3 phases at 208VAC (50/60 Hz). A complex matrix exists depending on user configuration. The Site and System Preparation Specification Manual (SSPS) contains additional details, referenced in Appendix E. An overview is provided herein. Dimensions: Refer to the SSPS for exact details on all systems and support equipment. Annex G and H provide supporting information. 300mm System Mainframe and Sub—Components Typical Dimensions and Weights Component Depth Width Height Weight in (cm) in (cm) in (cm) Ibs (kg) Factory Interface Unit 41.25 (105) 95 (241) 84.5 (215) 3000 (1360) Mainframe 132 (342) 96 (245) 65 (166) 6115 (2775) e Controllers 1, 2 23 (59) 21 (54) 23 (59) 200 (91) e Cryo Pump (ea) 75 (34) e Slit Valve (ea) 30 (14) e Robot Assy (ea) 85 (39) MDP Process Chamber (ea) 700 (318) ee Chamber Controller Gate Valve (ea) S 23rrarppnsop (59) e rammen 21 (54) onmprmrrmnm vernginencondin 16 (41) in P conmarma zen 200 (91) 70 (32) e Cryo Pump (ea) 75 (34) Main AC Box 18 (46) 39 (100) 84 (215) 900 (408) System AC Box 13 (34) 48 (123) 48 (123) 600 (272) RF/DC Generator Rack 42 (107) 24 (62) 81 (207) 1345 (610) Cryo Compressor Rack 24 (62) 22 (56) 70 (179) 850 (386) Heat Exchanger (DI Cooler) 33 (85) 33 (85) 55 (141) 610 (277) System Pump (Leybold) 39 (100) 15.5 (49) 42 (107) 750 (340) Loadlock Pump (Leybold) 39 (100) 15.5 (49) 42 (107) 750 (340)

~0230—20 . Date: 300mm Electrical Requirements— Main AC Box and Sub—Components Component N° Phases AC Line Voltage Current.,,,, (V) (A) Main AC Box 3 208 670° System AC Box 3 208 170° Generator Rack (ea) 3 208 250° Cryo Compressor 3 208 57 DI Cooler 3 208 11 Rough Pump (ea) 3 208 19.6 MCVD Heat Exchanger (optional) 3 208 20 *System configuration dependent 300mm Electrical Requirements— System AC Box and Sub—Components Component N° Phases AC Line Voltage Current.,,, (V) (A) Buffer/Transfer Chamber Heater (ea) 3 208 18.6 Loadlock Heater Driver (ea) 1 208 8 Degas Heater Driver (ea) 1 208 10 Mainframe Controllers 1, 2 (ea) 1 208 19.2 System UPS (optional) 3 208 20.8 Robot Motor Driver 1 120 23.6 Process Chamber 3 208 30 300mm Electrical Requirements— RF/DC Generator Rack Power Supplies Component N° AC Line Voltage Current,,,, Phases (V) (A) DC Sources Std PVD Al1 40kW (2 supplies) 3 208 2 x 75 Std PVD Ti, TN 20kW 3 208 75 PVD TiW 20kW 3 208 75 PVD IMP 20kW DC, SkW 2MHz, 1.2kW 13.56MHz 3 208 75 RF Sources Preclean 1.2kW 13.56MHz 3 208 25 Preclean 2kW 2MHz 3 208 25 Vectra IMP 5kW 2MHz 3 208 40 Vectra IMP 1.2kW 13.56MHz 3 208 10

FACTORY INTERFACE —W— | MONITOR 1 LLB LLA CLEAN ROOM WALL HAMBER F CHAMBER CE PROCESS PROCESS CHAMBER D CHAMBER C PROCESS PROCESS CHAMBER 4 CHAMBER 1 PROCESS PROCESS CHAMBER 3 HAMBER 2 Figure 2.1 300mm System Mainframe Overhead View jz

07/20/98 15: 12 F408 563 3993 AMAT MDD ENG & 002 @ EMC Test Report: Getter Pump, CAF, RCF Page: 7 of 8 Part no. 0225—20XXX Rev. PX 7/15/98 Location of EMC Testing The EMC testing was performed at the manufacturer‘s site at: Applied Materials, Inc., Building 25 Beta Lab, 2150 Mission College Drive, Santa Clara CA 95054. See figure below for layout of equipment during testing. CAF, RCF, AND GETTER PUMP EMC SETUP ANTENNA \ CASSETTE ALIGNMENT FIXTURE _f FIELD STRENGTH METER GEN RACK 4 ePT\ — GETTER PUMP INTERLOCK BOX 9 [S e ROBQT CHARACTER— tZATION PIXTURE SYSTEM AC RF Radiated Immunity Test Location Operating Environment: Testing was performed in a controlled environment maintained at a temperature of 23°C and a relative humidity of approximately 40%. Applied Materials® Confidential

86 /08 / L0 | amSt4 ‘| juowuyoeny y xipuoddy | 1 GRAPHICAL LOCATOR 6 TcST SYSTEM AC PANEL, 2aV 1 | NESLAB aEnNERATOR 020020035 0290—20011 0290—00010 cnvo—compresaons , 029020011 €666 £956 s0otS C BYaTeM CONTROLLEA MONOLITH V ©200—20008 PYD PROCESS 0200—20002 CHAMBER 0290—20002.0P PREOLEAN CHAMBER 0200—20028—0P LOADLOCK CHAMBER REMOTE 6260—20004 TRANSFORMER FRAME C [ mnmanay [ T—vene—ece 2 oNI UUHW LVKY go*~—*——dinh aA8 PANRL 0220—20008—.09 &~ /(W% CooLoOWN CHAMBER 0200—20002 °_ WAFER ORIENTER/ FRAAM ENDURA SYSTEM OVERALL VIEW ® DEQAS CHAMBER 0200—20011.0P LOCATOR DIAGRAM 0280—20000—0P £0oo P

07/20/98 15 :13 C408 563 3993 AMAT MDD ENG 4 004 Appendix A, Attachment 1, Tablel Height in. Viidth in. Depth in. Weight tb. Compoanent C {cm) u) (kg) Major Components Mainframe (Std) 57.5 (146)" 88.5 (224) 115.0 (292) 6000 (2724) (Standard 4—chamber) Transformes frame 61.0 (155)® 39.0 (99) 50.0 (127) 2550 (1158) (with Main AC box) System controller sa.0 (203)® 34.0 (86.4) 39.0 (99) 1290 (586) (with System AC box) RF/DC Source Cabinet #1 80.0 (203)* 24.0 (61)* 36.0 (91) © 1280 (581) RF/DC Source Cabinet #2 80.0 (203)° 24.0 (61)° 36.0 (91) 1280 (581) Cryo compressor 26.2 (66.5)° 19.5 (49.5) 21.0 (53) 500 (227) Neslab System (it Modified 36.0 (91) 23.5 (59.7) 26.0 (66) 400 (182) Heat Exchanger Standard pump frame 64.5 (164)° 24.0 (61) 36.0 (91) 1010 (459) {with 3 pumps) PVD chamber 12.5 (31.8)° 18.0 (45.7) 31.0 (78.7)"** 500 (227) Subcomponents D—25 Roughing Pump 11.8 (30) 9.8 (25) 25.0 (63) 85.0 (38.6) WSU-151 Roots Blower 12.8 (32.5) 8.8 (25) 24.6 (62) _ 216.0 (98) Cryo—Tormr 8 Cryopump 7.0 (18) 8.0 (20) 22.6 (57) 45.0 (20) =ITMP—360 Turbopump 8.3 (21) 7.9 (20) 7.9 (20) 20.4 (9.25) System AC box 36.0 (21) 25.4 (64) 129 (33) 420 (191) Main AC box 64.3 (163) 37.5 (95) 8.0 (20) 1165 (529) *Does not iInclude levelting pads or wheoels. oo mz treme n api e **Measured from the top surface of the bulferchambeér. ***Distance out from the process chamber interface, includes cryopump.


Document Created: 2002-06-12 08:22:36
Document Modified: 2002-06-12 08:22:36
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