Exhibits

3388-EX-ST-1998 Text Documents

APPLIED MATERIALS, INC.

2002-06-12ELS_56493

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                                     OPERATOR CRT




                                                                                     * PROCESS CHAMBER
                                                                                        CONTROLLER(S)
                                                             D WATER COOLER        1 PROCESS CONTROLLER STOWED
                                                                                   BELOW EACH PROCESS CHAMBER




                                                               MAINFRAME                MAINFRAME
                                                             CONTROLLER #1            CONTROLLER #2
                                        RF / DC
                                   CENERATOR RACK(S)      STOWED UNDER CHAMBER F   STOWED UNDER CHAMBER E




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                                                                                     CA
                                                                                     18
                                                                                            £




CITI COMPRESSOR RACK                                       30O0mm   MAINFRAME



                 Figure 2.2   Overall Ilustration — 300mm System Sub—Components Identification


25        GENERAL INFORMATION

The product identified within this TCF consist of the following equipment with the dimensions shown
below. A detailed technical description of the overall systems may be found in the appropriate service
manuals referenced in Annex E.

2.5.1 Dimension / Weight / Power Requirement
Due to the variable configuration of the 300mm Metallization System, along with support equipment, input
power requirements will vary. The main circuit breaker for the system is rated at 800 Amps, 3 phases at
208VAC (50/60 Hz).

A complex matrix exists depending on user configuration. The Site and System Preparation Specification
Manual (SSPS) contains additional details, referenced in Appendix E. An overview is provided herein.

Dimensions: Refer to the SSPS for exact details on all systems and support equipment. Annex G and H
provide supporting information.


                              300mm System Mainframe and Sub—Components
     Typical Dimensions and Weights
     Component                      Depth                    Width                          Height                    Weight
                                    in (cm)                  in (cm)                        in (cm)                   Ibs (kg)
     Factory Interface Unit           41.25 (105)            95 (241)                    84.5 (215)                  3000 (1360)
     Mainframe                         132 (342)             96 (245)                     65 (166)                   6115 (2775)
     e Controllers 1, 2                 23 (59)               21 (54)                      23 (59)                     200 (91)
     e Cryo Pump (ea)                                                                                                  75 (34)
     e  Slit Valve (ea)                                                                                                30 (14)
     e  Robot Assy (ea)                                                                                                85 (39)
     MDP Process Chamber (ea)                                                                                         700 (318)
     ee   Chamber  Controller
          Gate Valve (ea)          S 23rrarppnsop
                                            (59)  e rammen   21 (54) onmprmrrmnm vernginencondin
                                                                                      16 (41)    in P conmarma zen    200  (91)
                                                                                                                       70 (32)
     e    Cryo Pump (ea)                                                                                               75 (34)
     Main AC Box                          18 (46)            39 (100)                      84 (215)                  900 (408)
     System AC Box                        13 (34)            48 (123)                      48 (123)                  600 (272)
     RF/DC Generator Rack                42 (107)             24 (62)                      81 (207)                  1345 (610)
     Cryo Compressor Rack                 24 (62)            22 (56)                       70 (179)                   850 (386)
     Heat Exchanger (DI Cooler)           33 (85)            33 (85)                       55 (141)                   610 (277)
     System Pump (Leybold)               39 (100)            15.5 (49)                     42 (107)                   750 (340)
     Loadlock Pump (Leybold)             39 (100)            15.5 (49)                     42 (107)                   750 (340)


                                                                    ~0230—20
                                                                           . Date:




    300mm Electrical Requirements— Main AC Box and Sub—Components
    Component                         N° Phases   AC Line Voltage              Current.,,,,
                                                                 (V)                 (A)
    Main AC Box                                 3                208                 670°
    System AC Box                               3                208                 170°
    Generator Rack (ea)                         3                208                 250°
    Cryo Compressor                             3                208                  57
    DI Cooler                                   3                208                  11
    Rough Pump (ea)                             3                208                 19.6
    MCVD Heat Exchanger (optional)              3                208                 20
                                  *System configuration dependent



    300mm Electrical Requirements— System AC Box and Sub—Components
    Component                               N° Phases    AC Line Voltage       Current.,,,
                                                                 (V)                 (A)
    Buffer/Transfer Chamber Heater (ea)         3                208                 18.6
    Loadlock Heater Driver (ea)                  1               208                  8
    Degas Heater Driver (ea)                     1               208                  10
    Mainframe Controllers 1, 2 (ea)              1               208                 19.2
    System UPS (optional)                       3                208                 20.8
    Robot Motor Driver                          1                120                 23.6
    Process Chamber                             3                208                 30




300mm Electrical Requirements— RF/DC Generator Rack Power Supplies
Component                                          N°      AC Line Voltage                 Current,,,,
                                                        Phases          (V)                   (A)
DC Sources
Std PVD Al1 40kW (2 supplies)                             3             208                  2 x 75
Std PVD Ti, TN 20kW                                       3             208                    75
PVD TiW 20kW                                              3             208                    75
PVD IMP 20kW DC, SkW 2MHz, 1.2kW 13.56MHz                 3             208                    75
RF Sources
Preclean 1.2kW 13.56MHz                                   3             208                    25
Preclean 2kW 2MHz                                         3             208                    25
Vectra IMP 5kW 2MHz                                       3             208                    40
Vectra IMP 1.2kW 13.56MHz                                 3             208                    10


                                      FACTORY
                                     INTERFACE




                                                                       —W—
                                             |
     MONITOR          1        LLB               LLA
                                                                      CLEAN ROOM WALL




               HAMBER F                                CHAMBER CE




                 PROCESS                                  PROCESS
                CHAMBER D                                CHAMBER C




                 PROCESS                                  PROCESS
                CHAMBER 4                                CHAMBER 1




                   PROCESS                             PROCESS
                  CHAMBER 3                            HAMBER 2




                    Figure 2.1 300mm System Mainframe Overhead View
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07/20/98     15: 12       F408 563 3993                                AMAT MDD ENG                                   & 002



   @ EMC Test Report: Getter Pump, CAF, RCF                                                          Page: 7 of 8
           Part no. 0225—20XXX                                         Rev. PX                            7/15/98


   Location of EMC Testing

   The EMC testing was performed at the manufacturer‘s site at: Applied Materials, Inc., Building 25 Beta Lab, 2150
   Mission College Drive, Santa Clara CA 95054.

   See figure below for layout of equipment during testing.




                         CAF, RCF, AND GETTER PUMP EMC SETUP

                       ANTENNA \               CASSETTE ALIGNMENT FIXTURE
                                                                                 _f




                                   FIELD STRENGTH METER
            GEN RACK




                                                          4
                                                          ePT\     —

                                         GETTER PUMP
                                        INTERLOCK BOX
                                                              9
                                                            [S e

                                     ROBQT CHARACTER—
                                        tZATION PIXTURE
             SYSTEM AC




                                         RF Radiated Immunity Test Location

   Operating Environment:

   Testing was performed in a controlled environment maintained at a temperature of 23°C and a relative humidity of
   approximately 40%.




                      Applied Materials® Confidential


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                                                                                         0290—20011
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                                                               MONOLITH                                                                         V ©200—20008
                             PYD PROCESS                       0200—20002
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                             0290—20002.0P


               PREOLEAN
               CHAMBER
             0200—20028—0P


LOADLOCK
CHAMBER                                                                                                                                                  REMOTE
6260—20004                                                                                                                                            TRANSFORMER
                                                                                                                                                         FRAME


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                                             °_       WAFER ORIENTER/                                FRAAM                          ENDURA SYSTEM OVERALL VIEW
                                     ®                DEQAS CHAMBER                               0200—20011.0P
                                                                                                                                              LOCATOR DIAGRAM
                                                       0280—20000—0P




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07/20/98      15 :13        C408 563 3993                           AMAT MDD ENG
                                                                                                                                   4 004


      Appendix A, Attachment 1, Tablel




                                           Height in.          Viidth in.      Depth in.       Weight tb.
       Compoanent                          C                   {cm)            u)              (kg)
       Major Components

           Mainframe (Std)                 57.5 (146)"         88.5 (224)      115.0 (292)     6000 (2724)
           (Standard 4—chamber)

           Transformes frame               61.0 (155)®         39.0 (99)       50.0 (127)      2550 (1158)
           (with Main AC box)

           System controller               sa.0 (203)®         34.0 (86.4)     39.0 (99)       1290 (586)
           (with System AC box)

           RF/DC Source Cabinet #1         80.0 (203)*         24.0 (61)*      36.0 (91)     © 1280 (581)
           RF/DC Source Cabinet #2         80.0 (203)°         24.0 (61)°      36.0 (91)       1280 (581)
           Cryo compressor                 26.2 (66.5)°        19.5 (49.5)     21.0 (53)      500 (227)
           Neslab System (it Modified      36.0 (91)           23.5 (59.7)     26.0 (66)      400 (182)
           Heat Exchanger

           Standard pump frame             64.5 (164)°         24.0 (61)       36.0 (91)       1010 (459)
           {with 3 pumps)
           PVD chamber                     12.5 (31.8)°        18.0 (45.7)     31.0 (78.7)"** 500 (227)
      Subcomponents

           D—25 Roughing Pump              11.8 (30)           9.8 (25)        25.0 (63)      85.0 (38.6)
           WSU-151 Roots Blower            12.8 (32.5)         8.8 (25)        24.6 (62)     _ 216.0 (98)
           Cryo—Tormr 8 Cryopump          7.0 (18)             8.0 (20)        22.6 (57)      45.0 (20)
       =ITMP—360 Turbopump                8.3 (21)             7.9 (20)        7.9 (20)       20.4 (9.25)
           System AC box                  36.0 (21)            25.4 (64)       129 (33)       420 (191)
           Main AC box                    64.3 (163)           37.5 (95)       8.0 (20)        1165 (529)

      *Does not iInclude levelting pads or wheoels.
                                                                                                             oo mz treme n api e




      **Measured from the top surface of the bulferchambeér.
      ***Distance out from the process chamber interface, includes cryopump.



Document Created: 2002-06-12 08:22:36
Document Modified: 2002-06-12 08:22:36

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