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United States Patent | 4,903,119 |
Ito , et al. | February 20, 1990 |
A semi-conductor device in which a semi-conductor element is sealed with a molding resin is disclosed. In the device, adhesion between a semi-conductor chip and the molding resin is achieved mainly by oxygen-crosslinking between silicon in the semi-conductor chip and silicon in the molding resin. The device exhibits excellent moisture-resistant reliability even after mounting.
Inventors: | Ito; Satoshi (Osaka, JP), Kitayama; Akiko (Osaka, JP), Hamada; Takatoshi (Osaka, JP), Yamaguchi; Miho (Osaka, JP) |
Assignee: |
Nitto Electric Industrial Co., Ltd.
(Osaka,
JP)
|
Appl. No.: | 07/328,712 |
Filed: | March 27, 1989 |
Application Number | Filing Date | Patent Number | Issue Date | ||
44546 | May., 1987 | ||||
May 01, 1986 [JP] | 61-101752 | |||
Current U.S. Class: | 257/788 ; 174/544; 257/E23.119; 257/E23.12; 257/E23.127 |
Current International Class: | H01L 23/29 (20060101); H01L 23/31 (20060101); H01L 23/28 (20060101); H01L 023/28 () |
Field of Search: | 357/72 174/52.2 264/272.11 |
2913358 | November 1959 | Harrington et al. |
4001870 | January 1977 | Saiki et al. |
4327369 | April 1982 | Kaplan |
58-225120 | Dec., 1983 | JP | |||
59-48942 | Mar., 1984 | JP | |||
60-4527 | Jan., 1985 | JP | |||
60-18517 | Jan., 1985 | JP | |||